CN109862734A - Electronic device package structure - Google Patents
Electronic device package structure Download PDFInfo
- Publication number
- CN109862734A CN109862734A CN201811612036.XA CN201811612036A CN109862734A CN 109862734 A CN109862734 A CN 109862734A CN 201811612036 A CN201811612036 A CN 201811612036A CN 109862734 A CN109862734 A CN 109862734A
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- CN
- China
- Prior art keywords
- cover board
- groove
- back box
- electronic device
- device package
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- 238000002955 isolation Methods 0.000 abstract description 7
- 239000005030 aluminium foil Substances 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000011888 foil Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 16
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 210000003195 fascia Anatomy 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Abstract
The present invention is suitable for microwave multichannel engineering device technique field, a kind of electronic device package structure is provided, including back box and cover board, several vertical plates that back box includes bottom plate and is connected with bottom plate, each vertical plate and bottom plate are enclosed respectively into several chambers, cover board is plate body structure, the position that the downside of cover board corresponds to each vertical plate is equipped with several first grooves, the position that the upper side of cover board corresponds to each vertical plate is equipped with several second grooves, and cover board is connect with back box by laser welded seal by the first groove and the second groove.Electronic device package structure provided by the invention, groove structure is separately designed by the position that downside on the cover board corresponds to back box vertical plate, connect cover board and back box by groove laser welded seal, and the cavity seal in back box is isolated, isolation effect is obvious, thorough, reliable, there are aluminium foils to be crushed, fall off risk due to using foil sealing to avoiding when negative common difference, also avoids the problem that because plus tolerance causes cover board mechanical deformation occur.
Description
Technical field
The invention belongs to microwave multichannel engineering device technique fields, are to be related to a kind of electronic device package knot more specifically
Structure.
Background technique
Multi-channel microwave component is to improve isolation between road at present, and crosstalk passes through box frequently with cavity configuration is divided between reduction road
Body and cover board are in close contact microwave signal leakage, crosstalk between inhibiting each cavity.But when specific operation due to machining tolerances
Lead between cover board and box body that there are gaps in the presence of or due to negative common difference, be unable to reach close contact purpose, influences shielding effect
Fruit improves shield effectiveness often through cushioning aluminium foil at this time, but aluminium foil presence is crushed, fall off risk；Since plus tolerance is led
Cover board is caused slightly to be jacked up, " convex epirelief " occurs in cover board upper surface, causes cover board mechanical deformation occur, influences product reliably and with long-term
Property.
Summary of the invention
The purpose of the present invention is to provide a kind of electronic device package structures, it is intended to solve the prior art be Package boxes with
Cover board and existing aluminium foil there is technical issues that be crushed, fall off or cover board.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of electronic device package structure, including back box and
Cover board, the back box include bottom plate and several vertical plates for being connected with the bottom plate, and each vertical plate and the bottom plate enclose respectively
Into several chambers, the cover board is plate body structure, and the position that the downside of the cover board corresponds to each vertical plate is equipped with several
First groove, the position that the upper side of the cover board corresponds to each vertical plate are equipped with several second grooves, and the cover board is by institute
The first groove and second groove is stated to connect with the back box by laser welded seal.
Further, the width of second groove is less than the width of first groove.
Further, the vertical plate width is w, and the width range of first groove is 1.05w~1.15w.
Further, the width range of second groove is 0.5w~0.7w.
Further, the vertical plate width w >=1mm.
Further, the cover sheet thickness is h, first groove and the second depth of groove range be 0.3h~
0.4h。
Further, the cover sheet thickness range is 0.8mm≤h≤1.2mm.
Further, the back box is 6061 component of aluminium alloy, and the cover board is 4047 component of aluminium alloy.
Further, the cover sheet thickness range is 0.8mm≤h≤1.2mm, and the back box is 6061 structure of aluminium alloy
Part, the cover board are 4047 component of aluminium alloy.
Further, first groove and second groove are to be milled into.
Electronic device package structure provided by the invention is distinguished by the position that downside on the cover board corresponds to back box vertical plate
Groove structure is designed, connects cover board and back box by groove laser welded seal, and keep the chamber in back box close
It insulates from isolation effect is obvious, thorough, reliable, so that there are aluminium foils to be crushed due to using foil sealing when avoiding negative common difference, de-
Risk is fallen, is also avoided the problem that because plus tolerance causes cover board mechanical deformation occur.Simultaneously laser welding have energy density it is high,
The feature that heat affected area is small, compactness is good, irregular, multi-cavity structure sealing welding especially suitable for such box body.
Detailed description of the invention
Fig. 1 is the decomposition texture schematic diagram of electronic device package structure provided in an embodiment of the present invention；
Fig. 2 is the A direction view (i.e. the top view of Fig. 1 cover plate) of Fig. 1 cover plate；
Fig. 3 is the B direction view (i.e. the bottom view of Fig. 1 cover plate) of Fig. 1 cover plate.
In figure: 1- cover board；The first groove of 11-；The second groove of 12-；2- back box；21- vertical plate；22- bottom plate.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that unless otherwise clearly defined and limited, " installation ", " connected ", " fixation ", " are set " connection "
Set " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In addition, " multiple ", " several " are meant that two or more, unless
Separately there is clearly specific restriction.
