CN109916209A - One kind being based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface - Google Patents
One kind being based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface Download PDFInfo
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- CN109916209A CN109916209A CN201910261026.4A CN201910261026A CN109916209A CN 109916209 A CN109916209 A CN 109916209A CN 201910261026 A CN201910261026 A CN 201910261026A CN 109916209 A CN109916209 A CN 109916209A
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Abstract
The invention belongs to field of energy-saving technology, it is related to one kind based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface, it is cooling which can be used for high-temperature component under complex working condition.It is described based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface, in addition to heating zone and cooling zone, remaining pipeline is multiple dimensioned collaboration hydrophobic surface heat transfer；The heating zone is being lower than cooling zone based on the height on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface based on the height on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface.20% or more the coefficient of heat transfer can be improved by the present invention, it can be achieved that flow resistance declines to a great extent, and small-power stable operation effect is improved.
Description
Technical field
The invention belongs to field of energy-saving technology, are related to a kind of based on the high hot rainbow of liquid filled ratio loop of multiple dimensioned collaboration hydrophobic surface
Suction pipe, it is cooling (such as high-power chip, LED, solar thermal collector) which can be used for high-temperature component under complex working condition.
Background technique
For the two-phase loop thermal siphon of high liquid filled ratio (between 60%-90%), the heat exchange mode near heating surface is
Flow boiling (liquid phase convection current+liquid phase evaporation boiling), therefore relatively low liquid filled ratio thermal siphon (pool boiling phase-change heat-exchange), heat exchange
High more of coefficient, and can realize that heat transferring of high heat flow density (is greater than 10W/cm2), it is suitable for small heating surface (area) (HS, high heat flux density work
Condition heat transfer, is the effective way for solving the small big hot-fluid heat dissipation problem in space.
The steam bubble that high liquid filled ratio two-phase loop thermal siphon is generated using liquid phase evaporation, pushes tube fluid to generate circulation,
It realizes from driving, therefore steam bubble migration velocity determines velocity of circulation in pipe, velocity of circulation is bigger, the heat exchange system of the heat transfer system
Number is higher, and the temperature gradient of temperature fluctuation amplitude, heating zone and the cooling zone temperature difference and entire loop can be improved, heat transfer
System work is relatively reliable.
Steam bubble migration velocity is influenced by gravity and wall surface flow resistance, therefore high liquid filled ratio two-phase loop thermal siphon
Need certain startup power that circulation stable operation just can be achieved, small-power stable operation effect is poor.Steam bubble migration is reduced as far as possible
Resistance, improve velocity of circulation be realize this heat transfer system small-power operation effective way.
Therefore, the resistance of steam bubble migration how is reduced, improving velocity of circulation is to improve high liquid filled ratio two-phase loop thermal siphon
The most important thing of pipe heat transfer property.
Summary of the invention
To solve the problems, such as that above-mentioned is that the present invention provides a kind of based on the high hot rainbow of liquid filled ratio loop of multiple dimensioned collaboration hydrophobic surface
Suction pipe forms hydrophobic surface using multiple dimensioned (micrometer structure+nanostructure) synergistic principle, reduces wall friction coefficient, in turn
Steam bubble migration resistance in high liquid filled ratio two-phase loop thermal siphon is reduced, realizes the raising of velocity of circulation, enhances high liquid filled ratio two
Phase loop thermal siphon heat exchange property.
Technical solution of the present invention:
One kind being based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface, described to be dredged based on multiple dimensioned collaboration
The high liquid filled ratio loop thermal siphon of water surface, in addition to heating zone and cooling zone, remaining pipeline is multiple dimensioned collaboration hydrophobic surface biography
Pipe line；The heating zone based on the height on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface lower than cold
But area is based on the height on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface；
Heating device is equipped with outside the heating zone, for heating to liquid heat transfer working medium；
It is cased with cooling jacket outside the cooling zone, for cooling down to liquid heat transfer working medium；
The described multiple dimensioned collaboration hydrophobic surface heat transfer inner surface production is dredged comprising micrometer structure and nanostructure
Water surface.
The hydrophobic surface of the multiple dimensioned collaboration hydrophobic surface heat transfer inner surface uses chemical corrosion method, utilizes
Chemistry displacement reaction obtains.
The hydrophobic surface, contact angle are greater than 150 °, and roll angle is less than 5 °.
