CN202780161U - Carrier for wave soldering - Google Patents
Carrier for wave soldering Download PDFInfo
- Publication number
- CN202780161U CN202780161U CN 201220370226 CN201220370226U CN202780161U CN 202780161 U CN202780161 U CN 202780161U CN 201220370226 CN201220370226 CN 201220370226 CN 201220370226 U CN201220370226 U CN 201220370226U CN 202780161 U CN202780161 U CN 202780161U
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- Prior art keywords
- tin
- carrier
- pad
- pin
- wave soldering
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Abstract
The utility model discloses a carrier for wave soldering. The carrier for the wave soldering comprises pads of a plurality of jack element pins and is characterized in that tin dragging strips are arranged at the position of 2.3mm away from the edges of the pads. The tin dragging strips are copper strips, diameter of the tin dragging strips is 2mm, length of the tin dragging strips is equal to distance between the edge of the pad of a first pin of a jack element and the edge of the pad of the last pin and plus 1mm, and the 1mm is equally distributed to two ends of the tin dragging strips. The carrier for the wave soldering is adopted to enable tin connection defects after the wave soldering of dense spacing jack elements to be reduced greatly, the tin connection defects are close to disappear, tin connection defect proportion is dropped from original 50% to current 5%, manpower and material resources for plate repairing are saved, and a lot of money is saved finally.
Description
Technical field
The utility model belongs to communication technical field, relates in particular to a kind of carrier for pcb circuit board wave-soldering welding usefulness.
Background technology
In recent years; miniaturization and lightness along with product design; surface mount elements on the pcb wiring board is used more and morely; but for the communication class product, often can use large electrochemical capacitor, a large amount of connectors and various interface; and these elements are inadequate because of material cost and weld strength; still need to use the jack element, therefore for the manufacturing of communication class product, wave-soldering technique is still being served as extremely important link.
Wave-soldering refers to the scolder with fusing, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, also can be by forming to the solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder that is electrically connected between components and parts welding end or pin and the printed board pad.Wave-soldering flow process: element is inserted in the corresponding component hole → pre-coated soldering flux → preliminary drying → wave-soldering → inspection.
But for wave-soldering, but have a main technique problem perplexing for a long time the technical staff, close exactly pin connects the tin problem.And cause that the subject matter that connects tin has 2, (1) pin-pitch, (2) pin ejecting plate length, according to us Long-term analysis and experiment, we find that company's tin phenomenon is serious when pin-pitch≤2mm, for pin ejecting plate length, when ejecting plate length＞0.7mm, connecting the tin phenomenon increases greatly.And we now the way of reply be that suggestion client design drags the soldering dish to improve the short and company's tin problem that causes of close pin-pitch at pcb board, but because design drags the soldering dish can take the upper confined space of PCB, cause other Welding Problems or change the pcb board profile and affect mechanism's part assembling and shorten element spacing, these all are that the client is loth.And can greatly increase human cost for control pin ejecting plate length way, and production capacity is descended, cut pin length but also can't precisely control.So now known technology to improve effect not too obvious.
The utility model content
The utility model purpose is: a kind of carrier for Wave crest Welding is provided, causes the problem defective of short circuit with solving pcb product pin after crossing wave-soldering in the communications field to connect tin.
The technical solution of the utility model is: a kind of carrier for Wave crest Welding, comprise it is characterized in that the pad of several jack component pins, and arrange in the position of distance pad edge 2.3mm and drag tin bar.
Further, the described tin bar that drags is copper bar, and diameter is 2mm, and length is that the pad edge of first pin of jack element adds that to the pad edge distance of end pin 1mm, this 1mm are distributed to described two ends of dragging tin bar.
Further, described to drag tin bar to be designed to U-shaped, the opposite direction at U-shaped groove direction and carrier afferent echo peak.
Principle:
The essence of the company's of formation tin phenomenon in the wave soldering:
Thin layer solder inside in formed stripping area when PCB withdraws from crest exists pressure differential.Ignoring in the solder flow behavior influence factor situation, can think this pressure differential in the left and right sides existence and the size then be the surface tension of molten solder, and on the last stripper wire in crest taken thin layer district the line segment of existing those small radius of curvature, formed taken thin layer district in PCB and the liquid solder stripping process in the wave soldering, be the zone of action that forms the bridging phenomenon, that is to say that all bridgings all form in this district forms.
