CN109887982A - A kind of display module and preparation method thereof and display equipment - Google Patents
A kind of display module and preparation method thereof and display equipment Download PDFInfo
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Abstract
A kind of display module and preparation method thereof and display equipment, mould group includes: substrate；In array distribution and multiple islands separated from one another, setting is on substrate；Multiple bridges are arranged on substrate and are between multiple islands and connect multiple islands；Luminescent layer is arranged on island and bridge；And first electrode layer, setting is on the light-emitting layer；The first connection line layer corresponding with island, barrier dam and pixel defining layer are provided on bridge, barrier dam is located between pixel defining layer and the first connection line layer and separates luminescent layer, barrier dam includes insulating layer and the second connection line layer on insulating layer, and the second connection line layer connects first electrode layer and the first connection line layer.Obstructing dam is in bulge-structure, luminescent layer can be made of conventional mask version, barrier dam separate luminescent layer because of protrusion, prevent water oxygen along luminescent layer to island fractional transmission with this, the problem of water oxygen corrodes island portion separation structure is effectively prevented, can reduce the cost of mask plate.
Description
Technical field
Present document relates to display equipment technical field, espespecially a kind of display module, a kind of display module production method and one kind
Show equipment.
Background technique
Currently, typical stretching structure includes hard film buckling structure, island bridge structure, in addition to this there are also open grid knots
Structure.Island bridge structure is due to unique tensile property and by favor.This structure is that display unit is arranged in island, connecting line
It is arranged in Qiao Chu, stretching, the amount of tension of bridge is greater than the amount of tension on island, so the display unit in island is not easily susceptible to destroy, bridge
Stretching is realized by vacancy section.Therefore, stretchable display panel in the prior art is not provided with encapsulating on the substrate of vacancy section
Film layer, only setting encapsulates film layer on the side wall of vacancy section.
Stretchable display panel in the prior art, during stretching, the envelope on the groove medial surface of vacancy section
Dress layer can be broken, and encapsulation performance is caused to decline.The luminescent layer in water oxygen intrusion island is needed when making display panel in order to prevent
Luminescent layer is deposited using the high-precision metal mask plate of island, so that luminescent layer is only vaporized on island.Island it is high-precision
Spending metal mask plate, so that its design difficulty and cost of manufacture further increase, leads to display surface due to the presence of hollow-out unit
Plate cost improves, and reduces the product yield of display panel.Therefore, in order to reduce the cost of stretchable display panel, urgently
Wait propose the structure and preparation method of a kind of novel stretchable display panel.
Summary of the invention
At least one of in order to solve the above-mentioned technical problem, there is provided herein a kind of stretchable display modules, can solve
Certainly for the problem that the mask plate cost of manufacture of luminescent layer is high, design difficulty is big to be deposited.
This civilization additionally provides the production method and a kind of display equipment of a kind of stretchable display module.
Stretchable display module provided in an embodiment of the present invention, comprising: substrate has display area and non-display area；
In array distribution and multiple islands separated from one another, it is arranged on the display area of the substrate；Multiple bridges are arranged in the lining
On the non-display area at bottom and between multiple islands and connect multiple islands；Luminescent layer, setting on the island and
On the bridge；And first electrode layer, setting is on the light-emitting layer；Wherein, the bridge includes corresponding with the island
One connection line layer and barrier dam, the barrier dam is between the island and the first connection line layer and described in partition
Luminescent layer, the barrier dam includes insulating layer and the second connection line layer on the insulating layer, second connecting line
Road floor connects the first electrode layer and the first connection line floor.
Optionally, the side towards the island on the barrier dam separates the luminescent layer, the second connection line layer
The side towards the island connect relative to luminescent layer exposure and with the first electrode layer.
Optionally, the side and the side of the first connection line layer backwards to the island of the second connection line layer
It is connected to each other.
Optionally, the side towards the island on the barrier dam, the insulating layer is relative to second connection line
Layer recess.
Optionally, the barrier dam further include: antioxidation coating is arranged on the second connection line layer, for institute
It states the second connection line layer and carries out protection against oxidation.
Optionally, the side backwards to the island on the barrier dam also separates the luminescent layer, i.e., antioxidation coating relative to
First connection line layer protrusion, the step structure that antioxidation coating and the first connection line layer are formed separate luminescent layer, make luminescent layer
Tomography at this.
Optionally, the angle of gradient of the side towards the island of the second connection line layer is 85~95 degree.
Optionally, the angle of gradient of the side towards the first connection line layer of the second connection line layer be 85~
95 degree.
Optionally, the thickness of the insulating layer is not less than the thickness of the luminescent layer.
Optionally, the bridge further includes the groove for realizing stretching, the first connecting line corresponding with each island
Road floor and barrier dam are also equipped with the luminescent layer and first electricity by the recess divides on the bottom wall of the groove
Pole layer.
Optionally, the luminescent layer on the groove bottom wall and the luminescent layer outside the groove disconnect.
Optionally, the first electrode layer on the groove bottom wall and the first electrode layer outside the groove disconnect
Display equipment provided in an embodiment of the present invention, including stretchable display module described in any of the above-described embodiment.
