CN109860378B - White light LED device and manufacturing method thereof - Google Patents
White light LED device and manufacturing method thereof Download PDFInfo
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- CN109860378B CN109860378B CN201811591003.1A CN201811591003A CN109860378B CN 109860378 B CN109860378 B CN 109860378B CN 201811591003 A CN201811591003 A CN 201811591003A CN 109860378 B CN109860378 B CN 109860378B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 178
- 239000000843 powder Substances 0.000 claims abstract description 56
- 239000010410 layer Substances 0.000 claims abstract description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims abstract description 24
- 239000000741 silica gel Substances 0.000 claims abstract description 24
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims description 45
- 238000002955 isolation Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention discloses a white light LED device and a manufacturing method thereof. The white light LED device includes: the LED lamp comprises a bracket and an LED chip arranged on the bracket; the LED chip is used for emitting blue light; the middle part of the LED chip is provided with an arc convex adhesive layer, the first end of the LED chip is provided with a first arc concave adhesive layer, and the second end of the LED chip is provided with a second arc concave adhesive layer; any two of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer are respectively provided with red fluorescent powder and green fluorescent powder, and the other one is a silica gel layer. The white light LED device and the manufacturing method thereof can realize uniform mixing of red light, green light and blue light and avoid the occurrence of a monochromatic aperture at the edge of white light.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a white light LED device and a manufacturing method thereof.
Background
The LED device has the advantages of high luminous efficiency, low power consumption, long service life and the like, and is widely applied to the illumination fields of televisions, displays, car lamps, landscape lamps and the like. At present, a main-stream white light LED device in the market is basically formed by packaging a blue light LED chip and yellow YAG fluorescent powder, and the LED device utilizes the yellow YAG fluorescent powder to carry out secondary quantum conversion on blue light to form white light, and the conversion efficiency of the white light is relatively low.
In order to improve the luminous efficiency and the display capability of the white LED device, as shown in fig. 1, most of the existing white LED devices are packaged with red LED chips, green LED chips and blue LED chips, and the red light, the green light and the blue light are mixed into white light. However, in the existing white light LED device, the red light LED chip, the green light LED chip and the blue light LED chip are usually located on the same horizontal plane, and the light emitted by each LED chip is relatively dispersed, so that the existing white light LED device has the problem of uneven light mixing of red light, green light and blue light, and further a monochromatic aperture appears at the edge of white light.
Disclosure of Invention
Aiming at the problems, the white light LED device and the manufacturing method thereof can realize uniform mixing of red light, green light and blue light and avoid the occurrence of a monochromatic aperture at the edge of white light.
In order to solve the above technical problems, a white light LED device of the present invention includes: the LED lamp comprises a bracket and an LED chip arranged on the bracket; the LED chip is used for emitting blue light;
An arc-shaped convex adhesive layer is arranged in the middle of the LED chip, a first arc-shaped concave adhesive layer is arranged at the first end of the LED chip, and a second arc-shaped concave adhesive layer is arranged at the second end of the LED chip;
any two of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer are respectively provided with red fluorescent powder and green fluorescent powder, and the other one is a silica gel layer.
Compared with the prior art, in the white light LED device, the arc convex adhesive layer arranged in the middle of the LED chip, the first arc concave adhesive layer arranged at the first end of the LED chip and the second arc concave adhesive layer arranged at the second end of the LED chip jointly form a fluorescent layer structure with two concave surfaces clamping one convex surface, so that light emitted from the middle of the LED chip is diffused towards two ends, and light emitted from the two ends of the LED chip is gathered towards the middle; on the other hand, red fluorescent powder and green fluorescent powder are respectively arranged on any two of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer, the other one of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer is a silica gel layer, blue light emitted by the LED chip can be converted into red light through the red fluorescent powder, converted into green light through the green fluorescent powder and transmitted out of the blue light through the silica gel layer, and further the white LED device can realize uniform mixing of the red light, the green light and the blue light, avoid single-color aperture at the edge of white light, and improve white light density of mixed white light.
