CN109935559A - Reinforcing radiator and method containing PCM encapsulation particle - Google Patents
Reinforcing radiator and method containing PCM encapsulation particle Download PDFInfo
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- CN109935559A CN109935559A CN201910137846.2A CN201910137846A CN109935559A CN 109935559 A CN109935559 A CN 109935559A CN 201910137846 A CN201910137846 A CN 201910137846A CN 109935559 A CN109935559 A CN 109935559A
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- pcm
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- hot wall
- distributor
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- 239000002245 particle Substances 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005538 encapsulation Methods 0.000 title claims abstract description 9
- 230000003014 reinforcing effect Effects 0.000 title claims abstract description 9
- 238000005338 heat storage Methods 0.000 claims abstract description 9
- 239000011232 storage material Substances 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims 1
- 230000007704 transition Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- 240000002853 Nelumbo nucifera Species 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 2
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Abstract
A kind of reinforcing radiator and method containing PCM encapsulation particle, belongs to the fields such as energy source and power.There are several PCM particles (3) being packaged in the radiator, during the work time, air enters device from the air intlet (1) of bottom of device after distributor (2), the PCM(phase-change heat-storage material of air driven device inner chamber body (4)) particle formed in the device fountain shape flowing, the hot wall face (5) of PCM particle and device, which contacts with each other to collide, in flow process occurs heat exchange, and the purpose of enhanced heat exchange is realized with this；In device hot wall face (5) there are when intermittent high load capacity operating condition, the PCM in PCM particle (3) is undergone phase transition when temperature increases to a certain extent, plays buffer function in intermittent high load capacity operating condition.The present invention is suitble to the finite volume system to radiator and there are the occasions such as the electronic radiation of intermittent high load capacity operating condition.
Description
Technical field
The present invention relates to a kind of reinforcing radiators and method containing PCM encapsulation particle, belong to the energy and dynamic field.
Background technique
With the continuous development of integrated circuit, electronic equipment is in past many decades towards high-performance, the side of micromation
To rapid development.Number of transistors can be accommodated with every 18 months by having in chip industry on famous " Moore's Law " i.e. chip is
The rate that a cycle is doubled increases.As integrated chip number of transistors is increasing, in chip heating power and chip
Portion's transistor density is also increasing, and chip cooling problem is also more and more prominent.High temperature is that electronic component is caused to generate heat
One of principal element of failure is usually in the closing confined space due to the micromation of electronic device, and chip has
Higher heat sensitivity, the study found that CPU, in 70~80 degrees Celsius of operations, temperature is every to increase 1 degree, and reliability then declines 5%,
Simultaneously as chip is to design reasons, under most of time chip all in standby or low-load state, arrive at this time calorific value compared with
It is small；There are intermittent oepration at full load rule, the calorific value in oepration at full load should not be underestimated, and can make chip temperature wink
Between the problem of increasing, bringing thermal shock.
The type of cooling common at present is mainly forced air cooling heat dissipation.Forced air cooling heat dissipation passes through heat pipe for heat band first
Onto the fin of air-cooled radiator, being reached using fan by fin surface forced-convection heat transfer mode reduces chip surface temperature
Purpose.There is data to show, when chip heat flow density is greater than 0.078W/cm2When, it generally requires and is considered as forced-air convection
The type of cooling, however when heat flow density be greater than 80W/cm2When, if still using the type of cooling of forced-air convection, for
The air quantity and wind pressure of fan are more demanding, this meeting is so that noise is larger when fan running, and moreover, chip is intermittent high negative
Brought thermal shock problem air-cooled radiator is also required to not obtain between cost, space, comfort satisfactory under lotus
Balance.
Phase-change heat-storage material (PCM) can there are the characteristics that being similar to isothermal in phase transition process due to it in storing exothermic process
By attracting attention for researcher, there are many researchs is applied to PCM in electronic heat sink, completely negative especially within the chip short time
When generating thermal shock when lotus runs, PCM absorbs heat in phase transition process and temperature-resistant feature can play buffer function.