The production method of stretchable display module provided in an embodiment of the present invention, comprising:
Barrier dam corresponding with island is formed on non-display area and the first connection line layer, the barrier dam are located at institute
It states between the first connection line layer and the island, the barrier dam includes insulating layer and the second connection line layer, and described second connects
Link layer is formed on the insulating layer and connect with the first connection line layer；
Luminescent layer is formed on display area and non-display area, the barrier dam separates the luminescent layer and makes described
Second connection line layer is relative to luminescent layer exposure；
First electrode layer, the first electrode layer and second connecting line are formed on display area and non-display area
The exposed region of road floor connects.
Optionally, the side towards the island on the barrier dam separates the luminescent layer, the second connection line layer
The side towards the island connect relative to luminescent layer exposure with the first electrode layer.
Optionally, the barrier dam further includes antioxidation coating, is formed on the second connection line layer, the insulation
Layer, the second connection line layer and the antioxidation coating are made of a patterning processes, and the etching speed of the insulating layer
Rate is greater than the etch rate of the antioxidation coating and the etch rate of the second connection line layer, so that the insulating layer
The side towards the island be recessed relative to the antioxidation coating and the second connection line layer.
Optionally, before the step of forming the first connection line layer and the barrier dam, the production method is also
Include:
The first electrode trace layer and flatness layer corresponding to island are sequentially formed on non-display area, the flatness layer covers
The first electrode trace layer is covered, and is formed with the via hole of the exposure first electrode trace layer on the flatness layer.
Optionally, when forming the step of the first connection line layer, the first connection line layer and described first
Contact conductor layer is connected by via hole.
Optionally, two flatness layers between adjacent two island can be connected together when being formed, two first electrode trace layers exist
It can be connected together when formation, two first connection line layers can be connected together when being formed.
Optionally, between the step of forming the barrier dam and the luminescent layer, the production method further include:
Groove is formed on the non-display area, the groove separates the first connection line layer, the flatness layer
With the first electrode trace layer, the exposure substrate on the bottom wall of the groove；
In the step of forming the luminescent layer and the first electrode layer, hair is also sequentially formed on the bottom wall of the groove
Photosphere and first electrode layer.
Compared with prior art, stretchable display module provided in an embodiment of the present invention, barrier dam are located at pixel defining layer
And first between connection line layer, is in bulge-structure, can make luminescent layer using conventional mask version, the luminescent layer of production be formed
On island and bridge, barrier dam separates luminescent layer because of protrusion, so that luminescent layer is in mutually independent two parts in barrier dam both sides,
With this come prevent water oxygen from stretchable zone along luminescent layer to island fractional transmission, effectively prevent water oxygen and corrode island portion separation structure
Problem can reduce the cost of mask plate, connects first electrode layer and first by the second connection line layer in barrier dam and connects
Link layer realizes that first electrode layer is connected to the first connection line layer.
Certainly, which also can be applied in conventional non-stretchable display module.
The other feature and advantage of this paper will illustrate in the following description, also, partly become from specification
It is clear that by implementing to understand herein.The purpose of this paper and other advantages can be by specifications, claims
And specifically noted structure is achieved and obtained in attached drawing.
Detailed description of the invention
Attached drawing is used to provide to further understand this paper technical solution, and constitutes part of specification, with this Shen
Embodiment please is used to explain the technical solution of this paper together, does not constitute the limitation to this paper technical solution.
Fig. 1 to Fig. 9 is that the front view structure of the production process of stretchable display module described in one embodiment of the invention is cutd open
Depending on partial schematic diagram；
Figure 10 is the overlooking structure diagram of stretchable display module described in one embodiment of the invention；
Figure 11 is the production method flow chart of stretchable display module described in one embodiment of the invention；
Figure 12 is the section view partial schematic diagram of stretchable display module described in the relevant technologies.
Wherein, corresponding relationship of the Fig. 1 into Fig. 9 between appended drawing reference and component names are as follows:
100 substrates, 1 circuit structure layer, 11 islands, 12 bridges, 2 third electrode layers, 3 first electrode trace layers, 4 flatness layers, 5
Two electrode layers, 6 first connection line layers, 7 pixel defining layers, 8 barrier dams, 81 insulating layers, 82 second connection line layers, 83 oxygen
Change layer, 9 grooves, 201 luminescent layers, 202 first electrode layers, 203 encapsulated layers.
Specific embodiment
For the purposes, technical schemes and advantages of this paper are more clearly understood, below in conjunction with attached drawing to the reality of this paper
Example is applied to be described in detail.It should be noted that in the absence of conflict, the spy in embodiment and embodiment in the application
Sign can mutual any combination.
Many details are explained in the following description in order to fully understand herein, still, can also be adopted herein
Implemented with other than the one described here mode, therefore, the protection scope of this paper is not by following public specific implementation
The limitation of example.
A kind of island bridge structure is shown in Figure 12, is provided with line construction layer 301 on substrate 300, on line construction layer 301
Multiple islands 302 and bridge 303 be set, in array distribution and separated from one another, multiple bridges 303 connect multiple islands 302 on multiple islands 302,
It is disposed with drain electrode layer 304, anode layer 305 and luminescent layer 306 on island 302, is provided on the bridge 303 for the recessed of stretching
Slot 307 and the cathode leg layer 308 corresponding to island 302, flatness layer 309, pixel defining layer 310 and the first connection line layer
311, pixel defines side layer 310 between the first connection line layer 311 and corresponding island 302, and the first connection line layer 311 is logical
The via hole crossed on flatness layer 309 is connected with cathode leg layer 308, finally makes cathode layer 312, cathode layer 312 and first again
The upper surface of connection line layer 311 is directly connected to, and finally re-forms encapsulated layer 313.
