CN109901959A - The pressure of AEP memory surveys method, system, terminal and storage medium under a kind of mix mode - Google Patents

The pressure of AEP memory surveys method, system, terminal and storage medium under a kind of mix mode Download PDF

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CN109901959A
CN109901959A CN201910147474.1A CN201910147474A CN109901959A CN 109901959 A CN109901959 A CN 109901959A CN 201910147474 A CN201910147474 A CN 201910147474A CN 109901959 A CN109901959 A CN 109901959A
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memory
aep
pressure
measured
aep memory
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CN109901959B (en
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范鹏飞
贠雄斌
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Suzhou Wave Intelligent Technology Co Ltd
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Suzhou Wave Intelligent Technology Co Ltd
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Abstract

The pressure that the present invention provides AEP memory under a kind of mix mode surveys method, system, terminal and storage medium, comprising: presets one group of AEP Memory adjustments strategy, the mode that each AEP Memory adjustments strategy is used to adjust AEP memory to be measured is mix mode;Loop through each AEP Memory adjustments strategy, and according to the AEP Memory adjustments strategy respectively traversed, circulation adjusts the hard disk mould group of AEP memory to be measured and the accounting of memory modules, until the total degree that previous cycle traverses each AEP Memory adjustments strategy reaches preset cycle-index;After adjusting the accounting of hard disk mould group and memory modules of AEP memory to be measured every time, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured respectively.The present invention is used to test the stability of AEP memory.

Description

The pressure of AEP memory surveys method, system, terminal and storage medium under a kind of mix mode
Technical field
The present invention relates to memory test fields, and in particular under a kind of mix mode the pressure of AEP memory survey method, system, Terminal and storage medium, for testing the stability of AEP memory.
Background technique
AEP (Apache Pass) memory, uses 3D XPoint technology, and boundary is between hard disk and common memory, installation Mode is identical as common memory, and having transmission speed, (transmission speed of AEP memory is 100-1000 times of hard disk, is common fastly 8-10 times of memory) and have the characteristics that non-volatile.
There are three types of the modes of AEP memory, be respectively memorymodel (memory mode), hard disk mode (APD mode) and Mixed mode (mix mode).In use, the mode of AEP memory can be arranged by AEP Memory Allocation Strategy according to actual needs It is any in the memorymodel (memory mode), hard disk mode (APD mode) and mixed mode (mix mode) It is a kind of.
Wherein, when the mode setting of AEP memory is 100% hard disk mode (APD mode) by AEP Memory Allocation Strategy, The AEP memory then can be used as hard disk, have the function of storage, but faster than common hard disc read or write speed.When AEP Memory Allocation plan When being slightly mixed mode (mix mode) by the mode setting of AEP memory, which, which is then virtually resolved into, has accordingly greatly Small hard disk mould group and there are memory modules of corresponding size, has both memory function and hard disk function, wherein hard disk mould group has Hard disk function, memory modules have memory function;Wherein, the specific size of hard disk mould group and the specific size of memory modules, Meet the sum of size of hard disk mould group and memory modules be equal to AEP memory size under the premise of, can by technical staff according to Actual demand adjustment, such as: there is the AEP memory of a 128GB in computer, it both can be by strategy setting by the 128GB's AEP memory is divided into the hard disk mould group of 64GB and the memory modules of 64GB, can also be divided the AEP memory of the 128GB by strategy At the hard disk mould group of 30GB and the memory modules of 98GB.
AEP memory is a kind of relatively new memory, currently, AEP memory pressure testing scheme commonly used in the prior art, Mostly be first by AEP memory setting at hard disk mode and by AEP memory setting at hard disk mode after carry out hard disk fio pressure Test, then by AEP memory setting at memorymodel and by AEP memory setting at memorymodel after carry out memory pressure test; Or carry out in turn, i.e., AEP memory setting is first subjected to memory pressure test at memorymodel, again by AEP memory setting at hard Disk mode carries out hard disk fio pressure test.In addition for the pressure test of the AEP memory under mix mode, lead in the prior art Be often in AEP memory hard disk mould group and memory modules successively pressurize.
It can be seen that in the prior art, the AEP memory test strategy used for those skilled in the art is relatively fewer.In addition As it can be seen that the pressure test strategy of existing AEP memory, can not cope with relative complex application scenarios test, make to a certain extent About to the reliability of the verification result of AEP stable memory and reliability.
