CN109854973A - A kind of light source module and a kind of electroluminescent lamp - Google Patents
A kind of light source module and a kind of electroluminescent lamp Download PDFInfo
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- CN109854973A CN109854973A CN201910132921.6A CN201910132921A CN109854973A CN 109854973 A CN109854973 A CN 109854973A CN 201910132921 A CN201910132921 A CN 201910132921A CN 109854973 A CN109854973 A CN 109854973A
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention provides a kind of electroluminescent lamp, light source module is set to lamp body interior zone in setting, increases light-emitting angle and radiation three-dimensional space angle, avoid the appearance of above-mentioned black area by the design cooperation light source module of electroluminescent lamp, realizes comprehensive effective light out.In addition, setting unified whole for light source module and lamp body, along with being mechanically fixed, electroluminescent lamp overall structure stability is improved, and substantially reduce heat propagation approach.
Description
Technical field
The present invention relates to a kind of light emitting device technologies fields, and in particular to a kind of light source module and a kind of electroluminescent lamp.
Background technique
Traditional LED electroluminescent lamp is located at lamp referring to Fig. 1, including: lamp holder 04 ', the lamp body 02 ' on lamp holder 04 '
The wiring board 021 ' of 02 ' two sides of body, the LED lamp bead 01 ' being located on wiring board 021 ' and lamp body front cover 00.Lamp body front cover 00
It should be at the top of lamp body 02 '.LED lamp bead 01 ' is to be fixed on LED chip on ceramic substrate using conducting resinl to encapsulate.LED
Lamp bead 01 ' is welded in assist side 021 ' by tin cream.Wiring board 021 ' is bonded and fixed at lamp body 02 ' two by heat-conducting silicone grease
Side.Wiring board 021 ' is copper-based or aluminum-based circuit board.
Above-mentioned LED electroluminescent lamp is problematic in that in terms of light distribution and heat dissipation.First, in terms of heat dissipation: heat-conducting silicone grease is thermally conductive
Coefficient is very low, currently on the market up to 6 ~ 10 W/m K, 50 ~ 70W/m of thermal coefficient of used Sn10sb tin cream
K, and eutectic welding procedure can achieve 80 ~ 100W/m K.LED chip is transferred heat on ceramic substrate by conducting resinl,
So that the heat that lamp bead generates is transmitted on wiring board by tin cream；And the heat of wiring board is transmitted to by heat-conducting silicone grease
On lamp body, finally spread out.This structure not only increases the transmission path (4 grades of transmitting) of heat, but also capacity of heat transmission
It is largely limited by the minimum heat-conducting silicone grease of thermal coefficient, heat conduction path and transmission capacity are very limited.Thermal diffusivity is not
Good, radiating treatment is not taken pains light decay, influences car light service life.
It is mechanically fixed in addition, the various pieces of above structure do not use, for example, between wiring board and lamp body, for a long time
It works under high temperature environment, it may appear that removing (Nian Jie loosely) phenomenon occurs in colloid aging between wiring board and lamp body；Be not suitable for
It illuminates for a long time, causes product quality irregular.
Secondly, the LED electroluminescent lamp of above structure is also performed poor in light type design aspect, for example LED lamp bead is posted in two sides
Wiring board be adhesively fixed on lamp body by heat-conducting silicone grease, increase the spacing between the LED lamp bead of two sides in this way.Relative to tradition
Halogen lamp can be equivalent to linear light source, and this tradition LED modulated structure that shines can not be equal, and cannot directly substitute traditional halogen
Plain car light.The luminous modulated structure of this LED increases light distribution difficulty, and makes the use of LED electroluminescent lamp limited.
In addition, also with maintainability, poor, lamp appearance and the light bulb that we are accustomed to have a certain distance, the acceptance of people
The problems such as being challenged.
Summary of the invention
In order to overcome the above problems, the present invention is intended to provide a kind of electroluminescent lamp, it is therefore intended that increase light source light-emitting angle；Separately
One purpose is to improve the stability of electroluminescent lamp；Another object is to shorten heat propagation path, reduction light decay.Another object exists
In the application range that is integrated and expanding light source module for realizing light source module.
To achieve the goals above, the present invention provides a kind of electroluminescent lamps comprising:
Lamp body；There is light-emitting window on lamp body；
Light source module is fixed on lamp body interior zone and corresponds to light-emitting window.
In some embodiments, the light-emitting window is set to the top of the lamp body.