There are some researches show that spacing increases between the adjacent wires, Additional inner press reduces, and therefore is difficult for forming the condition of " connecting tin ".Spacing between the opposite adjacent wires narrows down, being connected across to press in the molten solder between adjacent two conductors of stripper wire bears greatlyr, thereby cause and adjacent area (pad or wire) molten solder between interior pressure reduction increase, the molten solder of adjacent area (pad or wire) all flows to the cross-over connection district, causes solder to gather in the cross-over connection district and forms " connect tin ".And because the spacing of the adjacent wires (pin) of element is that we can't change, and shorten pin ejecting plate length improve not conspicuousness of effect, so we study and improve from wave soldering carrier.
Fig. 1 is traditional wave soldering carrier schematic diagram, and is regional take interior zone as Wave crest Welding at barricade, be the pin ejecting plate zone of jack element, and other zones (non-welding region) covers to prevent that by carrier the tin ripple from touching.When using wave soldering carrier by the tin stove, zone within the carrier barricade, because excess Temperature, molten solder oxidation aggravation, the liquid solder surface is wrapped up by layer oxide film, its resultant effect is equivalent to surface tension increase, molten solder cross flow variation, and the redundant brazing filler metal in the thin layer is not easy to be pulled crest and forms easily " connecting tin " at this moment.This analysis formula calculating is once learnt:
Formula is: f=4 98.1-0.045T μ=μ, 0 e
F--surface tension;
T--absolute temperature;
μ--viscosity;
μ 0--the viscosity under the room temperature;
E--activation evergy.
When device was crossed crest, often easy tail end at device produced and connects the tin phenomenon.Aborning for avoiding this defective, the utility model device afterbody orientation (on the anchor clamps) add and drag tin bar as virtual pad, draw molten tin, the company's of avoiding tin phenomenon.
The utility model has the advantages that: use the utility model wave soldering carrier, make close spacing jack element behind wave-soldering " connecting tin " defective greatly reduce, approach and disappear, " connecting tin " defective proportion drops to present 5% from original 50%.Save the man power and material who repaiies plate, finally saved a large amount of financial resources.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further described:
Fig. 1 is traditional wave soldering carrier schematic diagram;
Fig. 2 is the position view that the utility model wave soldering carrier drags tin bar;
Wherein: 1, barricade, 2, welding window zone, 3, pad, 4, drag tin bar, 5, carrier advances the direction of wave-soldering, 31, the pad of first pin, 32, the pad of an end pin.
The specific embodiment
Embodiment:
Below in conjunction with specific embodiment such scheme is described further.Should be understood that these embodiment are not limited to limit scope of the present utility model for explanation the utility model.The implementation condition that adopts among the embodiment can be done further adjustment according to the condition of concrete engineering, and not marked implementation condition is generally the condition in the normal experiment.
As shown in Figure 2, a kind of carrier for Wave crest Welding comprises the pad 3 of several jack component pins,, arrange in the position of distance pad 3 edge 2.3mm and to drag tin bar 4.
In the preferred embodiment of the present utility model, the described tin bar 4 of dragging is copper bar, and diameter is 2mm, and length is that pad 31 edges of first pin of jack element add 1mm to pad 32 Edge Distances of the individual pin in end, and this 1mm is distributed to described two ends of dragging tin bar.
In the preferred embodiment of the present utility model, described to drag tin bar 4 to be designed to U-shaped, and U-shaped groove direction is opposite with the direction 5 that carrier advances wave-soldering.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present utility model; the utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these changes and improvements all fall in claimed the utility model scope.
Claims (3)
1. carrier that is used for Wave crest Welding comprises it is characterized in that the pad of several jack component pins, arranges in the position of distance pad edge 2.3mm and drags tin bar.
2. the carrier for Wave crest Welding according to claim 1, it is characterized in that the described tin bar that drags is copper bar, diameter is 2mm, length is that the pad edge of first pin of jack element adds that to the pad edge distance of end pin 1mm, this 1mm are distributed to described two ends of dragging tin bar.
3. the carrier for Wave crest Welding according to claim 2 is characterized in that, described to drag tin bar to be designed to U-shaped, the opposite direction at U-shaped groove direction and carrier afferent echo peak.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220370226 CN202780161U (en) | 2012-07-30 | 2012-07-30 | Carrier for wave soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220370226 CN202780161U (en) | 2012-07-30 | 2012-07-30 | Carrier for wave soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202780161U true CN202780161U (en) | 2013-03-13 |
Family
ID=47807502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220370226 Expired - Fee Related CN202780161U (en) | 2012-07-30 | 2012-07-30 | Carrier for wave soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202780161U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110199578A (en) * | 2017-08-11 | 2019-09-03 | 华为技术有限公司 | A kind of printed circuit board and terminal |
-
2012
- 2012-07-30 CN CN 201220370226 patent/CN202780161U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110199578A (en) * | 2017-08-11 | 2019-09-03 | 华为技术有限公司 | A kind of printed circuit board and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20170730 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |