CN109923363B - 具有非均匀绝热的热处理装置 - Google Patents
具有非均匀绝热的热处理装置 Download PDFInfo
- Publication number
- CN109923363B CN109923363B CN201780053146.4A CN201780053146A CN109923363B CN 109923363 B CN109923363 B CN 109923363B CN 201780053146 A CN201780053146 A CN 201780053146A CN 109923363 B CN109923363 B CN 109923363B
- Authority
- CN
- China
- Prior art keywords
- layer
- heating element
- element assembly
- insulation
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 90
- 238000009413 insulation Methods 0.000 title claims description 25
- 239000012774 insulation material Substances 0.000 claims abstract description 36
- 230000004323 axial length Effects 0.000 claims abstract description 19
- 238000007669 thermal treatment Methods 0.000 claims abstract description 15
- 239000011810 insulating material Substances 0.000 claims description 30
- 238000012545 processing Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 17
- 239000010410 layer Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/0003—Linings or walls
- F27D1/0033—Linings or walls comprising heat shields, e.g. heat shieldsd
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
- F27B9/068—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated heated by radiant tubes, the tube being heated by a hot medium, e.g. hot gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/32—Casings
- F27B9/34—Arrangements of linings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/36—Arrangements of heating devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Furnace Details (AREA)
- Tunnel Furnaces (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662371525P | 2016-08-05 | 2016-08-05 | |
US62/371,525 | 2016-08-05 | ||
PCT/US2017/045646 WO2018027208A1 (en) | 2016-08-05 | 2017-08-05 | Thermal process device with non-uniform insulation |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109923363A CN109923363A (zh) | 2019-06-21 |
CN109923363B true CN109923363B (zh) | 2021-01-22 |
Family
ID=59677327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780053146.4A Active CN109923363B (zh) | 2016-08-05 | 2017-08-05 | 具有非均匀绝热的热处理装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10837703B2 (zh) |
EP (1) | EP3494351B1 (zh) |
JP (1) | JP7058637B2 (zh) |
KR (1) | KR102403525B1 (zh) |
CN (1) | CN109923363B (zh) |
WO (1) | WO2018027208A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1611565S (zh) * | 2018-02-27 | 2018-08-20 | ||
JP1620676S (zh) * | 2018-02-27 | 2018-12-17 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3651240A (en) * | 1969-01-31 | 1972-03-21 | Trw Inc | Heat transfer device |
WO2010068703A1 (en) * | 2008-12-12 | 2010-06-17 | Solopower, Inc. | Reactor to form solar cell absorbers |
CN201852439U (zh) * | 2010-11-05 | 2011-06-01 | 黄喜锤 | 一种电磁感应熔炼炉 |
CN204757682U (zh) * | 2015-07-01 | 2015-11-11 | 皮洛特·白乐礼·西奥 | 一种窑炉 |
CN105737598A (zh) * | 2016-03-07 | 2016-07-06 | 苏州新凌电炉有限公司 | 一种高效率辊道窑炉 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1416726A (en) * | 1921-07-18 | 1922-05-23 | Champion Ignition Co | Burning ceramic wares and apparatus therefor |
JPS5099963A (zh) * | 1974-01-09 | 1975-08-08 | ||
US4849608A (en) | 1987-02-14 | 1989-07-18 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for heat-treating wafers |
JP2676083B2 (ja) * | 1988-01-28 | 1997-11-12 | 東京エレクトロン株式会社 | 加熱炉 |
US5038019A (en) * | 1990-02-06 | 1991-08-06 | Thermtec, Inc. | High temperature diffusion furnace |
JP3687902B2 (ja) * | 2001-09-05 | 2005-08-24 | 大学共同利用機関法人自然科学研究機構 | 連続焼成炉及びそれを用いた焼成体の製造方法 |
US6807220B1 (en) | 2003-05-23 | 2004-10-19 | Mrl Industries | Retention mechanism for heating coil of high temperature diffusion furnace |
WO2004111540A2 (en) | 2003-06-11 | 2004-12-23 | Huntington Alloys Corporation | Furnace with multiple heating |
US7413592B2 (en) * | 2004-03-31 | 2008-08-19 | Nu-Iron Technology, Llc | Linear hearth furnace system and methods regarding same |
EP1662219B1 (en) * | 2004-08-04 | 2008-09-10 | Ibiden Co., Ltd. | Firing kiln and process for producing porous ceramic member therewith |
US20100226629A1 (en) * | 2008-07-21 | 2010-09-09 | Solopower, Inc. | Roll-to-roll processing and tools for thin film solar cell manufacturing |
US8199193B2 (en) * | 2008-10-30 | 2012-06-12 | Caskol, Llc | Video camera inspection system for roller hearth heat treating furnaces and the like |
US9171746B2 (en) | 2011-09-06 | 2015-10-27 | Arsalan Emami | Heater elements with enhanced cooling |
US10204806B2 (en) | 2011-09-06 | 2019-02-12 | Arsalan Emami | Modular heater |
US8816252B2 (en) * | 2011-11-22 | 2014-08-26 | Corning Incorporated | Methods and apparatus for localized heating and deformation of glass sheets |
-
2017
- 2017-08-05 CN CN201780053146.4A patent/CN109923363B/zh active Active
- 2017-08-05 KR KR1020197006434A patent/KR102403525B1/ko active IP Right Grant
- 2017-08-05 JP JP2019506187A patent/JP7058637B2/ja active Active
- 2017-08-05 US US15/669,899 patent/US10837703B2/en active Active
- 2017-08-05 WO PCT/US2017/045646 patent/WO2018027208A1/en unknown
- 2017-08-05 EP EP17754897.1A patent/EP3494351B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3651240A (en) * | 1969-01-31 | 1972-03-21 | Trw Inc | Heat transfer device |
WO2010068703A1 (en) * | 2008-12-12 | 2010-06-17 | Solopower, Inc. | Reactor to form solar cell absorbers |
CN201852439U (zh) * | 2010-11-05 | 2011-06-01 | 黄喜锤 | 一种电磁感应熔炼炉 |
CN204757682U (zh) * | 2015-07-01 | 2015-11-11 | 皮洛特·白乐礼·西奥 | 一种窑炉 |
CN105737598A (zh) * | 2016-03-07 | 2016-07-06 | 苏州新凌电炉有限公司 | 一种高效率辊道窑炉 |
Also Published As
Publication number | Publication date |
---|---|
JP2019531453A (ja) | 2019-10-31 |
JP7058637B2 (ja) | 2022-04-22 |
WO2018027208A1 (en) | 2018-02-08 |
US20180038649A1 (en) | 2018-02-08 |
CN109923363A (zh) | 2019-06-21 |
US10837703B2 (en) | 2020-11-17 |
KR20190035857A (ko) | 2019-04-03 |
EP3494351B1 (en) | 2021-06-02 |
KR102403525B1 (ko) | 2022-05-27 |
EP3494351A1 (en) | 2019-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: California, USA Patentee after: Cantel thermal transmission Co.,Ltd. Address before: California, USA Patentee before: Sandvik Thermal Process, Inc. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: North Carolina, USA Patentee after: Cantel thermal transmission Co.,Ltd. Country or region after: U.S.A. Address before: California, USA Patentee before: Cantel thermal transmission Co.,Ltd. Country or region before: U.S.A. |