CN109898065A - A kind of production technology of magnetron sputtering plating - Google Patents
A kind of production technology of magnetron sputtering plating Download PDFInfo
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- CN109898065A CN109898065A CN201910310994.XA CN201910310994A CN109898065A CN 109898065 A CN109898065 A CN 109898065A CN 201910310994 A CN201910310994 A CN 201910310994A CN 109898065 A CN109898065 A CN 109898065A
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- magnetron sputtering
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- sputtering
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Abstract
The invention discloses a kind of production technologies of magnetron sputtering plating, comprise the following production steps that step 1: counterdie manufacture, and the counterdie of magnetron sputtering film is carried out to the manufacturing of former film, and production obtains the counterdie of magnetron sputtering film；Step 2: the counterdie of magnetron sputtering film is added in vacuum processing apparatus, carries out the coating process of first time magnetron sputtering, to form one layer of magnetron sputtering film layer on the counterdie of magnetron sputtering film；Step 3: by the coating process of second of the magnetron sputtering of carry out of the counterdie with magnetron sputtering film layer in vacuum equipment, to obtain magnetron sputtering film, it is manufactured by magnetron sputtering plating under vacuum conditions, it ensures in plated film, the substance that plated film is participated in when the stabilization of surrounding enviroment can be very good control plated film simultaneously, so that the stability for the membrane material produced is more good.
Description
Technical field
The present invention relates to plated film fields, more particularly, to a kind of production technology of magnetron sputtering plating.
Background technique
" magnetron sputtering " technology is the glass-film that the U.S. develops that aerospace cause synchronized development gets up after the 60.70's
Manufacturing technology.It is originally the heat isolation explosion proof for being used to solve the problems, such as space flight glass applied to aviation industry earliest.
Current " magnetron sputtering " technology is more and more used to carry out the plated film manufacture of membrane material, but current magnetic control splashes
It penetrates in plated film during producing plated film, is easy the stability when coating process influenced because of the factor of environment, thus
Influence the quality of production.
Summary of the invention
The present invention is to overcome above situation insufficient, it is desirable to provide a kind of technical solution that can solve the above problem.
A kind of production technology of magnetron sputtering plating, comprises the following production steps that
Step 1: the counterdie of magnetron sputtering film is carried out the manufacturing of former film by counterdie manufacture, and production obtains magnetron sputtering film
Counterdie；
Step 2: the counterdie of magnetron sputtering film is added in vacuum processing apparatus, carries out the plated film work of first time magnetron sputtering
Skill, to form one layer of magnetron sputtering film layer on the counterdie of magnetron sputtering film；
Step 3: by the plated film work of second of the magnetron sputtering of carry out of the counterdie with magnetron sputtering film layer in vacuum equipment
Skill, to obtain magnetron sputtering film.
As a further solution of the present invention: in the step 2, vacuum processing apparatus is the high pressure with vacuum condition
Impulse electric field magnetic-controlled sputtering coating equipment.
As a further solution of the present invention: the high-pressure pulse electric magnetic-controlled sputtering coating equipment of the vacuum condition has
Two sputtering processing cavitys when the coating process of the first time magnetron sputtering, are set in high-pressure pulse electric magnetron sputtering plating
What standby first sputtering processing cavity carried out, when the coating process of second of magnetron sputtering, splashed in high-pressure pulse electric magnetic control
Penetrate second sputtering processing cavity progress of filming equipment.
As a further solution of the present invention: in the step 2 and step 3, the coating process of magnetron sputtering is used
Electronics and ar atmo.
As a further solution of the present invention: in the step 2 and step 3, the coating process of magnetron sputtering are as follows: electronics
The counterdie mistake of magnetron sputtering film is flown in acceleration under the action of the electric field caused by high-pressure pulse electric magnetic-controlled sputtering coating equipment
Cheng Zhongyu ar atmo collide argon ion accelerate under the action of electric field bombard target, sputter a large amount of target atom, be in
Neutral target atom, which is deposited on the counterdie of magnetron sputtering film, to form a film.
