CN109946014B - Miniaturized digital pressure sensor - Google Patents
Miniaturized digital pressure sensor Download PDFInfo
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- CN109946014B CN109946014B CN201910249005.0A CN201910249005A CN109946014B CN 109946014 B CN109946014 B CN 109946014B CN 201910249005 A CN201910249005 A CN 201910249005A CN 109946014 B CN109946014 B CN 109946014B
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- 239000000919 ceramic Substances 0.000 claims abstract description 30
- 239000000084 colloidal system Substances 0.000 claims abstract description 19
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- 238000004382 potting Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 6
- 230000003750 conditioning effect Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
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- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The invention discloses a miniaturized digital pressure sensor, and belongs to the technical field of sensors. The miniaturized digital pressure sensor comprises a shell, wherein the inner space of the shell can be divided into a first cavity and a second cavity which are communicated with each other; the ceramic circuit board is arranged in the first cavity and can isolate the first cavity from the second cavity; the ASIC chip is arranged in the first cavity and is connected with the ceramic circuit board; the pressure chip is arranged in the second cavity and is connected with the ceramic circuit board; the second chamber is filled with a first colloid for transmitting pressure; and one end of the signal output piece is connected with the ceramic circuit board, and the other end of the signal output piece extends out of the free end of the first cavity. The miniaturized digital pressure sensor is filled with colloid, has simple production process and low equipment investment, and effectively reduces the production cost.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a miniaturized digital pressure sensor.
Background
MEMS (micro-electromechanical system, micro-electro-mechanical systems), basically refers to small devices with dimensions below a few centimeters or even smaller, is a self-contained smart system. MEMS technology has been widely used in the fields of electronics, medicine, industry, automotive and aerospace systems, etc. because of its advantages of miniaturization, intellectualization, high integration and mass production. The MEMS pressure sensor is a pressure sensor manufactured by adopting MEMS technology.
The existing MEMS pressure sensor mostly adopts the structural form of an oil filling core body, and the structure is generally packaged by adopting a metal diaphragm and a glass sintering base, and pressure transmitting oil and a pressure chip for transmitting pressure are packaged in the structure. The diaphragm is deformed by external pressure, so that a pressure signal is transmitted to the pressure chip through pressure transmission oil, the pressure chip outputs a millivolt signal, and the signal which can be acquired by the instrument can be output only by conditioning of the transmitter. Pressure sensor based on filling oil core encapsulation needs to encapsulate filling oil core through the welded mode, and the output of signal then needs to adopt the cable to draw forth or aviation plug's mode of drawing forth.
The adoption of the packaging mode of the oil filling core body leads to the fact that the overall size of the sensor is larger, and the sensor is not suitable for being integrally embedded into a fine instrument; and in the manufacturing process of the whole sensor, various complex processes such as welding, glass sintering, vacuum oil filling and the like are needed, and the whole cost is high.
Accordingly, there is a need to provide a miniaturized digital pressure sensor that solves the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a miniaturized digital pressure sensor, which can simplify the production process, reduce the volume of products and reduce the production cost.
In order to achieve the above object, the following technical scheme is provided:
a miniaturized digital pressure sensor, comprising:
A housing whose internal space is partitioned into a first chamber and a second chamber which are communicated with each other;
the ceramic circuit board is arranged in the first cavity and can isolate the first cavity from the second cavity;
the ASIC chip is arranged in the first cavity and is connected with the ceramic circuit board;
The pressure chip is arranged in the second cavity and is connected with the ceramic circuit board; the second cavity is filled with a first colloid for transmitting pressure;
And one end of the signal output piece is connected with the ceramic circuit board, and the other end of the signal output piece extends out of the free end of the first cavity.
Further, an installation table is arranged on the inner wall of the shell; the first chamber and the second chamber are respectively arranged at two sides of the mounting table;
the ceramic circuit board is arranged on the mounting table.
Further, a T-shaped through hole is formed in the shell, and the mounting table is formed in the shell through the T-shaped through hole.
Further, the free end of the second chamber is provided with an opening.
Further, pouring sealant is filled in the first chamber.
Further, a groove is formed in the inner wall of the first chamber, and the pouring sealant can be filled in the groove.
Further, the signal output member is a wire, and the number of the wires is set to at least four.
Further, the shell comprises a first connector and a second connector which are connected in sequence; the first chamber is arranged in the first connecting body, and the second chamber is arranged in the second connecting body; and an external thread is arranged on the outer wall of the second connector.
Further, two mutually parallel tangential planes are arranged on the outer wall of the first connector.