Partial heat is stored when chip full-load run, is being released in chip underrun.It in this way can be substantially
Reducing thermal shock influences chip bring, and the performance requirement of radiator can be suitably reduced by the buffer function of PCM.
Summary of the invention
It is scattered it is an object of the invention to propose a kind of reinforcing radiator and method containing PCM encapsulation particle
Heat space is narrow and there is the reliable heat sink conception of intermittent high load capacity operating condition offer.
The device includes device housing, and device housing one end is air intlet, and the other end is air outlet slit；In device housing
Distributor and strainer are sequentially installed with from air intlet to air outlet slit；Distributor and strainer are being divided into three inside device housing
Section；It is air intlet section between air intlet and distributor；Between distributor and strainer for device inner cavity section, inner cavity section with dissipated
The wall surface that hot object is in contact is referred to as device hot wall face；It is air outlet slit section between strainer and air outlet slit；In above-mentioned apparatus
There are the particles that several enclosed insides have PCM in chamber section；The aperture size of distributor and strainer is less than the minimum ruler of PCM particle
It is very little.
Above-mentioned PCM particle by thermal conductive shell and and be loaded on phase-change heat-storage material therein and form, wherein phase-change thermal storage
Material fills the 80~90% of thermal conductive shell internal volume, and phase-change heat-storage material fusing point is higher than the conventional operating condition of locating operative scenario
When temperature.
The course of work of radiator mentioned in the present invention is as follows: air enters device from air intlet, by distribution
The packaged PCM particle in device inner chamber body is agitated after device, it is made to form fountain shape flowing in cavity in the device.It is flowing
Contact with each other between PCM particle and the hot wall face of device collision in the process, and device hot wall face has been not only broken up in collision process
Neighbouring boundary layer of air enhances the heat exchange between air and device hot wall face, and PCM particle is being touched with device hot wall face
Hit the heat transfer phenomenon of process also can intensifying device hot wall face heat dissipation, and collision heat exchange mutual between PCM particle also can
So that the Temperature Distribution in device is average, be conducive to the quick discharge of heat, last air carry heat through filter screen from
It is discharged in air outlet slit.Device can be had little time to be discharged when device is in PCM particle when intermittent high load capacity operating condition occurs
Heat storage get up, absorb a large amount of latent heat of phase change when using PCM phase transformation and characteristic that temperature is held essentially constant, accommodate heat
The a large amount of heat transmitted at wall surface, protection prevent it from damaging because temperature is excessively high by heat dissipation element, the PCM in running on the lower load
Particle again by high load capacity operating condition when stored heat release, improve the ability of radiator reply thermal shock.
Detailed description of the invention
Fig. 1 is that the present invention proposes a kind of reinforcing radiator schematic diagram containing PCM encapsulation particle；
Fig. 2 is the packaged PCM particle schematic diagram of the present invention;
Figure label title: 1. air intlets；2. distributor；3.PCM particle；4. device inner chamber body；5. device hot wall face；6. filter
Net；7. air outlet slit；31.PCM；32. package casing；33.PCM particle internal voids.
Specific embodiment
Narrow space electronic radiation in application, the course of work of radiator mentioned in the present invention is as follows: air
Enter device from air intlet, the packaged PCM particle in device inner chamber body is agitated after distributor, makes it in the device
Fountain shape flowing is formed in cavity.Contact with each other collision between PCM particle in flow process and the hot wall face of device, is colliding
The boundary layer of air for having not only broken up the hot near wall of device in the process enhances heat exchange between air and device hot wall face, and
And PCM particle and device hot wall face collision process heat transfer phenomenon also can intensifying device hot wall face heat dissipation, and PCM
Mutual collision heat exchange also can make the Temperature Distribution in device average between grain, be conducive to the quick discharge of heat, most
Air carries heat and is discharged from air outlet slit through filter screen afterwards.When device is in PCM when intermittent high load capacity operating condition occurs
Device can be had little time the heat storage of discharge by particle, absorb a large amount of latent heat of phase change when using PCM phase transformation and temperature
The characteristic being held essentially constant, accommodates a large amount of heat transmitted at hot wall face, and protection prevents it because of temperature mistake by heat dissipation element
It is high and damage, in running on the lower load PCM particle again by high load capacity operating condition when stored heat release, improve heat dissipation
The ability of device reply thermal shock.