For this purpose, the pressure that the present invention provides AEP memory under a kind of mix mode surveys method, system, terminal and storage medium, with Solve above-mentioned technical problem.
Summary of the invention
For the technical problems in the prior art, the present invention provides a kind of pressure survey side of AEP memory under mix mode Method, system, terminal and storage medium, for testing the stability of AEP memory.
In a first aspect, the pressure that the present invention provides AEP memory under a kind of mix mode surveys method, under the mix mode in AEP The pressure deposited surveys method
One group of AEP Memory adjustments strategy is preset, each AEP Memory adjustments strategy is used to adjust AEP memory to be measured Mode is mix mode;
Each AEP Memory adjustments strategy is looped through, and according to the AEP Memory adjustments strategy respectively traversed, circulation The hard disk mould group of AEP memory to be measured and the accounting of memory modules are adjusted, until previous cycle traverses each AEP Memory adjustments The total degree of strategy reaches preset cycle-index;
After adjusting the accounting of hard disk mould group and memory modules of AEP memory to be measured every time, respectively to existing in AEP to be measured Current hardware mould group in composite mode and memory modules carry out pressure survey.
Further, described to be carried out in AEP to be measured in the presence of current hardware mould group in composite mode and memory modules Pressure is surveyed, comprising:
Hardware pressure test is carried out to there is current hardware mould group in composite mode in AEP to be measured;
Memory pressure test is carried out to there are current memory modules in composite mode in AEP to be measured.
Further, the hardware pressure test is synchronous with the memory pressure test carries out.
Further, each preset AEP Memory adjustments strategy inequality.
Second aspect, the present invention provides a kind of pressure examining system of AEP memory under mix mode, under the mix mode in AEP The pressure examining system deposited includes:
Memory adjustments policy unit, it includes one group of preset AEP Memory adjustments strategy, each AEP Memory adjustments plans The mode for being slightly used to adjust AEP memory to be measured is mix mode;
AEP memory modules accounting adjustment unit loops through Memory adjustments plan for being based on preset cycle-index Omit each AEP Memory adjustments strategy that unit is included;And for according to the AEP Memory adjustments strategy respectively traversed, circulation adjustment The hard disk mould group of AEP memory to be measured and the accounting of memory modules;
Pressure survey unit, for adjusted every time in AEP memory modules accounting adjustment unit AEP memory to be measured hard disk mould group and After the accounting of memory modules, pressed in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured respectively It surveys.
Further, the pressure surveys unit, comprising:
First pressure surveys module, carries out hardware pressure test for the hardware mould group to AEP memory to be measured;
Second pressure surveys module, carries out memory pressure test for the memory modules to AEP memory to be measured.
Further, the hardware pressure test is synchronous with the memory pressure test carries out.
Further, each preset AEP Memory adjustments strategy inequality.
The third aspect, the present invention provide a kind of terminal, which includes:
Processor;
The memory executed instruction for storage processor;
Wherein, the processor is configured to the pressure for executing AEP memory under mix mode as described above surveys method.
Fourth aspect, the present invention provide a kind of computer readable storage medium, store in the computer readable storage medium There is computer program, when computer program is run on computers, so that the above-mentioned various aspects of computer execution are as described above The pressure of AEP memory surveys method under mix mode.
The third aspect provides a kind of terminal, comprising:
Processor, memory, wherein
The memory is used to store computer program,
The processor from memory for calling and running the computer program, so that terminal executes above-mentioned terminal Method.
Fourth aspect provides a kind of computer storage medium, is stored in the computer readable storage medium, when it When running on computers, so that computer executes method described in above-mentioned various aspects.
The beneficial effects of the present invention are:
(1) pressure of AEP memory surveys method, system, terminal and storage medium under mix mode provided by the invention, based on pre- The AEP Memory adjustments strategy first set, circulation adjusts AEP memory to be measured, and hardware mould group and memory modules account in a hybrid mode Than, and AEP memory to be measured is being adjusted every time in a hybrid mode after hardware mould group and the accounting of memory modules, respectively to be measured There is current hardware mould group in composite mode in AEP and memory modules carry out pressure survey, then reaches circulation and carry out in AEP to be measured It is pressed there are rolling in composite mode and surveys purpose, to realize the test to AEP reliability of memory and stability, it is seen that the present invention A kind of new AEP memory pressure survey technology is provided, compensates for test AEP stable memory in the prior art to a certain extent and can By the relatively small number of deficiency of strategy of property.
