CN109877463A - Laser drilling system and method - Google Patents
Laser drilling system and method Download PDFInfo
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- CN109877463A CN109877463A CN201910283427.XA CN201910283427A CN109877463A CN 109877463 A CN109877463 A CN 109877463A CN 201910283427 A CN201910283427 A CN 201910283427A CN 109877463 A CN109877463 A CN 109877463A
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Abstract
Present invention discloses a kind of systems of laser drill, it includes laser, diffraction optics module and focusing optical module, laser is for emitting first laser beam, diffraction optics module receives the first laser beam of laser transmitting and carries out diffraction to it, and generate multiple second laser beams, it focuses optical module and receives multiple second laser beams of diffraction optics module diffraction, and focus on workpiece respectively, form multiple holes on workpiece；Present invention further teaches a kind of boring methods of laser drilling system.The application is by laser, diffraction optics module and focuses optical module and is equipped with carry out laser drill, improves the efficiency of laser drill, can satisfy the demand that the band under the conditions of high-speed motion drills online.
Description
Technical field
The present invention relates to laser drilling processes field, it is specifically related to a kind of laser drilling system and method.
Background technique
The advantages that laser goes with coherence with its monochromaticjty, high directivity, processing and in terms of have widely
Using wherein laser drill is the relatively early laser processing technology for reaching functionization, such as the laser on the slim band of large format
Drilling.The laser drill of the slim band of large format often has the requirement of stringent porosity, especially in lithium ion battery
Collector drills this block, and the porosity of collector influences whether the performance of lithium ion battery.And laser drill is in the prior art
It is carried out in such a way that galvanometer jumps, processing minor face can be limited to the breadth of galvanometer, and its bore mode is to process one by one, processing
Efficiency is relatively low, is not able to satisfy the demand that the band under the conditions of high-speed motion drills online.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of system and method for laser drill.
A kind of system of laser drill includes laser, is used to emit first laser beam；
Diffraction optics module, the first laser beam for receiving laser transmitting simultaneously carries out diffraction to it, and generates multiple the
Dual-laser beam；And
Optical module is focused, multiple second laser beams of diffraction optics module diffraction are received, and focuses on work respectively
Multiple holes are formed on part, on workpiece.
According to an embodiment of the present invention, the quantity of the second laser beam of diffraction optics module diffraction is adjustable, or/and poly-
Effective focusing length of burnt optical module is adjustable.
It according to an embodiment of the present invention, further include Workpiece transfer mechanism；Workpiece transfer mechanism is for driving workpiece alignment
Property it is mobile.
According to an embodiment of the present invention, Workpiece transfer mechanism drives the linearly moving speed of workpiece adjustable.
A kind of boring method of laser drilling system includes:
A prebored hole) is carried out on workpiece, and measures the pitch of holes of prebored hole on workpiece；
B judge the pitch of holes being formed on workpiece) as pitch of holes preset value, laser drill is carried out to workpiece.
According to an embodiment of the present invention, step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C1), make to focus optical module
Effective focusing length is constant and Workpiece transfer mechanism drives the linearly moving speed of workpiece constant, adjust diffraction optics module and spread out
The quantity for the second laser beam penetrated, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
According to an embodiment of the present invention, step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C2), make diffraction optics module
The quantity of the second laser beam of diffraction is constant and Workpiece transfer mechanism drives the linearly moving speed of workpiece constant, adjusts and focuses light
Effective focusing length of module is learned, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
According to an embodiment of the present invention, by formula D=F*tan (θ s) to the effective focusing length for focusing optical module
It is adjusted；Wherein, F is expressed as focusing effective focusing length of optical module, and θ s is expressed as focusing the phase that optical module focuses
The angle of departure of adjacent laser interfascicular；D is expressed as pitch of holes.
According to an embodiment of the present invention, step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C3), make diffraction optics module
The quantity of the second laser beam of diffraction is constant constant with effective focusing length of focusing optical module, adjusts Workpiece transfer mechanism band
It starts building the linearly moving speed of part, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
According to an embodiment of the present invention, step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C4), it is adjusted in synchronism diffraction light
The quantity of the second laser beam of module diffraction, effective focusing length of focusing optical module and Workpiece transfer mechanism band is learned to start building
Two kinds in the linearly moving speed of part or three kinds, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
Compared with the existing technology, the application is set by the cooperation of laser, diffraction optics module and focusing optical module
Carry out laser drill is set, the efficiency of laser drill is improved, can satisfy the need that the band under the conditions of high-speed motion drills online
It asks.
