CN109971406A - A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant - Google Patents
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant Download PDFInfo
- Publication number
- CN109971406A CN109971406A CN201910332149.2A CN201910332149A CN109971406A CN 109971406 A CN109971406 A CN 109971406A CN 201910332149 A CN201910332149 A CN 201910332149A CN 109971406 A CN109971406 A CN 109971406A
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- China
- Prior art keywords
- epoxy resin
- parts
- agent
- component
- resistant
- Prior art date
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- Granted
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 67
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 67
- 239000000565 sealant Substances 0.000 title claims abstract description 26
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 title claims description 18
- 239000003063 flame retardant Substances 0.000 claims abstract description 77
- 239000003292 glue Substances 0.000 claims abstract description 41
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 21
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 239000011159 matrix material Substances 0.000 claims abstract description 5
- 238000002360 preparation method Methods 0.000 claims description 29
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 22
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 239000012745 toughening agent Substances 0.000 claims description 18
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 16
- 239000013530 defoamer Substances 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- KCAMLFCTSSYIFW-UHFFFAOYSA-N 2,4,6-tris(dimethylamino)phenol Chemical group CN(C)C1=CC(N(C)C)=C(O)C(N(C)C)=C1 KCAMLFCTSSYIFW-UHFFFAOYSA-N 0.000 claims description 13
- 239000007822 coupling agent Substances 0.000 claims description 13
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 12
- -1 alicyclic amines Chemical class 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 9
- DIYBTKBUJDFZLQ-UHFFFAOYSA-N NC1=NC(N)=NC(N)=N1.N1C(=O)NC(=O)C2=C1NC(=O)N2 Chemical compound NC1=NC(N)=NC(N)=N1.N1C(=O)NC(=O)C2=C1NC(=O)N2 DIYBTKBUJDFZLQ-UHFFFAOYSA-N 0.000 claims description 9
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 8
- 229940106691 bisphenol a Drugs 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 8
- 238000010348 incorporation Methods 0.000 claims description 8
- 238000002791 soaking Methods 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 7
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 7
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 7
- 239000000347 magnesium hydroxide Substances 0.000 claims description 7
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 239000002518 antifoaming agent Substances 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- 238000004383 yellowing Methods 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 150000007974 melamines Chemical class 0.000 claims description 5
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 claims description 5
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- 239000004567 concrete Substances 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 239000011863 silicon-based powder Substances 0.000 claims description 4
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical class CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 claims description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 claims description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 2
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 claims description 2
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims 2
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- VGGRCVDNFAQIKO-UHFFFAOYSA-N formic anhydride Chemical compound O=COC=O VGGRCVDNFAQIKO-UHFFFAOYSA-N 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000005829 trimerization reaction Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 13
- 230000001404 mediated effect Effects 0.000 description 9
- 229930185605 Bisphenol Natural products 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- CQTGJMPFHKALGU-UHFFFAOYSA-N 1-[3,5-bis[(dimethylamino)methyl]phenyl]-n,n-dimethylmethanamine Chemical compound CN(C)CC1=CC(CN(C)C)=CC(CN(C)C)=C1 CQTGJMPFHKALGU-UHFFFAOYSA-N 0.000 description 1
- XGIWYYLRUDMUTH-UHFFFAOYSA-N 1-n,1-n,3-n,3-n,5-n,5-n-hexamethylbenzene-1,3,5-triamine Chemical compound CN(C)C1=CC(N(C)C)=CC(N(C)C)=C1 XGIWYYLRUDMUTH-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 238000004079 fireproofing Methods 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of Halogenless fire retarded epoxy resin sealants, mainly include A, B component, wherein component A is resin matrix, and B component is curative systems.It is characterized mainly in that and the epoxy resin in A glue is modified using melamine flame retardant, form fire-retardant epoxy resin matrix.The resin matrix has given full play to the flame-retarding characteristic, curing characteristics, rigid structure of melamine flame retardant, significantly improves the flame retardant properties, mechanical properties and high temperature resistance of sealant.The sealant can be used for the sealing of LED light source.