(2) pressure of AEP memory surveys method, system, terminal and storage medium under mix mode provided by the invention, each preparatory The AEP Memory adjustments strategy inequality of setting, i.e., different AEP Memory adjustments strategies, corresponding AEP memory are in composite mode Accounting difference, the accounting of corresponding AEP memory memory modules in composite mode of hardware mould group are also different, it is seen that the present invention Relative complex application scenarios can be tested, and then the reliability of AEP memory test can be improved to a certain extent And stability.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, for those of ordinary skill in the art Speech, without creative efforts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic flow chart of the method for one embodiment of the invention.
Fig. 2 is the schematic block diagram of the system of one embodiment of the invention.
Fig. 3 is a kind of structural schematic diagram of terminal provided in an embodiment of the present invention.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, below in conjunction with of the invention real The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common Technical staff's every other embodiment obtained without making creative work, all should belong to protection of the present invention Range.
The Key Term occurred in the present invention is explained below.
Fig. 1 is a kind of schematic flow chart of embodiment of the pressure survey method of AEP memory under mix mode of the present invention. The executing subject of Fig. 1 can be a kind of pressure examining system of AEP memory under mix mode.
As shown in Figure 1, the pressure of AEP memory surveys method 100 under the mix mode, comprising:
Step 110, one group of AEP Memory adjustments strategy is preset, each AEP Memory adjustments strategy is used to adjust to be measured The mode of AEP memory is mix mode;
Step 120, each AEP Memory adjustments strategy is looped through, and according to the AEP Memory adjustments plan respectively traversed Slightly, circulation adjusts the hard disk mould group of AEP memory to be measured and the accounting of memory modules, until previous cycle traverses each AEP The total degree of Memory adjustments strategy reaches preset cycle-index;Wherein, in the hard disk mould for adjusting AEP memory to be measured every time After group and the accounting of memory modules, respectively to exist in AEP to be measured current hardware mould group in composite mode and memory modules into Row pressure is surveyed.
Optionally, described to there is current hardware in composite mode in AEP to be measured as one embodiment of the invention Mould group and memory modules carry out pressure survey, comprising:
Hardware pressure test is carried out to there is current hardware mould group in composite mode in AEP to be measured;
Memory pressure test is carried out to there are current memory modules in composite mode in AEP to be measured.
Optionally, as one embodiment of the invention, the hardware pressure test and memory pressure test are same Step carries out.
Optionally, as one embodiment of the invention, each preset AEP Memory adjustments plan described in step 110 Slightly inequality.
In order to facilitate the understanding of the present invention, below under mix mode of the present invention AEP memory pressure survey method principle, The process for carrying out pressure survey in conjunction with the embodiments to AEP memory under mix mode, to AEP memory under mix mode provided by the invention Pressure survey method be further described.
Specifically, the pressure survey method of AEP memory includes: under the mix mode
(1) prepare pressure and survey environment: AEP memory to be measured being installed to test machine, linux system is installed in test machine, it is right Test machine carries out the driving installation of AEP memory, installs ipmctl tool and ndctl tool in the linux system of test machine later.
Wherein, ipmctl tool is a kind of software tool that Intel Company is directed to that AEP memory provides, can be to AEP memory Carry out parameter information inquiry, configuration strategy setting and debug case study.
Wherein, ndctl tool is a kind of software kit, have hard disk part in AEP memory is activated, is closed, The functions such as subregion.
(2) one group of AEP Memory adjustments strategy is preset, each AEP Memory adjustments strategy is used to adjust AEP memory to be measured Mode be mix mode, specifically:
Nine AEP Memory adjustments strategies are set, as shown in table 1 below, each AEP Memory adjustments strategy is used to adjust to be measured The mode of AEP memory is mix mode.Referring to table 1, each AEP Memory adjustments strategy includes existing to mix in AEP to be measured in table Hard disk mould group accounting x and memory modules accounting y under syntype;Wherein, in same AEP Memory adjustments strategy, hard disk mould group Accounting x and memory modules accounting y meet condition: 0 < x < 1,0 < y < 1 and x+y=1.
