CN109962050B - Pin for component - Google Patents
Pin for component Download PDFInfo
- Publication number
- CN109962050B CN109962050B CN201910317163.5A CN201910317163A CN109962050B CN 109962050 B CN109962050 B CN 109962050B CN 201910317163 A CN201910317163 A CN 201910317163A CN 109962050 B CN109962050 B CN 109962050B
- Authority
- CN
- China
- Prior art keywords
- solder paste
- pin
- bottom plate
- pin bottom
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 92
- 230000009194 climbing Effects 0.000 claims abstract description 11
- 230000000149 penetrating effect Effects 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adornments (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
A pin for a component belongs to the technical field of component pins and comprises a pin connecting plate and a pin bottom plate; the end face of the left end of the pin connecting plate is fixed with a pin bottom plate, the end part of the left end of the pin bottom plate is a climbing inclined plane, the climbing inclined plane is an inclined plane which is obliquely upwards arranged by the bottom surface of the pin bottom plate, a plurality of parallel solder paste retaining grooves are arranged on the pin bottom plate, and the solder paste retaining grooves are through grooves which penetrate through the pin bottom plate. The invention is used for solving the technical problems that the traditional pins are easy to float and cold joint during welding.
Description
Technical Field
The invention relates to the technical field of component pins, in particular to a pin for a component.
Background
With the popularization of computers and the development of various data clouds, the application of servers and personal computers is increasing, the functions of the servers and the personal computers tend to be powerful, the number of components connected to the main board is increasing, and most of the components are connected to the main board through pins.
When the solder paste is applied to the surface of a main board, solder paste is needed to be applied to the components with the pins, the existing pins are basically formed by bending metal sheets, the pins have a certain width, the solder paste is placed right below the pins, the solder paste has a certain viscosity, the solder paste is in a spherical state when placed, the solder paste in the spherical state can cause the problem of high welding floating due to the thickness of the solder paste in the spherical state when placed on the solder paste in the spherical state, and on the other hand, the solder paste cannot be in complete contact with the pins, so that the phenomenon of cold welding is easy to cause, and the components cannot be completely welded to the main board, so that the components cannot be used.
Disclosure of Invention
The invention aims to provide a pin for a component, which is used for solving the technical problems that the traditional pin is easy to float and cold joint during welding.
The technical scheme adopted for solving the technical problems is as follows:
A pin for a component comprises a pin connecting plate and a pin bottom plate; the end face of the left end of the pin connecting plate is fixed with a pin bottom plate, the end part of the left end of the pin bottom plate is a climbing inclined plane, the climbing inclined plane is an inclined plane which is obliquely upwards arranged by the bottom surface of the pin bottom plate, a plurality of parallel solder paste retaining grooves are arranged on the pin bottom plate, and the solder paste retaining grooves are through grooves which penetrate through the pin bottom plate.
The cross section of the pin bottom plate is triangular.
The solder paste retaining grooves are rectangular long grooves, the width of each solder paste retaining groove is 0.5mm, and the distance between every two adjacent solder paste retaining grooves is 0.5mm.
The lower part of the inner walls of two sides of each solder paste reserve tank is provided with a plurality of first protruding points, and the first protruding points are cylinders.
A row of solder paste grooves are formed in the bottom surface of the pin bottom plate on two sides of each solder paste reserve groove, each row of solder paste grooves are rectangular grooves, the number of each row of solder paste grooves is multiple, and the distance between every two adjacent solder paste grooves is 0.3mm.
The upper surface of the inside of every solder paste recess all is equipped with a plurality of second bump, the second bump is the cylinder, and the lower terminal surface of second bump is in the coplanar with the bottom surface of pin bottom plate.
The effects provided in the present disclosure are merely effects of embodiments, and not all effects of the invention, and the above technical solution has the following advantages or beneficial effects:
1. According to the pins for the components, the plurality of solder paste retaining grooves are uniformly distributed on the pin bottom plate, the solder paste retaining grooves are through grooves penetrating through the pin bottom plate, when the pin bottom plate is placed on the solder paste, the solder paste can be dispersed on the lower surface of the pin bottom plate and in the pin retaining grooves, so that the overall thickness of the solder paste is reduced, the problem of floating height is solved, the pin bottom plate is fully contacted with the solder paste, and the problem of cold joint of the traditional pins is solved.
2. According to the pin for the component, the first salient points are arranged in the solder paste reserve tank, and the first salient points can increase the contact area with the solder paste, so that the solder paste can be better contacted with the pin bottom plate, and the stability after welding is improved.