Claims (3)
1. a kind of reinforcing radiator containing PCM encapsulation particle, it is characterised in that:
The device includes device housing, and device housing one end is air intlet (1), and the other end is air outlet slit (7)；
Distributor (2) and strainer (6) are sequentially installed with from air intlet (1) to air outlet slit (7) in device housing；Distributor
(2) and strainer (6) is being divided into three sections inside device housing；It is air intlet section between air intlet (1) and distributor (2)；Point
It is device inner cavity section between cloth device (2) and strainer (6), inner cavity section is referred to as device hot wall with the wall surface being in contact by thermal dissipating object
Face (5)；It is air outlet slit section between strainer (6) and air outlet slit (7)；
There are the particles (3) that several enclosed insides have PCM in the section of above-mentioned apparatus inner cavity；
The aperture size of distributor (2) and strainer (6) is less than the minimum dimension of PCM particle (3).
2. the reinforcing radiator according to claim 1 containing PCM encapsulation particle, it is characterised in that:
Above-mentioned PCM particle (3) by thermal conductive shell (32) and and be loaded on phase-change heat-storage material therein (31) and form, wherein phase
Change heat storage material (31) fills the 80~90% of thermal conductive shell (32) internal volume, and phase-change heat-storage material fusing point is higher than locating work
Temperature when the conventional operating condition of scene.
3. it is according to claim 1 containing PCM encapsulation particle reinforcing radiator method, it is characterised in that including with
Lower process:
Air enters device from air intlet (1), and the PCM particle (3) in device inner chamber body (4) is agitated after distributor (2),
Making it, the middle fountain shape that formed of cavity (4) flows in the device；PCM particle (3) in flow process between device hot wall face (5)
Contact with each other collision, on the one hand destroys the boundary layer of air of device hot wall face (5) nearby and enhances air and device hot wall face
(5) heat exchange between, on the other hand, the heat dissipation of heat transfer phenomenon meeting intensifying device hot wall face (3) of collision process, last air
The discharge from air outlet slit (7) through filter screen (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910137846.2A CN109935559A (en) | 2019-02-25 | 2019-02-25 | Reinforcing radiator and method containing PCM encapsulation particle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910137846.2A CN109935559A (en) | 2019-02-25 | 2019-02-25 | Reinforcing radiator and method containing PCM encapsulation particle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109935559A true CN109935559A (en) | 2019-06-25 |
Family
ID=66985848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910137846.2A Pending CN109935559A (en) | 2019-02-25 | 2019-02-25 | Reinforcing radiator and method containing PCM encapsulation particle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109935559A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1418373A (en) * | 2000-03-14 | 2003-05-14 | 英特尔公司 | Apparatus and method for passive phase change thermal management |
| US20090211732A1 (en) * | 2008-02-21 | 2009-08-27 | Lakhi Nandlal Goenka | Thermal energy exchanger for a heating, ventilating, and air conditioning system |
| CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
-
2019
- 2019-02-25 CN CN201910137846.2A patent/CN109935559A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1418373A (en) * | 2000-03-14 | 2003-05-14 | 英特尔公司 | Apparatus and method for passive phase change thermal management |
| US20090211732A1 (en) * | 2008-02-21 | 2009-08-27 | Lakhi Nandlal Goenka | Thermal energy exchanger for a heating, ventilating, and air conditioning system |
| CN107567247A (en) * | 2017-09-07 | 2018-01-09 | 太原理工大学 | A kind of dissipation from electronic devices method that array jetting, solid-liquid phase change are coupled |
Non-Patent Citations (1)
| Title |
|---|
| 刘传平等: ""气固两相流强化传热研究进展"", 《化工学报》 * |
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Application publication date: 20190625 |
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