Embodiment one
Stretchable display module provided in an embodiment of the present invention, as shown in Figure 6 to 8, comprising: substrate 100；In array point
Cloth and multiple islands 11 separated from one another are arranged on substrate 100；Multiple bridges 12 are arranged on substrate 100 and in multiple
Between the island 11 and multiple islands 11 of connection；Luminescent layer 201 is arranged on island 11 and bridge 12；With first electrode layer 202, setting is being sent out
On photosphere 201；Wherein, any bridge 12 includes two group of first connection line layer 6, barrier dam 8 and pixel defining layer 7, obstructs 8, dam
Between pixel defining layer 7 and the first connection line layer 6 and separate luminescent layer 201, barrier dam 8 includes insulating layer 81 and is located at
The second connection line layer 82 on insulating layer 81, the second connection line layer 82 connect first electrode layer 202 and the first connection line
Layer 6.The luminescent layer 201 being only located on island 11 shines, and the luminescent layer on bridge 12 does not shine, and luminescent layer 201 can be organic
Luminescent layer.
The stretchable display module, barrier dam 8 are located between pixel defining layer 7 and the first connection line layer 6, in protrusion knot
Structure can make luminescent layer 201 using conventional mask version, and the luminescent layer 201 of production is formed on island 11 and bridge 12, obstructs dam 8
Separate luminescent layer 201 because of protrusion, so that luminescent layer 201 is in mutually independent two parts in barrier dam 8 both sides, is prevented with this
Water oxygen from stretchable zone along luminescent layer 201 to 11 fractional transmission of island, effectively prevent the problem of water oxygen corrodes island portion separation structure,
The cost that can reduce mask plate connects first electrode layer 202 and first by the second connection line layer 82 in barrier dam 8 and connects
Link layer 6 realizes that first electrode layer 202 is connected to the first connection line layer 6.Barrier dam 8 also separates first electrode layer 202.
Wherein, the side towards pixel defining layer 7 of the second connection line layer 82 relative to luminescent layer 201 exposure and with
First electrode layer 202 connects, the side of the first connection line layer 6 of direction of the second connection line layer 82 and the first connection line layer
6 connections.
Due to obstructing the presence on dam 8, when vapor deposition forms luminescent layer 201, luminescent layer 201 is disconnected because existing in barrier Ba8Chu
Difference and disconnects (it also will be understood that are as follows: the tomography of ladder), barrier dam 8 and pixel defining layer 7 between luminescent layer 201 surface it is low
In the surface of the second connection line layer 82 on barrier dam 8, i.e. the side phase towards pixel defining layer 7 of the second connection line layer 82
Be for luminescent layer 201 it is exposed, first electrode layer 202 is deposited again at this time, be vaporized on barrier dam 8 and pixel defining layer 7 between
Luminescent layer 201 on first electrode layer 202 be just docked and connected with the second connection line layer 82, to realize first electrode
Layer 202 is connected with the second connection line layer 82.
It when production obstructs dam 8, can be produced by a patterning processes, the first film of first deposition production insulating layer 81
The thickness of layer, the second film layer of redeposition the second connection line layer 82 of production, the thickness of the first film layer and the first film layer is set as
It is identical as the thickness of the first connection line layer 6, photoresist is then coated in the second film layer and is exposed, in the first connecting line
Unexposed area is formed between road floor 6 and pixel defining layer 7, other regions form exposure area, and unexposed area and first connect
The alignment of edge that 6 phase of link layer is closed on, is then developed and is etched, and the first film layer and the of exposure area is sequentially etched
Two film layers, are fabricated to barrier dam 8, the second connection line layer 82 be located at the one side of the first connection line layer 6 and with the first connection line
6 connection of layer communicates.
In order to ensure the first electrode layer 202 of vapor deposition is smoothly connect with the second connection line layer 82, the thickness of insulating layer 81
It can be set to the thickness not less than luminescent layer 201.It is preferred that the thickness of insulating layer 81 can be set to the thickness equal to luminescent layer 201
The lower surface of degree, the upper surface of the luminescent layer 201 between insulating layer 81 and pixel defining layer 7 and the second connection line layer 82 is total
Face, first electrode layer 202 directly link together with the second connection line layer 82 after being deposited.
The side towards pixel defining layer 7 on dam 8 is obstructed, insulating layer 81 can be set relative to the second connection line layer 82
For recess, i.e., recessed portion is formed in etching, avoid insulating layer 81 to the company of first electrode layer 202 and the second connection line layer 82
It connects and has an impact.Moreover, the angle of gradient of the side towards pixel defining layer 7 of the second connection line layer 82 is 85~95 degree, the
The gradient of the side of the first connection line layer 6 of direction of two connection line layers 82 is also configured as 85~95 degree.
Specifically, the thickness of insulating layer 81 is set as 1000~3000 angstroms, and the thickness of the second connection line layer 82 is set as
100~5000 angstroms.Second connection line layer 82 can select metallic aluminium, Titanium or metal molybdenum etc., can pass through dry carving technology
Etching.The material of insulating layer 81 can be silicon oxide or silicon nitride etc..