3. According to the pin for the component, the left end part of the pin bottom plate is the climbing inclined plane, the climbing inclined plane is the inclined upward inclined plane, so that the extruded solder paste can conveniently climb upwards along the inclined plane, and the contact area between the solder paste and the pin bottom plate is increased.
4. According to the pin for the component, the plurality of solder paste grooves are formed in the bottom surface of the pin bottom plate, so that solder paste can not be extruded out of the bottom surface of the pin bottom plate completely, the contact area between the bottom surface of the pin bottom plate and the solder paste is increased, and the overall stability of the welded pin bottom plate is improved.
Drawings
FIG. 1 is a schematic diagram of a connection structure between a pin body and a component according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an embodiment of the present invention;
FIG. 3 is a schematic diagram of the pin base plate of FIG. 2;
Fig. 4 is an enlarged partial schematic view of the pin base plate of fig. 3.
In the figure: 1. the device comprises a pin connecting plate, a pin bottom plate, a solder paste reserve tank, a climbing inclined plane, a solder paste groove, a first bump, a second bump and a component.
Detailed Description
In order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below with reference to the following detailed description and the accompanying fig. 1 to 4. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and well-known techniques are omitted so as to not unnecessarily obscure the present invention.
A pin for a component comprises a pin connecting plate 1 and a pin bottom plate 2; the end face of the left end of the pin connecting plate 1 is fixed with a pin bottom plate 2, the end part of the left end of the pin bottom plate 2 is a climbing inclined plane 22, the climbing inclined plane 22 is an inclined plane which is obliquely upwards arranged by the bottom face of the pin bottom plate 2, a plurality of parallel solder paste retaining grooves 21 are arranged on the pin bottom plate 2, and the solder paste retaining grooves 21 are through grooves which penetrate through the pin bottom plate 2.
The pin connecting plate 1 is a rectangular plate, the left end of the pin connecting plate 1 is fixedly provided with a pin bottom plate 2, and the right end of the pin connecting plate 1 is fixedly arranged on the side surface of the component 3.
The cross section of the pin bottom plate 2 is triangular, so that on one hand, the overall stability of the welded component 2 can be improved, and on the other hand, compared with a traditional metal sheet, the weight of the pin bottom plate 2 can be increased, and the weight of the part can play a role in extruding solder paste.
After the solder paste is extruded from the pin bottom plate 2, the climbing inclined plane 22 is convenient for the solder paste to climb upwards along the inclined plane, so that the contact area between the solder paste and the pin bottom plate 2 is increased.
The solder paste retaining groove 21 is a rectangular long groove, the solder paste retaining groove 21 is a through groove penetrating the pin bottom plate 2 upwards from the bottom surface of the pin bottom plate 2, when the bottom surface of the pin bottom plate 2 is placed on solder paste, the solder paste can be dispersed on the lower surface of the pin bottom plate 2 and in the solder paste retaining groove 21, so that the thickness of the whole solder paste is reduced, the problem of floating height is solved, the pin bottom plate 2 is fully contacted with the solder paste, and the problem of cold joint of the traditional pins is solved.
The width of the solder paste reservoir 21 was 0.5mm, and the interval between each two adjacent solder paste reservoirs 21 was 0.5mm.
The lower part of each solder paste reserve tank 21 both sides inner wall all is equipped with a plurality of first bump 24, first bump 24 is the cylinder, first bump can increase the area of contact with the solder paste, makes solder paste and pin bottom plate 2 better contact, increases the steadiness after the welding.
A row of solder paste grooves 23 are formed in the bottom surface of the pin bottom plate 2 on two sides of each solder paste reserve tank 21, each solder paste groove 23 is a rectangular groove, each row of solder paste grooves 23 are arranged in parallel with the length direction of the solder paste reserve tank 21, the solder paste grooves 23 can ensure that solder paste cannot be completely extruded out of the bottom surface of the pin bottom plate 2, the contact area between the bottom surface of the pin bottom plate 2 and the solder paste is increased, and therefore the overall stability of the welded pin bottom plate 2 is improved.
The number of the solder paste grooves 23 in each row is multiple, and the interval between every two adjacent solder paste grooves 23 is 0.3mm.
The upper surface of the inside of each solder paste groove 23 is provided with a plurality of second protruding points 25, each second protruding point 25 is a cylinder, the lower end surface of each second protruding point 25 and the bottom surface of the pin bottom plate 2 are positioned on the same plane, and the contact area between the bottom surface of the pin bottom plate 2 and the solder paste can be increased by the second protruding points 25.