1 AEP Memory adjustments Policy Table of table
Referring to table 1, there are nine AEP Memory adjustments strategies, corresponding serial number 1~9 in table, wherein AEP memory mixing to be measured Nine hard disk mould group accounting x under mode are respectively 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, Each AEP Memory adjustments strategy is not entirely identical.
Hard disk mould group accounting x and memory modules accounting when specific implementation, referring to table 1, in same AEP Memory adjustments strategy The size of y can be set on the basis of meeting above-mentioned condition according to specific test case.
(3) each AEP Memory adjustments strategy in table 1, and the AEP Memory adjustments strategy that foundation respectively traverses are looped through, The hard disk mould group of AEP memory to be measured and the accounting of memory modules in circulation adjustment test machine, until previous cycle traversal is each described The total degree of AEP Memory adjustments strategy reach preset cycle-index;Wherein, AEP memory to be measured is being adjusted every time After hard disk mould group and the accounting of memory modules, respectively to there is current hardware mould in composite mode in AEP to be measured in test machine Group and memory modules carry out pressure survey.
Every traversal completed to 1-9 AEP Memory adjustments strategy in above-mentioned table 1, i.e. completion one cycle traversal.
Every completion one cycle traversal, current global cycle number increase by 1.
Presetting cycle-index is n times, when current global cycle number is less than n, is continued cycling through each in traversal list 1 AEP Memory adjustments strategy, and according to the AEP Memory adjustments strategy respectively traversed, circulation adjusts the hard disk mould group of AEP memory to be measured It is treated and after adjusting the accounting of hard disk mould group and memory modules of AEP memory to be measured every time respectively with the accounting of memory modules It surveys in AEP and carries out pressure survey in the presence of current hardware mould group in composite mode and memory modules, until current global cycle number is equal to N stops ending automatically test at this time to the searching loop next time of AEP Memory adjustments strategy each in table 1, specifically can be used as Lower method and step is realized:
Step s1, current global cycle number m is initialized, and makes m=0;Step s2 is executed later;
Step s2, the AEP Memory adjustments strategy in the table 1 is traversed, and configures in AEP to be measured that there are current mixed modes Under hard disk mould group accounting x be 90%, memory modules accounting y is 10%;Step s3 is executed later;
Step s3, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;Later Execute step s4;
Step s4, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current mixed modes Under hard disk mould group accounting x be 80%, memory modules accounting y is 20%;Step s5 is executed later;
Step s5, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;Later Execute step s6;
Step s6, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current mixed modes Under hard disk mould group accounting x be 70%, memory modules accounting y is 30%;Step s7 is executed later;
Step s7, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;Later Execute step s8;
Step s8, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current mixed modes Under hard disk mould group accounting x be 60%, memory modules accounting y is 40%;Step s9 is executed later;
Step s9, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;Later Execute step s10;
Step s10, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current hybrid guided modes Hard disk mould group accounting x under formula is 50%, memory modules accounting y is 50%;Step s11 is executed later;
Step s11, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;It Step s12 is executed afterwards;
Step s12, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current hybrid guided modes Hard disk mould group accounting x under formula is 40%, memory modules accounting y is 60%;Step s13 is executed later;
Step s13, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;It Step s14 is executed afterwards;
Step s14, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current hybrid guided modes Hard disk mould group accounting x under formula is 30%, memory modules accounting y is 70%;Step s15 is executed later;
Step s15, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;It Step s16 is executed afterwards;
Step s16, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current hybrid guided modes Hard disk mould group accounting x under formula is 20%, memory modules accounting y is 80%;Step s17 is executed later;
Step s17, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured;It Step s18 is executed afterwards;
Step s18, continue the AEP Memory adjustments strategy in traversal list 1, and configure in AEP to be measured that there are current hybrid guided modes Hard disk mould group accounting x under formula is 10%, memory modules accounting y is 90%;Step s19 is executed later;
The value of current global cycle number m is increased by 1 by step 19;Step s20 is executed later;
Step 20 determines whether the value of current global cycle number m is less than preset cycle-index n, if so, then after It is continuous to execute step s2;Otherwise step s21 is continued to execute;
Step s21, stop the searching loop next time to AEP Memory adjustments strategy each in table 1, terminate test, print Test result.
