CN109903342B - Laser in-situ processing equipment and method based on scanning galvanometer - Google Patents
Laser in-situ processing equipment and method based on scanning galvanometer Download PDFInfo
- Publication number
- CN109903342B CN109903342B CN201910138298.5A CN201910138298A CN109903342B CN 109903342 B CN109903342 B CN 109903342B CN 201910138298 A CN201910138298 A CN 201910138298A CN 109903342 B CN109903342 B CN 109903342B
- Authority
- CN
- China
- Prior art keywords
- laser
- dimensional
- galvanometer
- camera
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
The invention discloses laser in-situ processing equipment and a method based on a scanning galvanometer, wherein the equipment comprises an industrial camera, a five-axis motion platform, a laser, an industrial control computer and a three-dimensional galvanometer consisting of a two-dimensional galvanometer and a dynamic focusing mirror; the method comprises the following steps: the method comprises the following steps of camera calibration, workpiece three-dimensional appearance pose measurement, in-situ processing path generation, three-dimensional laser in-situ processing and processing result detection. The invention adopts the hardware design of a three-dimensional galvanometer and a five-axis motion platform, fully meets the industrial requirement, and the laser emits laser or indication light to scan a laser line on a workpiece through the three-dimensional galvanometer, generates the three-dimensional appearance of the workpiece on line by utilizing the three-dimensional structured light principle, and performs laser in-situ three-dimensional processing after generating an in-situ processing path. Therefore, the scanning galvanometer-based laser in-situ processing equipment and method provided by the invention realize the integration of three-dimensional modeling, processing and detection in the laser three-dimensional processing process, and improve the positioning precision of workpieces and the convenience of operation.
Description
Technical Field
The invention belongs to the technical field of laser processing of numerical control machines, and particularly relates to laser in-situ processing equipment and method based on a scanning galvanometer.
Background
The principle of laser processing is that laser reaches very high energy density on the focus after lens focus, processes by relying on photothermal effect, and numerical control machine tool laser processing technology combines a multi-axis machine tool, a galvanometer and laser, makes full use of the advantages of laser non-contact processing, high energy density and the like, and is used for processing materials which comprise laser welding, cutting, carving, surface modification, marking, drilling, micromachining and traditional difficultly-processed materials.
When a traditional two-dimensional galvanometer is used for processing a three-dimensional workpiece, a layering mode or a mode of increasing a rotating shaft is needed, the processing precision and efficiency are difficult to guarantee, the three-dimensional galvanometer cannot be flexibly applied to three-dimensional laser processing, a three-dimensional model of the workpiece needs to be obtained in advance, at present, independent scanning equipment is mostly used for obtaining the three-dimensional model of an object and then three-dimensional galvanometer control software is introduced for generating a three-dimensional processing track, the operation process is complex, the workpiece needs to be manually placed at a specific position, and the placing precision is difficult to guarantee.
Disclosure of Invention
The invention aims to overcome the defects and provides laser in-situ processing equipment and a laser in-situ processing method based on a scanning galvanometer.
The invention is realized by adopting the following technical scheme:
a laser in-situ processing device based on a scanning galvanometer comprises a five-axis motion platform, an industrial camera, a laser, an industrial control computer and a three-dimensional galvanometer consisting of a two-dimensional galvanometer and a dynamic focusing mirror; wherein the content of the first and second substances,
the laser is used for emitting laser or indicating light with corresponding wavelength, sequentially passes through the dynamic focusing mirror and the two-dimensional galvanometer, and is focused on the five-axis motion platform; the five-axis motion platform is used for adjusting the pose of a workpiece on the five-axis motion platform; the industrial camera is used for obtaining the spot position of laser or indicating light on the five-axis motion platform; the industrial control computer is used for controlling the movement of the three-dimensional galvanometer, the on-off of the laser, the acquisition of images by the industrial camera, the movement of the five-axis movement platform and the completion of the three-dimensional shape measurement of the workpiece and the linkage control of laser processing.