As a further solution of the present invention: in the step 2 and step 3, the coating process of magnetron sputtering is also used
Oxygen atom, atomic nucleus.
As a further solution of the present invention: in the step 2 and step 3, the counterdie of magnetron sputtering film layer is in vacuum
It carries out moving back and forth when the coating process of magnetron sputtering in arrangement in equipment.
Compared with prior art, the beneficial effects of the present invention are: by magnetron sputtering plating manufacture under vacuum conditions,
It ensures in plated film, the substance that plated film is participated in when the stabilization of surrounding enviroment can be very good control plated film simultaneously, to make
The stability for the membrane material that must be produced is more good.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
In the embodiment of the present invention, a kind of production technology of magnetron sputtering plating is comprised the following production steps that
Step 1: the counterdie of magnetron sputtering film is carried out the manufacturing of former film by counterdie manufacture, and production obtains magnetron sputtering film
Counterdie；
Step 2: the counterdie of magnetron sputtering film is added in vacuum processing apparatus, carries out the plated film work of first time magnetron sputtering
Skill, to form one layer of magnetron sputtering film layer on the counterdie of magnetron sputtering film；
Step 3: by the plated film work of second of the magnetron sputtering of carry out of the counterdie with magnetron sputtering film layer in vacuum equipment
Skill, to obtain magnetron sputtering film.
In the step 2, vacuum processing apparatus is that the high-pressure pulse electric magnetron sputtering plating with vacuum condition is set
It is standby.
The vacuum condition high-pressure pulse electric magnetic-controlled sputtering coating equipment tool there are two sputter processing cavity, described first
It is first sputtering processing cavity progress in high-pressure pulse electric magnetic-controlled sputtering coating equipment when the coating process of secondary magnetron sputtering
, when the coating process of second of magnetron sputtering, be high-pressure pulse electric magnetic-controlled sputtering coating equipment second sputtering plus
What work chamber carried out.
In the step 2 and step 3, the coating process of magnetron sputtering uses electronics and ar atmo.
In the step 2 and step 3, the coating process of magnetron sputtering are as follows: electronics is in high-pressure pulse electric magnetron sputtering
Accelerate to fly to the argon that collided during the counterdie of magnetron sputtering film with ar atmo under the action of electric field caused by filming equipment
Ion accelerates to bombard target under the action of electric field, sputters a large amount of target atom, the target atom being in neutrality is deposited on magnetic control
It forms a film on the counterdie of sputtered film.
In the step 2 and step 3, the coating process of magnetron sputtering additionally uses oxygen atom, atomic nucleus.
In the step 2 and step 3, the counterdie of magnetron sputtering film layer carries out the plated film of magnetron sputtering in vacuum equipment
It is moved back and forth when technique in arrangement.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
Claims (7)
1. a kind of production technology of magnetron sputtering plating, which is characterized in that comprise the following production steps that
Step 1: the counterdie of magnetron sputtering film is carried out the manufacturing of former film by counterdie manufacture, and production obtains magnetron sputtering film
Counterdie；
Step 2: the counterdie of magnetron sputtering film is added in vacuum processing apparatus, carries out the plated film work of first time magnetron sputtering
Skill, to form one layer of magnetron sputtering film layer on the counterdie of magnetron sputtering film；
Step 3: by the plated film work of second of the magnetron sputtering of carry out of the counterdie with magnetron sputtering film layer in vacuum equipment
Skill, to obtain magnetron sputtering film.
2. a kind of production technology of magnetron sputtering plating according to claim 1, which is characterized in that in the step 2,
Vacuum processing apparatus is the high-pressure pulse electric magnetic-controlled sputtering coating equipment with vacuum condition.