Description
Technical field
The invention belongs to electronic seal glue technical fields, and in particular to a kind of LED encapsulation halogen-free flame-resistant high-temperature-resistant epoxy
Resin sealer.
Background technique
LED encapsulates the encapsulation for referring to luminescence chip, has relatively big difference compared to integrated antenna package, the encapsulation of LED is not only wanted
Wick can be protected by asking, but also have certain light transmittance and flame retardant property.It mainly include halogen-free flameproof at fire-retardant aspect
With it is halogen fire-retardant, wherein it is halogen it is fire-retardant can generate a large amount of smog and toxic corrosive hydrogen halides gas in the case of fire,
Cause secondary hazards.Smoke amount is few when halogen-free flameproof burns, and does not generate toxic corrosive gas, is the important of fire proofing research
Direction.
Currently, the fire retardant that LED casting glue uses is mainly inorganic fire retardants.As patent CN2015104863160 is used
Halogen-free flame retardants be mainly average grain diameter be 2-10 μm of the aluminium hydroxide crossed through coupling agent surface treatment, magnesium hydroxide or boron
One of sour zinc.Its flame retardant property is controlled here mainly by the partial size for adjusting inorganic fire retardants.For another example, patent
The magnesium that CN2016103731188 retrofits using nanometer-aluminium composite flame-retardant agent.However, with inorganic fire retardants additive amount
Increase, mechanical property and light transmittance have significant decrease.Simultaneously as organic resin epoxy system still has flammability,
So individually the flame retardant effect of addition inorganic fire retardants is not obvious.
Summary of the invention
To solve the deficiencies in the prior art, the present invention provides a kind of novel halogen-free flame-resistant high-temperature-resistant epoxy resin sealing
Glue makes it have flame-retarding characteristic by the modification to epoxy resin, further improves the flame retardant property of sealant, concrete scheme
It is as follows:
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A is resin matrix, B group
It is divided into curative systems, calculates by weight, the concrete composition of each component is as follows:
Component A: epoxy resin 100 divides, 2-15 parts of melamine series fire retardant, 2-10 parts of inorganic fire retardants, diluent
5-20 parts, 0.2-5 parts of anti-yellowing agent, 0.1-2 parts of defoaming agent, 2-12 parts of coupling agent；
The epoxy resin includes bisphenol A type epoxy resin and bisphenol-A epoxy resin, the ring of the epoxy resin
Oxygen value is between 0.02-0.56；
The melamine series fire retardant includes one in melamine, uric acid melamine or melamine phosphate
Kind or a variety of compositions；
The inorganic fire retardants includes magnesium hydroxide, aluminium hydroxide, silicon powder, zinc borate, magnesia, one in aluminium oxide
Kind or a variety of mixtures；
The diluent includes trihydroxymethylpropanyltri diglycidyl ether or C12-14One of aliphatic glycidyl ether
Or both mixture；
The anti-yellowing agent be ultraviolet absorbing agent, including UV-40, UV-531, UV-9, UV-P, UV-329, UV-326,
One of UV-320, UV-234, UV-0 or a variety of mixtures；
The defoaming agent is organic silicon defoamer；
The coupling agent is silane coupling agent, including methyltrimethoxysilane, dimethyldimethoxysil,ne, vinyl
The mixture of one or more of trimethoxy silane, vinyltriethoxysilane, ethyl orthosilicate；
B component: 100 parts of curing agent, 0.5-8 parts of curing accelerator, 0.2-5 parts of toughener, 3-15 parts of coupling agent；
The curing agent includes organic acid anhydride type curing agent or alicyclic amines curing agent, wherein organic acid anhydride curing agent
For one of methylhexahydrophthalic anhydride, phthalic anhydride, maleic anhydride, methylnadic anhydride or a variety of
Mixture；Alicyclic amines curing agent includesBis- (the ammonia first of alkane diamines, N- aminoethyl piperazine, isophorone diamine, 1,3-
Base) one of hexamethylene or a variety of mixtures；
The curing accelerator is 2,4,6- tri- (dimethylamino) phenol (TAP), 2,4,6- tri- (dimethylamino methyl) benzene
Three (2 ethyl hexanoic acid) salt of phenol, one of three oleates of 2,4,6- tri- (dimethylamino methyl) phenol or a variety of mixing
Object；
The toughener is polyalcohol, and the specific trade mark includes JA-782, JA-783；