Wherein, when specific implementation, the value of the cycle-index n can be set according to actual conditions, such as can foundation It needs to be set as 20, it can also be according to needing to be set as 30, it can also be according to needing to be set as other correlation values.
After test, test result is checked and analyzed, is that can determine whether the stabilization of AEP memory to be measured according to test result Property and reliability.
It should be noted that the hard disk mould group of the adjustment AEP memory to be measured and the accounting of memory modules, can be used The adjustment configuration of ipmctl tool, for example the AEP Memory adjustments strategy of serial number 2 in table 1 is currently traversed, it can be used as follows Ipmctl instruction adjusts the hard disk mould group of AEP memory to be measured and the accounting of memory modules:
#ipmctl create-goal MemoryMode=20PersistentMemoryType= AppDirectNotInterleaved。
" #ipmctl create-goal MemoryMode=is instructed based on above-mentioned ipmctl 20PersistentMemoryType=AppDirectNotInterleaved " can will have current mixing in AEP to be measured Memory modules accounting under mode is set as 20%, correspondingly has at this time, exists in AEP to be measured current in composite mode hard Part mould group accounting becomes 80%.
Wherein, during looping through each time, in the hard disk mould group and memory modules for adjusting AEP memory to be measured every time Accounting after, can respectively to there is current hardware mould group in composite mode in AEP to be measured and memory modules synchronize pressure and survey, Specifically, by the hardware pressure test that there is current hardware mould group in composite mode in AEP to be measured and in AEP to be measured It is synchronous to carry out in the presence of the memory pressure test of current memory modules in composite mode.
Optionally, fio pressure test can be used in the hardware pressure test, and the memory pressure test can adopt It is tested with memtester memory pressure, the synchronous pressure survey can be used the included && tool of Linux and be realized.Specifically When realization, other related pressures test in the prior art, the memory pressure is also can be used in the hardware pressure test Test also can be used other related pressures test in the prior art, the described synchronous pressure survey also can be used in the prior art other Any related tool realized.
Wherein, memtester memory pressure test as carries out memory pressure survey by memtester tool Examination.Memtester tool is a kind of Linux memory test tool, mainly error catch memory and be constantly in it is very high or Very low bad position, the main project of test has random value, exclusive or to compare, subtraction, multiplication, division, with or operation etc., pass through The size and number of given test memory, can carry out the test of projects as above to the existing memory of system.
Wherein, the && tool carries out tool front and back process for synchronizing for the tool that linux system carries Logical AND function.In the present embodiment, the && tool is for realizing the hardware pressure test and the memory pressure The synchronous of test carries out.
Wherein, it is each carry out the fio pressure test before, be both needed to that there are under current mixed mode in AEP to be measured Hard disk mould group pre-processed, concrete mode is as follows:
#ndctl create-namespace-r regionX-m fsdax-f# activates hard disk mould group
#mkfs.ext4/dev/pmemX# formats the hard disk mould group after activation
Wherein, it is each carry out the memtester memory pressure test before, be both needed to work as to existing in AEP to be measured Preceding memory modules in composite mode are pre-processed, and concrete mode is as follows:
# calculates AEP memory size to be measured:
Memtotal=$ (cat/proc/meminfo | awk'/MemTotal/ { print $ 2 } ');
# sets AEP memory pressurization ratio, pressurization 85%:
Memsize=$ (echo " $ memtotal*0.85/1024/1024 " | bc).
Based on the above-mentioned pretreatment to there is current hard disk mould group and memory modules in composite mode in AEP to be measured, often Fio pressure test and its corresponding the synchronous of memtester memory pressure test carry out, and under type such as can be used and realize:
Nohup fio--filename=/dev/pmemX--direct=1--rw=write--bs=4k--siz e= 15G--numjobs=8--runtime=100000--group_reporting--name=te st-read&&hohup./ memtester$memsize 100000。
Wherein, fio pressure test each time and its corresponding the synchronous of memtester memory pressure test carry out, true respectively It has protected under the configuration mode of mix mode, the pressure of hard disk mould group and memory modules to AEP memory to be measured starts while survey With terminate simultaneously, i.e., on the one hand ensure that AEP memory to be measured can never pressurized state enters hard disk mould group and memory modules are same When pressurized state, on the other hand also ensure pressurized state while AEP memory to be measured can be from hard disk mould group and memory modules Be directly entered and pressure condition be not added, it is seen that the invention enables in AEP to be measured there are identical pressure survey under, have it is relatively large even most Big pressure amplitude, it is then visible compared with prior art, the present invention can preferably test AEP memory stability and Reliability.