Referring to Figure 1 to Fig. 3, now the embodiment of electronic device package structure provided by the invention is illustrated.Electronics
Device package, including back box 2 and cover board 1, several vertical plates 21 that back box 2 includes bottom plate 22, is connected with bottom plate 21.Setting exists
The vertical plate 21 of periphery is exactly the Side fascia of back box 2, and the vertical plate 21 that inner ring is arranged in is exactly internal partition in back box.These exterior walls
Plate, internal partition and bottom plate 22 are enclosed respectively into several chambers.
Cover board 1 is plate body structure, and the position that the downside of cover board 1 corresponds to each vertical plate 21 is equipped with several first grooves 11, lid
The position that the upper side of plate 1 corresponds to each vertical plate 21 is again provided with several second grooves 12, i.e., after cover board 1 is fastened in back box 2,
The position that each vertical plate 21 is corresponded on cover board 1 is all provided with fluted, and the upper side of cover board 1 is equipped with the second groove 12, the downside of cover board 1
Equipped with the first groove 11, and to be then that confronting grooves protrude " convex for the upper side of the corresponding cover board 1 of each chamber and downside position
Face body ".The position that vertical plate 21 is corresponded on cover board 1 is most thin.
Here it is also understood that the first groove 11 and the second groove 12 are not only possible between setting two " convex body ",
First groove 11 and the second groove 12 are also possible to that the marginal position of cover board 1 is arranged in, that is, are located at first groove 11 at 1 edge of cover board
And second groove 12 be also possible to be between one " convex body " and the edge of cover board 1.
Cover board 1 has been connect with vertical plate 21 using laser welded seal with back box 2 by the first groove 11, the second groove 12
Come, while each chamber for needing seal isolation to get up is also that isolation is sealed by way of laser welding.
When being tightly connected cover board 1 and back box 2 and sealing off each chamber, first cover board 1 is placed into back box 2, cover board 1
Downside is adjacent to back box 2, and each first groove 11 is corresponding with each vertical plate 21 respectively at this time, and the first groove 11 is fastened on outside vertical plate 21
Side is equivalent to the predeterminated position for making cover board 1 navigate to back box 2；Later using laser welder to all the second of 1 upper side of cover board
Laser welding is carried out at groove 12, laser welding makes the position of corresponding first groove 11 (the second groove 12) and back box 2 on cover board 1
Vertical plate fusion seal, thereby realize cover board 1 and be just sealedly connected with back box 2, each needs in back box 2 are close
It insulates also just to seal off respectively from the chamber to get up and come.
Electronic device package structure provided in an embodiment of the present invention, the position of back box vertical plate is corresponded to by downside on the cover board
It sets and separately designs groove structure, connect cover board and back box by groove laser welded seal, and make in back box
Cavity seal isolation, isolation effect is obvious, thorough, reliable, so that there are aluminium foils due to using foil sealing when avoiding negative common difference
Be crushed, fall off risk, also avoid the problem that because plus tolerance cause cover board mechanical deformation occur.Laser welding has energy simultaneously
The feature that density is high, heat affected area is small, compactness is good, irregular, multi-cavity structure sealing welding especially suitable for such box body
It connects.
Fig. 2 and Fig. 3 are referred to, as a kind of specific embodiment of electronic device package structure provided by the invention,
Width of the width of two grooves 12 less than the first groove 11, laser positioning when facilitating welding, while laser are from the second groove 12
Place, which injects, not only to have been guaranteed air-tightness requirement but also the fusant of laser generation can be prevented to be splashed into inside back box, and welding effect is good.
As a kind of specific embodiment of electronic device package structure provided by the invention, 21 width of vertical plate is w, first
The width range of groove 11 is 1.05w~1.15w, in order to weld the outside that preceding first groove 11 can be fastened on vertical plate 21,
Also make the first groove 11 and the cooperation of vertical plate 21 that there is certain positioning action simultaneously.
As a kind of specific embodiment of electronic device package structure provided by the invention, the width model of the second groove 12
It encloses for 0.5w~0.7w, the setting of the second groove 12 is primarily to facilitate laser to inject from the second groove 12, the second groove
12 width is less than 21 width w of vertical plate, laser positioning when facilitating welding.
As a kind of specific embodiment of electronic device package structure provided by the invention, 21 width w >=1mm of vertical plate.
As a kind of specific embodiment of electronic device package structure provided by the invention, 21 width w of vertical plate is 1mm.
As a kind of specific embodiment of electronic device package structure provided by the invention, cover board 1 is with a thickness of h, and first
Groove 11 and 12 depth bounds of the second groove are 0.3h~0.4h, in order to laser welding operation.
As a kind of specific embodiment of electronic device package structure provided by the invention, the first groove 11 and second is recessed
12 depth bounds of slot are 0.35h.
As a kind of specific embodiment of electronic device package structure provided by the invention, 1 thickness range of cover board is
0.8mm≤h≤1.2mm。
As a kind of specific embodiment of electronic device package structure provided by the invention, cover board 1 is with a thickness of 1mm.