The coupling agent is silane coupling agent, including methyltrimethoxysilane, dimethyldimethoxysil,ne, vinyl
The mixture of one or more of trimethoxy silane, vinyltriethoxysilane, ethyl orthosilicate；
The sealed colloid ties up to the amido of epoxy group and melamine series fire retardant in use process in epoxy resin
Uniform modified epoxy complex can be formed using the effect of intermolecular hydrogen bond force at low temperature.Further, this is compound
The ring-opening polymerisation of epoxy group can also occur at high temperature for body, form the epoxy networks system of flame retardant type, improve asphalt mixtures modified by epoxy resin
The flame retardant effect of rouge.Simultaneously as introducing rigid melamine structure in epoxy group, the network system after polymerization is also
High temperature resistance with higher.
The present invention also provides the preparation method of related seals glue, concrete scheme is as follows:
The preparation of A glue: mainly including the following steps, (1) is first stirring epoxy resin and melamine flame retardant
It is sufficiently mixed in kettle, mixing temperature is 70-90 DEG C, incorporation time 20-60min, and then cool down to obtain flame-retardant modified epoxy resin；
(2) by fire retardant and silane coupling agent in grinder ground and mixed 20min, the inorganic fire retardants for then sufficiently soaking on surface
It is put into drying in 80-120 DEG C of baking oven, so that coupling agent is sufficiently bonded to the surface of inorganic fire retardants, then cools down modified
Inorganic fire retardants；(3) by modified epoxy resin, modified inorganic fire retardants, diluent, anti-yellowing agent, defoaming agent
It is added sequentially in kneader, sufficiently mediates at 60-80 DEG C to being uniformly mixed, be down to room temperature and obtain A glue；
The preparation of B glue: curing agent, curing accelerator, toughener, coupling agent are added sequentially in kneader, 50-80 DEG C
Lower sufficiently to mediate 30-60min, cooling discharge obtains B glue.
After the vacuum of A glue and B glue 1-5:1 in mass ratio being mixed when use, be poured into the surface of device to be packaged, then
Curing molding can obtain packaging product at 120-170 DEG C.
The packaging plastic of this method preparation has that good flame retardation effect, light transmittance are high, heat resistance is good and good mechanical performance
Characteristic can be widely used for the encapsulation system of LED light source.
Specific embodiment
The principles and features of the present invention are described below, and illustrated embodiment is served only for explaining the present invention, is not intended to
It limits the scope of the invention.Formula as below is by weight calculation:
Embodiment 1.
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A includes bisphenol type epoxy
100 points of resin (E44), 8 parts of melamine, 3 parts of aluminium hydroxide, 6 parts of trihydroxymethylpropanyltri diglycidyl ether, UV-40 type are purple
0.5 part of outer absorbent, 0.2 part of organic silicon defoamer, 3 parts of methyltrimethoxysilane；B component includes methyl hexahydro O-phthalic
100 parts of acid anhydrides, 1 part of 2,4,6- tri- (dimethylamino) phenol, 3 parts of JA-782 type toughener, 4 parts of methyltrimethoxysilane；
The epoxy resin sealant the preparation method is as follows:
Bisphenol A type epoxy resin (E44): (1) being sufficiently mixed by the preparation of A glue in a stirring kettle with melamine first,
Mixing temperature is 75 DEG C, incorporation time 30min, and then cool down to obtain flame-retardant modified epoxy resin；(2) by aluminium hydroxide and methyl
Trimethoxy silane ground and mixed 20min in grinder, the inorganic fire retardants for then sufficiently soaking on surface are put into 100 DEG C
It is dry in baking oven, so that methyltrimethoxysilane is sufficiently bonded to the surface of inorganic fire retardants, then cool down to obtain modified nothing
Machine fire retardant；(3) by modified epoxy resin, modified inorganic fire retardants, trihydroxymethylpropanyltri diglycidyl ether,
UV-40 type ultraviolet absorber, organic silicon defoamer are added sequentially in kneader, are sufficiently mediated at 70 DEG C to being uniformly mixed, are dropped
A glue is obtained to room temperature；
The preparation of B glue: by methylhexahydrophthalic anhydride, 2,4,6- tri- (dimethylamino) phenol, JA-782 type toughening
Agent, methyltrimethoxysilane are added sequentially in kneader, and 40min is sufficiently mediated at 60 DEG C, and cooling discharge obtains B glue.