The working principle of the invention is as follows:
through equipartition has a plurality of solder paste holding tanks 23 on the pin bottom plate, and solder paste holding tank 23 is the logical groove that runs through pin bottom plate 2, and when pin bottom plate 2 was placed on the solder paste, the solder paste can disperse in the lower surface of pin bottom plate 2 and pin holding tank 23, has reduced the holistic thickness of solder paste on the one hand, has solved the problem of floating height, and on the other hand also makes pin bottom plate 2 and solder paste fully contact, has solved the problem of the rosin joint that traditional pin appears.
Other than the technical features described in the specification, all are known to those skilled in the art.
While the foregoing description of the embodiments of the present invention has been presented with reference to the drawings, it is not intended to limit the scope of the invention, and on the basis of the technical solutions of the present invention, various modifications or variations can be made by those skilled in the art without the need of inventive effort, and still remain within the scope of the invention.
Claims (4)
1. The pin for the component is characterized by comprising a pin connecting plate and a pin bottom plate; the end face of the left end of the pin connecting plate is fixed with a pin bottom plate, the end part of the left end of the pin bottom plate is a climbing inclined plane which is an inclined plane obliquely upwards arranged from the bottom surface of the pin bottom plate, the pin bottom plate is provided with a plurality of parallel solder paste retaining grooves, and the solder paste retaining grooves are through grooves penetrating through the pin bottom plate;
the lower parts of the inner walls of the two sides of each solder paste reserve tank are respectively provided with a plurality of first protruding points, and the first protruding points are cylinders;
A row of solder paste grooves are formed in the bottom surface of the pin bottom plate on two sides of each solder paste reserve tank, each row of solder paste grooves is a rectangular groove, the number of each row of solder paste grooves is multiple, and the interval between every two adjacent solder paste grooves is 0.3mm;
through equipartition have a plurality of solder paste holding tanks on the pin bottom plate, the solder paste holding tank is the logical groove that runs through the pin bottom plate, and when the pin bottom plate was placed on the solder paste, the solder paste can disperse in the lower surface of pin bottom plate and the pin holding tank, reduces the holistic thickness of solder paste, solves the problem of floating height for the pin bottom plate fully contacts with the solder paste, solves the problem of the rosin joint that the pin appears.
2. A pin for a component as claimed in claim 1, wherein the cross section of the pin base is triangular.
3. A pin for a component as claimed in claim 1, wherein the solder paste reservoirs are rectangular slots having a width of 0.5mm, and each of the adjacent solder paste reservoirs has a pitch of 0.5mm.
4. The pin for components of claim 1, wherein a plurality of second bumps are provided on the inner upper surface of each solder paste groove, the second bumps are cylindrical, and the lower end surfaces of the second bumps are in the same plane with the bottom surface of the pin bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910317163.5A CN109962050B (en) | 2019-04-19 | 2019-04-19 | Pin for component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910317163.5A CN109962050B (en) | 2019-04-19 | 2019-04-19 | Pin for component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109962050A CN109962050A (en) | 2019-07-02 |
| CN109962050B true CN109962050B (en) | 2024-04-26 |
Family
ID=67026222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910317163.5A Active CN109962050B (en) | 2019-04-19 | 2019-04-19 | Pin for component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109962050B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111653537B (en) * | 2020-07-15 | 2022-02-22 | 苏州达亚电子有限公司 | Insulated isolation semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315519A (en) * | 1992-05-08 | 1993-11-26 | Seiko Epson Corp | Semiconductor element |
| JPH0730042A (en) * | 1993-07-13 | 1995-01-31 | Sony Corp | Lead frame, for semiconductor device, semiconductor device using same, and manufacture thereof |
| JP2012104708A (en) * | 2010-11-11 | 2012-05-31 | Shindengen Electric Mfg Co Ltd | Connection plate, joint structure, and semiconductor device |
| CN209561385U (en) * | 2019-04-19 | 2019-10-29 | 苏州浪潮智能科技有限公司 | A kind of pin on component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9972558B1 (en) * | 2017-04-04 | 2018-05-15 | Stmicroelectronics, Inc. | Leadframe package with side solder ball contact and method of manufacturing |
-
2019
- 2019-04-19 CN CN201910317163.5A patent/CN109962050B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315519A (en) * | 1992-05-08 | 1993-11-26 | Seiko Epson Corp | Semiconductor element |
| JPH0730042A (en) * | 1993-07-13 | 1995-01-31 | Sony Corp | Lead frame, for semiconductor device, semiconductor device using same, and manufacture thereof |
| JP2012104708A (en) * | 2010-11-11 | 2012-05-31 | Shindengen Electric Mfg Co Ltd | Connection plate, joint structure, and semiconductor device |
| CN209561385U (en) * | 2019-04-19 | 2019-10-29 | 苏州浪潮智能科技有限公司 | A kind of pin on component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109962050A (en) | 2019-07-02 |
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