In addition, by the quantity for the second laser beam for adjusting diffraction optics module diffraction, or/and adjust and focus optical module
Effective focusing length, or/and adjust Workpiece transfer mechanism drive the linearly moving speed of workpiece, can reach adjust workpiece on bore
The purpose of the porosity in hole, and adjustment process is convenient, can be applicable in the drilling of various porosity workpiece, symbol is processed on workpiece
Close the product that porosity requires.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of laser drilling system in embodiment one；
Fig. 2 is the structural schematic diagram of multiple groups laser drilling system in embodiment one.
Description of symbols:
1, laser；11, laser；12, laser head；2, diffraction optics module；3, optical module is focused；4, Workpiece transfer
Mechanism.
Specific embodiment
Multiple embodiments of the invention will be disclosed with schema below, as clearly stated, the details in many practices
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the invention, the details in these practices is non-essential.In addition, for the sake of simplifying schema,
Some known usual structures and component will be painted it in the drawings in simply illustrative mode.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the situation of movement etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, not especially censure
The meaning of order or cis-position, also non-to limit the present invention, the component described just for the sake of difference with same technique term
Or operation, it is not understood to indicate or imply its relative importance or implicitly indicates the number of indicated technical characteristic
Amount." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one of the features.In addition, each
Technical solution between a embodiment can be combined with each other, but must can be implemented as base with those of ordinary skill in the art
Plinth will be understood that the combination of this technical solution is not present when conflicting or cannot achieve when occurs in the combination of technical solution,
Also not the present invention claims protection scope within.
For that can further appreciate that the contents of the present invention, feature and effect, the following examples are hereby given, and cooperates attached drawing detailed
It is described as follows:
Embodiment one
Referring to Figures 1 and 2, Fig. 1 is the structural schematic diagram of laser drilling system in embodiment one, and Fig. 2 is in embodiment one
The structural schematic diagram of multiple groups laser drilling system.The system of laser drill in the present embodiment includes laser 1, diffraction optics mould
Block 2 and focusing optical module 3.Laser 1 is for emitting first laser beam.Diffraction optics module 2 receives what laser 1 emitted
First laser beam simultaneously carries out diffraction to it, and generates multiple second laser beams.It focuses optical module 3 and receives diffraction optics module 2
Multiple second laser beams of diffraction, and focus on workpiece respectively, multiple holes are formed on workpiece.
It is equipped with carry out laser drill by laser 1, diffraction optics module 2 and focusing optical module 3, is improved
The efficiency of laser drill can satisfy the demand that the band under the conditions of high-speed motion drills online, process symbol on workpiece
Close the product that porosity requires.
Multiple the quantity of the second laser beam of 2 diffraction of diffraction optics module is adjustable referring to Figures 1 and 2, or/and focusing light
The effective focusing length for learning module 3 is adjustable.
By the quantity of the second laser beam of adjusting 2 diffraction of diffraction optics module, or/and adjusts and focus optical module 3
Effective focusing length can reach the purpose for adjusting the porosity to drill on workpiece, and adjustment process is convenient, can be applicable in various holes
The drilling of gap rate workpiece.
Specifically, laser 1, diffraction optics module 2 and the central axis overlapping for focusing optical module 3.The present embodiment
In laser 1 include laser 11 and laser head 12, laser 11 connect with laser head 12 by wire rod, the production of laser 11
Raw laser is launched in the form of laser beam laser head 12, by the position of mobile laser head 12 and towards diffraction light
The angle of module 2 is learned, adjustable laser head 12 launches the orientation of laser beam.When concrete application, laser head 12, diffraction optics
Module 2 and the central axis overlapping for focusing optical module 3, laser 11 can be rationally arranged according to processing environment, with section
Save space.
Diffraction optics module 2 is diffactive lens in the present embodiment, and specifically optional multifocal diffractive mirror, laser head 12 are launched
The quantity for the first laser beam come by the diffraction optics module 2 of different size can diffraction go out the second laser beam of different number.