In some embodiments, the top of the lamp body has at least two flattened sides, and the light-emitting window is set to institute
It states in flattened side.
In some embodiments, the lamp body is composed of at least two sub-lamp bodies；
The top of each sub-lamp body has flat surfaces；Light-emitting window is arranged in the upper planar surface of each sub-lamp body；
The light source module is located at least two sub-lamp bodies and corresponds to the light-emitting window, so that the light source module
The light of sending is emitted from the light-emitting window.
In some embodiments, the LED chip in the light source module is outwardly protruded from the bottom of the light-emitting window.
In some embodiments, the top of the LED chip is flushed with the flat surfaces.
In some embodiments, the thickness on the top of the lamp body be equal to or less than the circuit substrate thickness+it is described
The thickness of LED chip.
In some embodiments, the sidewall slope of the light-emitting window and in being flared out form.
In some embodiments, the top of the sub-lamp body has groove；The length direction of groove and the flat surfaces
In parallel, short transverse is vertical with the flat surfaces；Light-emitting window is arranged with groove adjacent contact and is connected to groove；The circuit
Substrate is contained in the cavity of groove composition of at least two sub-lamp bodies.
In some embodiments, the light source module is adopted with the sub-lamp body and is mechanically fixed；Alternatively, the light source
It is fixed by bolts between module and the sub-lamp body.
In some embodiments, the light source module is fixed on the lamp being made of multiple sub-lamp bodies using welding manner
The inside of body.
In some embodiments, the light source module is connected with conducting wire, and one end of conducting wire is located in lamp body and the light source
Module connection, the other end are pierced by the lamp body and connect with external circuit.
In some embodiments, the bottom of the lamp body is provided with pedestal, is provided with circuit interface in pedestal；The light source
Module is connect with the circuit interface in the pedestal.
In some embodiments, the lower inside of the lamp body is provided with radiator；In the radiator and the pedestal
Circuit interface connection.
In some embodiments, the radiator has through-hole, through the top and bottom of the radiator, the conducting wire
In the circuit interface that the through-hole is linked into the pedestal.
In some embodiments, the radiator is surround by rotation lodicule or heat-dissipating pipe and forms hollow structure.
In some embodiments, the radiator is set in the pedestal.
In some embodiments, the height of the pedestal is greater than the height of the radiator.
In some embodiments, the lower part of the lamp body has radiator structure.
In some embodiments, the radiator structure and the lamp body are coaxial.
In some embodiments, the radiator structure is relative to the top of the lamp body along outside perpendicular to axially direction
Protrusion.
In some embodiments, the radiator structure has oxidation film using metal material and metal surface.
Light source module is set to lamp body interior zone in setting by electroluminescent lamp of the invention, increases light-emitting angle and spoke
Three-dimensional space angle is penetrated, the appearance of above-mentioned black area is avoided, realizes comprehensive effective light out.In addition, by light source module and lamp
Body is set as unified whole, along with being mechanically fixed, improves electroluminescent lamp overall structure stability, and substantially reduce hot biography
Approach is broadcast, the thermal management capabilities of light source module is improved, reduces light decay.Further, light-emitting window is designed using inclination diverging,
Further improve light-emitting angle.In addition, being provided with radiator structure in lamp body lower part, radiator is provided with also below lamp body,
Radiator is active heat removal, and radiator structure is passive Sa heat, increases heat dissipation effect, the time required to shortening thermal balance, significantly
Reduce light decay；Metal material further is used to radiator structure, metal surface is handled, forms oxidation film, example
Anodized is such as used, the heat management of light source module is strengthened.In addition, using multiple LED are arranged on circuit substrate
The light source module that chip is constituted so that light source module using more flexible, expand the application range of light source module；Further
, LED chip is combined with the setting of circuit substrate can be in circuit substrate side or in circuit substrate two sides, can be with
Using a piece of circuit substrate, can also use multichip circuit substrate combination；Realize the flexible configuration of light source module；Also,
Relative to Conventional luminescent lamp, the back spacing between one side in the light source module with LED chip is substantially reduced, thus in circuit
Substrate single side realizes the transmitting range close to 180 °, also, the spacing on circuit substrate two sides is small, that is to say the thickness of circuit substrate
Spend relatively thin, the lamp body for overcoming Conventional luminescent lamp occupies larger volume, and electroluminescent lamp is made the problem of black area occur.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of traditional electroluminescent lamp
Fig. 2 is the structural schematic diagram of the electroluminescent lamp of one embodiment of the present of invention
Fig. 3 is the matching relationship schematic diagram between the light source module and sub-lamp body of one embodiment of the present of invention
Fig. 4 is the structural schematic diagram of the light-emitting window of one embodiment of the present of invention；Wherein, the figure on the right side Fig. 4 is left side figure
Schematic side view
Fig. 5 is the structural schematic diagram of the light source module of one embodiment of the present of invention
Fig. 6 is the structural schematic diagram of the light source module of one embodiment of the present of invention
Fig. 7 is the structural schematic diagram of the light source module of one embodiment of the present of invention
Fig. 8 is the structural schematic diagram of the light source module of one embodiment of the present of invention.