Optionally, dam 8 is obstructed further include: antioxidation coating 83 is arranged on the second connection line layer 82, for connecting to second
Link layer 82 carries out protection against oxidation.The material of antioxidation coating 83 can be silicon oxide or silicon nitride etc..Antioxidation coating 83 exists
Orthographic projection on substrate 100 is set as being overlapped with orthographic projection of the second connection line layer 82 on substrate 100.Insulating layer 81
Side can be face directly or inclined-plane.
Furthermore as shown in Fig. 6 to Figure 10, bridge 12 further includes the groove 9 for realizing stretching, corresponding with each island 11
Each group pixel defining layer 7, the first connection line layer 6 and barrier dam 8 are separated out by groove 9, are also set on the bottom wall of groove 9
It is equipped with luminescent layer 201 and first electrode layer 202.Wherein, the luminescent layer 201 on 9 bottom wall of groove and the luminescent layer 201 outside groove 9
It disconnects, the first electrode layer 202 outside first electrode layer 202 and groove 9 on 9 bottom wall of groove disconnects.
It is provided with the circuit structure layer 1 comprising driving circuit, starting circuit etc. on substrate 100, is arranged on circuit structure layer 1
Island 11 and bridge 12.Wherein, island 11 includes third electrode layer 2, and third electrode layer 2 can be drain electrode, be provided on third electrode layer 2
The second electrode lay 5, the second electrode lay 5 can be anode, and first electrode layer 202 can be cathode；Bridge 12 further includes corresponding to island
(the first electrode trace layer 3 between adjacent two island can be connected together 11 first electrode trace layer 3 when being formed, and finally exist
Groove 9 is formed after being broken into two parts) and flatness layer 4 (flatness layer 4 between adjacent two island can be connected together in formation,
Finally groove 9 is being formed after being broken into two parts), flatness layer 4 covers first electrode trace layer 3, the first connection line layer 6, resistance
It is arranged on flatness layer 4 every dam 8 and pixel defining layer 7, groove 9 is opened up to flatness layer 4, exposure electricity on the bottom wall of groove 9
Line structure layer 1, forms encapsulated layer 203 after having made first electrode layer 202, and encapsulated layer 203 can be produced on the interior of groove 9
It on side and outer end face, can be formed by way of vapor deposition, barrier dam 8, pixel defining layer 7 and the first connection line layer
6 is raised on flatness layer 4.The first connection line layer 6 between adjacent two island 11 can be connected together when being formed, and finally exist
Groove 9 is formed after being broken into two parts.
In any 12 structure of bridge, the two sides of groove 9 are symmetrically arranged with first electrode trace layer 3, flatness layer 4, first connects
Line layer 6, barrier dam 8 and pixel defining layer 7.
Embodiment two
Display equipment (not shown) provided in an embodiment of the present invention, including stretchable described in any of the above-described embodiment
Display module.
Display equipment provided by the invention, the whole for having stretchable display module described in any of the above-described embodiment are excellent
Point, details are not described herein.
Show that equipment can be with are as follows: mobile phone, tablet computer, television set, display, laptop, Digital Frame, navigator
Etc. any products or components having a display function.
Embodiment three
The production method of stretchable display module provided in an embodiment of the present invention, as shown in figure 11, comprising:
S100: as shown in fig. 6, sequentially forming barrier dam 8 corresponding with island 11 and the first connection on non-display area
Line layer 6, barrier dam 8 includes insulating layer 81 and the second connection line layer 82, and the second connection line layer 82 is formed in insulating layer 81
Above and with the first connection line layer 6 it connect；
S200: as shown in fig. 7, forming luminescent layer 201 on display area and non-display area, the partition of barrier dam 8 shines
Layer 201 simultaneously makes the second connection line layer 82 relative to the exposure of luminescent layer 201；
S300: as shown in figure 8, forming first electrode layer 202, first electrode layer on display area and non-display area
202 connect with the exposed region of the second connection line layer 82.
The production method of the stretchable display module, barrier dam 8 is located between island 11 and the first connection line layer 6, in convex
Structure is played, luminescent layer 201 can be made of conventional mask version, the luminescent layer 201 of production be formed in display area and non-display
On region, barrier dam 8 separates luminescent layer 201 because of protrusion, so that luminescent layer 201 is in mutually independent two in barrier 8 both sides of dam
Part, with this come prevent water oxygen from stretchable zone along luminescent layer 201 to 11 fractional transmission of island, effectively prevent water oxygen and corrode island
The problem of part-structure, can reduce the cost of mask plate.
Wherein, the side towards island 11 for obstructing dam 8 separates luminescent layer 201, the second connection line layer 82 towards island 11
Side relative to luminescent layer 201 exposure and connect with first electrode layer 202, the second connection line layer 82 direction first company
The side of link layer 6 is connect with the first connection line layer 6.