The pipeline material based on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface is copper.
By experimental studies have found that, it is of the invention can based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface
20% or more the coefficient of heat transfer is improved, it can be achieved that flow resistance declines to a great extent (about 15%-40%), small-power stable operation effect
Improved, systems stay is run 4 days or more, there is not the case where performance significant change.
Beneficial effects of the present invention:
1, wall surface flowage friction coefficient is reduced by making multiple dimensioned collaboration hydrophobic surface, reduces steam bubble migration resistance, mentions
High pipeline velocity of circulation increases high liquid filled ratio loop thermal siphon heat-transfer capability, improves the control effect to Heating Zone Temperature；
2, using multiple dimensioned collaboration hydrophobic surface, the power for reducing high liquid filled ratio loop thermal siphon stable operation is wanted
It asks, has widened its power scope of application.
Detailed description of the invention
Fig. 1 is the high liquid filled ratio loop thermal siphon schematic diagram of multiple dimensioned collaboration hydrophobic surface of the invention.
In figure: 1 heating zone；2 steam bubbles；3 gas phase zones；4 cooling zones；5 multiple dimensioned collaboration hydrophobic surface heat transfers；6 liquid
Heat-transfer working medium.
Fig. 2 is the multiple dimensioned hydrophobic surface electron microscope formed using chemistry displacement reaction in copper pipe road surfaces.
Specific embodiment
Below in conjunction with attached drawing and technical solution, a specific embodiment of the invention is further illustrated.
As shown in Figure 1, for high liquid filled ratio loop thermal siphon, before not heating, pipeline underfill when, on pipeline top
There are certain gas phase zones 3, and after giving heating in heating zone 1, the liquid heat transfer working medium 6 near heating zone 1 undergoes phase transition production
Raw steam bubble 2, under density contrast effect, steam bubble 2 is moved upwards, and generates squeezing action, while vapour to the gas of the gas phase zone 3 on top
It steeps and will push the movement of liquid heat transfer working medium 6 in 2 upward transition process, velocity of circulation is generated in pipeline, such heating zone 1 exists
Liquid phase convection current and liquid phase evaporation two kinds of heat transfer types of boiling.Since liquid heat transfer working medium 6 is not easy to be compressed, when steam bubble 2 produces
After life, corresponding gas phase zone 3 is compressed, and volume reduces.Steam bubble 2 buries in oblivion phenomenon after moving to cooling zone 4, therefore cold
But there is also two kinds of heat transfer types of convection current and Liquid-Vapor Phase Transition in area 4.The migration velocity of steam bubble 2 is by heating power, gravity, wall surface stream
The influence of dynamic resistance, wherein the migration velocity of steam bubble 2 is inversely proportional with wall surface flow resistance or coefficient of friction.
Using chemical corrosion method, produced in pipeline (in addition to heating zone 1 and cooling zone 4) using chemistry displacement reaction
Hydrophobic surface comprising micrometer structure and nanostructure forms multiple dimensioned collaboration hydrophobic surface heat transfer 5 (as shown in Fig. 2, being
AgNO3The micron obtained after solution corrosion copper pipe surface+nanometer composite hydrophobic structure), the contact angle of hydrophobic surface up to 150 ° with
On, roll angle is less than 5 °, it can be achieved that flow resistance declines to a great extent (about 15%-40%).Then the multiple dimensioned association that will be made
It is assembled with the heating device corresponding with the heating zone 1 in Fig. 1 of hydrophobic surface heat transfer 5 and the corresponding cooling jacket in cooling zone 4
It is good, that is, form the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface.During the work time, since pipeline wall surface becomes
The lower hydrophobic surface of coefficient of friction, the steam bubble 2 migration resistance decline in Fig. 1, migration velocity increase, and pipeline velocity of circulation increases
Greatly, heat exchange property improves.
By experimental studies have found that, it is of the invention can based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface
Improve 20% or more the coefficient of heat transfer, system startup power decline 30% or so, systems stay runs 4 days or more, not appearance property
The case where energy significant change.
