CN109971097A - A kind of environmentally protective bamboo and woods fiber circuit board and its manufacturing method - Google Patents
A kind of environmentally protective bamboo and woods fiber circuit board and its manufacturing method Download PDFInfo
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- CN109971097A CN109971097A CN201910337237.1A CN201910337237A CN109971097A CN 109971097 A CN109971097 A CN 109971097A CN 201910337237 A CN201910337237 A CN 201910337237A CN 109971097 A CN109971097 A CN 109971097A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/102—Azo-compounds
- C08J9/103—Azodicarbonamide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/04—N2 releasing, ex azodicarbonamide or nitroso compound
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08J2327/06—Homopolymers or copolymers of vinyl chloride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2497/00—Characterised by the use of lignin-containing materials
- C08J2497/02—Lignocellulosic material, e.g. wood, straw or bagasse
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
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- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
A kind of environmentally protective bamboo and woods fiber circuit board, by weight, including following components: 8-12 parts of bamboo fibre powder;12-18 parts of wood fiber powder;90-110 parts of powdered whiting;90-110 parts of Corvic;8-12 parts of ethylene-vinyl acetate copolymer;4-5 parts of heat stabilizer;5-6 parts of foaming control agent;0.6-1.2 parts of foaming agent;0.5-1 parts of stearic acid;0.5-1 parts of PE wax;5-10 parts of medical stone;0-10 parts of barite, further include tin element, and the tin element comes from stanniferous inorganic compound.Based on the total weight of the environmentally protective bamboo and woods fiber circuit board, the mass content of the tin element is 0.095-0.115%.The invention also discloses the manufacturing methods of above-mentioned environmentally protective bamboo and woods fiber circuit board.Not only tensile strength is improved the bamboo and woods fiber circuit board, but also water resistance is preferable, finds after tested, and the compression strength of bamboo and woods fiber circuit board provided by the invention can reach 15.2Mpa or more, and coefficient of softing can reach 1.12 or more.
Description
Technical field
The present invention relates to indoor circuit board technical field, be related specifically to a kind of environmentally protective bamboo and woods fiber circuit board and its
Manufacturing method.
Background technique
Bamboo and woods fiber integrated wall plate is a kind of quick decoration material, can be adapted for indoor any wall and top at present.Family
Dress can be used for kitchen, parlor, toilet, bedroom, child room, old room, gymnasium etc., easy for installation quick.Bamboo is the world
Upper generally acknowledged growth most rapidly, one of the maximum plant of unit plane accumulated amount, bamboo once afforests success, can cut selectively every year it is raw not
Breath, continuous utilization replace part timber environmentally protective using being conducive to without destroying ecological environment, therefore using bamboo,
And bamboo and woods fiber circuit board itself is free of formaldehyde, is a kind of very environmentally protective material, and the enthusiasm for being increasingly subject to people chases after
It holds in both hands.
The Chinese patent of Publication No. 106995303A discloses a kind of bamboo and woods fiber plate and preparation method thereof: by wood-fibred
45~55 parts uniformly mix drying with 12~18 parts of bamboo fibre, and 20~27 parts of magnesia and 5~7 parts of magnesium chloride are added, add
4~6 parts and 0.05~0.2 part of tourmaline powder of adhesive, mixing is press-formed to obtain the final product.The bamboo and wood being prepared by this method
Fiberboard density is smaller, and water content is not higher than 8%, and fire-protection rating can reach B1 grades or more.But the tension of the bamboo and woods fiber plate
Intensity and water resistance are bad, and tensile strength is up to state standards reluctantly, and even national standard is not achieved in water resistance, greatly limit
The application of the bamboo and woods fiber plate.
Summary of the invention
The purpose of the present invention is to provide the preferably environmentally protective bamboo and woods fiber circuit boards of a kind of tensile strength and water resistance.
To solve the above-mentioned problems, using following technical scheme: a kind of environmentally protective bamboo and woods fiber circuit board, including with
Lower component: 8-12 parts of bamboo fibre powder;12-18 parts of wood fiber powder;90-110 parts of powdered whiting;Corvic 90-110
Part;8-12 parts of ethylene-vinyl acetate copolymer;4-5 parts of heat stabilizer;5-6 parts of foaming control agent;0.6-1.2 parts of foaming agent;Firmly
0.5-1 parts of resin acid;0.5-1 parts of PE wax;5-10 parts of medical stone;0-10 parts of barite.