As the improvement of above-mentioned scheme, arc convex surface glue film with be provided with first isolation glue film between the first arc concave surface glue film, arc convex surface glue film with be provided with the second isolation glue film between the second arc concave surface glue film.
As the improvement of above-mentioned scheme, first arc concave glue film with second arc concave glue film symmetry set up in the both sides of arc convex glue film.
As an improvement of the above scheme, the concavities of the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are inclined toward the arc-shaped convex adhesive layer.
As an improvement of the scheme, the curvature radius of the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer is larger than that of the arc-shaped convex adhesive layer.
As an improvement of the above-mentioned scheme, the LED chip includes a front-mounted blue LED chip, a flip-chip blue LED chip, or a vertical blue LED chip.
As an improvement of the scheme, the bracket is provided with a reflecting bowl cup;
the LED chip, the arc-shaped convex adhesive layer, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are arranged in the reflecting bowl cup;
The highest point of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer is lower than the top of the reflecting bowl cup.
The invention also provides a manufacturing method of the white light LED device, which comprises the following steps:
Fixing the LED chip on the bracket; the LED chip is used for emitting blue light;
Coating colloid on the middle part of the LED chip to form an arc convex surface adhesive layer;
Coating colloid at two ends of the LED chip respectively to form a first arc-shaped concave glue layer and a second arc-shaped concave glue layer; any two of the first arc-shaped concave adhesive layer, the second arc-shaped concave adhesive layer and the arc-shaped convex adhesive layer are respectively mixed with red fluorescent powder and green fluorescent powder, and the other one is a silica gel layer.
Compared with the prior art, in the manufacturing method of the white light LED device, the arc-shaped convex adhesive layer is formed in the middle of the LED chip, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are respectively formed at the two ends of the LED chip, so that a fluorescent layer structure with two concave surfaces clamped with a convex surface is formed on the LED chip, light emitted from the middle of the LED chip is diffused at the two ends, and light emitted from the two ends of the LED chip is gathered at the middle; on the other hand, as the red fluorescent powder and the green fluorescent powder are respectively arranged on any two of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer, the other one of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer is the silica gel layer, blue light emitted by the LED chip can be converted into red light through the red fluorescent powder, converted into green light through the green fluorescent powder and transmitted out of the blue light through the silica gel layer, and further the white light LED device can realize uniform mixing of the red light, the green light and the blue light, avoid the occurrence of a monochromatic aperture at the edge of white light, and improve the white light density of mixed white light.
As an improvement of the above scheme, the method further comprises the following steps before coating the colloid on the middle part of the LED chip to form the arc convex adhesive layer:
And respectively fixing the first isolation adhesive layer and the second isolation adhesive layer on the LED chip so as to isolate the arc-shaped convex adhesive layer, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer.
As the improvement of above-mentioned scheme, first arc concave glue film with second arc concave glue film symmetry set up in the both sides of arc convex glue film, just first arc concave glue film with the concave surface of second arc concave glue film is to the slope of arc convex glue film.
Drawings
Fig. 1 is a schematic diagram of a conventional white LED device.
Fig. 2 is a schematic structural diagram of a white LED device according to embodiment 1 of the present invention.
Fig. 3 is a schematic structural diagram of a white LED device according to embodiment 2 of the present invention.
Fig. 4 is a schematic diagram of the white LED device of embodiment 2 of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be embodied in many other forms than described herein and similarly practiced by those skilled in the art without departing from the spirit or scope of the invention, which is therefore not limited to the specific embodiments disclosed below.
The technical scheme of the present invention is clearly and completely described below with reference to specific embodiments and drawings.
Example 1
Fig. 2 is a schematic structural diagram of a white LED device according to embodiment 1 of the present invention.
As shown in fig. 2, the white LED device includes: a bracket 1, and an LED chip 2 arranged on the bracket 1; wherein the LED chip 2 is used for emitting blue light; the middle part of the LED chip 2 is provided with an arc convex adhesive layer 31, the first end of the LED chip 2 is provided with a first arc concave adhesive layer 32, and the second end of the LED chip 2 is provided with a second arc concave adhesive layer 33; any two of the arc-shaped convex adhesive layer 31, the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 are respectively provided with red fluorescent powder and green fluorescent powder, and the other one of the arc-shaped convex adhesive layer 31, the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 is a silica adhesive layer.