3. a kind of production technology of magnetron sputtering plating according to claim 1 to 2, which is characterized in that the vacuum condition
High-pressure pulse electric magnetic-controlled sputtering coating equipment tool there are two sputter processing cavity, the coating process of the first time magnetron sputtering
When, it is to be carried out in first sputtering processing cavity of high-pressure pulse electric magnetic-controlled sputtering coating equipment, second magnetron sputtering
It when coating process, is carried out in second sputtering processing cavity of high-pressure pulse electric magnetic-controlled sputtering coating equipment.
4. a kind of production technology of magnetron sputtering plating according to claim 1, which is characterized in that the step 2 and step
In rapid three, the coating process of magnetron sputtering uses electronics and ar atmo.
5. a kind of production technology of magnetron sputtering plating according to claim 1 to 2, which is characterized in that the step 2 with
In step 3, the coating process of magnetron sputtering are as follows: electronics electric field caused by high-pressure pulse electric magnetic-controlled sputtering coating equipment
Under the action of accelerate to fly to during the counterdie of magnetron sputtering film collide with ar atmo argon ion under the action of electric field plus
Speed bombardment target, sputters a large amount of target atom, the target atom being in neutrality is deposited on the counterdie of magnetron sputtering film and forms a film.
6. a kind of production technology of magnetron sputtering plating according to claim 1, which is characterized in that the step 2 and step
In rapid three, the coating process of magnetron sputtering additionally uses oxygen atom, atomic nucleus.
7. a kind of production technology of magnetron sputtering plating according to claim 1, which is characterized in that the step 2 and step
In rapid three, the counterdie of magnetron sputtering film layer carry out to be moved back and forth in arrangement when the coating process of magnetron sputtering in vacuum equipment
's.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910310994.XA CN109898065A (en) | 2019-04-18 | 2019-04-18 | A kind of production technology of magnetron sputtering plating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910310994.XA CN109898065A (en) | 2019-04-18 | 2019-04-18 | A kind of production technology of magnetron sputtering plating |
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| Publication Number | Publication Date |
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| CN109898065A true CN109898065A (en) | 2019-06-18 |
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| CN201910310994.XA Pending CN109898065A (en) | 2019-04-18 | 2019-04-18 | A kind of production technology of magnetron sputtering plating |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111740044A (en) * | 2020-07-09 | 2020-10-02 | 夏笔文 | Composite foil and production process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110005920A1 (en) * | 2009-07-13 | 2011-01-13 | Seagate Technology Llc | Low Temperature Deposition of Amorphous Thin Films |
| CN102978577A (en) * | 2011-09-06 | 2013-03-20 | 鸿富锦精密工业（深圳）有限公司 | Intermediate-frequency magnetron sputtering coating device |
| CN104342624A (en) * | 2014-03-21 | 2015-02-11 | 宁波海燕家电玻璃技术有限公司 | Method for manufacturing high-temperature-resisting black borosilicate glass |
| CN106521440A (en) * | 2016-11-12 | 2017-03-22 | 北京印刷学院 | Method for preparing high-adhesion aluminum laminated film by adopting magnetron sputtering method |
-
2019
- 2019-04-18 CN CN201910310994.XA patent/CN109898065A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110005920A1 (en) * | 2009-07-13 | 2011-01-13 | Seagate Technology Llc | Low Temperature Deposition of Amorphous Thin Films |
| CN102978577A (en) * | 2011-09-06 | 2013-03-20 | 鸿富锦精密工业（深圳）有限公司 | Intermediate-frequency magnetron sputtering coating device |
| CN104342624A (en) * | 2014-03-21 | 2015-02-11 | 宁波海燕家电玻璃技术有限公司 | Method for manufacturing high-temperature-resisting black borosilicate glass |
| CN106521440A (en) * | 2016-11-12 | 2017-03-22 | 北京印刷学院 | Method for preparing high-adhesion aluminum laminated film by adopting magnetron sputtering method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111740044A (en) * | 2020-07-09 | 2020-10-02 | 夏笔文 | Composite foil and production process thereof |
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Application publication date: 20190618 |
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