That is, the second laser of 2 diffraction of diffraction optics module can be completed by the diffraction optics module 2 for replacing different specifications
The adjusting of the quantity of beam.
Focusing optical module 3 in the present embodiment is focus lamp, and specific can be selected focuses convex lens, diffraction optics module 2
The a plurality of second laser beam that diffraction goes out, is focused respectively through over-focusing optical module 3, and workpiece, which is in, focuses optical module 2
Focal position focuses the focus point that optical module 3 is formed and acts on workpiece, can reach the purpose to drill on workpiece.It is different
The effective focusing length of focusing optical module 3 of specification is different, that is to say, that by the focusing optical module 3 for replacing different size
The adjusting for focusing effective focusing length of optical module 3 can be completed.
Workpiece to be processed is the slim band of large format, such as the metal of production affluxion body in lithium ion batteries in the present embodiment
Piece can be formed on sheet metal by the laser drilling system of the application and be uniformly distributed or the hole of non-uniform Distribution, work as needs
When the hole of non-homogeneous difference, the laser energy of non-uniform Distribution may be selected as metal in energy source or change of scale area
The porosity of on piece.The laser beam that single laser head 12 emits is by diffraction optics module 2 and after focusing optical module 3
Achievable multiple drilling processings are equivalent to the mode that traditional galvanometer jumps drilling, save and jump the time, improve drilling effect
Rate, and reduce drilling cost.
Multiple reference Fig. 2, further, the laser drilling system in the present embodiment further includes Workpiece transfer mechanism 4.Workpiece moves
Send mechanism 4 for driving workpiece linear movement.Roll shaft mobile device, metal can be used in Workpiece transfer mechanism 4 in the present embodiment
Piece moves on roller in the form that material volume unreels, and the tranmitting frequency for focusing the laser beam that optical module 3 focuses is combined with, between progress
Formula of having a rest is mobile, realizes on-line machining on roller, further improves the processing efficiency of drilling.
It is adjustable that Workpiece transfer mechanism 4, which drives the linearly moving speed of workpiece, for example, sheet metal moves online on roller
When dynamic, by increaseing or decreasing the velocity of rotation of roller, that is, it can reach and adjust the linearly moving speed of workpiece.It is understood that
If the quantity of the second laser beam of 2 diffraction of diffraction optics module and the effective focusing length for focusing optical module 3 are constant, work as workpiece
When transfer mechanism 4 drives the linearly moving speed of workpiece to accelerate, the pitch of holes for the drilling being formed on workpiece will become larger, relatively
Unit length in the quantity of drilling will become smaller, that is, porosity will become smaller, conversely, working as 4 band of Workpiece transfer mechanism
When starting building that part is linearly moving to slow, the porosity of workpiece just be will increase.In this way, by adjusting 4 band of Workpiece transfer mechanism
It starts building the linearly moving speed of part, also can reach the purpose for adjusting the porosity to drill on workpiece.
Preferably, Workpiece transfer mechanism 4 and laser 1, diffraction optics module 2 and the central axis for focusing optical module 3
Line overlap.
Multiple reference Fig. 2, further, the quantity of laser 1, diffraction optics module 2 and focusing optical module 3 is more
Group, laser 1, diffraction optics module 2 and the focusing optical module 3 of multiple groups are arranged side by side.By the way that multiple groups laser is arranged side by side
Hole-drilling system can be improved the compatibility that material strip width can be processed in hole-drilling system, realize the flexibility remodeled.
Preferably, the moving direction and multiple focusing optical modules 3 arranged side by side for the workpiece that Workpiece transfer mechanism 4 drives
Setting direction it is vertical.In this way, the movement for the workpiece that Workpiece transfer mechanism 4 drives, multiple focusing optical modules 3 arranged side by side
The drilling that can be completed at the same time on workpiece, for example, the drilling of a row can be synchronously completed on sheet metal.
Embodiment two
A kind of boring method of laser drilling system includes:
A prebored hole) is carried out on workpiece, and measures the pitch of holes of prebored hole on workpiece.
B judge the pitch of holes being formed on workpiece) as pitch of holes preset value, laser drill is carried out to workpiece.