In the white light LED device, an LED chip 2 is fixed in a reflector cup 11 of a bracket 1 by an adhesive 4.
In the white light LED device, when red fluorescent powder is disposed in the first arc-shaped concave adhesive layer 32 and green fluorescent powder is disposed in the second arc-shaped concave adhesive layer 33, the arc-shaped convex adhesive layer 31 is a silica gel layer; at this time, when the blue light emitted from the LED chip 2 passes through the first arc-shaped concave adhesive layer 32, the second arc-shaped concave adhesive layer 33 and the arc-shaped convex adhesive layer 31, red light, green light and blue light are respectively obtained.
It can be understood that when the first arc-shaped concave adhesive layer 32 is provided with green fluorescent powder and the second arc-shaped concave adhesive layer 33 is provided with red fluorescent powder, the arc-shaped convex adhesive layer 31 is a silica gel layer; when the first arc-shaped concave adhesive layer 32 is a silica gel layer and the second arc-shaped concave adhesive layer 33 is provided with red fluorescent powder, the arc-shaped convex adhesive layer 31 is provided with green fluorescent powder. Other setting modes of the red fluorescent powder, the green fluorescent powder and the silica gel layer can be deduced through the setting modes, and are not repeated here.
Compared with the prior art, in the white light LED device, the arc convex adhesive layer 31 arranged in the middle of the LED chip 2, the first arc concave adhesive layer 32 arranged at the first end of the LED chip 2 and the second arc concave adhesive layer 33 arranged at the second end of the LED chip 2 jointly form a fluorescent layer structure with two concave surfaces clamping one convex surface, so that light emitted from the middle of the LED chip 2 diffuses towards two ends, and light emitted from two ends of the LED chip 2 gathers towards the middle; on the other hand, any two of the arc convex adhesive layer 31, the first arc concave adhesive layer 32 and the second arc concave adhesive layer 33 are respectively provided with red fluorescent powder and green fluorescent powder, the other one of the arc convex adhesive layer 31, the first arc concave adhesive layer 32 and the second arc concave adhesive layer 33 is a silica gel layer, blue light emitted by the LED chip 2 can be converted into red light through the red fluorescent powder, converted into green light through the green fluorescent powder and transmitted out of blue light through the silica gel layer, and further the white LED device can realize uniform mixing of the red light, the green light and the blue light, avoid single-color aperture at the edge of white light, and improve white light density of mixed white light.
Example 2
Fig. 3 is a schematic structural diagram of a white LED device according to embodiment 2 of the present invention.
As shown in fig. 3, the white LED device includes, in addition to all the constituent components in embodiment 1: a first layer of insulating glue 51 is provided between the arcuate convex glue layer 31 and the first arcuate concave glue layer 32 and a second layer of insulating glue 52 is provided between the arcuate convex glue layer 31 and the second arcuate concave glue layer 33.
In this embodiment, the first insulating adhesive layer 51 and the second insulating adhesive layer 52 isolate the arc-shaped convex adhesive layer 31, the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33, so that the mutual absorption and scattering between the red fluorescent powder and the green fluorescent powder can be avoided, the diffusion of the red fluorescent powder or the green fluorescent powder into the silica gel layer can be avoided, and the overall luminous efficiency of the white light LED device can be improved.
Preferably, as shown in fig. 3, in order to make the white light mixed into the white light LED device more uniform, the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 are symmetrically disposed at both sides of the arc-shaped convex adhesive layer 31 in the white light LED device so as to make the color temperature of the mixed white light uniform at various angles.
Further, as shown in fig. 3 and fig. 4, in order to improve the light mixing efficiency of the white light LED device, the concave surface 321 of the first arc-shaped concave adhesive layer 32 and the concave surface 331 of the second arc-shaped concave adhesive layer 33 in the white light LED device are inclined towards the arc-shaped convex adhesive layer 31, so that light reflected by the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 is prevented from diffusing outwards, and the light mixing efficiency is improved.