It is raised on flatness layer 4 to obstruct dam 8, luminescent layer 201 is in hierarchic structure (i.e. luminescent layer 201 in barrier Ba8Chu partition
Because obstructing dam 8 due to tomography), the second connection line layer 82 is higher than the luminescent layer 201 between barrier dam 8 and island 7, at this time the second connection
The side side towards island of line layer 82 is then relative to the exposure of luminescent layer 201, after making first electrode layer 202, on island 11
Part between barrier dam 8, side and second connecting line of the first electrode layer 202 by the exposure of the second connection line layer 82
Road floor 82 is electrically connected, and when production obstructs dam 8, directly the second connection line layer 82 and the first connection line layer 6 can be connected
It connects and is connected, that is, realize the mesh for being connected to first electrode layer 202 and the first connection line layer 6 by the second connection line layer 82
's.
Furthermore obstructing dam 8 further includes antioxidation coating 83, is formed on the second connection line layer 82, and insulating layer 81, second connects
Link layer 82 and antioxidation coating 83 are made of a patterning processes, form insulating layer 81, the second connection line layer in etching
82 and when antioxidation coating 83, different etching liquid or etch rate can be used, so that the side towards island 7 of insulating layer 81
It is recessed relative to antioxidation coating 83 and the second connection line layer 82, avoids insulating layer 81 from influencing first electrode layer 202 and second and connect
The connection conducting of link layer 82.
After etching, the positive throwing of orthographic projection of the antioxidation coating 83 on substrate 100 and the second connection line layer 82 in substrate 100
Shadow is overlapped, thus, antioxidation coating 83 preferably can carry out protection against oxidation to the second connection line layer 82.Moreover, the second connection
The surface of the surface of line layer 82 and the first connection line layer 6 also flush.The thickness and insulating layer of second connection line layer 82
The sum of 81 thickness can be set to it is identical as the thickness of the first connection line layer 6, the thickness of insulating layer 81 can be set to
The thickness of luminescent layer 201 is identical, and the thickness of first electrode layer 202 can be set to the thickness phase with the second connection line layer 82
Together.
Further, before step S100, production method further include:
The first electrode trace layer 3 and flatness layer 4 corresponding to island 11, flatness layer 4 are sequentially formed on non-display area
First electrode trace layer 3 is covered, the via hole for exposing first electrode trace layer 3 is provided on flatness layer 4.
In step S100, is forming barrier dam 8 and then forming the first connection line layer 6, the first connection line layer 6 is logical
Via hole is connect with first electrode trace layer 3；
Two flatness layers 4 between adjacent two island can be connected together when being formed, two first electrode trace layers 3 are when forming
It can be connected together, two first connection line layers 6 can be connected together when being formed.
Between S100 and S200, production method further include:
As shown in Fig. 6 to Figure 10, groove 9 is formed on non-display area, groove 9 separates the first connection line layer 6, flat
Layer 4 and first electrode trace layer 3 are at relative to the symmetrical two parts of groove 9, exposure substrate 100, substrate on the bottom wall of groove 9
Circuit structure layer 1 can be set on 100, at this time exposed circuits structure sheaf 1 on the bottom wall of groove, 3 He of first electrode trace layer
Flatness layer 4 is arranged on circuit structure layer 1；
In step S200 and S300, luminescent layer 201 and first electrode layer 202 are also sequentially formed on the bottom wall of groove 9.
After step S300, encapsulated layer 203 is formed on display area and non-display area, encapsulated layer 203 covers extremely
First electrode layer 202 on the side wall of groove 9 and on exposure 9 bottom wall of groove.
As shown in Figures 1 to 5, before step S100, which also has formation circuit structure layer on substrate 100
1 the step of；On the non-display area of circuit structure layer 1 correspond to island 11 be arranged two first electrode trace layers 3, two first
Contact conductor layer 3 is spaced, and then successively makes a flatness layer 4 on non-display area again；Made two barrier dams 8 it
Afterwards, then two pixel defining layers 7 and the first connection line layer 6 etc. being made, flatness layer 4 covers two first electrode trace layers 3,
One the first connection line layer 6 is set on flatness layer 4, and the first connection line layer 6 passes through two via holes and two on flatness layer 4
First electrode trace layer 3 is connected, and two barrier dams 8 are between the first connection line layer 6 and two pixel defining layers 7.It can
To make groove 9 by patterning processes, the groove 9 being fabricated to separates flatness layer 4 and the first connection line layer 6 at mutually indepedent
Two parts.
Example IV
The production method (not shown) of stretchable display module provided in an embodiment of the present invention, comprising:
1) as shown in Figure 1, making circuit structure layer 1 on substrate 100, island 11 and bridge 12 are set on circuit structure layer,
Island 11 is located at display area (at the dotted line frame of both sides), and bridge 12 is located at non-display area (at intermediate dotted line frame)；
Island defines that one or more pixel units, a pixel unit include at least three sub-pixel, each sub-pixel packet
Include thin film transistor (TFT) (Thin Film Transistor, TFT).One pixel unit may include 4 sub-pixels, respectively red
Sub-pixels R, green sub-pixels G, blue subpixels B and white sub-pixels W.One pixel unit also may include 3 sub- pictures
Plain (red sub-pixel R, green sub-pixels G and blue subpixels B) situation.In the present embodiment, the structure and system of circuit structure layer 1
Standby process is identical as existing structure and preparation process.Wherein, thin film transistor (TFT) can be bottom grating structure, be also possible to top-gated knot
Structure can be amorphous silicon (a-Si) thin film transistor (TFT), be also possible to low temperature polycrystalline silicon (LTPS) thin film transistor (TFT) or oxide
(Oxide) thin film transistor (TFT) does not do specific restriction herein.When actual implementation, substrate 100 can use glass, quartz, polyene
It is resin, polyethylene naphthalate system resin, polyimides system resins, poly terephthalic acid class plastics, phenolic resin etc.