In step A), first by workpiece feeding in Workpiece transfer mechanism 4, transfer mechanism 4 drives workpiece constant velocity linear mobile,
And the movement speed for keeping mobile mechanism 4 to drive workpiece is constant, it is enterprising in workpiece by the laser drilling system in embodiment one
Row prebored hole, and the distance between adjacent two hole, i.e. pitch of holes are measured according to the actual borehole on workpiece, specific test can pass through
Distance mearuring equipment is tested, distance mearuring equipment can direct market purchase, details are not described herein again.It needs to drill in the present embodiment and add
The workpiece of work is sheet metal, and Workpiece transfer mechanism 4 uses the online mobile device of roll shaft, according to the laser drill system in embodiment one
After system is set, the form that sheet metal is unreeled with material volume moves online in roll shaft mobile device, by controlling Workpiece transfer machine
Structure 4 controls the movement and stopping of sheet metal.
It is worth noting that the porosity of workpiece is the closeness of the drilling on workpiece unit area, workpiece unit is adjusted
The distance between adjacent two hole on area, that is, adjusting pitch of holes is to have adjusted the porosity of workpiece.
In step B), after needing the porosity of drilling-workpiece to determine, that is, pitch of holes preset value is determined, has pressed
Carrying out drilling according to the pitch of holes preset value can be obtained the workpiece of required porosity.Judge the pitch of holes being formed on workpiece as hole
Spacing preset value then illustrates that the porosity to be drilled on workpiece is satisfactory, is continued by laser drilling system to workpiece
Laser drill is carried out, can be obtained satisfactory product.Wherein, pitch of holes preset value can be according to the actually required porosity of workpiece
Flexible setting is carried out, such as affluxion body in lithium ion batteries is for the actual requirement of porosity.Specific judgement can pass through practical survey
The numerical value and pitch of holes preset value of the pitch of holes of amount directly compare.
Step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C1), make to focus optical module
3 effective focusing length is constant and the drive linearly moving speed of workpiece of Workpiece transfer mechanism 4 is constant, adjusting diffraction optics mould
The quantity of the second laser beam of 2 diffraction of block, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
In the step B) in, the quantity of the second laser beam of 2 diffraction of diffraction optics module is more, and it is poly- to focus optical module 3
The quantity of burnt second laser beam is more, and the drilling on workpiece in unit area is more intensive, that is, the pitch of holes of Workpiece boring
Smaller, porosity is bigger, conversely, the quantity of the laser beam of 2 diffraction of diffraction optics module is fewer, then the porosity of Workpiece boring
It is smaller, the quantity of the second laser beam by adjusting 2 diffraction of diffraction optics module, and make pitch of holes default equal to pitch of holes
Value, as porosity needed for workpiece actual processing obtain the product for meeting porosity requirement.
Specifically, the quantity of second laser beam can be adjusted by replacing different diffraction optics modules 2.Diffraction light
Module 2 is diffactive lens, and multifocal diffractive mirror can be selected, and the quantity for the second laser beam that laser head 12 emits passes through difference
The quantity for the second laser beam that diffraction comes out when the multifocal diffractive mirror of specification is different, so passes through replacement diffraction optics module 2
The adjusting of second laser beam quantity can be realized.The quantity for the first laser beam that laser head 12 emits passes through different size
Diffraction optics module 2 forms the second laser beam of different quantity, replaces different diffraction optics modules according to actual needs
2, laser system, which can drill out, meets the corresponding product for requiring porosity.
It is subsequent that workpiece progress laser drill can be completed by following processes after the completion of pitch of holes is adjusted:
Firstly, the workpiece that Workpiece transfer mechanism 4 drives is moved to the coverage area of laser drilling system, then laser drill
System starts to drill, and focusing optical module 3 arranged side by side forms the first row hole drilling on workpiece.
Secondly, laser drilling system first fixes tentatively drilling after the completion of the first row hole drilling of workpiece.
Then, Workpiece transfer mechanism 4 drives workpiece mobile, and laser drilling system drills again, and arranged side by side is poly-
Burnt optical module 3 forms the second row hole drilling on workpiece.
And so on, until completing all boring works of workpiece.The drilling processing of band slim for large format, such as
The drilling processing of the sheet metal of strip, above-mentioned operation can smoothness be efficiently completed.