Further, the free end portion of the second connecting body is provided with a chamfer.
Compared with the prior art, the invention has the beneficial effects that:
1) The miniaturized digital pressure sensor provided by the invention adopts colloid filling, has simple production process, avoids the high-cost and high-difficulty procedures of welding, core oil filling, resistance welding sealing steel balls and the like in the traditional sensor manufacturing process, has low equipment investment, and effectively reduces the production cost;
2) The miniaturized digital pressure sensor provided by the invention has a simple structure, and is easy for automatic batch production; the device has small volume and is suitable for pressure acquisition of a microminiature interface;
3) The miniaturized digital pressure sensor provided by the invention adopts the ASIC chip to process the pressure signal, and adopts the lead to directly lead out the signal for transmission, so that signal conditioning by conditioning equipment such as a transmitter and the like is avoided, the volume of the whole sensor is further reduced, and the signal processing process is simplified.
Drawings
FIG. 1 is a schematic diagram of a miniaturized digital pressure sensor under a first view angle according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a miniaturized digital pressure sensor under a second view angle according to an embodiment of the present invention;
FIG. 3 is a front view of a miniaturized pressure sensor in accordance with an embodiment of the present invention;
Fig. 4 is a cross-sectional view of the A-A plane of fig. 3.
Reference numerals:
1-a housing; 11-a mounting table; 12-a first chamber; 13-a second chamber; 14-a first linker; 141-cutting; 15-a second linker; 16-a third linker; 2-ceramic circuit board; 3-a pressure chip; a 4-ASIC chip; 5-a signal output member; 51-wire.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention more clear, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 4, the present embodiment discloses a miniaturized digital pressure sensor including a housing 1, a ceramic circuit board 2, a pressure chip 3, an ASIC chip 4, and a signal output 5. The interior of the housing 1 is hollow. The inner wall of the shell 1 is provided with a mounting table 11, and the ceramic circuit board 2 is arranged on the mounting table 11 to realize the fixation with the shell 1. Alternatively, the ceramic circuit board 2 is adhered to the mounting table 11 by an adhesive, but is not limited to being fixed by an adhesive. Alternatively, the ASIC chip 4 and the pressure chip 3 are located on both sides of the ceramic circuit board 2, respectively, and are connected to the ceramic circuit board 2 by a reflow process. Signals can be transferred between the pressure chip 3 and the ceramic circuit board 2, and between the ceramic circuit board 2 and the ASIC chip 4. One end of the signal output piece 5 is connected with the ceramic circuit board 2, and the other end of the signal output piece extends out of the free end of the shell 1, so that signals of the ceramic circuit board 2 can be output to external equipment; at the same time, the signal output 5 can also function to power the entire digital pressure sensor.
Further, the housing 1 may be delimited by the mounting table 11, and the internal space of the housing 1 may be partitioned into a first chamber 12 and a second chamber 13 that are mutually communicated, that is, the first chamber 12 and the second chamber 13 are disposed on both sides of the mounting table 11, respectively. The ceramic circuit board 2 and the ASIC chip 4 are located in a first chamber 12 and the pressure chip 3 is located in a second chamber 13, wherein the ceramic circuit board 2 also serves to isolate the first chamber 12 from the second chamber 13. In order to collect the pressure signal, the second chamber 13 is filled with a first gel, which is a conductive medium for the external pressure. Alternatively, the first colloid is a silicone gel.
Further, the first chamber 12 and the second chamber 13 provided with the housing 1 are formed by T-shaped through holes provided throughout the housing 1, and the T-shaped through holes form exactly one mounting table 11 in the housing 1, facilitating the mounting of the ceramic circuit board 2.
The working principle of the digital pressure sensor in this embodiment is as follows: the environmental pressure changes and acts on the first colloid to deform the first colloid; the first colloid transmits the pressure signal to the pressure chip 3, and the pressure chip 3 converts the received pressure signal into an electric signal and outputs the electric signal to the ceramic circuit board 2; the ASIC chip 4 provided above the ceramic circuit board 2 processes the electric signal into an IIC digital signal, and outputs the digital signal to the external device through the signal output member 5. The digital pressure sensor provided by the embodiment avoids the conditioning of signals by adopting conditioning equipment such as a transmitter and the like, so that the volume of the whole digital pressure sensor is further reduced, and the signal processing process is simplified.
In order to achieve a sufficient transmission of the pressure signal, the free end of the second chamber 13 of the housing 1 is optionally provided with an open design, so that the first glue in the second chamber 13 can sufficiently receive the pressure change signal of the environment.