Claims (5)
1. one kind is based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface, which is characterized in that described based on more
Scale cooperates with the high liquid filled ratio loop thermal siphon of hydrophobic surface, and in addition to heating zone and cooling zone, remaining pipeline is multiple dimensioned collaboration
Hydrophobic surface heat transfer；The heating zone is on based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface
Height is lower than cooling zone based on the height on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface；
Heating device is equipped with outside the heating zone, for heating to liquid heat transfer working medium；
It is cased with cooling jacket outside the cooling zone, for cooling down to liquid heat transfer working medium；
The multiple dimensioned collaboration hydrophobic surface heat transfer inner surface production includes the hydrophobic table of micrometer structure and nanostructure
Face.
2. it is according to claim 1 a kind of based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface, it is special
Sign is that the hydrophobic surface of the multiple dimensioned collaboration hydrophobic surface heat transfer inner surface uses chemical corrosion method, utilizes
Chemistry displacement reaction obtains.
3. one kind according to claim 1 or 2 is based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface,
It is characterized in that, the hydrophobic surface, contact angle is greater than 150 °, and roll angle is less than 5 °.
4. one kind according to claim 1 or 2 is based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface,
It is characterized in that, the pipeline material based on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface is copper.
5. it is according to claim 3 a kind of based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface, it is special
Sign is that the pipeline material based on the multiple dimensioned collaboration high liquid filled ratio loop thermal siphon of hydrophobic surface is copper.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910261026.4A CN109916209A (en) | 2019-04-02 | 2019-04-02 | One kind being based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface |
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| CN201910261026.4A CN109916209A (en) | 2019-04-02 | 2019-04-02 | One kind being based on the multiple dimensioned high liquid filled ratio loop thermal siphon of collaboration hydrophobic surface |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114234690A (en) * | 2021-12-29 | 2022-03-25 | 大连理工大学 | High-molecular polymer liquid absorption core and high-molecular polymer liquid absorption core loop heat pipe |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101078600A (en) * | 2007-07-05 | 2007-11-28 | 上海交通大学 | Two-phase closed type hot siphon tube using water-based carbon nanotube suspension liquid as working fluid |
| CN102022936A (en) * | 2010-11-12 | 2011-04-20 | 北京工业大学 | Improved high-efficiency unidirectional heat transfer pipe used for heat dissipation of microelectronics |
| CN104197761A (en) * | 2014-09-15 | 2014-12-10 | 东南大学 | Strengthened heat transfer gravity assisted heat pipe |
| CN105973044A (en) * | 2016-07-25 | 2016-09-28 | 上海交通大学 | Gravity assisted heat pipe device and preparation method |
| CN106767062A (en) * | 2016-12-27 | 2017-05-31 | 山东海晶电子科技有限公司 | The copper-based pulsating heat pipe of Nanosurface |
| CN210070686U (en) * | 2019-04-02 | 2020-02-14 | 大连理工大学 | High-liquid-filling-rate loop thermosiphon based on multi-scale collaborative hydrophobic surface |
-
2019
- 2019-04-02 CN CN201910261026.4A patent/CN109916209A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101078600A (en) * | 2007-07-05 | 2007-11-28 | 上海交通大学 | Two-phase closed type hot siphon tube using water-based carbon nanotube suspension liquid as working fluid |
| CN102022936A (en) * | 2010-11-12 | 2011-04-20 | 北京工业大学 | Improved high-efficiency unidirectional heat transfer pipe used for heat dissipation of microelectronics |
| CN104197761A (en) * | 2014-09-15 | 2014-12-10 | 东南大学 | Strengthened heat transfer gravity assisted heat pipe |
| CN105973044A (en) * | 2016-07-25 | 2016-09-28 | 上海交通大学 | Gravity assisted heat pipe device and preparation method |
| CN106767062A (en) * | 2016-12-27 | 2017-05-31 | 山东海晶电子科技有限公司 | The copper-based pulsating heat pipe of Nanosurface |
| CN210070686U (en) * | 2019-04-02 | 2020-02-14 | 大连理工大学 | High-liquid-filling-rate loop thermosiphon based on multi-scale collaborative hydrophobic surface |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114234690A (en) * | 2021-12-29 | 2022-03-25 | 大连理工大学 | High-molecular polymer liquid absorption core and high-molecular polymer liquid absorption core loop heat pipe |
| CN114234690B (en) * | 2021-12-29 | 2022-10-28 | 大连理工大学 | High-molecular polymer liquid absorption core and high-molecular polymer liquid absorption core loop heat pipe |
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