As a kind of specific embodiment of electronic device package structure provided by the invention, back box 2 is aluminium alloy 6061
Component, cover board 1 is 4047 component of aluminium alloy, in order to the welding procedure demand of laser welding.
As a kind of specific embodiment of electronic device package structure provided by the invention, the first groove 11 and second is recessed
Slot 12 is to be milled into, in order to manufacture.
As a kind of specific embodiment of electronic device package structure provided by the invention, in welding manufacture, the present invention is real
When the electronic device package structure of example offer is provided, the technological parameter of laser welding are as follows:
Type of laser: selection YAG yttrium-aluminium-garnet solid-state laser generator；
Laser pulse width: 1.8ms；
Waveform: square wave；
Duty ratio: 1.8%；
Laser peak power: 1.7kW；
Light frequency out: 10Hz；
Defocusing amount: 0mm；
Speed of welding: 2-3mm/s.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. electronic device package structure, including back box and cover board, the back box includes bottom plate and is connected with the bottom plate several
Vertical plate, each vertical plate and the bottom plate are enclosed respectively into several chambers, which is characterized in that and the cover board is plate body structure,
The position that the downside of the cover board corresponds to each vertical plate is equipped with several first grooves, and the upper side of the cover board corresponds to each institute
The position for stating vertical plate is equipped with several second grooves, and the cover board is by first groove and second groove and the back box
It is connected by laser welded seal.
2. electronic device package structure as described in claim 1, which is characterized in that the width of second groove is less than described
The width of first groove.
3. electronic device package structure as claimed in claim 2, which is characterized in that the vertical plate width is w, and described first is recessed
The width range of slot is 1.05w~1.15w.
4. electronic device package structure as claimed in claim 3, which is characterized in that the width range of second groove is
0.5w~0.7w.
5. electronic device package structure as described in claim 1, which is characterized in that the vertical plate width w >=1mm.
6. electronic device package structure according to any one of claims 1 to 5, which is characterized in that the cover sheet thickness is h,
First groove and the second depth of groove range are 0.3h~0.4h.
7. electronic device package structure as claimed in claim 6, which is characterized in that the cover sheet thickness range is 0.8mm≤h
≤1.2mm。
8. electronic device package structure as claimed in claim 6, which is characterized in that the back box is 6061 component of aluminium alloy,
The cover board is 4047 component of aluminium alloy.
9. electronic device package structure according to any one of claims 1 to 5, which is characterized in that the back box is aluminium alloy
6061 components, the cover board are 4047 component of aluminium alloy.
10. electronic device package structure according to any one of claims 1 to 5, which is characterized in that first groove and
Second groove is to be milled into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811612036.XA CN109862734A (en) | 2018-12-27 | 2018-12-27 | Electronic device package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811612036.XA CN109862734A (en) | 2018-12-27 | 2018-12-27 | Electronic device package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109862734A true CN109862734A (en) | 2019-06-07 |
Family
ID=66892756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811612036.XA Pending CN109862734A (en) | 2018-12-27 | 2018-12-27 | Electronic device package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109862734A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4304656A1 (en) * | 1993-02-16 | 1994-08-18 | Deutsche Aerospace | Method for avoiding electrical crosstalk and arrangement for carrying out the method |
| US5386204A (en) * | 1993-08-03 | 1995-01-31 | Motorola, Inc. | High isolation microwave module |
| DE19609718C1 (en) * | 1996-03-13 | 1997-06-26 | Bosch Gmbh Robert | Electromagnetic HF screening between chambers of microwave circuit housing |
| CN202474161U (en) * | 2012-03-06 | 2012-10-03 | 成都市大富科技有限公司 | Cavity filter and communication radio frequency device |
| CN203387835U (en) * | 2013-07-11 | 2014-01-08 | 合肥乐宜嘉家居设备有限公司 | Electromagnetic sealing box for large microwave resonant cavity |
| CN209806263U (en) * | 2018-12-27 | 2019-12-17 | 中国电子科技集团公司第十三研究所 | Electronic device packaging structure |
-
2018
- 2018-12-27 CN CN201811612036.XA patent/CN109862734A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4304656A1 (en) * | 1993-02-16 | 1994-08-18 | Deutsche Aerospace | Method for avoiding electrical crosstalk and arrangement for carrying out the method |
| US5386204A (en) * | 1993-08-03 | 1995-01-31 | Motorola, Inc. | High isolation microwave module |
| DE19609718C1 (en) * | 1996-03-13 | 1997-06-26 | Bosch Gmbh Robert | Electromagnetic HF screening between chambers of microwave circuit housing |
| CN202474161U (en) * | 2012-03-06 | 2012-10-03 | 成都市大富科技有限公司 | Cavity filter and communication radio frequency device |
| CN203387835U (en) * | 2013-07-11 | 2014-01-08 | 合肥乐宜嘉家居设备有限公司 | Electromagnetic sealing box for large microwave resonant cavity |
| CN209806263U (en) * | 2018-12-27 | 2019-12-17 | 中国电子科技集团公司第十三研究所 | Electronic device packaging structure |
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