Specific embodiment
To keep the contents of the present invention more clear and easy to understand, below in conjunction with Figure of description, the contents of the present invention are made into one
Walk explanation.Certainly the invention is not limited to the specific embodiment, general replacement known to those skilled in the art
It is included within the scope of protection of the present invention.
Below in conjunction with attached drawing 1 ~ 8 and specific embodiment, invention is further described in detail.It should be noted that attached drawing is equal
The present embodiment is aided in illustrating to facilitate, clearly reach using very simplified form, using non-accurate ratio, and only
Purpose.
Referring to Fig. 2, the electroluminescent lamp structural schematic diagram of one embodiment of the present of invention.The electroluminescent lamp includes: light source module
01 and lamp body 02.There is light-emitting window 025 on lamp body 02.Light source module 01 is fixed on 02 interior zone of lamp body and corresponds to light-emitting window
025.Here, light-emitting window 025 is set to the top 023 of lamp body 02, and the top 023 of lamp body 02 has at least two flattened sides,
In this embodiment, there are two flattened sides for tool, but this is not used in and limits the scope of the invention.Light-emitting window 025 is set to flat
In side.Lamp body 02 is composed of at least two sub-lamp bodies.There is two sub-lamp bodies 021,022, sub- lamp in this embodiment
It can be, but not limited to be fixedly connected using mechanical system between body 021,022, such as bolt shown in Fig. 2 07.
Incorporated by reference to Fig. 2 and Fig. 3, the top 023 of each sub-lamp body 021,022 has flat surfaces；Light-emitting window 025 is set to
In the flat surfaces on the top 023 of each sub-lamp body 021,022.Light source module 01 is located in the two sub-lamp bodies 021,022,
And correspond to light-emitting window 025, so that the light that light source module 01 issues can be emitted from light-emitting window 025.Incorporated by reference to figure
5, specifically, light source module 01 includes LED chip 102 and circuit substrate 101, therefore, LED chip 102 should correspond to light
Mouth 025, so that the light that LED chip 102 issues can be launched from light-emitting window 025.In some cases, work as light source die
When block 01 is located in sub-lamp body 021,022, LED chip 102 is outwardly protruded from the bottom of light-emitting window 025, incorporated by reference to Fig. 4, Fig. 4
The middle left side is position and pattern schematic diagram of the light-emitting window 025 on top 023, and the right side is the cooperation of light-emitting window 025 and groove in Fig. 4
Relationship, it is light-emitting window 025 that black line circle, which is lived, in Fig. 4.Here, the setting outwardly protruded can make the top of LED chip 102 with
The flat surfaces of sub-lamp body 021,022 flush, and can also slightly can also exceed flat surfaces without departing from flat surfaces.From safety
Property and consider on photosensitiveness out, it is preferred that the top of LED chip 102 flushes with the flat surfaces of sub-lamp body 021,022 or slightly exceeds
Flat surfaces.In this way, the thickness on the top 021 of lamp body 02 can be equal to or less than the thickness of light source module 01, circuit that is to say
The sum of the thickness of thickness+LED chip 102 of substrate 101.Certainly, in other embodiments, the thickness on the top 021 of lamp body 02
Degree can also be greater than the sum of the thickness of thickness+LED chip 102 of circuit substrate 101.It is real in order to improve the shooting angle of light
Now go out light on a large scale, the sidewall slope of light-emitting window 025 and in being flared out form.The top 023 of sub-lamp body 021,022 has ditch
Slot 026(is for the ease of expressing, and dotted line is shown in the structure on the right side in Fig. 4).Here it may be defined that the length direction of groove 026
Parallel with flat surfaces, short transverse talks the vertical of surface with assessment.Light-emitting window 025 and 026 adjacent contact of groove are arranged, and with
Groove 026 is connected to, so that circuit substrate 101 can be contained in the cavity that the groove 026 of two sub-lamp bodies 021,022 forms
In, and LED chip 102 can be contained in light-emitting window 025.