Further, in order to protect the ceramic circuit board 2, the ASIC chip 4 and the signal output member 5 located in the first cavity 12 from interference caused by the external environment, the first cavity 12 is filled with a second gel. Optionally, the second colloid is epoxy glue or other pouring sealant. Optionally, in order to reduce the weight of the digital pressure sensor and simplify the production process, the free end of the first chamber 12 of the housing 1 is also designed to be open, and the open design of the housing 1 does not affect the internal components of the digital pressure sensor to realize the function of signal transmission because the second colloid has isolated the internal structure of the second chamber 12 from the outside.
Optionally, internal threads are provided on the inner wall of the first chamber 12 of the housing 1, and the second glue can be filled in the grooves between the internal threads. The arrangement can play a role in fixing the second colloid, and the phenomenon that the second colloid is separated from the first chamber 12 due to the fact that the inner wall of the first chamber 12 is too smooth after the second colloid is solidified and formed integrally is prevented; the provision of the internal thread increases the resistance to escape of the second gel. In the concrete implementation, other groove structures besides the thread structure can be adopted to achieve the purpose of preventing the second colloid from falling out, for example, a plurality of bulges are arranged on the inner wall of the first chamber 12 along the axial direction of the shell 1, grooves are formed among the bulges, and the second colloid is solidified and formed in the grooves and can also achieve the purpose of preventing the second colloid from falling out; or the second colloid can be prevented from falling out by directly forming a groove on the inner wall of the first chamber 12.
Optionally, the signal output element 5 in this embodiment is a wire 51, and in other embodiments, a metal guide pin or other structure may be selected, so long as the signal output element can be connected with an external device to complete signal transmission. The lead 51 can improve the interface adaptability of the digital pressure sensor electric signal, and a worker can select a connector of the crimping terminal or a connector of the welding terminal according to different application scenes; alternatively, the wires 51 may be directly soldered to an external circuit board, or the wires 51 may be directly connected to corresponding electrical connectors; compared with the traditional sensor which adopts a fixed connector or an aerial plug, the applicability of the digital pressure sensor can be obviously improved. Alternatively, the number of wires 51 may be four or five, depending on the particular external device to be connected; the number of the wires 51 in this embodiment is set to four.
Optionally, the material of the casing 1 in this embodiment is stainless steel, so that the overall strength of the digital pressure sensor can be improved, and the structure in the casing 1 is fully protected, so that the digital pressure sensor is convenient to use in various different working environments.
Alternatively, the whole casing 1 is of a T-shaped structure, and includes a first connector 14 and a second connector 15 connected in sequence, and the outer diameter of the first connector 14 is larger than the outer diameter of the second connector 15. The first chamber 12 is provided in the first connecting body 14, and the second chamber 13 is provided in the second connecting body 15. The second connector 15 is connected with the instrument, and the signal output part 5 extends out from the first connector 14 to be connected with external equipment. Optionally, the first connector 14 and the second connector 15 are hollow and have a cylindrical structure, and external threads are arranged on the outer wall of the second connector 15, so that the digital pressure sensor and the instrument are conveniently connected through threads. When the digital pressure sensor is connected with the instrument in a threaded connection manner, two mutually parallel tangential planes 141 are arranged on the outer wall of the first connecting body 14, and the tangential planes 141 are planes. The existence of the tangential plane 141 can facilitate the clamping connection with the first connector 14 by using tools such as a wrench, thereby completing the installation in a time-saving and labor-saving manner; meanwhile, for the digital pressure sensor with small volume, the two mutually parallel tangential planes 141 are arranged, compared with the traditional six tangential planes 141 which are in hexagonal distribution, the strength of the first connecting body 14 can be obviously enhanced, and the deformation of the digital pressure sensor caused by the too thin side wall of the first connecting body 14 is avoided. Further, in order to facilitate the embedding of the second connecting body 15 of the digital pressure sensor into the meter, the free end portion of the second connecting body 15 is provided with a chamfer.
Optionally, the first connector 14 and the second connector 15 are connected through a third connector 16, and the third connector 16 is also of a hollow cylinder structure. Alternatively, the first, second and third connectors 14, 15, 16 are of unitary construction. Further, the connection between the third connecting body 16 and the first connecting body 14 is rounded and smooth, and the connection between the third connecting body 16 and the second connecting body 15 is rounded and smooth, so as to buffer the stress concentration at the connection.