Preferably, the environmentally protective bamboo and woods fiber circuit board includes following components: 10 parts of bamboo fibre powder;Wood fiber powder 15
Part;100 parts of powdered whiting;100 parts of Corvic;10 parts of ethylene-vinyl acetate copolymer;4.5 parts of heat stabilizer;
5.5 parts of foaming control agent;0.9 part of foaming agent;0.75 part of stearic acid;0.75 part of PE wax;8 parts of medical stone;5 parts of barite.
Wherein, the environmentally protective bamboo and woods fiber circuit board further includes tin element, and the tin element is from stanniferous inorganization
Object is closed, based on the total weight of the environmentally protective bamboo and woods fiber circuit board, the mass content of the tin element is 0.095-
0.115%。
It is highly preferred that the total weight based on the environmentally protective bamboo and woods fiber circuit board, the mass content of the tin element
It is 0.105%.
Preferably, the stanniferous inorganic compound is sodium stannate.
Wherein, the mesh number of the bamboo fibre powder and wood fiber powder is 80-120 mesh.
Wherein, the mesh number of the powdered whiting is 80-300 mesh.
Wherein, the heat stabilizer is calcium-zinc composite stabilizing agent, and the foaming agent is azodicarbonamide.
A kind of manufacturing method of environmentally protective bamboo and woods fiber circuit board, comprising the following steps:
A. compounding is begun to pratise: bamboo fibre powder, wood fiber powder, powdered whiting, Corvic, ethene-vinyl acetate are copolymerized
Object, heat stabilizer, foaming control agent, foaming agent, PE wax, stearic acid, medical stone, barite and the mixing of stanniferous inorganic compound are stirred
Uniformly simultaneously preplasticizing is mixed, obtains mixing material;
B. extrusion forming: extruder hopper is added in the mixing material after step A preplasticizing, control processing temperature is 150~170 DEG C
Extrusion molding;
C. sizing cooling: the material of step B forming is entered into vacuum cooling tank by calibration sleeve and carries out shaping and is cooled to room
Temperature;
D. sawing and press polish pad pasting: cutting obtains semi-finished product, and semi-finished product are then carried out the processing of press polish pad pasting to get in the present invention
The environmentally protective bamboo and woods fiber circuit board.
Compared to the prior art, the invention has the following advantages:
1, the present invention is by being added stanniferous inorganic compound, and tin element in the environmentally protective bamboo and woods fiber circuit board of strict control
Mass content, not only increases the tensile strength of bamboo and woods fiber circuit board, and improves its water resistance, finds after tested,
The compression strength of bamboo and woods fiber circuit board produced by the present invention can reach 15.2Mpa or more, and coefficient of softing can reach 1.12 or more.
2, the present invention is by being added medical stone, strengthens bamboo and woods fiber circuit board to the adsorption capacity of indoor harmful gas,
Further improve the environmentally protective performance of bamboo and woods fiber plate.
3, the present invention selectively adds barite, and barite has storage heating effects, can enable heat uniform conductive, to make
Floor heating product can be also suitable for by obtaining bamboo and woods fiber circuit board provided by the invention.
Specific embodiment
Embodiment is given below so that the present invention to be specifically described, it is necessary to which indicated herein is following embodiment
It is used to further illustrate the present invention, should not be understood as limiting the scope of the invention, the ordinary skill in the field
Personnel still fall within protection scope of the present invention to some nonessential improvement of the invention made or adjustment according to this embodiment.