It should be noted that synchronous pressure involved in the present invention is surveyed, AEP memory mixed mode in the prior art can be used Under any related pressure survey method be replaced, for example can be used to AEP memory to be measured hard disk mould group in composite mode and interior It deposits the mould group mode tested of successively pressurizeing to be replaced, for example first starts to hard disk mould under AEP memory mixed mode to be measured The hardware pressure test of group starts to test the memory pressure of memory modules under AEP memory mixed mode to be measured later again.
To sum up, the pressure of AEP memory surveys method under mix mode provided by the invention, on the one hand, it is based on preset AEP Memory adjustments strategy recycles and adjusts AEP memory to be measured hardware mould group and the accounting of memory modules in a hybrid mode, and AEP memory to be measured is adjusted every time in a hybrid mode after hardware mould group and the accounting of memory modules, respectively to existing in AEP to be measured Current hardware mould group in composite mode and memory modules carry out pressure survey, then reach circulation and carry out the presence of mixing in AEP to be measured Rolling pressure under mode surveys purpose, to realize the test to AEP reliability of memory and stability, it is seen that the present invention provides one The new AEP memory of kind presses survey technology, compensates for the plan for testing AEP stable memory and reliability in the prior art to a certain extent Slightly relatively small number of deficiency;On the other hand, each preset AEP Memory adjustments strategy inequality, it is seen that the present invention can be to phase Complicated application scenarios are tested, and then the reliability and stability of AEP memory test can be improved to a certain extent.
Fig. 2 is a kind of schematic block diagram of embodiment of the pressure examining system of AEP memory under mix mode of the present invention.It should The pressure examining system 200 of AEP memory under mix mode, comprising:
Memory adjustments policy unit 210, it includes one group of preset AEP Memory adjustments strategy, each AEP Memory adjustments The mode that strategy is used to adjust AEP memory to be measured is mix mode;
AEP memory modules accounting adjustment unit 220 loops through memory tune for being based on preset cycle-index Each AEP Memory adjustments strategy that whole policy unit 210 is included;And for following according to the AEP Memory adjustments strategy respectively traversed Ring adjusts the hard disk mould group of AEP memory to be measured and the accounting of memory modules;
Pressure surveys unit 230, for adjusting the hard disk of AEP memory to be measured every time in AEP memory modules accounting adjustment unit 220 After mould group and the accounting of memory modules, respectively to there are current hardware mould group in composite mode and memory modules in AEP to be measured Carry out pressure survey.
In use, one group of AEP Memory adjustments strategy is preset in memory adjustable strategies unit 210 first;Lead to later AEP memory modules accounting adjustment unit 220 is crossed, preset cycle-index is based on, loops through Memory adjustments policy unit The 210 each AEP Memory adjustments strategies for being included;And by AEP memory modules accounting adjustment unit 220, according to what is respectively traversed AEP Memory adjustments strategy, circulation adjust the hard disk mould group of AEP memory to be measured and the accounting of memory modules;Wherein, in AEP memory After mould group accounting adjustment unit 220 adjusts the hard disk mould group of AEP memory to be measured and the accounting of memory modules every time, pass through pressure respectively It surveys unit 230 and carries out pressure survey to there are currently hardware mould group in composite mode and memory modules in AEP to be measured.
Optionally, as one embodiment of the invention, the pressure surveys unit 230, comprising:
First pressure surveys module, carries out hardware pressure test for the hardware mould group to AEP memory to be measured;
Second pressure surveys module, carries out memory pressure test for the memory modules to AEP memory to be measured.
Optionally, as one embodiment of the invention, the hardware pressure test and memory pressure test are same Step carries out.
Optionally, as one embodiment of the invention, each preset AEP Memory adjustments strategy inequality.
The pressure examining system 200 of AEP memory under the mix mode, in view of itself and AEP memory under above-mentioned mix mode Press survey method 100 it is corresponding, each component units at above-mentioned mix mode AEP memory pressure survey method 100 it is corresponding Part is illustrated, and details are not described herein.