Referring to Fig. 2, light source module 01 can be fixed on the lamp being made of sub-lamp body 021,022 using welding manner
The inside of body 02.Metal welding can be adopted, carries out metal welding for example, by using tin cream.In addition, in order to further increase light source
Light source module 01 and sub-lamp body 02 are also fixed up using mechanical system, in Fig. 2 by stability of the module 01 in lamp body 02
It is shown, the two is fixed up using bolt 06.
Please continue to refer to Fig. 2, the lower part of lamp body 02 has radiator structure 024, herein, radiator structure 024 and lamp body 02
Coaxial arrangement, radiator structure 024 along with axially vertical direction outwardly convex, also have multi-disc cooling fin, to improve heat dissipation
Area and heat dissipation effect.Radiator structure 024 can be, but not limited to can be in metal in order to reinforce heat management using metal material
Material surface carries out specially treated, such as anodized etc., oxidation film is formed in metal surface, so as to shorten heat
The time required to balance, light decay is reduced.
Please continue to refer to Fig. 2, it is connected with conducting wire 03 on light source module 01, conducting wire can be set to the bottom of light source module 01
Portion.One end of conducting wire 03 is located in lamp body 02 and connect with light source module 01, particularly connect with circuit substrate 101；Conducting wire
03 other end is pierced by lamp body 02 and connect with external circuit.Here, the bottom of lamp body 02 is provided with pedestal 04, is set in pedestal 04
It is equipped with circuit structure, conducting wire 03 can be connect with circuit interface.The connection type of the bottom of lamp body 02 and pedestal 04 can with but not
It is limited to as shown in Figure 2, to be provided with connection structure using being mechanically connected at the top of pedestal 04, pedestal 04 can be connected to
02 bottom of lamp body, which shows as raising upward at the top of pedestal 04 in Fig. 2, and is arranged with and extends outwardly at top
Edge, in this way, the package assembly bottom of lamp body 02 has the hole that matches with the top bump of the pedestal 04, to realize card
Close connection.It is of course also possible to which screw thread is arranged at the top of pedestal 04, has in 02 bottom of lamp body and match with 04 screw top of pedestal
The screw thread of conjunction, to realize threaded connection.
Please continue to refer to Fig. 2, further, radiator 05 can also be set in the lower inside of lamp body 02.Radiator 05
It connect with the circuit interface in pedestal 04, is electrically connected to realize with external circuitry.Radiator 05 has through-hole, through heat dissipation
The top and bottom of device 05, conducting wire 03 pass through through-hole and access in the circuit structure of pedestal 04.Preferably, radiator 05 can be adopted
With propeller blade around hollow structure is formed, as shown in Figure 2.It, can also be using heat-dissipating pipe made of in other embodiments
Hollow structure.Hollow structure is as above-mentioned through-hole, so that conducting wire 03 passes through the radiator 05.Radiator 05 both can be set
The lower section outside lamp body 02 also can be set in the inside of lamp body 02, can also be set in pedestal 04.When radiator 05 is arranged
When in pedestal 04, the height of pedestal 04 is greater than the height of radiator 05, for accommodating radiator 05.Certainly, other
In embodiment, the height of radiator 05 can also be equal to the height of pedestal 04 or the height greater than pedestal 04, to realize difference
Thermal management capabilities.
Next, specifically describing light source module of the invention.
Referring to Fig. 5, light source module includes circuit substrate 101；The multiple LED chips being set on circuit substrate 101
102, further, it is also possible to be encapsulated in multiple LED chips 102 using encapsulating structure, encapsulating material is preferably transparent colloid material
Material.Here, LED chip 102 is set to the both side surface of circuit substrate 101.Due to using the thickness very little of circuit substrate 101,
Usually less than 1mm, to improve the similitude for going out light light distribution and traditional Vehicular lamp bulb of LED chip 101, effectively promotion light
Utilization rate, while making light go out light and more meeting automobile lighting specification.
Referring to Fig. 6, the single side surface of circuit substrate 101 can also be arranged in multiple LED chips 102.Circuit substrate 101
The side of upper setting LED chip 102 can be used as adhesive surface, bond with other circuit substrates 101.Two panels circuit base in Fig. 6
It can be, but not limited to be bonded together using welding manner between plate 101, such as can be welded using tin cream.Here circuit base
Plate 101 can be using ceramic base circuit board or metal-based circuit board.Preferably, metal-based circuit board can be Copper based electrical plate
Or aluminum base circuit board etc..