Embodiment 2.
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A includes bisphenol type epoxy
100 points of resin (E51), 8 parts of uric acid melamine, 3 parts of aluminium hydroxide, 6 parts of trihydroxymethylpropanyltri diglycidyl ether, UV-40
0.5 part of type ultraviolet absorber, 0.3 part of organic silicon defoamer, 8 parts of methyltrimethoxysilane；B component includes maleic anhydride
100 parts, 6 parts of 2,4,6- tri- (dimethylamino) phenol, 4 parts of JA-782 type toughener, 8 parts of methyltrimethoxysilane；
The epoxy resin sealant the preparation method is as follows:
The preparation of A glue: (1) first that bisphenol A type epoxy resin (E51) and uric acid melamine is sufficiently mixed in a stirring kettle
It closes, mixing temperature is 75 DEG C, incorporation time 30min, and then cool down to obtain flame-retardant modified epoxy resin；(2) by aluminium hydroxide with
Methyltrimethoxysilane ground and mixed 20min in grinder, the inorganic fire retardants for then sufficiently soaking on surface are put into 100
DEG C baking oven in it is dry, so that methyltrimethoxysilane is sufficiently bonded to the surface of inorganic fire retardants, then cool down modified
Inorganic fire retardants；(3) by modified epoxy resin, modified inorganic fire retardants, trimethylolpropane tris glycidol
Ether, UV-40 type ultraviolet absorber, organic silicon defoamer are added sequentially in kneader, at 70 DEG C sufficiently mediate to be uniformly mixed,
It is down to room temperature and obtains A glue；
The preparation of B glue: by maleic anhydride, 2,4,6- tri- (dimethylamino) phenol, JA-782 type toughener, methyl three
Methoxy silane is added sequentially in kneader, and 40min is sufficiently mediated at 60 DEG C, and cooling discharge obtains B glue.
Embodiment 3.
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A includes bisphenol type epoxy
100 points of resin (E51), 8 parts of uric acid melamine, 3 parts of magnesium hydroxide, C12-147 parts of aliphatic glycidyl ether, UV-320 type are purple
1 part of outer absorbent, 0.3 part of organic silicon defoamer, 8 parts of methyltrimethoxysilane；B component include 100 parts of maleic anhydride,
6 parts of 2,4,6- tri- (dimethylamino) phenol, 4 parts of JA-782 type toughener, 8 parts of methyltrimethoxysilane；
The epoxy resin sealant the preparation method is as follows:
The preparation of A glue: (1) first that bisphenol A type epoxy resin (E51) and uric acid melamine is sufficiently mixed in a stirring kettle
It closes, mixing temperature is 75 DEG C, incorporation time 30min, and then cool down to obtain flame-retardant modified epoxy resin；(2) by magnesium hydroxide with
Methyltrimethoxysilane ground and mixed 20min in grinder, the inorganic fire retardants for then sufficiently soaking on surface are put into 100
DEG C baking oven in it is dry, so that methyltrimethoxysilane is sufficiently bonded to the surface of inorganic fire retardants, then cool down modified
Inorganic fire retardants；(3) by modified epoxy resin, modified inorganic fire retardants, C12-14Aliphatic glycidyl ether,
UV-320 type ultraviolet absorber, organic silicon defoamer are added sequentially in kneader, are sufficiently mediated at 65 DEG C to being uniformly mixed, are dropped
A glue is obtained to room temperature；
The preparation of B glue: by maleic anhydride, 2,4,6- tri- (dimethylamino) phenol, JA-782 type toughener, methyl three
Methoxy silane is added sequentially in kneader, and 40min is sufficiently mediated at 60 DEG C, and cooling discharge obtains B glue.
