CN109950012A - A kind of heat sink resistance and preparation method thereof - Google Patents

A kind of heat sink resistance and preparation method thereof Download PDF

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Publication number
CN109950012A
CN109950012A CN201910117560.8A CN201910117560A CN109950012A CN 109950012 A CN109950012 A CN 109950012A CN 201910117560 A CN201910117560 A CN 201910117560A CN 109950012 A CN109950012 A CN 109950012A
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CN
China
Prior art keywords
insulating radiation
resistor body
coating
heat sink
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910117560.8A
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Chinese (zh)
Inventor
谢庆坚
王锦全
莫焕堂
周立强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hunan Fullde Electric Co Ltd
Guangdong Fullde Electronics Co Ltd
Zhuzhou Fullde Rail Transit Research Institute Co Ltd
Original Assignee
Hunan Fullde Electric Co Ltd
Guangdong Fullde Electronics Co Ltd
Zhuzhou Fullde Rail Transit Research Institute Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hunan Fullde Electric Co Ltd, Guangdong Fullde Electronics Co Ltd, Zhuzhou Fullde Rail Transit Research Institute Co Ltd filed Critical Hunan Fullde Electric Co Ltd
Priority to CN201910117560.8A priority Critical patent/CN109950012A/en
Publication of CN109950012A publication Critical patent/CN109950012A/en
Pending legal-status Critical Current

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Abstract

The present invention relates to resistive technologies fields, more particularly to a kind of heat sink resistance and preparation method thereof, its structure includes resistor body, insulating radiation coating is coated on the surface of the resistor body, the insulating radiation coating not exclusively coats the resistor body so that resistor body is there are the position connected for conducting wire, which has anti-oxidation, high temperature resistant, the performance of perfect heat-dissipating and surface insulation;Insulating radiation coating is made of Graphene powder, resin curing agent, dimethylbenzene and solvent, insulating radiation coated coating can be obtained by each component is mixing cured, preparation method can not only produce the resistance of above-mentioned advantage and have the advantages that easily operated.