Referring to Fig. 7, the single side surface of circuit substrate 101 is arranged in multiple LED chips 102.The unilateral side of circuit substrate 101
LED chip 102 is set.The other side of circuit substrate 101 has between the adhesive surface of two circuit substrates 101 as adhesive surface
Packing material.Heat dissipation, reinforced cementitious ability are improved using packing material, packing material can be thermally conductive organic material, for example, leading
Hot silicone grease etc..The adhesive surface that metal welding mode bonds two circuit substrates 101 is adopted simultaneously.It can be referred to about welding manner
The description of Fig. 6, which is not described herein again.
Referring to Fig. 8, being additionally provided with chip circuit plate 103 in 102 bottom of LED chip.The fixed electrical connection of LED chip 102
On chip circuit plate 103, chip circuit plate 103 is fixedly connected on circuit substrate 101.Chip circuit plate 103 and circuit base
The connection type of plate 101 can adopt metal welding mode, such as tin cream welding.Chip circuit plate 103 can use ceramic base
Circuit board or metal-based circuit board.Preferably, metal-based circuit board can be Copper based electrical plate or aluminum base circuit board etc..
In addition, above-mentioned LED chip 102 and the connection type of circuit substrate 101 can be, but not limited to melt using eutectic metal
Close connection type.It is greater than the thermal coefficient of tin cream using the thermal coefficient of eutectic metal fusion, heat-sinking capability can be improved, reinforces
To the heat management of LED chip 102.
Here, it is also wrapped on encapsulating structure in LED chip 102, is encapsulated for example, by using organic colloid.Using encapsulating structure,
So that LED chip 102 is by external world, can also with flexible setting LED chip 102 above-mentioned electroluminescent lamp lamp body 02(Fig. 2
It is shown) in position, can also be said with the groove 026(Fig. 3 on the top 023 of flexible setting lamp body 02 is) thickness and light-emitting window
025 thickness, for example, whether the top of LED chip 102 flushes with the top of light-emitting window 025 or the top beyond light-emitting window 025
Portion is all possible without departing from the top of light-emitting window 025.
In conclusion light source module and electroluminescent lamp of the invention, using multiple LED chip structures are arranged on circuit substrate
At light source module so that light source module using more flexible, expand the application range of light source module；Further, LED
Chip is combined with the setting of circuit substrate can use one in circuit substrate side or in circuit substrate two sides
Piece circuit substrate, the combination that multichip circuit substrate can also be used；Realize the flexible configuration of light source module；Also, relative to
Conventional luminescent lamp, the back spacing between one side in the light source module with LED chip is substantially reduced, thus in circuit substrate list
Face realizes the transmitting range close to 180 °, also, the spacing on circuit substrate two sides is small, that is to say the thickness of circuit substrate compared with
Thin, the lamp body for overcoming Conventional luminescent lamp occupies larger volume, and electroluminescent lamp is made the problem of black area occur.In addition, of the invention
Electroluminescent lamp light source module is set to lamp body interior zone in setting, increase light-emitting angle and radiation three-dimensional space angle
Degree, avoids the appearance of above-mentioned black area, realizes comprehensive effective light out.In addition, setting unified for light source module and lamp body
It is whole, along with being mechanically fixed, electroluminescent lamp overall structure stability is improved, and substantially reduce heat propagation approach, improved
The thermal management capabilities of light source module, reduce light decay.Further, light-emitting window is further increased using inclination diverging design
Light-emitting angle.In addition, being provided with radiator structure in lamp body lower part, radiator is provided with also below lamp body, based on radiator
Dynamic heat dissipation, radiator structure are passive Sa heat, increase heat dissipation effect, the time required to shortening thermal balance, greatly reduce light decay；
Metal material further is used to radiator structure, metal surface is handled, oxidation film is formed, for example, by using anodic oxygen
Change processing etc., strengthens the heat management of light source module.
Although the present invention is disclosed as above with preferred embodiment, the right embodiment illustrate only for the purposes of explanation and
, it is not intended to limit the invention, if those skilled in the art can make without departing from the spirit and scope of the present invention
Dry changes and retouches, and the protection scope that the present invention is advocated should be subject to described in claims.