The invention has the further improvement that the laser or the indicating light emitted by the laser realizes the three-dimensional processing of the workpiece on the five-axis motion platform through the three-dimensional galvanometer, and the five-axis motion platform is used for adjusting the pose of the workpiece and carrying out the laser three-dimensional processing at different poses.
A laser in-situ processing method based on a scanning galvanometer is based on the laser in-situ processing equipment based on the scanning galvanometer and comprises the following steps:
step 1, camera calibration: in galvanometer coordinate system OVibration device-XVibration deviceYVibration deviceCalibrating in a plane to obtain a conversion matrix of the camera internal reference, the camera external reference, the galvanometer coordinate system and the camera coordinate system; by measuring a reference at a known height in the galvanometer coordinate system ZVibration deviceCalibrating in the direction;
step 4, three-dimensional laser in-situ processing: carrying out in-situ processing on the workpiece by the laser through the three-dimensional galvanometer according to the in-situ processing path generated in the step 3;
step 5, processing result detection: and performing three-dimensional modeling by the method in the step 2 or detecting the processing effect by a two-dimensional image detection technology.
The invention is further improved in that, in step 1, in the galvanometer coordinate system OVibration device-XVibration deviceYVibration deviceMoving the plane of the five-axis motion platform to O of the three-dimensional galvanometer during camera calibration in the planeVibration device-XVibration deviceYVibration deviceAnd at the plane, taking a galvanometer coordinate system as a world coordinate system to calibrate the camera, wherein the coordinate systems are in the following relation:
in the formula, OImage-XImageYImageZImageAs a pixel plane coordinate system, OPhase (C)-XPhase (C)YPhase (C)ZPhase (C)As camera coordinate system, OVibration device-XVibration deviceYVibration deviceZVibration deviceIs a galvanometer coordinate system, [ u, v]TIs the pixel coordinate, f is the camera focal length, alpha,β、u0、v0The scaling and translation coefficients for the u-axis and v-axis, respectively, R, t are camera external parameters, i.e., the rotational translation matrix of the camera coordinate system relative to the galvanometer coordinate system.
The invention is further improved in that in the galvanometer coordinate system ZVibration deviceWhen the calibration is carried out in the direction, the five-axis motion platform is arranged along the galvanometer coordinate system ZVibration deviceAnd moving the laser lines to different heights in the direction to obtain the pixel difference of the same laser line in the industrial camera, and fitting the pixel difference with the actual height difference.
The invention is further improved in that in step 2, the traversing speed of the laser line is manually set.
The further improvement of the invention is that in step 3, the in-situ three-dimensional laser processing is realized by generating an in-situ processing path of the three-dimensional galvanometer by an industrial control computer and directly acting on the corresponding position of an actual workpiece.
The invention has the further improvement that the five-axis motion platform can feed back the current pose of the five-axis motion platform, so that the camera calibration in the step 1 only needs to be carried out once after the equipment is installed, and then three-dimensional measurement and processing are directly carried out.
The invention has the following beneficial technical effects:
according to the laser in-situ processing equipment based on the scanning galvanometer, the hardware design of the three-dimensional galvanometer and the five-axis motion platform is adopted, the requirement of the degree of freedom of industrial processing is fully met, the three-dimensional galvanometer can realize three-dimensional laser processing in a certain range, the three-dimensional processing precision and efficiency are improved, the available processing range can be further expanded by the five-axis motion platform, and the processing requirement of large-size workpieces is met.
According to the laser in-situ processing method based on the scanning galvanometer, the laser in-situ processing equipment based on the scanning galvanometer completes three-dimensional modeling, processing and detection of a workpiece through a set of equipment, the utilization rate of the equipment is fully exerted, and the function integration efficiency is improved. Meanwhile, the three-dimensional appearance and the pose of the workpiece are acquired on line, the traditional clamping step after modeling is avoided, and the clamping and positioning precision of the workpiece and the convenience of the machining process are greatly improved.