Preferably, the convex surface 311 of the arcuate convex adhesive layer 31 is in the shape of an arch bridge.
Preferably, as shown in fig. 3 and fig. 4, in the white LED device, the radius of curvature of the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 is larger than that of the arc-shaped convex adhesive layer 31, so that the light refracted by the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 has a larger light outgoing surface, and the light refracted by the arc-shaped convex adhesive layer 31 is more diffused, thereby increasing the area of the light mixing area and further improving the light mixing efficiency.
Preferably, as shown in fig. 3 and 4, in the white light LED device, the bracket 1 is provided with a reflective bowl cup; the LED chip 2, the arc-shaped convex adhesive layer 31, the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 are arranged in the reflector cup; the highest point of the arc-shaped convex adhesive layer 31, the first arc-shaped concave adhesive layer 32 and the second arc-shaped concave adhesive layer 33 is lower than the top of the reflector cup.
In the above embodiment, the LED chip 2 includes the front-mounted type blue LED chip 2, the flip-chip type blue LED chip 2, or the vertical type blue LED chip 2.
Example 3
The invention also provides a manufacturing method of the white light LED device, which comprises the following steps:
s1, fixing an LED chip on a bracket; the LED chip is used for emitting blue light;
S2, coating colloid on the middle of the LED chip to form an arc convex adhesive layer;
S3, coating colloid at two ends of the LED chip respectively to form a first arc-shaped concave adhesive layer and a second arc-shaped concave adhesive layer; wherein, two arbitrary in arc convex surface glue film, first arc concave surface glue film and the second arc concave surface glue film have mixed red phosphor powder, green phosphor powder respectively, and another in arc convex surface glue film, first arc concave surface glue film and the second arc concave surface glue film is the silica gel layer.
In the manufacturing method of the white light LED device, when red fluorescent powder is mixed in the first arc-shaped concave adhesive layer and green fluorescent powder is mixed in the second arc-shaped concave adhesive layer, the arc-shaped convex adhesive layer is a silica gel layer; at this time, when the blue light emitted by the LED chip passes through the first arc-shaped concave adhesive layer, the second arc-shaped concave adhesive layer and the arc-shaped convex adhesive layer, red light, green light and blue light are respectively obtained.
It can be understood that when the first arc-shaped concave adhesive layer is mixed with green fluorescent powder and the second arc-shaped concave adhesive layer is mixed with red fluorescent powder, the arc-shaped convex adhesive layer is a silica gel layer; when the first arc concave adhesive layer is a silica gel layer and the second arc concave adhesive layer is mixed with red fluorescent powder, the arc convex adhesive layer is mixed with green fluorescent powder. Other setting modes of the red fluorescent powder, the green fluorescent powder and the silica gel layer can be deduced through the setting modes, and are not repeated here.
Compared with the prior art, in the manufacturing method of the white light LED device, the arc-shaped convex adhesive layer is formed in the middle of the LED chip, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are respectively formed at the two ends of the LED chip, so that a fluorescent layer structure with two concave surfaces clamped with a convex surface is formed on the LED chip, light emitted from the middle of the LED chip is diffused at the two ends, and light emitted from the two ends of the LED chip is gathered at the middle; on the other hand, as the red fluorescent powder and the green fluorescent powder are respectively arranged on any two of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer, the other one of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer is the silica gel layer, blue light emitted by the LED chip can be converted into red light through the red fluorescent powder, converted into green light through the green fluorescent powder and transmitted out of the blue light through the silica gel layer, and further the white light LED device can realize uniform mixing of the red light, the green light and the blue light, avoid the occurrence of a monochromatic aperture at the edge of white light, and improve the white light density of mixed white light.
Preferably, the middle part of the LED chip is coated with colloid, and before the arc convex adhesive layer is formed, the method further comprises the following steps:
the first isolation adhesive layer and the second isolation adhesive layer are respectively fixed on the LED chip so as to isolate the arc-shaped convex adhesive layer, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer.
In this embodiment, keep apart between arc convex surface glue film, first arc concave surface glue film and the second arc concave surface glue film with first isolation glue film and the second isolation glue film, can avoid red phosphor powder and green phosphor powder between mutual absorption and scattering, can also avoid red phosphor powder or green phosphor powder to diffuse to the silica gel layer in, and then can promote the whole luminous efficacy of this white light LED device.