Embodiment 1-3 and comparative example 1-2
A kind of environmentally protective bamboo and woods fiber circuit board, manufacturing method are as follows:
A. compounding is begun to pratise: being formulated by table 1, by bamboo fibre powder, wood fiber powder, powdered whiting, Corvic, ethylene-vinegar
Sour ethylene copolymer, heat stabilizer, K100 foaming control agent, foaming agent, PE wax, stearic acid, medical stone, barite and stanniferous nothing
Machine compound is mixed evenly and preplasticizing, obtains mixing material;
B. extrusion forming: extruder hopper is added in the mixing material after step A preplasticizing, control processing temperature is 150~170 DEG C
Extrusion molding;
C. sizing cooling: the material of step B forming is entered into vacuum cooling tank by calibration sleeve and carries out shaping and is cooled to room
Temperature;
D. sawing and press polish pad pasting: cutting obtains semi-finished product, then by semi-finished product carry out the processing of press polish pad pasting to get.
Wherein, the mesh number of bamboo fibre powder and wood fiber powder is 100 mesh, and the mesh number of powdered whiting is 120 mesh, thermostabilization
Agent is calcium-zinc composite stabilizing agent, and foaming agent is azodicarbonamide.
Wherein, the mass content of tin element is 0.095% in embodiment 1, and the mass content of tin element is in embodiment 2
0.105%, the mass content of tin element is 0.115% in embodiment 3, is added in comparative example 1 without tin element, tin member in comparative example 2
The mass content of element is 0.12%.
Comparative example 3
A kind of bamboo and woods fiber plate, referring to the embodiment 1 of the Chinese patent of the Publication No. 106995303A mentioned in background technique
It obtains, raw material is as follows: 50 parts by weight of wood fiber powder, 15 parts of bamboo fibre powder, 24 parts of magnesia, 6 parts of magnesium chloride, vegetable protein glue
5 parts of stick, 0.1 part of tourmaline powder.
The compression strength and coefficient of softing of bamboo and woods fiber plate obtained in embodiment 1-3 and comparative example 1-3 are referring to GB/
23451-2009 " light partition board for building " test obtains, and test result see the table below shown in 2.
By the test result of upper table 2 it is found that the compression strength of the bamboo and woods fiber plate in embodiment 1-3 can reach 15.2Mpa
More than, coefficient of softing can reach 1.12 or more, be much higher than standard requirements, that is, it is integrated to demonstrate bamboo and woods fiber provided by the invention
Plate has both excellent tensile strength and water resistance.Comparative example 1 and comparative example 2 are different except the content of sodium stannate in the raw material being added
In addition, other conditions are all the same, find after comparing: tin element is not added for comparative example 1, and the tin element that comparative example 2 is added contains
It measures excessively high, tests obtained tensile strength and coefficient of softing is obviously inferior to embodiment 1-3.In addition, existing in comparative example 3
The tensile strength of bamboo and woods fiber plate is only capable of reaching 5.2 Mpa, can achieve standard requirements reluctantly, and coefficient of softing is even more to be lower than standard
It is required that.
Claims (10)
1. a kind of environmentally protective bamboo and woods fiber circuit board, which is characterized in that by weight, including following components: bamboo fibre powder
8-12 parts;12-18 parts of wood fiber powder;90-110 parts of powdered whiting;90-110 parts of Corvic;Ethene-vinyl acetate
8-12 parts of copolymer;4-5 parts of heat stabilizer;5-6 parts of foaming control agent;0.6-1.2 parts of foaming agent;0.5-1 parts of stearic acid;PE wax
0.5-1 parts;5-10 parts of medical stone;0-10 parts of barite.
2. environmentally protective bamboo and woods fiber circuit board according to claim 1, which is characterized in that including following components: bamboo is fine
10 parts of powder of dimension;15 parts of wood fiber powder;100 parts of powdered whiting;100 parts of Corvic;Ethylene-vinyl acetate copolymer
10 parts;4.5 parts of heat stabilizer;5.5 parts of foaming control agent;0.9 part of foaming agent;0.75 part of stearic acid;0.75 part of PE wax;Medical stone
8 parts;5 parts of barite.
3. environmentally protective bamboo and woods fiber circuit board according to claim 1 or 2, which is characterized in that it further include tin element, institute
Tin element is stated from stanniferous inorganic compound.
4. environmentally protective bamboo and woods fiber circuit board according to claim 3, which is characterized in that be based on the environmentally protective bamboo
The total weight of wood-fibred circuit board, the mass content of the tin element are 0.095-0.115%.