High photopermeability material or surface treated flexible polymeric film etc., circuit structure layer 1 can be made by patterning processes.
Line construction layer 1 can be dot structure layer, and dot structure layer includes a plurality of grid line and multiple data lines, a plurality of grid
Line and multiple data lines square crossing limit the pixel unit of multiple matrix arrangements, and each pixel unit includes at least three
Pixel, each sub-pixel include thin film transistor (TFT) (Thin Film Transistor, TFT).
2) as shown in Fig. 2, forming third electrode layer 2 on the display region, it is aobvious that one-to-one correspondence is formed on non-display area
Show two first electrode trace layers 3 of region setting；
Third electrode layer 2 and first electrode trace layer 3 are fabricated to by patterning processes, and " patterning processes " include deposition film
The processing such as layer, coating photoresist, mask exposure, development, etching, stripping photoresist, are the preparation processes of existing maturation.Deposition can
Using already known processes such as sputtering, vapor deposition, chemical vapor depositions, known coating processes are can be used in coating, and etching can be used known
Method, do not do specific restriction herein.The manufacturing process of third electrode layer 2 and first electrode trace layer 3 may is that deposition gold
Belong to film layer, photoresist is coated on metallic diaphragm, is then drawn by way of mask exposure in third electrode layer 2 and first electrode
Region except line layer 3 is exposed, and etches away the metallic diaphragm of exposure area after development, and third electrode layer 2 and is made
One contact conductor layer 3, then peel off the photoresist on third electrode layer 2 and first electrode trace layer 3, third electrode layer 2 can be with
For drain electrode, first electrode trace layer can be cathode leg layer 3.
3) as shown in figure 3, forming flatness layer 4 in non-display area, flatness layer 4 covers first electrode trace layer 3, flat
The via hole of each first electrode trace layer 3 of exposure is formed on layer 4, flatness layer 4 is made up of patterning processes；" patterning processes " packet
The processing such as depositional coating, coating photoresist, mask exposure, development, etching, stripping photoresist are included, are the preparation works of existing maturation
Skill.The already known processes such as sputtering, vapor deposition, chemical vapor deposition can be used in deposition, and known coating processes can be used in coating, and etching can
It adopts by known method, does not do specific restriction herein.Flatness layer 4 can be insulating layer.
The manufacturing process of flatness layer 4 can be with are as follows: the film layer of flatness layer 4, film layer covering first are arranged on non-display area
Contact conductor layer 3, then coats photoresist in film layer, is exposed by grinding, so that being located at the film layer on display area
Exposure, the film layer in first electrode trace layer 3 expose two circular holes, and exposure area is etched away after development, is finally removed not
The photoresist of exposure area.Tool is there are two via hole on flatness layer 4 at this time, and two first electrodes of exposure are drawn on the bottom wall of two via holes
Line layer 3.
4) as shown in figure 4, forming the second electrode lay 5 on third electrode layer 2, so that the surface of the second electrode lay 5 and flat
The surface co-planar of smooth layer 4, forms the first connection line layer 6 on flatness layer, and the first connection line layer 6 passes through each via hole and each the
One contact conductor layer 3 is connected；
The production method of the second electrode lay 5 and the first connection line layer 6 can be with are as follows: the first metallic film of deposition or first is thoroughly
Bright conductive film is formed simultaneously the second electrode lay 5 and the first connection line layer 6 by a patterning processes.First electrically conducting transparent
Film can using indium tin oxide (Indium Tin Oxide, ITO) or indium-zinc oxide (Indium Zinc Oxide,
The materials such as IZO), the first metallic film can using one kind of magnesium Mg, silver Ag, aluminium Al, copper Cu, lithium Li et al. metal material, or on
State alloy or the composite layer of above-mentioned metal material etc. of metal material.The embodiment of the present invention does not limit the first connection line layer 6
It is fixed, such as can be sheet, it is also possible to bar shaped etc., is connect by via hole with each first electrode trace layer 3.