Furthermore, the traversing speed of the laser line can be set artificially according to the requirements of measurement precision and speed, and the method is suitable for occasions with different precision requirements.
In conclusion, the scanning galvanometer-based laser in-situ processing equipment and method provided by the invention realize the integration of three-dimensional modeling, processing and detection in the laser three-dimensional processing process, and improve the positioning precision of workpieces and the convenience of operation.
Drawings
Fig. 1 is a schematic structural diagram of a laser in-situ processing device based on a scanning galvanometer.
Description of reference numerals: the system comprises a laser line 1, a five-axis motion platform 2, a workpiece 3, an industrial camera 4, a two-dimensional galvanometer 5, a dynamic focusing lens 6, a three-dimensional galvanometer 7, laser or indicating light 8, a laser 9, an in-situ processing path 10, a three-dimensional shape model 11 and an industrial control computer 12.
FIG. 2 is a flow chart of a laser in-situ processing method based on a scanning galvanometer according to the present invention.
Fig. 3 is a coordinate system relationship diagram in the camera calibration.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1, the laser in-situ processing equipment based on the scanning galvanometer provided by the invention comprises an industrial camera 4, a five-axis motion platform 2, a laser 9, an industrial control computer 12 and a three-dimensional galvanometer 7 consisting of a two-dimensional galvanometer 5 and a dynamic focusing mirror 6; the laser 9 is used for emitting laser or indicating light 8 with corresponding wavelength, sequentially passes through the dynamic focusing mirror 6 and the two-dimensional vibrating mirror 5, and is focused on the five-axis motion platform 2; the five-axis motion platform 2 is used for adjusting the pose of a workpiece 3 on the five-axis motion platform; the industrial camera 4 is used for obtaining the spot position of the laser or the indicating light 8 on the five-axis motion platform 2; the industrial control computer 12 is used for controlling the movement of the three-dimensional galvanometer 7, the on-off of the laser 9, the image acquisition of the industrial camera 4, the movement of the five-axis movement platform 2 and the three-dimensional shape measurement and laser processing linkage control of the workpiece 3.
The laser or the indicating light 8 emitted by the laser 9 realizes the three-dimensional processing of the workpiece 3 on the five-axis motion platform 2 through the three-dimensional galvanometer 7, and the five-axis motion platform 2 is used for adjusting the pose of the workpiece 3 and carrying out the laser three-dimensional processing at different poses.
As shown in fig. 2, the laser in-situ processing method based on the scanning galvanometer provided by the invention comprises the following steps:
step 1: calibrating a camera: in galvanometer coordinate system OVibration device-XVibration deviceYVibration deviceCalibrating in a plane to obtain a conversion matrix of the camera internal reference, the camera external reference, the galvanometer coordinate system and the camera coordinate system; by measuring a reference at a known height in the galvanometer coordinate system ZVibration deviceCalibrating in the direction;
step 2: measuring the three-dimensional appearance pose of the workpiece: the laser emits low-energy laser or indicating light 8, a laser line 1 is scanned on a workpiece 3 after passing through a three-dimensional galvanometer 7, the laser line 1 traverses the workpiece 3, the traversing speed of the laser line 1 can be set artificially, and a three-dimensional shape model 11 and pose information of the workpiece 3 are obtained by utilizing a three-dimensional structured light principle;
and step 3: the in-situ process path 10 generates: according to different applications, such as polishing, derusting, deburring, punching and the like, extracting, designing and generating an in-situ processing path 10 of the three-dimensional galvanometer on the three-dimensional appearance model 11 generated in the step 2;
and 4, step 4: three-dimensional laser in-situ processing: carrying out in-situ processing on the workpiece 3 by the laser through the three-dimensional galvanometer 7 according to the in-situ processing path 10 generated in the step 3;
and 5: and (3) detecting a processing result: and detecting the processing effect by using the three-dimensional modeling or two-dimensional image detection technology in the step 2.