Fig. 3 is a kind of structural schematic diagram of terminal 300 provided in an embodiment of the present invention, which can be used for executing The pressure of AEP memory surveys method under mix mode provided in an embodiment of the present invention.
Wherein, which includes: processor 310 and memory 320.These components by one or more bus into Row communication, it will be understood by those skilled in the art that the structure of terminal shown in Fig. 3 and do not constitute a limitation of the invention, it It may include than illustrating more or fewer components.
Wherein, memory 320 can be used for executing instruction for storage processor 310, and memory 320 can be by any type Volatibility or non-volatile memories terminal or their combination realize that, such as static random access memory (SRAM), electricity can Erasable programmable read-only memory (EPROM) (EEPROM), Erasable Programmable Read Only Memory EPROM (EPROM), programmable read only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, disk or CD.When executing instruction in memory 320 When being executed by processor 310, so that terminal 300 some or all of is able to carry out in above method embodiment step.
Processor 310 is the control centre of terminal 300, utilizes each of various interfaces and the entire electric terminal of connection Part by running or execute the software program and/or module that are stored in memory 320, and calls and is stored in memory Data in 320, to execute the various functions and/or processing data of terminal 300.The processor 310, can be by integrated electricity Road (Integrated Circuit, abbreviation IC) composition, such as the IC that can be encapsulated by single are formed, can also be more by connecting The encapsulation IC of identical function or different function and form.For example, processor 310 can only include central processing unit (Central Processing Unit, abbreviation CPU).In embodiments of the present invention, CPU can be single operation core, can also To include multioperation core.
In addition, the present invention also provides a kind of computer storage mediums, wherein be stored with journey in the computer storage medium Sequence, the program may include step some or all of in each method embodiment provided by the invention when executing.The storage is situated between Matter can be magnetic disk, CD, read-only memory (English: read-only memory, abbreviation: ROM) or random storage memory Body (English: random access memory, referred to as: RAM) etc..
Therefore, the present invention is based on the AEP Memory adjustments strategy of preset one group of inequality, circulation is adjusted in AEP to be measured Hardware mould group in a hybrid mode and the accounting of memory modules are deposited, and hard in a hybrid mode adjusting AEP memory to be measured every time After part mould group and the accounting of memory modules, respectively to there is current hardware mould group in composite mode and memory mould in AEP to be measured Group carries out pressure survey, it is seen that can either realize the test to AEP reliability of memory and stability, and cope with relative complex answer With scrnario testing, the reliability and stability of AEP memory test are improved to a certain extent.
It is required that those skilled in the art can be understood that the technology in the embodiment of the present invention can add by software The mode of general hardware platform realize.Based on this understanding, the technical solution in the embodiment of the present invention substantially or Say that the part that contributes to existing technology can be embodied in the form of software products, which is stored in Such as USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory in one storage medium The various media that can store program code such as (RAM, Random Access Memory), magnetic or disk, including it is several Instruction is used so that a terminal (can be personal computer, server or network terminal etc.) executes the present invention The all or part of the steps of each embodiment the method.
Same and similar part may refer to each other between each embodiment in this specification.Implement especially for system For example, since it is substantially similar to the method embodiment, so being described relatively simple, related place is referring in embodiment of the method Explanation.
In several embodiments provided by the present invention, it should be understood that disclosed system, terminal and method, it can be with It realizes by another way.For example, system embodiment described above is only schematical, for example, the unit It divides, only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components It can be combined or can be integrated into another system, or some features can be ignored or not executed.
In addition, the functional units in various embodiments of the present invention may be integrated into one processing unit, can also be Each unit physically exists alone, and can also be integrated in one unit with two or more units.
Although by reference to attached drawing and combining the mode of preferred embodiment to the present invention have been described in detail, the present invention It is not limited to this.Without departing from the spirit and substance of the premise in the present invention, those of ordinary skill in the art can be to the present invention Embodiment carry out various equivalent modifications or substitutions, and these modifications or substitutions all should in covering scope of the invention/appoint What those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, answer It is included within the scope of the present invention.Therefore, protection scope of the present invention is answered described is with scope of protection of the claims It is quasi-.