Claims (16)
1. a kind of electroluminescent lamp characterized by comprising
Lamp body；There is light-emitting window on lamp body；
Light source module is fixed on lamp body interior zone and corresponds to light-emitting window.
2. electroluminescent lamp according to claim 1, which is characterized in that the light-emitting window is set to the top of the lamp body.
3. electroluminescent lamp according to claim 2, which is characterized in that the top of the lamp body has at least two planar sides
Face, the light-emitting window are set in the flattened side.
4. electroluminescent lamp according to claim 2, which is characterized in that the lamp body is composed of at least two sub-lamp bodies；
The top of each sub-lamp body has flat surfaces；Light-emitting window is arranged in the upper planar surface of each sub-lamp body；
The light source module is located at least two sub-lamp bodies and corresponds to the light-emitting window, so that the light source module
The light of sending is emitted from the light-emitting window.
5. electroluminescent lamp according to claim 3, which is characterized in that LED chip in the light source module from it is described go out light
The bottom of mouth outwardly protrudes.
6. electroluminescent lamp according to claim 5, which is characterized in that the top of the LED chip and the flat surfaces are neat
It is flat.
7. electroluminescent lamp according to claim 3, which is characterized in that the thickness on the top of the lamp body is equal to or less than described
The thickness of circuit substrate+LED chip thickness.
8. electroluminescent lamp according to claim 3, which is characterized in that the sidewall slope of the light-emitting window and in being flared out shape
State.
9. electroluminescent lamp according to claim 4, which is characterized in that the top of the sub-lamp body has groove；The length of groove
Degree direction is parallel with the flat surfaces, and short transverse is vertical with the flat surfaces；Light-emitting window and groove adjacent contact are arranged
And it is connected to groove；The circuit substrate is contained in the cavity of groove composition of at least two sub-lamp bodies.
10. electroluminescent lamp according to claim 4, which is characterized in that the light source module and the sub-lamp body are using mechanical
Mode is fixed；Alternatively, the light source module is fixed on the inside for the lamp body being made of multiple sub-lamp bodies using welding manner.
11. electroluminescent lamp according to claim 4, which is characterized in that the light source module is connected with conducting wire, one end of conducting wire
It is connect in lamp body with the light source module, the other end is pierced by the lamp body and connect with external circuit；The bottom for stating lamp body is set
It is equipped with pedestal, is provided with circuit interface in pedestal；The light source module is connect with the circuit interface in the pedestal.
12. electroluminescent lamp according to claim 11, which is characterized in that the lower inside of the lamp body is provided with radiator；
The radiator is connect with the circuit interface in the pedestal；The radiator has through-hole, through the top of the radiator
And bottom, the conducting wire pass through the through-hole and are linked into the circuit interface of the pedestal.
13. electroluminescent lamp according to claim 12, which is characterized in that the radiator is surround by rotation lodicule or heat-dissipating pipe
Into hollow structure.
14. electroluminescent lamp according to claim 12, which is characterized in that the radiator is set in the pedestal；It is described
The height of pedestal is greater than the height of the radiator.
15. electroluminescent lamp according to claim 2, which is characterized in that the lower part of the lamp body has radiator structure；It is described to dissipate
Heat structure and the lamp body are coaxial；The radiator structure relative to the lamp body top along perpendicular to axially direction convex
It rises.
16. electroluminescent lamp according to claim 15, which is characterized in that the radiator structure uses metal material and metal material
Matter surface has oxidation film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910132921.6A CN109854973A (en) | 2019-02-22 | 2019-02-22 | A kind of light source module and a kind of electroluminescent lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910132921.6A CN109854973A (en) | 2019-02-22 | 2019-02-22 | A kind of light source module and a kind of electroluminescent lamp |
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| CN208090587U (en) * | 2018-04-19 | 2018-11-13 | 珠海麦格纳光电科技有限公司 | A kind of wind-cooling heat dissipating formula LED automobile headlight |
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| US20110089838A1 (en) * | 2009-10-20 | 2011-04-21 | Cree Led Lighting Solutions, Inc. | Heat sinks and lamp incorporating same |
| CN105240808A (en) * | 2014-05-29 | 2016-01-13 | 宁波高新区赛尔富电子有限公司 | Rotary lamp assembling structure |
| CN205278929U (en) * | 2015-12-17 | 2016-06-01 | 东莞市晟勤电子科技有限公司 | LED automobile headlamp |
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Application publication date: 20190607 |