Description

A kind of heat sink resistance and preparation method thereof
Technical field
The present invention relates to resistive technologies fields, and in particular to a kind of heat sink resistance and preparation method thereof.
Background technique
The circuit of high-voltage great-current is generally located in spacious environment, and the circuit needs to be arranged corresponding current-limiting resistance, It is easy to burn to prevent circuit.The current-limiting resistance of the prior art is set as lesser volume to save space as much as possible, this undoubtedly can Reduce the heat dissipation performance of resistance itself;In addition, current-limiting resistance is long-term exposed in spacious environment, for a long time by exposure and rainwater The influence of corrosion is easy to cause current-limiting resistance to be oxidized and damage.
Summary of the invention
For the prior art there are above-mentioned technical problem, the present invention provide a kind of anti-oxidation, high temperature resistant, perfect heat-dissipating and The resistance of surface insulation and a kind of preparation method that can produce advantage resistance is provided, this method has easily operated excellent Point.
To achieve the above object, the present invention the following technical schemes are provided:
A kind of heat sink resistance, including resistor body are provided, coat insulating radiation coating, institute on the surface of the resistor body State insulating radiation coating not exclusively coat the resistor body so that resistor body there are the positions connected for conducting wire.
Wherein, the resistor body is resistor disc.
Wherein, resistor disc punching in such a way that metal rushes grid forms.
Wherein, the insulating radiation coating with a thickness of 1~2mm.
Wherein, the insulating radiation coating is located at the middle part of the resistor disc, and the insulating radiation coating is not coated by institute State two opposed ends of resistor disc.
A kind of preparation method of heat sink resistance is provided, comprising the following steps:
Step 1: preparing insulating radiation coated coating:
(1) component of formula as below amount is weighed:
(2) component of above-mentioned formula ratio is uniformly mixed, obtains insulating radiation coated coating;
Step 2: brushing insulating radiation coated coating:
(1) resistor body is used, the resulting insulating radiation coating of step 1 is painted on to the surface of the resistor body;
(2) the insulating radiation coating on resistor body will be brushed to solidify, obtains the insulation being coated on resistor body surface Thermal dispersant coatings.
Wherein, the resin curing agent is one of resin acid, resinol, resen or any two or more mixing Object.
Wherein, the solvent is water.
Beneficial effects of the present invention:
(1) present invention is coated with one layer of insulating radiation coating on the surface of resistor body, which can coat guarantor Resistor body is protected, to prevent the air in resistor body and environment from oxidation occurs and prevent resistance by raindrop erosion, improves electricity The service life of resistance body;And the radiating insulating coating can effectively improve the rate of heat dispation of resistor body, substantially improve resistor body Heat dissipation performance.
(2) insulating radiation coating of the invention is made of Graphene powder, resin curing agent, dimethylbenzene and solvent, wherein Graphene there is the characteristic of compact structure, high temperature resistant and good heat conductivity, resin curing agent then makes Graphene powder be bonded as causing Close film, while resin curing agent has insulation performance, and insulating radiation coating brushing is formed insulating radiation on resistor body and is applied Layer, so that resistor body has the performance of anti-oxidation, high temperature resistant, perfect heat-dissipating and its surface insulation.
(3) component that the present invention will form insulating radiation coating mixes, and then brushes on resistor body, then by insulating radiation Paint solidification can be prepared by the resistance of anti-oxidation, high temperature resistant, perfect heat-dissipating and surface insulation, have the advantages that easily operated.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of heat sink resistance of the present invention.
Appended drawing reference:
Resistor body 1;Insulating radiation coating 2.
Specific embodiment
Below in conjunction with specific embodiments and drawings, the present invention is described in detail.
Embodiment 1.
A kind of heat sink resistance of the present embodiment, shown in Fig. 1, the surface of resistor body 1 coats insulating radiation coating 2, and insulation dissipates Hot coating 2 not exclusively coating resistor body 1 so that resistor body 1 there are the positions connected for conducting wire.Wherein, resistor body 1 is resistor disc, Resistor disc can preferably adapt to high-voltage great-current, and resistor disc punching in such a way that metal rushes grid forms.Coated in resistance The insulating radiation coating 2 of on piece with a thickness of 1~2mm, in order to avoid the thickness of insulating radiation coating 2 is blocked up and wastes raw material, and Insulating radiation coating 2 is blocked up and resistor disc is hindered to radiate.Insulating radiation coating 2 is not coated by two opposed ends of the resistor disc And it is located at the middle part of the resistor disc, so that there are the positions connected for conducting wire.
Embodiment 2.
A kind of preparation method of heat sink resistance is provided, comprising the following steps:
Step 1: preparing insulating radiation coated coating:
(1) Graphene powder 65%, resin curing agent 3%, dimethylbenzene 20% and solvent 12% are weighed;
(2) component of above-mentioned formula ratio is uniformly mixed, obtains insulating radiation coated coating;
Step 2: brushing insulating radiation coated coating:
(1) resistor body 1 is used, by the resulting insulating radiation coating application of step 1 in the surface of the resistor body 1;
(2) it will brush and solidify in the drying box of room temperature in the insulating radiation coating on resistor body 1, obtain being coated on resistance Insulating radiation coating on 1 surface of body.In the present embodiment, resin curing agent is the mixture of resinol, resen.This implementation In example, solvent is water.
Embodiment 3.
A kind of preparation method of heat sink resistance is provided, comprising the following steps:
Step 1: preparing insulating radiation coated coating:
(1) Graphene powder 55%, resin curing agent 3%, dimethylbenzene 26% and solvent 16% are weighed;
(2) component of above-mentioned formula ratio is uniformly mixed, obtains insulating radiation coated coating;
Step 2: brushing insulating radiation coated coating:
(1) resistor body 1 is used, by the resulting insulating radiation coating application of step 1 in the surface of the resistor body 1;
(2) it will brush and solidify in the drying box of room temperature in the insulating radiation coating on resistor body 1, obtain being coated on resistance Insulating radiation coating on 1 surface of body.In the present embodiment, resin curing agent is the mixture of resin acid, resinol.The present embodiment In, solvent is water.
Embodiment 4.
A kind of preparation method of heat sink resistance is provided, comprising the following steps:
Step 1: preparing insulating radiation coated coating:
(1) Graphene powder 70%, resin curing agent 4%, dimethylbenzene 18% and solvent 8% are weighed;
(2) component of above-mentioned formula ratio is uniformly mixed, obtains insulating radiation coated coating;
Step 2: brushing insulating radiation coated coating:
(1) resistor body 1 is used, by the resulting insulating radiation coating application of step 1 in the surface of the resistor body 1;
(2) it will brush and solidify in the drying box of room temperature in the insulating radiation coating on resistor body 1, obtain being coated on resistance Insulating radiation coating on 1 surface of body.In the present embodiment, resin curing agent is the mixture of resin acid, resinol, resen. In the present embodiment, solvent is water.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected The limitation of range is protected, although explaining in detail referring to preferred embodiment to the present invention, those skilled in the art are answered Work as understanding, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the reality of technical solution of the present invention Matter and range.