Claims (10)

1. the pressure of AEP memory surveys method under a kind of mix mode characterized by comprising
One group of AEP Memory adjustments strategy is preset, each AEP Memory adjustments strategy is used to adjust the mode of AEP memory to be measured For mix mode;
Each AEP Memory adjustments strategy is looped through, and according to the AEP Memory adjustments strategy respectively traversed, circulation adjustment The hard disk mould group of AEP memory to be measured and the accounting of memory modules, until previous cycle traverses each AEP Memory adjustments strategy Total degree reach preset cycle-index;
It is current to existing in AEP to be measured respectively after adjusting the accounting of hard disk mould group and memory modules of AEP memory to be measured every time Hardware mould group in composite mode and memory modules carry out pressure survey.
2. the pressure of AEP memory surveys method under mix mode according to claim 1, which is characterized in that described to be measured There is current hardware mould group in composite mode in AEP and memory modules carry out pressure survey, comprising:
Hardware pressure test is carried out to there is current hardware mould group in composite mode in AEP to be measured;
Memory pressure test is carried out to there are current memory modules in composite mode in AEP to be measured.
3. the pressure of AEP memory surveys method under mix mode according to claim 2, which is characterized in that the hardware pressure Power test is synchronous with the memory pressure test to be carried out.
4. the pressure of AEP memory surveys method under mix mode according to claim 1 or 2 or 3, which is characterized in that each preparatory The AEP Memory adjustments strategy inequality of setting.
5. the pressure examining system of AEP memory under a kind of mix mode characterized by comprising
Memory adjustments policy unit, it includes one group of preset AEP Memory adjustments strategy, each AEP Memory adjustments strategy is equal Mode for adjusting AEP memory to be measured is mix mode;
AEP memory modules accounting adjustment unit loops through Memory adjustments strategy list for being based on preset cycle-index Each AEP Memory adjustments strategy that member is included;And for according to the AEP Memory adjustments strategy respectively traversed, circulation adjustment to be to be measured The hard disk mould group of AEP memory and the accounting of memory modules;
Pressure surveys unit, for adjusting the hard disk mould group and memory of AEP memory to be measured every time in AEP memory modules accounting adjustment unit After the accounting of mould group, pressure survey is carried out in the presence of current hardware mould group in composite mode and memory modules in AEP to be measured respectively.
6. the pressure examining system of AEP memory under mix mode according to claim 5, which is characterized in that the pressure is surveyed single Member, comprising:
First pressure surveys module, carries out hardware pressure test for the hardware mould group to AEP memory to be measured;
Second pressure surveys module, carries out memory pressure test for the memory modules to AEP memory to be measured.
7. the pressure examining system of AEP memory under mix mode according to claim 6, which is characterized in that the hardware pressure Power test is synchronous with the memory pressure test to be carried out.
8. according to the pressure examining system of AEP memory under mix mode described in claim 5 or 6 or 7, which is characterized in that each preparatory The AEP Memory adjustments strategy inequality of setting.
9. a kind of terminal characterized by comprising
Processor;
The memory executed instruction for storage processor;
Wherein, the processor is configured to perform claim require 1 or 2 or 3 described under mix mode AEP memory pressure survey side Method, or the processor is configured to the pressure of AEP memory surveys method under mix mode described in perform claim requirement 4.
10. a kind of computer readable storage medium for being stored with computer program, which is characterized in that the computer program is located Reason device realizes that the pressure of AEP memory under mix mode described in claims 1 or 2 or 3 surveys method or the computer journey when executing Realize that the pressure of AEP memory under mix mode as claimed in claim 4 surveys method when sequence is executed by processor.
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CN109240865A (en) * 2018-09-06 2019-01-18 郑州云海信息技术有限公司 A kind of AC test method, device, terminal and the storage medium of AEP memory
CN109324933A (en) * 2018-09-06 2019-02-12 郑州云海信息技术有限公司 A kind of AEP memory reboot test method, device, terminal and storage medium

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Publication number Priority date Publication date Assignee Title
CN1684042A (en) * 2004-04-13 2005-10-19 英业达股份有限公司 Multiple mode test syste mand its method under multiple mutual repulsion conditions
CN104407951A (en) * 2014-11-05 2015-03-11 浪潮电子信息产业股份有限公司 Method for automatically testing server
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