The digital pressure sensor disclosed by the embodiment adopts colloid filling, has simple structure and production process, avoids the high-cost and high-difficulty procedures of welding, core oil filling, resistance welding sealing steel balls and the like in the traditional sensor manufacturing process, has low equipment investment, is easy for automatic batch production, and effectively reduces the production cost. In addition, simplification of the process and structure also facilitates miniaturization of the sensor. Specifically, in the digital pressure sensor provided in this embodiment, the maximum outer diameter of the housing 1 is 11mm, the height of the housing 1 is 13mm, and the thread size on the outer wall of the second connector 15 of the housing 1 is only M6 x 0.75, so that the volume of the whole digital pressure sensor is very small, and the whole digital pressure sensor can be embedded into a fine meter.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
1. A miniaturized digital pressure sensor, comprising:
A housing (1), wherein the internal space of the housing (1) can be divided into a first chamber (12) and a second chamber (13) which are communicated with each other;
a ceramic circuit board (2) which is arranged in the first chamber (12) and can isolate the first chamber (12) from the second chamber (13);
An ASIC chip (4) which is arranged in the first chamber (12) and is connected with the ceramic circuit board (2);
The pressure chip (3) is arranged in the second chamber (13) and is connected with the ceramic circuit board (2); the second chamber (13) is filled with a first colloid for transmitting pressure;
And one end of the signal output piece (5) is connected with the ceramic circuit board (2), and the other end of the signal output piece extends out of the free end of the first cavity (12).
2. A miniaturized digital pressure sensor according to claim 1, characterized in that the inner wall of the housing (1) is provided with a mounting table (11); the first chamber (12) and the second chamber (13) are respectively arranged at two sides of the mounting table (11);
The ceramic circuit board (2) is arranged on the mounting table (11).
3. A miniaturized digital pressure sensor according to claim 2, characterized in that a T-shaped through hole is provided in the housing (1), which T-shaped through hole forms the mounting table (11) in the housing (1).
4. A miniaturized digital pressure sensor according to claim 1, characterized in that the free end of the second chamber (13) is provided with an opening.
5. A miniaturized digital pressure sensor according to claim 1, characterized in that the first chamber (12) is filled with a potting compound.
6. A miniaturized digital pressure sensor according to claim 5, characterized in that the inner wall of the first chamber (12) is provided with a recess, in which recess the pouring sealant can be filled.
7. A miniaturized digital pressure sensor according to claim 1, characterized in that the signal output (5) is a wire (51), the number of wires (51) being set to at least four.
8. A miniaturized digital pressure sensor according to claim 1, characterized in that the housing (1) comprises a first connection body (14) and a second connection body (15) connected in sequence; the first chamber (12) is arranged in the first connecting body (14), and the second chamber (13) is arranged in the second connecting body (15); and an external thread is arranged on the outer wall of the second connecting body (15).
9. A miniaturized digital pressure sensor according to claim 8, characterized in that the outer wall of the first connecting body (14) is provided with two mutually parallel tangential surfaces (141).
10. A miniaturized digital pressure sensor according to claim 8, characterized in that the free end of the second connecting body (15) is provided with a chamfer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910249005.0A CN109946014B (en) | 2019-03-29 | 2019-03-29 | Miniaturized digital pressure sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910249005.0A CN109946014B (en) | 2019-03-29 | 2019-03-29 | Miniaturized digital pressure sensor |
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| Publication Number | Publication Date |
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| CN109946014A CN109946014A (en) | 2019-06-28 |
| CN109946014B true CN109946014B (en) | 2024-05-07 |
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| CN201910249005.0A Active CN109946014B (en) | 2019-03-29 | 2019-03-29 | Miniaturized digital pressure sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113091985B (en) * | 2021-04-21 | 2022-10-28 | 南京特敏传感技术有限公司 | Wide-range miniaturized pressure transmitter |
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|---|---|---|---|---|
| EP1128172B1 (en) * | 2000-02-22 | 2011-04-06 | Endress + Hauser GmbH + Co. KG | Pressure sensor |
| GB2542332A (en) * | 2015-06-29 | 2017-03-22 | Continental automotive systems inc | Pressure sensor device with a MEMS piezoresistive element attached to an in-circuit ceramic board |
| US10548492B2 (en) * | 2016-12-08 | 2020-02-04 | MEAS Switzerland S.a.r.l. | Pressure sensor |
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- 2019-03-29 CN CN201910249005.0A patent/CN109946014B/en active Active
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|---|---|---|---|---|
| CN104101456A (en) * | 2013-04-11 | 2014-10-15 | 苏州敏芯微电子技术有限公司 | Pressure sensor dielectric isolation packaging structure |
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