Embodiment 4.
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A includes bisphenol type epoxy
100 points of resin (E51), 8 parts of uric acid melamine, 3 parts of magnesium hydroxide, C12-147 parts of aliphatic glycidyl ether, UV-320 type are purple
1 part of outer absorbent, 0.3 part of organic silicon defoamer, 12 parts of vinyltriethoxysilane；B component includes isophorone diamine 100
Part, 3 parts of 2,4,6- tri- (dimethylamino) phenol, 4 parts of JA-783 type toughener, 8 parts of methyltrimethoxysilane；
The epoxy resin sealant the preparation method is as follows:
The preparation of A glue: (1) first that bisphenol A type epoxy resin (E51) and uric acid melamine is sufficiently mixed in a stirring kettle
It closes, mixing temperature is 75 DEG C, incorporation time 30min, and then cool down to obtain flame-retardant modified epoxy resin；(2) by magnesium hydroxide with
Vinyltriethoxysilane ground and mixed 30min in grinder, the inorganic fire retardants for then sufficiently soaking on surface are put into
It is dry in 105 DEG C of baking oven, so that vinyltriethoxysilane is sufficiently bonded to the surface of inorganic fire retardants, then cools down to change
Inorganic fire retardants after property；(3) by modified epoxy resin, modified inorganic fire retardants, C12-14Aliphatic glycidyl
Ether, UV-320 type ultraviolet absorber, organic silicon defoamer are added sequentially in kneader, are sufficiently mediated at 65 DEG C equal to mixing
It is even, it is down to room temperature and obtains A glue；
The preparation of B glue: by isophorone diamine, 2,4,6- tri- (dimethylamino) phenol, JA-783 type toughener, methyl three
Methoxy silane is added sequentially in kneader, and 30min is sufficiently mediated at 50 DEG C, and cooling discharge obtains B glue.
Embodiment 5.
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A includes bisphenol type epoxy
100 points of resin (E51), 8 parts of melamine phosphate, 3 parts of silicon powder, C12-144 parts of aliphatic glycidyl ether, trihydroxy methyl third
3 parts of alkane triglycidyl ether, 0.5 part of UV-9 type ultraviolet absorber, 0.5 part of UV-320 type ultraviolet absorber, organic silicon defoamer
0.3 part, 12 parts of vinyltriethoxysilane；B component includes 100 parts of isophorone diamine, 2,4,6- tri- (dimethylamino) benzene
3 parts of phenol, 4 parts of JA-783 type toughener, 8 parts of methyltrimethoxysilane；
The epoxy resin sealant the preparation method is as follows:
The preparation of A glue: (1) first that bisphenol A type epoxy resin (E51) and melamine phosphate is abundant in a stirring kettle
Mixing, mixing temperature are 75 DEG C, incorporation time 30min, and then cool down to obtain flame-retardant modified epoxy resin；(2) by silicon powder with
Vinyltriethoxysilane ground and mixed 30min in grinder, the inorganic fire retardants for then sufficiently soaking on surface are put into
It is dry in 105 DEG C of baking oven, so that vinyltriethoxysilane is sufficiently bonded to the surface of inorganic fire retardants, then cools down to change
Inorganic fire retardants after property；(3) by modified epoxy resin, modified inorganic fire retardants, C12-14Aliphatic glycidyl
Ether, trihydroxymethylpropanyltri diglycidyl ether, UV-320 type ultraviolet absorber, UV-9 type ultraviolet absorber, organic silicon defoamer
It is added sequentially in kneader, sufficiently mediates at 80 DEG C to being uniformly mixed, be down to room temperature and obtain A glue；
The preparation of B glue: by isophorone diamine, 2,4,6- tri- (dimethylamino) phenol, JA-783 type toughener, methyl three
Methoxy silane is added sequentially in kneader, and 30min is sufficiently mediated at 50 DEG C, and cooling discharge obtains B glue.