5) as shown in figure 5, sequentially forming in the first connection line layer 6 on flatness layer 4 and between display area barrier dam 8
It with pixel defining layer 7, obstructs dam 8 and is located between pixel defining layer 7 and the first connection line layer 6, barrier dam includes insulating layer 83
With the second connection line layer 82 being located on insulating layer, the second connection line layer 82 is electrically connected with the first connection line layer 6, pixel
It defines layer 7 and limits display area；
Forming pixel defining layer includes: that one pixel of coating defines film, defines film to pixel using mask plate and exposes
Pixel defining layer 7 is formed after photodevelopment.Pixel defining layer 7 is for limiting pixel region, (island 12 namely in the application).This
In embodiment, pixel defining layer 7 (Pixel Define Layer) can use polyimides, acrylic or poly terephthalic acid
Glycol ester can also use chemical vapor deposition manner.Barrier dam 8 is fabricated to by a patterning processes.Obstructing dam 8 can be with
Including the second connection line layer 82 for being located at insulating layer 81 and being set on insulating layer 81, barrier dam 8 also may include being located at absolutely
It edge layer 81, the second connection line layer 82 being set on insulating layer 81 and is set to anti-oxidation on the second connection line layer 82
Layer 83.It is illustrated, is sequentially depositing for obstructing dam 8 and including insulating layer 81, the second connection line layer 82 and antioxidation coating 83
The film layer of insulating layer 81, the second connection line layer 82 and antioxidation coating 83 (can pass through photoetching work after forming insulating layer 81
Skill etches away the insulating layer 81 of 6 side surface upper part of the first connection line layer, to ensure when forming the second connection line layer 82, second
Connection line layer 82 can be connected with the first connection line layer 6), Ba Chu is obstructed in film layer and coats photoresist, passes through exposure mask
Version exposure, unexposed area is between the first connection line layer 6 and pixel defining layer 7, after development, uses the first etch rate V1
The film layer of antioxidation coating 83 is performed etching, it is to be etched it is complete after reuse the second etch rate V2 to the second connection line layer 82
Film layer perform etching, reusing third etch rate V3 after completion to be etched performs etching the film layer of insulating layer 81, and
V3 > V1, V3 > V2, can be V1=V2, to be recessed in being formed towards 11 side of island for insulating layer 81, and the second connection line layer
82 orthographic projection is consistent with the orthographic projection of antioxidation coating 83 and is all larger than the orthographic projection of insulating layer 81.Antioxidation coating 83 and insulation
Layer 81 can be SiO2Or SiNx etc., different material is selected, antioxidation coating 83 is used to carry out oxygen to the second connection line layer 82
Change protection, the second connection line layer 82 can be the dry carving technologies materials such as aluminium, titanium or molybdenum.The thickness of insulating layer 81 can be set to
1000~3000 angstroms.The thickness of second connection line layer 82 can be set to 100~5000 angstroms.The court of second connection line layer 82
It is to face directly to the side of 11 side of island, the angle of gradient is 90 degree or so.The side towards 11 side of island of antioxidation coating 83 and insulating layer 81
For inclined-plane.And the sum of thickness of insulating layer 81 and the second connection line layer 82 is equal to the thickness of the first connection line layer 6, so that
Second connection line layer 82 of support is directly linked together with the first connection line layer 6 and is connected.
6) as shown in fig. 6, opening up groove 9 between two first electrode trace layers 3 on any non-display area, groove 9 every
Disconnected first connection line layer 6 and flatness layer 4 and bottom-exposed circuit structure layer 1, groove 9 can be made up of patterning processes；
" patterning processes " include the processing such as depositional coating, coating photoresist, mask exposure, development, etching, stripping photoresist, are existing
Mature preparation process.The already known processes such as sputtering, vapor deposition, chemical vapor deposition can be used in deposition, and known painting can be used in coating
Coating process, etching can be used known method, do not do specific restriction herein.
7) as shown in fig. 7, making luminescent layer 201 on non-display area and display area, the luminescent layer on dam 8 is obstructed
201 luminescent layer tomography due to obstructing dam protrusion with 7 side of pixel defining layer, the side towards island 11 of the second connection line layer 82
Relative to the exposure of luminescent layer 201, also tomography, i.e. luminescent layer 201 on 9 inner bottom surface of groove and first connect luminescent layer 201 at groove 9
Luminescent layer 201 on link layer 6 is disconnected because of groove 9, obstructs the luminescent layer 201 between dam 8 and pixel defining layer 7 at this time
Upper surface is concordant with the upper surface of insulating layer 81；As shown in figure 8, first electrode layer 202 is made on luminescent layer 201 again, second
It is connect at the exposure of connection line layer 82 with first electrode layer 202, the thickness of first electrode layer 202 can be fabricated to be connected with second
The thickness of link layer 82 is identical, obstructs the first electrode layer in the first electrode layer 202 and the first connection line layer 8 on dam 8
202 can also can pass through setting with tomography (at this time may be that continuous structure does not turn off when being not provided with antioxidation coating 83)
The mode of the thickness of antioxidation coating 83 etc. is realized；
Luminescent layer and first electrode layer can by by vapor deposition in a manner of make, because barrier dam is located at pixel defining layer and the
It is raised on flatness layer between one connection line layer, luminescent layer can be made using conventional mask version, the luminescent layer of production is formed
On island and bridge, barrier dam separates luminescent layer (can be unilateral partition, be also possible to bilateral partition) because of protrusion, so that shining
Layer is in mutually independent two parts or three parts in barrier Ba Chu, with this come prevent water oxygen from stretchable zone along luminescent layer to island
Interior transmission effectively prevents the problem of water oxygen corrodes island portion separation structure, can reduce production and the design cost of mask plate.
8) as shown in figure 9, production encapsulated layer 203, encapsulated layer 203 is formed to the side wall of groove 9, on 9 bottom wall of groove
The exposure of first electrode layer 202.Encapsulated layer 203 can be fabricated to using a Mapping Technology, that is, deposit organic or inorganic compounding material
The film layer of material, such as tetrafluoroethene TFE, film layer covers entire substrate 100, forms encapsulated layer 203, then by coating photoresist,
The processing such as mask exposure, development, etching, stripping photoresist, so that the exposure of cathode 202 on 9 bottom wall of groove；Encapsulated layer 203
It can be fabricated to by the way of coating.