5. environmentally protective bamboo and woods fiber circuit board according to claim 4, which is characterized in that be based on the environmentally protective bamboo
The total weight of wood-fibred circuit board, the mass content of the tin element are 0.105%.
6. environmentally protective bamboo and woods fiber circuit board according to claim 3, which is characterized in that the stanniferous inorganic compound
For sodium stannate.
7. environmentally protective bamboo and woods fiber circuit board according to claim 1, which is characterized in that the bamboo fibre powder and wood are fine
The mesh number for tieing up powder is 80-120 mesh.
8. environmentally protective bamboo and woods fiber circuit board according to claim 1, which is characterized in that the mesh of the powdered whiting
Number is 80-300 mesh.
9. environmentally protective bamboo and woods fiber circuit board according to claim 1, which is characterized in that the heat stabilizer is calcium zinc
Compound stabilizer, the foaming agent are azodicarbonamide.
10. the manufacturing method of the described in any item environmentally protective bamboo and woods fiber circuit boards of claim 1-9, which is characterized in that packet
Include following steps:
A. compounding is begun to pratise: bamboo fibre powder, wood fiber powder, powdered whiting, Corvic, ethene-vinyl acetate are copolymerized
Object, heat stabilizer, foaming control agent, foaming agent, PE wax, stearic acid, medical stone, barite and the mixing of stanniferous inorganic compound are stirred
Uniformly simultaneously preplasticizing is mixed, obtains mixing material;
B. extrusion forming: extruder hopper is added in the mixing material after step A preplasticizing, control processing temperature is 150~170 DEG C
Extrusion molding;
C. sizing cooling: the material of step B forming is entered into vacuum cooling tank by calibration sleeve and carries out shaping and is cooled to room
Temperature;
D. sawing and press polish pad pasting: cutting obtains semi-finished product, and semi-finished product are then carried out the processing of press polish pad pasting to get in the present invention
The environmentally protective bamboo and woods fiber circuit board.
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111019272A (en) * | 2019-12-30 | 2020-04-17 | 唐山市唯森新材料有限公司 | Negative ion decorative material, preparation method thereof, decorative plate and application thereof |
CN111907181A (en) * | 2020-08-13 | 2020-11-10 | 东莞顺裕纸业有限公司 | High-strength impact-resistant composite corrugated paper and preparation method thereof |
CN111945992A (en) * | 2020-07-28 | 2020-11-17 | 湖南恒信新型建材有限公司 | Mounting method of assembled bamboo-wood fiber board |
CN112092130A (en) * | 2020-08-25 | 2020-12-18 | 湖南恒信新型建材有限公司 | Bamboo fiber powder, bamboo fiber composite board and preparation method thereof |
CN112745603A (en) * | 2021-01-19 | 2021-05-04 | 湖南恒信新型建材有限公司 | Sulfonic biochar flame-retardant wood-plastic plate and production method thereof |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111019272A (en) * | 2019-12-30 | 2020-04-17 | 唐山市唯森新材料有限公司 | Negative ion decorative material, preparation method thereof, decorative plate and application thereof |
CN111945992A (en) * | 2020-07-28 | 2020-11-17 | 湖南恒信新型建材有限公司 | Mounting method of assembled bamboo-wood fiber board |
CN111907181A (en) * | 2020-08-13 | 2020-11-10 | 东莞顺裕纸业有限公司 | High-strength impact-resistant composite corrugated paper and preparation method thereof |
CN112092130A (en) * | 2020-08-25 | 2020-12-18 | 湖南恒信新型建材有限公司 | Bamboo fiber powder, bamboo fiber composite board and preparation method thereof |
CN112092130B (en) * | 2020-08-25 | 2022-04-08 | 湖南恒信新型建材有限公司 | Bamboo fiber powder, bamboo fiber composite board and preparation method thereof |
CN112745603A (en) * | 2021-01-19 | 2021-05-04 | 湖南恒信新型建材有限公司 | Sulfonic biochar flame-retardant wood-plastic plate and production method thereof |
WO2022156287A1 (en) * | 2021-01-19 | 2022-07-28 | 湖南恒信新型建材有限公司 | Sulfo group-containing biochar flame-retardant wood-plastic board, and production method thereof |
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