Embodiment 6.
A kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A includes hydrogenated bisphenol A type
Epoxy resin 100 divides, 5 parts of melamine, 3 parts of magnesia, C12-144 parts of aliphatic glycidyl ether, trimethylolpropane tris contracting
3 parts of water glycerin ether, 0.5 part of UV-9 type ultraviolet absorber, 0.5 part of UV-320 type ultraviolet absorber, 0.3 part of organic silicon defoamer,
12 parts of vinyltriethoxysilane；B component include 100 parts of isophorone diamine, 3 parts of 2,4,6- tri- (dimethylamino) phenol,
4 parts of JA-783 type toughener, 8 parts of methyltrimethoxysilane；
The epoxy resin sealant the preparation method is as follows:
Bisphenol-A epoxy resin: (1) being sufficiently mixed by the preparation of A glue in a stirring kettle with melamine first, mixes
Closing temperature is 80 DEG C, incorporation time 45min, and then cool down to obtain flame-retardant modified epoxy resin；(2) by magnesia and vinyl three
Ethoxysilane ground and mixed 30min in grinder, the inorganic fire retardants for then sufficiently soaking on surface are put into 95 DEG C of baking
It is dry in case, so that vinyltriethoxysilane is sufficiently bonded to the surface of inorganic fire retardants, then cool down to obtain modified nothing
Machine fire retardant；(3) by modified epoxy resin, modified inorganic fire retardants, C12-14Aliphatic glycidyl ether, three hydroxyl first
Base propane triglycidyl ether, UV-320 type ultraviolet absorber, UV-9 type ultraviolet absorber, organic silicon defoamer are added sequentially to
In kneader, sufficiently mediates at 80 DEG C to being uniformly mixed, be down to room temperature and obtain A glue；
The preparation of B glue: by isophorone diamine, 2,4,6- tri- (dimethylamino) phenol, JA-783 type toughener, methyl three
Methoxy silane is added sequentially in kneader, and 30min is sufficiently mediated at 50 DEG C, and cooling discharge obtains B glue.
Comparative example 1.
Formula used is similar to Example 1, and the main distinction is without containing melamine flame retardants, also not to asphalt mixtures modified by epoxy resin
Rouge is modified processing, and other preparation processes are same.
Comparative example 2.
Formula used is similar to Example 3, and the main distinction is without containing uric acid melamine flame retardants, also not to ring
Oxygen resin is modified processing, and other preparation processes are same.
Comparative example 3.
Formula used is similar to Example 5, and the main distinction is not containing melamine phosphate fire retardant, and also no pair
Epoxy resin is modified processing, and other preparation processes are same.
For the performance characteristics for evaluating above-described embodiment and comparative example, glue is made by different proportion respectively in A, B glue of preparation
Plate, tests its tensile property, glass transition temperature, transmittance data respectively, and correlated results is as follows:
As the analysis of above-described embodiment and comparative example as it can be seen that the mechanical property of the solidfied material of sealant prepared by the present invention
It is significantly increased with flame retardant property, while also improving its heat resistance, and do not influence the light transmittance of product.
The epoxy resin includes bisphenol A type epoxy resin and bisphenol-A epoxy resin, the ring of the epoxy resin
Oxygen value is between 0.02-0.56；
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, including A, B component, wherein component A is resin matrix, B component
It for curative systems, calculates by weight, the concrete composition of each component is as follows:
Component A: epoxy resin 100 divides, 2-15 parts of melamine series fire retardant, 2-10 parts of inorganic fire retardants, diluent 5-20
Part, 0.2-5 parts of anti-yellowing agent, 0.1-2 parts of defoaming agent, 2-12 parts of coupling agent；B component: 100 parts of curing agent, curing accelerator
0.5-8 parts, 0.2-5 parts of toughener, 3-15 parts of coupling agent；Melamine series fire retardant can be to epoxy resin in the component A
It is modified, forms modified flame-retardant epoxy resin-base.