Claims (8)

1. a kind of heat sink resistance coats insulating radiation coating, institute on the surface of the resistor body it is characterized in that: including resistor body State insulating radiation coating not exclusively coat the resistor body so that resistor body there are the positions connected for conducting wire.
2. a kind of heat sink resistance according to claim 1, it is characterized in that: the resistor body is resistor disc.
3. a kind of heat sink resistance according to claim 2, it is characterized in that: the resistor disc is in such a way that metal rushes grid Punching forms.
4. a kind of heat sink resistance according to claim 1, it is characterized in that: the insulating radiation coating with a thickness of 1~ 2mm。
5. a kind of heat sink resistance according to claim 2, it is characterized in that: the insulating radiation coating is located at the resistor disc Middle part, and the insulating radiation coating is not coated by two opposed ends of the resistor disc.
6. a kind of preparation method of heat sink resistance described in claim 1, it is characterized in that: the following steps are included:
Step 1: preparing insulating radiation coated coating:
(1) component of formula as below amount is weighed:
Graphene powder 55~70%
Resin curing agent 1.5~4%
Dimethylbenzene 15~26%
Solvent 8~16%;
(2) component of above-mentioned formula ratio is uniformly mixed, obtains insulating radiation coated coating;
Step 2: brushing insulating radiation coated coating:
(1) resistor body is used, the resulting insulating radiation coating of step 1 is painted on to the surface of the resistor body;
(2) the insulating radiation coating on resistor body will be brushed to solidify, obtains the insulating radiation being coated on resistor body surface Coating.
7. the preparation method of a kind of heat sink resistance according to claim 6, it is characterized in that: the resin curing agent is resin One of acid, resinol, resen or any two or more mixture.
8. the preparation method of a kind of heat sink resistance according to claim 6, it is characterized in that: the solvent is water.
CN201910117560.8A 2019-02-15 2019-02-15 A kind of heat sink resistance and preparation method thereof Pending CN109950012A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910117560.8A CN109950012A (en) 2019-02-15 2019-02-15 A kind of heat sink resistance and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910117560.8A CN109950012A (en) 2019-02-15 2019-02-15 A kind of heat sink resistance and preparation method thereof

Publications (1)

Publication Number Publication Date
CN109950012A true CN109950012A (en) 2019-06-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114300208A (en) * 2021-12-24 2022-04-08 杭州光之神科技发展有限公司 Preparation method of heat dissipation insulating protective layer of piezoresistor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104761937A (en) * 2015-04-14 2015-07-08 常州太平洋电力设备(集团)有限公司 Graphene heat-dissipation paint and preparation method thereof, and gas insulated switchgear
CN105086688A (en) * 2015-08-25 2015-11-25 济宁利特纳米技术有限责任公司 Oxidized graphene insulating heat-radiating coating and preparation method thereof
CN208444687U (en) * 2018-06-12 2019-01-29 深圳市业展电子有限公司 A kind of high-power paster type resistor of high-precision
CN209607519U (en) * 2019-02-15 2019-11-08 广东福德电子有限公司 A kind of heat sink resistance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104761937A (en) * 2015-04-14 2015-07-08 常州太平洋电力设备(集团)有限公司 Graphene heat-dissipation paint and preparation method thereof, and gas insulated switchgear
CN105086688A (en) * 2015-08-25 2015-11-25 济宁利特纳米技术有限责任公司 Oxidized graphene insulating heat-radiating coating and preparation method thereof
CN208444687U (en) * 2018-06-12 2019-01-29 深圳市业展电子有限公司 A kind of high-power paster type resistor of high-precision
CN209607519U (en) * 2019-02-15 2019-11-08 广东福德电子有限公司 A kind of heat sink resistance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114300208A (en) * 2021-12-24 2022-04-08 杭州光之神科技发展有限公司 Preparation method of heat dissipation insulating protective layer of piezoresistor

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