Embodiment three
The present embodiment and embodiment two the difference is that, step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C2), make diffraction optics module
The quantity of the second laser beam of 2 diffraction is constant and Workpiece transfer mechanism 4 drive the linearly moving speed of workpiece be it is constant, adjust poly-
The effective focusing length of burnt optical module 3, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
The effective focusing length for focusing optical module 3 is adjusted by mathematical formulae D=F*tan (θ s)；Wherein, F is indicated
For the effective focusing length for focusing optical module 3, θ s is expressed as focusing the separation for the adjacent laser interfascicular that optical module 3 focuses
Angle；D is expressed as pitch of holes.After the porosity of workpiece determines, the numerical value that D is represented then is determining value, selectes and focuses optical module 3
The numerical value of θ behalf is also determining value afterwards, in this way, F is just with D-shaped at a corresponding relationship, when D and pitch of holes preset value not phase
Whens equal, reach identical with pitch of holes preset value by changing the i.e. adjustable D of F, namely meet the requirement of workpiece porosity.Specifically
For, F and D are proportional relation, and the focusing effective focusing length of optical module 3 is bigger, then pitch of holes is bigger, conversely, focusing optics
Effective focusing length of module 3 is smaller, then pitch of holes is smaller.
Specifically, the effective focusing length for focusing 3 pairs of optical module focusing optical modules 3 of replacement different size can be passed through
It is adjusted.Focusing optical module 3 is focus lamp, and specific can be selected focuses convex lens, and the focus lamp of different size has difference
Effective focusing length, there is the focusing optical module 3 of different size by replacing, that is, can reach and focus optical module 3 and have
The adjusting of focusing length is imitated, and then produces and meets the corresponding product for requiring porosity to drill.
It is worth noting that ensure to focus optical module 3 during adjusting pitch of holes in order to ensure safety and focus
Laser beam fall on workpiece.As shown in fig. 1, θ f is expressed as focusing farthest two laser interfasciculars of the focusing of optical module 3
The angle of departure forms the laser beam focus of θ f in the as drilling range S of the part on workpiece between position, is carrying out pitch of holes adjusting
When be necessary to ensure that laser beam in drilling range S, avoids the generation of security risk always, so before formal processing drilling,
Need the focusing optical module 3 for selecting that there is suitable θ f and S parameter.
Example IV
The present embodiment and embodiment two the difference is that, step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C3), make diffraction optics module
The quantity of the second laser beam of 2 diffraction is constant constant with effective focusing length of focusing optical module 3, adjusts Workpiece transfer mechanism
4 drive the linearly moving speed of workpiece, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
2 diffraction of diffraction optics module second laser beam quantity and focus optical module 3 effective focusing length not
Becoming, the linearly moving speed of workpiece is faster, and in the unit time, focusing optical module 3, to focus on the area on workpiece bigger,
Opposite, the pitch of holes for being formed in the drilling on workpiece will be bigger, and porosity will be smaller, conversely, working as workpiece linear movement
Speed it is slower, the porosity of workpiece just will increase.In this way, driving workpiece linearly moving by adjusting Workpiece transfer mechanism 4
Speed also can reach the purpose for adjusting the porosity to drill on workpiece.
Embodiment five
In the present embodiment with embodiment two the difference is that, step B) further include:
Judge that the pitch of holes being formed on workpiece is not pitch of holes preset value, then follow the steps C4), it is adjusted in synchronism diffraction light
Quantity, the focusing effective focusing length of optical module 3 and 4 band of Workpiece transfer mechanism for learning the second laser beam of 2 diffraction of module are started building
The linearly moving speed of part, and the pitch of holes on workpiece is made to be equal to pitch of holes preset value.
Simultaneously using two or three in above-mentioned adjusting method, so that the adjusting of porosity is more accurate fast on workpiece
Speed, specific regulative mode can refer to embodiment two to four, and details are not described herein again.
The upper only embodiments of the present invention, are not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.All any modifications made in spirit and principles of the present invention are equal
Replacement, improvement etc., should all be included within scope of the presently claimed invention.
Claims (10)
1. a kind of laser drilling system characterized by comprising
Laser (1), is used to emit first laser beam；
Diffraction optics module (2) receives the first laser beam of laser (1) transmitting and carries out diffraction to it, and generates
Multiple second laser beams；And
It focuses optical module (3), receives multiple second laser beams of diffraction optics module (2) diffraction, and divide
It does not focus on workpiece, forms multiple holes on the workpiece.