2. a kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant according to claim 1, it is characterised in that the trimerization
Cyanamide fire-retardant agent includes one of melamine, uric acid melamine or melamine phosphate or a variety of combinations
Object.
3. a kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant according to claim 1, which is characterized in that the epoxy
Resin includes bisphenol A type epoxy resin and bisphenol-A epoxy resin, and the epoxide number of the epoxy resin is in 0.02-0.56
Between.
4. a kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant according to claim 1, which is characterized in that described inorganic
Fire retardant includes one of magnesium hydroxide, aluminium hydroxide, silicon powder, zinc borate, magnesia, aluminium oxide or a variety of mixing
Object；
The diluent includes trihydroxymethylpropanyltri diglycidyl ether or C12-14One of aliphatic glycidyl ether or two
The mixture of person；
The anti-yellowing agent is ultraviolet absorbing agent, including UV-40, UV-531, UV-9, UV-P, UV-329, UV-326, UV-
320, one of UV-234, UV-0 or a variety of mixtures；
The defoaming agent is organic silicon defoamer；
Coupling agent in the component A is silane coupling agent, including methyltrimethoxysilane, dimethyldimethoxysil,ne,
The mixture of one or more of vinyltrimethoxysilane, vinyltriethoxysilane, ethyl orthosilicate.
5. a kind of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant according to claim 1, which is characterized in that the solidification
Agent includes organic acid anhydride type curing agent or alicyclic amines curing agent, and wherein organic acid anhydride curing agent is methyl hexahydro neighbour benzene two
One of formic anhydride, phthalic anhydride, maleic anhydride, methylnadic anhydride or a variety of mixtures；It is alicyclic
Amine curing agent includesOne of bis- (aminomethyl) hexamethylenes of alkane diamines, N- aminoethyl piperazine, isophorone diamine, 1,3-
Or a variety of mixture；
The curing accelerator is 2,4,6- tri- (dimethylamino) phenol (TAP), 2,4,6- tri- (dimethylamino methyl) phenol
One of three oleates or a variety of mixtures of three (2 ethyl hexanoic acid) salt, 2,4,6- tri- (dimethylamino methyl) phenol；
The toughener is polyalcohol, and the specific trade mark includes JA-782, JA-783；
Coupling agent in the B component is silane coupling agent, including methyltrimethoxysilane, dimethyldimethoxysil,ne,
The mixture of one or more of vinyltrimethoxysilane, vinyltriethoxysilane, ethyl orthosilicate.
6. the preparation method of halogen-free flame-resistant high-temperature-resistant epoxy resin sealant, feature described in any one of claim 1-5 exist
In including the following steps:
Epoxy resin and melamine flame retardant: (1) being sufficiently mixed by the preparation of A glue in a stirring kettle first, mixing temperature
It is 70-90 DEG C, incorporation time 20-60min, then cool down to obtain flame-retardant modified epoxy resin；(2) by fire retardant with it is silane coupled
Agent ground and mixed 20min in grinder, the inorganic fire retardants for then sufficiently soaking on surface are put into 80-120 DEG C of baking oven
It is dry, so that coupling agent is sufficiently bonded to the surface of inorganic fire retardants, then cool down to obtain modified inorganic fire retardants；(3) will change
Epoxy resin, modified inorganic fire retardants, diluent, anti-yellowing agent, defoaming agent after property are added sequentially in kneader,
It sufficiently mediates at 60-80 DEG C to being uniformly mixed, is down to room temperature and obtains A glue；
The preparation of B glue: curing agent, curing accelerator, toughener, coupling agent are added sequentially in kneader, are filled at 50-80 DEG C
Divide and mediate 30-60min, cooling discharge obtains B glue.
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