As shown in fig. 3, in a galvanometer coordinate system OVibration device-XVibration deviceYVibration deviceWhen camera calibration is carried out in the plane, the plane of the five-axis motion platform 2 is moved to the coordinate system O of the three-dimensional galvanometer 7Vibration device-XVibration deviceYVibration deviceAnd at the plane, taking a galvanometer coordinate system as a world coordinate system to calibrate the camera, wherein the coordinate systems are in the following relation:
in the formula, OImage-XImageYImageZImageAs a pixel plane coordinate system, OPhase (C)-XPhase (C)YPhase (C)ZPhase (C)As camera coordinate system, OVibration device-XVibration deviceYVibration deviceZVibration deviceIs a galvanometer coordinate system, [ u, v]TIs the pixel coordinate, f is the focal length of the camera, alpha, beta, u0、v0Scaling and translation coefficients for the u-axis and v-axis, respectively, R, t is a rotational translation matrix of the camera external reference camera coordinate system relative to the galvanometer coordinate system. In the galvanometer coordinate system ZVibration deviceWhen the calibration is carried out in the direction, the five-axis motion platform 2 is moved to different heights to obtain the pixel difference of the same laser line 1 in the industrial camera 4, and the pixel difference is fitted with the actual height difference.
The in-situ processing path 10 of the three-dimensional galvanometer 7 generated by the industrial control computer 12 can directly act on the corresponding position of the actual workpiece 3 to realize in-situ three-dimensional laser processing. The five-axis motion platform 2 can feed back the current pose of the platform, so that the camera calibration in the step 1 only needs to be carried out once after the equipment is installed, and the three-dimensional measurement and processing can be directly carried out subsequently.
Claims (4)
1. A laser in-situ processing method based on a scanning galvanometer is characterized in that the laser in-situ processing equipment based on the scanning galvanometer comprises a five-axis motion platform (2), an industrial camera (4), a laser (9), an industrial control computer (12) and a three-dimensional galvanometer (7) consisting of a two-dimensional galvanometer (5) and a dynamic focusing mirror (6); wherein the content of the first and second substances,
the laser (9) is used for emitting laser or indicating light (8) with corresponding wavelength, sequentially passes through the dynamic focusing mirror (6) and the two-dimensional vibrating mirror (5), and is focused on the five-axis motion platform (2); the five-axis motion platform (2) is used for adjusting the pose of a workpiece (3) on the five-axis motion platform; the industrial camera (4) is used for obtaining the spot position of the laser or the indicating light (8) on the five-axis motion platform (2); the industrial control computer (12) is used for controlling the movement of the three-dimensional galvanometer (7), the on-off of the laser (9), the acquisition of images by the industrial camera (4), the movement of the five-axis movement platform (2) and the completion of the three-dimensional shape measurement and laser processing linkage control of the workpiece (3), and the linkage control means that three axes of the five-axis movement platform and the three-dimensional galvanometer synchronously move in a coordinated manner to jointly complete processing;
laser or indicating light (8) emitted by a laser (9) realizes three-dimensional processing of a workpiece (3) on a five-axis motion platform (2) through a three-dimensional galvanometer (7), the five-axis motion platform (2) is used for adjusting the pose of the workpiece (3), and laser three-dimensional processing at different poses is realized through linkage control;
the method comprises the following steps:
step 1, calibrating internal reference and external reference of a camera: in galvanometer coordinate system OVibration device-XVibration deviceYVibration deviceCalibrating in a plane to obtain a conversion matrix of the camera internal reference, the camera external reference, the galvanometer coordinate system and the camera coordinate system; and (3) compensation calibration in the height direction: by measuring a reference at a known height in the galvanometer coordinate system ZVibration deviceCalibrating in the direction; in galvanometer coordinate system OVibration device-XVibration deviceYVibration deviceWhen camera calibration is carried out in the plane, the plane of the five-axis motion platform (2) is moved to O of the three-dimensional galvanometer (7)Vibration device-XVibration deviceYVibration deviceAnd at the plane, taking a galvanometer coordinate system as a world coordinate system to calibrate the camera, wherein the coordinate systems are in the following relation:
in the formula, OImage-XImageYImageZImageAs a pixel plane coordinate system, OPhase (C)-XPhase (C)YPhase (C)ZPhase (C)As camera coordinate system, OVibration device-XVibration deviceYVibration deviceZVibration deviceIs a galvanometer coordinate system, [ u, v]TIs the pixel coordinate, f is the focal length of the camera, alpha, beta, u0、v0Scaling and translation coefficients of a u axis and a v axis respectively, and R, t is a camera external parameter, namely a rotation and translation matrix of a camera coordinate system relative to a galvanometer coordinate system;
compensation calibration in height direction, i.e. galvanometer coordinate system ZVibration deviceWhen the direction is calibrated, the five-axis motion platform (2) is arranged along the galvanometer coordinate system ZVibration deviceMoving the direction to different heights to obtain the pixel difference of the same laser line (1) in the industrial camera (4), fitting the pixel difference with the actual height difference, and compensating the height direction measurement result based on the internal reference and the external reference of the camera through the fitting result;
step 2, measuring the three-dimensional appearance pose of the workpiece (3): the laser (9) emits low-energy laser or indicating light (8), the laser line (1) is scanned on the workpiece (3) after passing through the three-dimensional galvanometer (7), the laser line (1) traverses the workpiece (3), the industrial camera (4) acquires a series of images of the laser line (1), and a three-dimensional shape model (11) and pose information of the workpiece (3) are obtained by utilizing a three-dimensional structured light principle;
and 3, generating an in-situ machining path (10): according to different applications, an in-situ processing path (10) of the three-dimensional galvanometer (7) is extracted, designed and generated on the three-dimensional shape model (11) generated in the step 2;
step 4, three-dimensional laser in-situ processing: carrying out in-situ processing on the workpiece (3) by laser through a three-dimensional galvanometer (7) according to the in-situ processing path (10) generated in the step (3);
step 5, processing result detection: and performing three-dimensional modeling by the method in the step 2 or detecting the processing effect by a two-dimensional image detection technology.
2. The laser in-situ processing method based on the scanning galvanometer of claim 1, wherein in step 2, the traversing speed of the laser line (1) is set artificially.
3. The laser in-situ processing method based on the scanning galvanometer according to the claim 1, characterized in that in step 3, the in-situ three-dimensional laser processing is realized by the in-situ processing path (10) of the three-dimensional galvanometer (7) generated by the industrial control computer (12) and directly acting on the corresponding position of the actual workpiece (3).