2. the system of laser drill according to claim 1, which is characterized in that diffraction optics module (2) diffraction
The quantity of the second laser beam is adjusted or/and the effective focusing length for focusing optical module (3) is adjustable.
3. the system of laser drill according to claim 1, which is characterized in that it further includes Workpiece transfer mechanism (4)；Institute
Workpiece transfer mechanism (4) are stated for driving the workpiece linear movement.
4. the system of laser drill according to claim 3, which is characterized in that the Workpiece transfer mechanism (4) drives institute
It is adjustable to state the linearly moving speed of workpiece.
5. a kind of boring method of laser drilling system as described in claim 1 characterized by comprising
A prebored hole) is carried out on the workpiece, and measures the pitch of holes of prebored hole on the workpiece；
B judge the pitch of holes being formed on the workpiece) as pitch of holes preset value, laser drill is carried out to the workpiece.
6. the boring method of laser drilling system according to claim 5, which is characterized in that step B) further include:
Judge that the pitch of holes being formed on the workpiece is not pitch of holes preset value, then follow the steps C1), make the focusing optics
The constant and described Workpiece transfer mechanism (4) of effective focusing length of module (3) drives the linearly moving speed of workpiece constant,
The quantity of the second laser beam of diffraction optics module (2) diffraction is adjusted, and makes the pitch of holes etc. on the workpiece
In pitch of holes preset value.
7. the boring method of laser drilling system according to claim 5, which is characterized in that step B) further include:
Judge that the pitch of holes being formed on the workpiece is not pitch of holes preset value, then follow the steps C2), make the diffraction optics
The constant and described Workpiece transfer mechanism (4) of the quantity of the second laser beam of module (2) diffraction drives the workpiece linearly to move
Dynamic speed is constant, adjusts the effective focusing length for focusing optical module (3), and make the pitch of holes on the workpiece
Equal to pitch of holes preset value.
8. the boring method of laser drilling system according to claim 7, which is characterized in that pass through formula D=F*tan (θ
S) the effective focusing length for focusing optical module (3) is adjusted；Wherein, F is expressed as the focusing optical module (3)
Effective focusing length, θ s be expressed as it is described focusing optical module (3) focus adjacent laser interfascicular the angle of departure；D is expressed as
Pitch of holes.
9. the boring method of laser drilling system according to claim 5, which is characterized in that step B) further include:
Judge that the pitch of holes being formed on the workpiece is not pitch of holes preset value, then follow the steps C3), make the diffraction optics
The constant and described effective focusing length for focusing optical module (3) of the quantity of the second laser beam of module (2) diffraction is constant,
It adjusts the Workpiece transfer mechanism (4) and drives the linearly moving speed of workpiece, and make the pitch of holes etc. on the workpiece
In pitch of holes preset value.
10. the boring method of laser drilling system according to claim 5, which is characterized in that step B) further include:
Judge that the pitch of holes that is formed on the workpiece is not pitch of holes preset value, then follow the steps C4), spread out described in synchronous adjustment
Penetrate the quantity of the second laser beam of optical module (2) diffraction, the effective focusing length of optical module (3) and described of focusing
Workpiece transfer mechanism (4) drives two kinds or three kinds in the linearly moving speed of workpiece, and makes the hole on the workpiece
Spacing is equal to pitch of holes preset value.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112192019A (en) * | 2020-10-13 | 2021-01-08 | 深圳市韵腾激光科技有限公司 | Laser processing drilling system |
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| CN103495805A (en) * | 2013-09-27 | 2014-01-08 | 苏州德龙激光股份有限公司 | Laser point printing device |
| KR20170137468A (en) * | 2016-06-03 | 2017-12-13 | 주식회사 소재의맥 | Roll -to-Roll laser processing apparatus and method for the production of large area breathable film |
| CN206638896U (en) * | 2017-04-18 | 2017-11-14 | 广东工业大学 | A kind of array hole processing device |
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| CN112192019A (en) * | 2020-10-13 | 2021-01-08 | 深圳市韵腾激光科技有限公司 | Laser processing drilling system |
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