Preferably, in step S3, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are symmetrically disposed on two sides of the arc-shaped convex adhesive layer, so that the white light mixed is more uniform.
Preferably, in step S3, the concave surfaces of the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer incline towards the arc-shaped convex adhesive layer, so that light reflected by the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer is prevented from diffusing outwards, and the light mixing efficiency is improved.
The present invention is not limited to the preferred embodiments, and any simple modification, equivalent variation and modification made to the above embodiments according to the technical substance of the present invention will still fall within the scope of the technical solution of the present invention.
Claims (8)
1. A white LED device, comprising: the LED lamp comprises a bracket and an LED chip arranged on the bracket; the LED chip is used for emitting blue light;
An arc-shaped convex adhesive layer is arranged in the middle of the LED chip, a first arc-shaped concave adhesive layer is arranged at the first end of the LED chip, and a second arc-shaped concave adhesive layer is arranged at the second end of the LED chip;
any two of the arc-shaped convex adhesive layer, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are respectively provided with red fluorescent powder and green fluorescent powder, and the other one is a silica gel layer;
The first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are symmetrically arranged on two sides of the arc-shaped convex adhesive layer; the concave surfaces of the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer incline towards the arc-shaped convex adhesive layer.
2. The white LED device of claim 1, wherein a first layer of insulating glue is disposed between the arcuate convex glue layer and the first arcuate concave glue layer, and a second layer of insulating glue is disposed between the arcuate convex glue layer and the second arcuate concave glue layer.
3. The white LED device of claim 1, wherein the radius of curvature of the first arcuate concave glue layer and the second arcuate concave glue layer is greater than the radius of curvature of the arcuate convex glue layer.
4. A white LED device as recited in any one of claims 1-3, wherein the LED chip comprises a front-mounted blue LED chip, a flip-chip blue LED chip, or a vertical blue LED chip.
5. The white LED device of claim 1, wherein the stand is provided with a reflector cup;
the LED chip, the arc-shaped convex adhesive layer, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer are arranged in the reflecting bowl cup;
The highest point of the arc convex adhesive layer, the first arc concave adhesive layer and the second arc concave adhesive layer is lower than the top of the reflecting bowl cup.
6. The manufacturing method of the white light LED device is characterized by comprising the following steps of:
Fixing the LED chip on the bracket; the LED chip is used for emitting blue light;
Coating colloid on the middle part of the LED chip to form an arc convex surface adhesive layer;
Coating colloid at two ends of the LED chip respectively to form a first arc-shaped concave glue layer and a second arc-shaped concave glue layer; any two of the first arc-shaped concave adhesive layer, the second arc-shaped concave adhesive layer and the arc-shaped convex adhesive layer are respectively mixed with red fluorescent powder and green fluorescent powder, and the other one is a silica gel layer.
7. The method of manufacturing of claim 6, wherein the step of coating a gel on the middle of the LED chip to form an arc-shaped convex gel layer, further comprises the steps of:
And respectively fixing the first isolation adhesive layer and the second isolation adhesive layer on the LED chip so as to isolate the arc-shaped convex adhesive layer, the first arc-shaped concave adhesive layer and the second arc-shaped concave adhesive layer.
8. The method of claim 6, wherein the first and second arcuate concave adhesive layers are symmetrically disposed on both sides of the arcuate convex adhesive layer, and the concavities of the first and second arcuate concave adhesive layers are inclined toward the arcuate convex adhesive layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811591003.1A CN109860378B (en) | 2018-12-25 | 2018-12-25 | White light LED device and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811591003.1A CN109860378B (en) | 2018-12-25 | 2018-12-25 | White light LED device and manufacturing method thereof |
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| CN109860378A CN109860378A (en) | 2019-06-07 |
| CN109860378B true CN109860378B (en) | 2024-05-10 |
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| JP6107475B2 (en) * | 2013-06-28 | 2017-04-05 | 日亜化学工業株式会社 | Light emitting device |
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