Wherein, island 11 includes third electrode layer 2 and the second electrode lay 5；Bridge 12 includes first electrode trace layer 3, flatness layer
4, pixel defining layer 7, barrier dam 8, the first connection line layer 6 and groove 9.Luminescent layer 201, first electrode layer 202 and encapsulated layer
203 are located on island 11 and bridge 12 simultaneously.
It should be pointed out that barrier dam 8 can make before the making step of pixel defining layer 7 and the first connection line layer 6
Out, barrier dam 8 can also be produced between pixel defining layer 7 and the making step of the first connection line layer 6, and barrier dam 8 is also
It can be produced in the thickness of pixel defining layer 7 and the making step of the first connection line layer 6.
Certainly, island 11 also may include the luminescent layer 201 and first electrode layer 202 positioned at display area part, island 12
It may include the luminescent layer 201 and first electrode layer 202 positioned at non-display area part.
In the present embodiment described " patterning processes " include depositional coating, coating photoresist, mask exposure, development, etching,
Stripping photoresist etc. is handled, and described " photoetching process " includes the processing such as coating film layer, mask exposure, development in the present embodiment,
It is preparation process mature in the related technology.The already known processes such as sputtering, chemical vapor deposition can be used in deposition, and coating can be used
The coating processes known, etching can be used known method, do not do specific restriction herein.
In description herein, term " installation ", " connected ", " connection ", " fixation " etc. be shall be understood in a broad sense, for example,
" connection " may be fixed connection or may be dismantle connection, or integral connection；It can be directly connected, can also lead to
Intermediary is crossed to be indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning herein.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of this paper
In example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.
Moreover, the particular features, structures, materials, or characteristics of description can be in any one or more of the embodiments or examples with suitable
Mode combine.
Although embodiment disclosed herein is as above, the content only implementation of use herein for ease of understanding
Mode is not limited to herein.Technical staff in any this paper fields, do not depart from spirit disclosed herein and
Under the premise of range, any modification and variation, but the patent protection model of this paper can be carried out in the form and details of implementation
It encloses, still should be subject to the scope of the claims as defined in the appended claims.
Claims (10)
1. a kind of display module characterized by comprising
Substrate has display area and non-display area；
In array distribution and multiple islands separated from one another, it is arranged on the display area of the substrate；
Multiple bridges are arranged on the non-display area of the substrate and are between multiple islands and connect multiple described
Island；
Luminescent layer is arranged on the island and the bridge；With
First electrode layer, setting is on the light-emitting layer；
Wherein, the bridge includes the first connection line layer corresponding with the island and barrier dam, and the barrier dam is located at institute
The luminescent layer is stated between island and the first connection line layer and separates, the barrier dam includes insulating layer and is located at described
The second connection line layer on insulating layer, the second connection line layer connect the first electrode layer and first connecting line
Road floor.
2. display module according to claim 1, which is characterized in that the side towards the island on the barrier dam separates
The luminescent layer, the side towards the island of the second connection line layer relative to the luminescent layer exposure and with it is described
First electrode layer connection.
3. display module according to claim 1, which is characterized in that the side towards the island on the barrier dam, institute
Insulating layer is stated to be recessed relative to the second connection line layer.
4. display module according to claim 1, which is characterized in that the barrier dam further include:
Antioxidation coating is arranged on the second connection line layer, for carrying out anti-oxidation guarantor to the second connection line layer
Shield.
5. display module according to claim 1, which is characterized in that the angle of gradient of the side of the second connection line layer
It is 85~95 degree, the thickness of the insulating layer is not less than the thickness of the luminescent layer.
6. display module according to any one of claim 1 to 5, which is characterized in that the bridge further include for realizing
The groove of stretching, the first connection line layer and barrier dam described in each group corresponding with each island are separated by the groove
It opens, the luminescent layer and the first electrode layer is also equipped on the bottom wall of the groove.
7. a kind of display equipment, which is characterized in that including just like display module described in any one of claims 1 to 6.
8. a kind of production method of display module characterized by comprising
Barrier dam corresponding with island and the first connection line layer are formed on non-display area, the barrier dam is located at described
Between first connection line layer and the island, the barrier dam includes insulating layer and the second connection line layer, second connection
Line layer is formed on the insulating layer and connect with the first connection line layer；
Luminescent layer is formed on display area and non-display area, the barrier dam separates the luminescent layer and makes described second
Connection line layer is relative to luminescent layer exposure；
First electrode layer, the first electrode layer and the second connection line layer are formed on display area and non-display area
Exposed region connection.
9. the production method of display module according to claim 8, which is characterized in that the barrier dam towards the island
Side separate the luminescent layer, the side towards the island of the second connection line layer is sudden and violent relative to the luminescent layer
Reveal and is connect with the first electrode layer.
10. the production method of display module according to claim 8, which is characterized in that the barrier dam further includes oxygen
Change layer, is formed on the second connection line layer, the insulating layer, the second connection line layer and the antioxidation coating are adopted
It is made of a patterning processes, and the etch rate of the insulating layer is greater than the etch rate and described the of the antioxidation coating
The etch rate of two connection line layers, so that the insulating layer the side towards the island relative to the antioxidation coating and
The second connection line layer recess.
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