4. The laser in-situ processing method based on the scanning galvanometer according to claim 1, characterized in that a five-axis motion platform (2) can feed back the current pose of the platform, so that the camera calibration in the step 1 only needs to be performed once after the equipment is installed, and then three-dimensional measurement and processing are directly performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910138298.5A CN109903342B (en) | 2019-02-25 | 2019-02-25 | Laser in-situ processing equipment and method based on scanning galvanometer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910138298.5A CN109903342B (en) | 2019-02-25 | 2019-02-25 | Laser in-situ processing equipment and method based on scanning galvanometer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109903342A CN109903342A (en) | 2019-06-18 |
| CN109903342B true CN109903342B (en) | 2021-07-13 |
Family
ID=66945459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910138298.5A Active CN109903342B (en) | 2019-02-25 | 2019-02-25 | Laser in-situ processing equipment and method based on scanning galvanometer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109903342B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238521B (en) * | 2019-06-26 | 2022-04-22 | 北京工业大学 | Laser precision welding device and method for collimator grid structure |
| CN110369402B (en) * | 2019-07-02 | 2021-08-31 | 华中科技大学 | Multi-axis laser remote deicing system and method |
| CN110760842A (en) * | 2019-12-02 | 2020-02-07 | 湖北汽车工业学院 | Hot forging die laser bionic enhancement equipment and method based on galvanometer scanning |
| CN112781525A (en) * | 2020-12-28 | 2021-05-11 | 广东艾视智能有限公司 | Three-dimensional imaging system based on laser high-speed galvanometer structured light and calibration method |
| CN112828448B (en) * | 2020-12-31 | 2023-05-05 | 武汉华工激光工程有限责任公司 | Three-dimensional scanning imaging processing equipment and processing method based on vibrating mirror |
| CN113427133A (en) * | 2021-06-16 | 2021-09-24 | 西安交通大学 | Laser equipment and method for guiding automatic processing based on three-dimensional vision online measurement |
| CN113857654B (en) * | 2021-12-06 | 2022-02-22 | 苏州菲镭泰克激光技术有限公司 | Multi-axis linkage processing equipment and method for real-time acquisition and three-dimensional scanning and verification |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103862167A (en) * | 2014-03-18 | 2014-06-18 | 西安交通大学 | Flexible electronic material plate micro-hole high-speed manufacturing device based on ultrafast laser |
| US20180126489A1 (en) * | 2016-11-04 | 2018-05-10 | General Electric Company | In-situ laser machining using mirrored optics |
-
2019
- 2019-02-25 CN CN201910138298.5A patent/CN109903342B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109903342A (en) | 2019-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109903342B (en) | Laser in-situ processing equipment and method based on scanning galvanometer | |
| CN108838551B (en) | A kind of three-dimension curved surface laser etching method | |
| CN101497279B (en) | Measuring and machining integrated laser three-dimensional marking method and device | |
| CN101786200B (en) | Method for projection-type laser etching on free curved surface | |
| CN104028890B (en) | A kind of big two-photon polymerized processing method of stroke cylindrical coordinates and device | |
| CN109940270A (en) | A kind of sevenfive axis ultrafast laser machining system | |
| CN112276339B (en) | Intelligent conformal laser scanning machining method and device for curved surface workpiece | |
| CN102001025B (en) | Processing precision property online measurement device and method for super-heavy lathe | |
| Li et al. | Development of an in-situ laser machining system using a three-dimensional galvanometer scanner | |
| CN106735963B (en) | A kind of machining beams space propagation pointing accuracy detection device | |
| JPH0241856A (en) | Machine tool equipped with cutting tool shape measuring function | |
| CN107932185A (en) | The numerically-controlled machine tool closed loop system of view-based access control model | |
| CN113427133A (en) | Laser equipment and method for guiding automatic processing based on three-dimensional vision online measurement | |
| CN109909602A (en) | A kind of ultrafast laser process unit Light Electrical cooperative control system | |
| CN208033917U (en) | Real-time dynamic focusing three-dimensional marking system | |
| CN113333942A (en) | Machining head with laser focus automatic focusing function and machining method thereof | |
| CN111928776A (en) | Multi-sensor-based non-contact online measurement system and method for numerical control machine tool | |
| CN110238520B (en) | Automatic precise laser welding method based on CCD visual detection | |
| CN110421264A (en) | A kind of micro- texture processing method of laser | |
| CN104360636A (en) | Double-channel coordinated motion control method for mirror image milling | |
| CN211588658U (en) | Machine vision auxiliary curved surface machining device | |
| CN115255652A (en) | Multi-angle laser emission self-adaptive control method and device for laser engraving machine | |
| Yin et al. | Welding seam detection and tracking based on laser vision for robotic arc welding | |
| CN108170095A (en) | The processing method of the numerically-controlled machine tool closed loop system of view-based access control model | |
| TW201720563A (en) | Controlling system of laser processing device and the method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |