CN109848767B - High-precision four-dimensional ultrasonic polishing device and using method thereof - Google Patents

Abstract

The invention provides a high-precision four-dimensional ultrasonic polishing device and a using method thereof, wherein the device comprises: the polishing machine comprises a base, an ultrasonic polishing mechanism, a polishing solution spraying and atomizing mechanism, a linkage mechanism, a dual piezoelectric stack ultrasonic vibration generating device, a polishing solution recycling mechanism and a workpiece clamping mechanism, wherein the base is placed on a horizontal working surface, the ultrasonic polishing mechanism is used for contacting with a workpiece, the linkage mechanism is used for moving a polishing head, and the workpiece clamping mechanism is used for clamping the workpiece and generating two-dimensional elliptic ultrasonic vibration on the workpiece; the polishing solution recovery mechanism comprises a positioning hole regularly arranged on the upper portion of the machine base and a waste liquid collecting hole communicated with the positioning hole. The high-precision four-dimensional ultrasonic polishing device and the use method thereof improve the processing proportion of the ductile domain during the processing of the hard and brittle material and reduce the brittleness removal proportion of the surface material. Meanwhile, the problems of surface damage, over-polishing and under-polishing caused by uneven abrasive particle aggregation and distribution are solved, and the working efficiency is improved.

Description

High-precision four-dimensional ultrasonic polishing device and using method thereof

Technical Field

The invention relates to the field of polishing processing of high-precision planes and complex curved surfaces of hard and brittle materials and metal materials, in particular to a high-precision adjustable four-dimensional ultrasonic polishing device and a using method thereof.

Background

In the national astronomy, military and aerospace field of heavy and large engineering, high precision optical system components are increasingly required, and for the polishing processing of optical components, the surface roughness of the components directly influences the quality of the components and the quality, service performance and service life of products produced by using the components, so the surface roughness of the optical components becomes an important mark for measuring the quality of the components.

In most cases, when a hard and brittle material and an optical workpiece are polished, a plane workpiece is polished relatively simply, but the condition of polishing a curved surface edge is complex, the situation that the polishing liquid cannot enter and dry grinding is formed often occurs, or particles in the polishing liquid are gathered, abrasive particles are unevenly distributed on the workpiece, so that the scratching distribution of the abrasive particles is uneven, or the surface damage is caused, which greatly influences the surface precision and the service life of the workpiece.

Polishing is generally the last step of workpiece processing, but the characteristics of low processing efficiency and long processing time always troubles the development of the polishing industry. How to improve the ultrasonic polishing efficiency and ensure the surface quality of the workpiece while shortening the ultrasonic polishing time is a hot point in the industry.

Disclosure of Invention

According to the mentioned contact type ultrasonic polishing processing, one-dimensional ultrasonic vibration is generally added on an ultrasonic polishing head, although the processing efficiency of the polishing processing is improved to a certain extent, and the surface appearance of a processed workpiece is improved, when hard and brittle materials such as glass and the like are processed, the technical problem that the application requirements in a part of fields cannot be met is solved, and the high-precision four-dimensional ultrasonic polishing device and the using method thereof are provided. The ultrasonic polishing machine mainly utilizes the ultrasonic polishing mechanism, the polishing solution spraying and atomizing mechanism, the linkage mechanism, the dual piezoelectric stack ultrasonic vibration generating device, the polishing solution recycling mechanism and the workpiece clamping mechanism to realize various types of polishing of workpieces in a matching way, so that the rapid positioning, the accurate polishing and the reduction of the surface roughness are realized, the surface shape precision and the processing efficiency of the surface of the workpiece are improved, and the problems of surface damage, local over-polishing or under-polishing caused by the aggregation or uneven distribution of abrasive particles in the polishing solution are solved.

The technical means adopted by the invention are as follows:

a high-precision four-dimensional ultrasonic polishing device comprises: the polishing machine comprises a machine base placed on a horizontal working surface, an ultrasonic polishing mechanism used for being in contact with a workpiece, a polishing solution spraying and atomizing mechanism, a linkage mechanism used for moving a polishing head, a dual piezoelectric stack ultrasonic vibration generating device, a polishing solution recycling mechanism and a workpiece clamping mechanism used for clamping the workpiece and generating two-dimensional elliptical ultrasonic vibration on the workpiece.

The polishing solution recovery mechanism comprises a positioning hole regularly arranged at the upper part of the machine base and a waste liquid collecting hole communicated with the positioning hole; the workpiece clamping mechanism and the double-piezoelectric-stack ultrasonic vibration generating device are arranged at the center of the upper surface of the machine base through a positioning hole; the polishing solution spraying and atomizing device is characterized in that a mechanical arm sliding rail is arranged on the front end face of the base, a polishing solution spraying and atomizing mechanism for spraying polishing solution to a workpiece is arranged on the mechanical arm sliding rail, and the polishing solution spraying and atomizing mechanism can move on the mechanical arm sliding rail.

The linkage mechanism comprises an x-axis stepping motor II, an x-axis lead screw I and an x-axis stepping motor I; the X-axis lead screw I and the X-axis lead screw II are respectively arranged at the upper ends of two side walls of the base, the end part of the X-axis lead screw I is connected with an X-axis stepping motor I in a transmission manner, and the end part of the X-axis lead screw II is connected with an X-axis stepping motor II in a transmission manner; the X-axis lead screw I and the X-axis lead screw II are respectively provided with a sliding seat, and the two same sliding seats are connected through a cross beam, so that the sliding seats can move back and forth in the axis direction of the X-axis lead screw I and the X-axis lead screw II; a y-axis lead screw is arranged between the two sliding seats, and the end part of the y-axis lead screw is connected with a y-axis stepping motor in a transmission way; the y-axis screw is provided with a z-axis moving device, so that the z-axis moving device can move back and forth in the axis direction of the y-axis screw; the z-axis moving device is provided with an ultrasonic polishing mechanism, and the ultrasonic polishing mechanism can be driven to move up and down in the vertical direction through the z-axis moving device.

Further, the dual piezoelectric stack ultrasonic vibration generating device comprises a base, a piezoelectric stack I, a piezoelectric stack II, a flexible mechanism I, a stepping motor, a flexible mechanism II, an assembling hole and a turntable; the base is arranged on the positioning hole through a turntable, the piezoelectric stack I and the piezoelectric stack II are arranged in two channels of the base, and the outlet positions of the two channels are respectively provided with a flexible mechanism I and a flexible mechanism II; the outer ends of the flexible mechanisms I and II are connected with stepping motors through mounting seats, the stepping motors are fixedly connected with the workpiece clamping mechanisms through connectors, the stepping motors are enabled to rotate, and then the workpiece clamping mechanisms are driven to rotate, so that different angles in workpiece machining are achieved.

Further, the workpiece clamping mechanism comprises a clamp base, a clamp clamping jaw, a set screw, a compression screw, a sliding groove and an assembling hole; a sliding groove is processed on the clamp base with the fixed clamping jaw, the pressing screw rod is arranged on the sliding groove, the clamp clamping jaw is assembled on the pressing screw rod, and the positioning and fixing of the clamp clamping jaw are realized through a set screw; the end part of the clamp base is provided with an assembling hole for connecting a stepping motor.

Further, when the dual piezoelectric stack ultrasonic vibration mechanism receives an excitation model with a certain phase difference, the piezoelectric stacks I and the piezoelectric stacks II can generate vibration in a staggered mode, two-dimensional elliptical vibration parallel to the base surface can be formed when the piezoelectric stacks I and the piezoelectric stacks II are synthesized on the workpiece clamping mechanism through motion, and the workpiece clamping mechanism drives the workpiece to vibrate elliptically.

Further, the sliding seat comprises a sliding seat support, a sliding seat flange, a y-axis lead screw nut, an x-axis lead screw nut and an x-axis sliding block; the sliding seat flange is positioned at the upper end of the sliding seat support, and a y-axis lead screw nut for mounting a y-axis lead screw is arranged inside the sliding seat flange; the x-axis screw nut and the x-axis sliding block are sequentially arranged at the lower end of the sliding seat support.

Further, the polishing solution spraying and atomizing mechanism comprises a three-degree-of-freedom mechanical arm and an ultrasonic close spraying nozzle, wherein the three-degree-of-freedom mechanical arm comprises a mechanical arm sliding seat, a mechanical arm I, a mechanical arm II and a mechanical arm III; the mechanical arm sliding seat is mounted on the mechanical arm sliding rail and can move on the mechanical arm sliding rail; the bottom of the mechanical arm I is connected with a rotating end at the upper part of the mechanical arm sliding seat, and the mechanical arm I can rotate relative to the mechanical arm sliding seat under the drive of the rotating end; the upper end of the mechanical arm I is hinged with a mechanical arm II, the upper end of the mechanical arm II is hinged with a mechanical arm III, and the front end of the mechanical arm III is provided with an ultrasonic wave close spraying nozzle.

Furthermore, a y-axis slide rail I is arranged at the upper end of the cross beam, and a y-axis slide rail II is arranged at the lower end of the cross beam; the z-axis moving device comprises a z-axis moving device base, a y-axis sliding rail sliding block, a y-axis lead screw nut II, an ultrasonic electric spindle base, a z-axis sliding rail sliding block, a z-axis sliding rail and an ultrasonic electric spindle turntable; a y-axis slide rail sliding block and a y-axis lead screw nut are arranged on the z-axis moving device base, wherein the y-axis slide rail sliding block is assembled on the y-axis slide rail I and the y-axis slide rail II; the ultrasonic polishing device is characterized in that a z-axis sliding rail is arranged on the z-axis moving device base, the ultrasonic electric spindle base is installed on the z-axis sliding rail through a z-axis sliding rail sliding block, and the ultrasonic electric spindle base is provided with an ultrasonic polishing mechanism through an ultrasonic electric spindle turntable.

Furthermore, the ultrasonic polishing mechanism comprises an ultrasonic electric spindle, an ultrasonic polishing head and a spindle holding seat for fixing; the ultrasonic electric spindle is arranged on the ultrasonic electric spindle turntable through a spindle holding seat, and the ultrasonic polishing head is arranged at the front end of the ultrasonic electric spindle.

The invention also discloses a use method of the high-precision four-dimensional ultrasonic polishing device, which comprises the following steps:

the ultrasonic polishing mechanism performs one-dimensional ultrasonic polishing, and the polishing solution spraying and atomizing mechanism performs one-dimensional ultrasonic motion.

When a plane part is polished, signals with phase differences are transmitted to the double piezoelectric stack ultrasonic vibration generating device, the connected workpiece vibrates in a two-dimensional elliptical mode, the vibration direction of the workpiece vibration plane is perpendicular to the vibration direction of an ultrasonic electric spindle in the ultrasonic polishing mechanism, and four-dimensional ultrasonic polishing is conducted at the moment.

When a regular cylindrical curved surface part is machined, a signal without phase difference is transmitted to the double piezoelectric stack elliptical vibration generating device, the double piezoelectric stack elliptical vibration generating device conducts one-dimensional ultrasonic vibration, and at the moment, three-dimensional ultrasonic polishing is conducted.

When a complex curved surface is machined, signals are not input into the double piezoelectric stack elliptical vibration generating device, and the workpiece clamping mechanism and the double piezoelectric stack elliptical vibration generating device are regarded as common clamps and are subjected to two-dimensional ultrasonic polishing.

In actual processing, due to the fact that the hard and brittle materials are very brittle, the abrasive particles in polishing liquid are prone to brittle fracture in the processing process, and compared with the prior art, the high-precision four-dimensional ultrasonic polishing device and the using method thereof improve the processing proportion of a ductile domain during processing of the hard and brittle materials and reduce the brittle removal proportion of surface materials. Meanwhile, the ultrasonic polishing device solves the problems of surface damage, over-polishing and under-polishing caused by uneven abrasive particle aggregation and distribution, improves the working efficiency, can quickly identify the surface shapes of workpieces such as planes, cylindrical regular curved surfaces, complex curved surfaces and the like, and automatically adjusts the polishing dimension to correspond to different surface shapes.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a high-precision four-dimensional ultrasonic polishing apparatus according to the present invention.

FIG. 2 is a schematic view of a workpiece clamping mechanism according to the present invention.

Fig. 3 is a schematic diagram of an ultrasonic vibration generating device of a dual piezoelectric stack.

FIG. 4 is a schematic diagram of the beam slider of the present invention.

FIG. 5 is a schematic structural view of a polishing solution spraying and atomizing mechanism according to the present invention.

FIG. 6 is a schematic view of a z-axis moving device according to the present invention.

Wherein, 1, x-axis stepping motors II and 2, x-axis screw II,

3. a three-degree-of-freedom mechanical arm 301, a mechanical arm sliding seat 302, mechanical arms I and 303, mechanical arms II and 304 and a mechanical arm III,

4. an ultrasonic close spraying nozzle, a 5-axis stepping motor and a y-axis stepping motor,

6. a beam, 605, y-axis slide rails I, 606, y-axis slide rails II,

7. a y-axis screw, 8 and z-axis stepping motors, 9, an ultrasonic electric spindle, 10 and a z-axis moving device,

11. a slide carriage 1101, a slide carriage flange 1102, a y-axis lead screw nut 1103, an x-axis lead screw nut 1104, an x-axis slide block,

12. a workpiece clamping mechanism 1201, a clamp base 1202, a clamp clamping jaw 1203, a set screw 1204, a compression screw 1205, a sliding chute 1206 and an assembling hole,

13. x-axis screw rods I and 14, x-axis stepping motors I and 15, a waste liquid collecting hole 16, a mechanical arm slide rail 17 and a positioning hole,

18. a double piezoelectric stack ultrasonic vibration device 1801, a base 1802, piezoelectric stacks I, 1803, piezoelectric stacks II, 1804, flexible mechanisms I, 1805, a stepping motor 1806, flexible mechanisms II, 1807, an assembling hole, 1808 and a turntable,

19. a machine seat is arranged on the machine seat,

1001. the ultrasonic electric spindle comprises a z-axis moving device base, 1002 y-axis sliding rail sliding blocks, 1003, y-axis lead screw nuts II and 1004, an ultrasonic electric spindle base, 1005 and z-axis sliding rail sliding blocks, 1006 and z-axis sliding rails, 1007 and an ultrasonic electric spindle turntable.

Detailed Description

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the absence of any contrary indication, these directional terms are not intended to indicate and imply that the device or element so referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be considered as limiting the scope of the present invention: the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

As shown in the figure, the present invention provides a high precision four-dimensional ultrasonic polishing apparatus, comprising: the polishing machine comprises a machine base 19 placed on a horizontal working surface, an ultrasonic polishing mechanism used for contacting with a workpiece, a polishing solution spraying and atomizing mechanism, a linkage mechanism used for moving a polishing head, a dual piezoelectric stack ultrasonic vibration generating device 18, a polishing solution recycling mechanism and a workpiece clamping mechanism 12 used for clamping the workpiece and generating two-dimensional elliptical ultrasonic vibration on the workpiece; the polishing solution recovery mechanism comprises a positioning hole 17 regularly arranged on the upper part of the machine base 19 and a waste liquid collecting hole 15 communicated with the positioning hole 17; the workpiece clamping mechanism 12 and the dual piezoelectric stack ultrasonic vibration generating device 18 are arranged at the center of the upper surface of the machine base 19 through a positioning hole 17.

The positioning hole 17 on the upper surface of the equipment base 19 can be used for positioning and mounting the double piezoelectric stack ultrasonic vibration mechanism 18 and the lower rotary table 1808, and can also be used for collecting polishing liquid sprayed from the workpiece clamping mechanism 12, the collected polishing liquid flows to the waste liquid collecting hole 15 from the lower slope of the positioning hole 17 for waste liquid collection, and the waste liquid collecting hole 15 is introduced through a liquid passing channel with a slope below the hole and is used for collecting liquid in a centralized manner. Preferably, the positioning holes 17 are circular holes.

The front end face of the base 19 is provided with a mechanical arm slide rail 16, and the polishing solution spraying and atomizing mechanism for spraying polishing solution to a workpiece is arranged on the mechanical arm slide rail 16 and can move on the mechanical arm slide rail 16.

The linkage mechanism comprises an x-axis stepping motor II1, an x-axis lead screw II2, an x-axis lead screw I13 and an x-axis stepping motor I14; the x-axis lead screw I13 and the x-axis lead screw II2 are respectively installed at the upper ends of two side walls of the machine base 19, the end part of the x-axis lead screw I13 is in transmission connection with an x-axis stepping motor I14, and the end part of the x-axis lead screw II2 is in transmission connection with an x-axis stepping motor II 1; the x-axis lead screw I13 and the x-axis lead screw II2 are respectively provided with a sliding seat 11, and the two identical sliding seats 11 are connected through a cross beam 6, so that the sliding seats 11 can move back and forth in the axis direction of the x-axis lead screw I13 and the x-axis lead screw II 2; a y-axis lead screw 7 is arranged between the two sliding seats 11, and the end part of the y-axis lead screw 7 is connected with a y-axis stepping motor 5 in a transmission way; the y-axis screw 7 is provided with a z-axis moving device 10, so that the z-axis moving device 10 can move back and forth in the axis direction of the y-axis screw 7; the z-axis moving device 10 is provided with an ultrasonic polishing mechanism, and the ultrasonic polishing mechanism can be driven by the z-axis moving device 10 to move up and down in the vertical direction.

As shown in fig. 3, the dual piezoelectric stack ultrasonic vibration generating device 18 includes a base 1801, a piezoelectric stack I1802, a piezoelectric stack II1803, a flexible mechanism I1804, a stepper motor 1805, a flexible mechanism II1806, an assembly hole 1807, and a turntable 1808; the base 1801 is mounted on the positioning hole 17 through a turntable 1808, the piezoelectric stack I1802 and the piezoelectric stack II1803 are mounted in two channels of the base 1801, and a flexible mechanism I1804 and a flexible mechanism II1806 are respectively arranged at the outlet positions of the two channels; the outer ends of the flexible mechanisms I1804 and II1806 are connected with a stepping motor 1805 through mounting seats, so that the flexible mechanisms I1804 and II1806 are connected with the stepping motor 1805, the stepping motor 1805 is connected and fixed with the workpiece clamping mechanism 12 through a connector, the stepping motor 1805 rotates, the workpiece clamping mechanism 12 is driven to rotate, the workpiece clamp is rotated, the workpiece machining angle is adjusted, and therefore different angles in workpiece machining are achieved.

Here, the stepping motor 1805 is used to drive the workpiece clamping mechanism 12 to rotate, and the pedestal 1801 is disposed on the turntable 1808, preferably, the turntable 1808 can rotate in the horizontal direction under the driving of the driving device, so as to adjust the setting angle of the pedestal 1801, and further adjust the angle of the workpiece clamping mechanism 12.

As shown in fig. 2, the workpiece clamping mechanism 12 includes a clamp base 1201, a clamp jaw 1202, a set screw 1203, a compression screw 1204, a slide slot 1205 and a mounting hole 1206; a sliding groove 1205 is machined in the clamp base 1201 with the fixed clamping jaw, the compression screw 1204 is arranged, the clamp clamping jaw 1202 is assembled on the sliding groove 1205 and the compression screw 1204, and the clamp clamping jaw 1202 is positioned and fixed through a set screw 1203; the end of the clamp base 1201 has a mounting hole 1206 for attachment of a stepper motor 1805. The workpiece clamping mechanism 12 is a detachable clamp.

When the dual piezoelectric stack ultrasonic vibration mechanism 18 receives an excitation model with a certain phase difference, the piezoelectric stack I1802 and the piezoelectric stack II1803 vibrate in a staggered manner, and the motion of the piezoelectric stack I1802 and the piezoelectric stack II1803 is synthesized on the workpiece clamping mechanism 12 to form two-dimensional elliptical vibration parallel to the basal plane, and the workpiece clamping mechanism 12 drives the workpiece to perform elliptical vibration.

When an electric signal without phase difference is input to the dual piezoelectric stack ultrasonic vibration mechanism 18, one-dimensional ultrasonic vibration parallel to the plane of the positioning hole can be realized, and when an electric signal is not input to the dual piezoelectric stack ultrasonic vibration generating device 18, the workpiece clamping mechanism 12 does not move, and can be regarded as a common clamp.

As shown in fig. 4, the slide 11 includes a slide bracket, a slide flange 1101, a y-axis lead screw nut 1102, an x-axis lead screw nut 1103, and an x-axis slider 1104; the sliding seat flange 1101 is positioned at the upper end of the sliding seat support, and a y-axis lead screw nut 1102 for mounting a y-axis lead screw 7 is arranged inside the sliding seat flange; the x-axis lead screw nut 1103 and the x-axis sliding block 1104 are sequentially arranged at the lower end of the sliding seat support.

The slide 11 is mounted on the x-axis lead screws on two sides through an x-axis slide block 1104, and can move back and forth along the x-axis lead screws under the driving of a stepping motor through the assembly connection of x-axis lead screw nuts 1103. The beam 6, the y-axis stepping shaft motor 5 and the y-axis lead screw 7 are arranged on the slide base 11, the beam 6 and the y-axis lead screw 7 are arranged on the slide base flanges 1101 on two sides, and the y-axis lead screw 7 is fixedly connected through a y-axis lead screw nut 1102. The y-axis stepping shaft motor 5 and the y-axis lead screw 7 can move back and forth on the x-axis lead screw along with the sliding seat 11; the z-axis moving device is mounted on the y-axis lead screw 7 and the cross beam 6.

The X-axis lead screw I13 and the X-axis lead screw II2 are distributed on two edges of the left side wall and the right side wall of the device, and the same sliding seat flange I and sliding seat flange II are arranged on the X-axis lead screw I13 and the X-axis lead screw II 2.

As shown in fig. 5, the polishing solution spraying and atomizing mechanism includes a three-degree-of-freedom mechanical arm 3 and an ultrasonic close spraying nozzle 4, where the three-degree-of-freedom mechanical arm 3 includes a mechanical arm slide 301, a mechanical arm I302, a mechanical arm II303, and a mechanical arm III 304; the mechanical arm slide carriage 301 is mounted on the mechanical arm slide rail 16 and can move on the mechanical arm slide rail 16; the mechanical arm slide rail 16 is located right in front of the machine base 19, the bottom of the mechanical arm I302 is connected with the rotating end of the upper part of the mechanical arm slide seat 301, and the mechanical arm I302 can rotate relative to the mechanical arm slide seat 301 under the driving of the rotating end.

The upper end of the mechanical arm I302 is hinged with a mechanical arm II303, so that the mechanical arm II303 can rotate relative to the hinge shaft; the upper end of the mechanical arm II303 is hinged with a mechanical arm III304, so that the mechanical arm III304 can rotate relative to the hinge shaft; the front end of the mechanical arm III304 is provided with an ultrasonic close spraying nozzle 4.

During polishing, the top end of the three-degree-of-freedom mechanical arm 3 drives the ultrasonic close spraying nozzle 4 with one-dimensional ultrasonic vibration to move left and right on the mechanical arm slide rail 16, and meanwhile, polishing liquid is sprayed on the surface of a workpiece.

The upper end of the cross beam 6 is provided with a y-axis slide rail I605, and the lower end is provided with a y-axis slide rail II 606; as shown in fig. 6, the z-axis moving device 10 includes a z-axis moving device base 1001, a y-axis slide block 1002, a y-axis lead screw nut II1003, an ultrasonic electric spindle base 1004, a z-axis slide block 1005, a z-axis slide rail 1006, and an ultrasonic electric spindle turntable 1007; and a y-axis sliding rail sliding block 1002 which is used for being assembled on the y-axis sliding rail I605 and the y-axis sliding rail II606 and a y-axis lead screw nut II1003 which is used for being assembled on the y-axis lead screw 7 are arranged on the z-axis moving device base 1001.

A z-axis slide rail 1006 is arranged on the z-axis moving device base 1001, and the ultrasonic electric spindle base 1004 is mounted on the z-axis slide rail 1006 through a z-axis slide rail slider 1005, so that the ultrasonic electric spindle base 1004 can be driven by a z-axis stepping motor 8 to move up and down on the z-axis slide rail 1006; the ultrasonic electric spindle base 1004 is provided with an ultrasonic polishing mechanism through an ultrasonic electric spindle turntable 1007, so that the ultrasonic polishing mechanism is mounted on the z-axis moving device base 1001, and further the up-and-down movement of the ultrasonic polishing mechanism is realized through the z-axis moving device 10. And the z-axis moving device 10 can be driven by the y-axis stepping motor 5 to move left and right on the y-axis lead screw, so as to drive the ultrasonic polishing mechanism to move left and right on the y-axis lead screw.

The z-axis stepping motor 8 controls the up-and-down motion of the ultrasonic electric spindle base 1004 in the z-axis moving device, thereby controlling the z-axis displacement of the ultrasonic electric spindle. The z-axis stepping motor 8 provides main power, and the ultrasonic electric spindle is enabled to move vertically through an internal power transmission mechanism, and the power transmission mechanism is a conventional transmission mechanism in the prior art.

The slide carriage 11 can move back and forth on the x-axis lead screw I13 and the x-axis lead screw II2 under the driving of the x-axis stepping motor I14 and the x-axis stepping motor II to drive the z-axis moving device 10 to move back and forth on the x-axis lead screw I13 and the x-axis lead screw II2, further drive the ultrasonic polishing mechanism to move back and forth on the x-axis lead screw I13 and the x-axis lead screw II2, and drive the polishing head mounted on the ultrasonic electric spindle 9 to move on the workbench to polish and process a workpiece.

The ultrasonic polishing mechanism comprises an ultrasonic electric spindle 9, an ultrasonic polishing head and a spindle holding seat for fixing; the ultrasonic electric spindle 9 is mounted on the ultrasonic electric spindle turntable 1007 through a spindle holding seat, and the ultrasonic polishing head is mounted at the front end of the ultrasonic electric spindle 9. The ultrasonic electric spindle 9 moves on the working platform, and can polish and process workpieces. The ultrasonic electric spindle 9 integrates and installs an ultrasonic transducer, an ultrasonic amplitude transformer and a motor together, and the outside is connected with an ultrasonic polishing head through a connecting part, so that the structure of the whole polishing device is greatly simplified.

The high-precision four-dimensional ultrasonic polishing device is provided with stepping motors arranged on an x lead screw I13, an x lead screw II2, a y-axis lead screw 7, a z-axis slide rail 1006 and a mechanical arm, wherein the rotation of the motors outputs motion through a transmission device and transmits the motion to an ultrasonic electric spindle 9 and the mechanical arm to drive a polishing tool head to move on a base surface of a workbench for ultrasonic polishing, so that the mechanical arm can throw polishing liquid in real time, and the high-precision adjustable four-dimensional ultrasonic polishing device is provided.

As shown in fig. 1 to 6, a method for using the high-precision four-dimensional ultrasonic polishing device to perform ultrasonic polishing on a workpiece made of a hard and brittle material includes the following steps:

the ultrasonic polishing mechanism performs one-dimensional ultrasonic polishing, and the polishing solution spraying and atomizing mechanism performs one-dimensional ultrasonic motion. Different dimensions of polishing modes can be adopted when plane parts, regular cylindrical curved surface parts or complex curved surface parts are polished.

When a plane part is polished, signals with phase differences are transmitted to the double piezoelectric stack ultrasonic vibration generating device, the connected workpiece vibrates in a two-dimensional elliptical mode, the vibration direction of the workpiece vibration plane is perpendicular to the vibration direction of the ultrasonic electric spindle 9 in the ultrasonic polishing mechanism, and four-dimensional ultrasonic polishing is conducted at the moment.

When a regular cylindrical curved surface part is machined, a signal without phase difference is transmitted to the double piezoelectric stack elliptical vibration generating device, the double piezoelectric stack elliptical vibration generating device conducts one-dimensional ultrasonic vibration, the workpiece conducts one-dimensional ultrasonic vibration, and at the moment, three-dimensional ultrasonic polishing is conducted.

According to a specific object, the detachable workpiece clamping mechanism 12 can be replaced, after a workpiece is clamped, the linkage mechanism is adjusted, the polishing head is adjusted to the designated position, the polishing pressure is adjusted, the polishing path is converted and input into the control system in a code form, and then the polishing operation can be carried out.

When a complex curved surface is machined, signals are not input into the double piezoelectric stack elliptical vibration generating device, the workpiece clamping mechanism 12 and the double piezoelectric stack elliptical vibration generating device are not moved at the moment and are regarded as a common clamp structure, and the polishing mode at the moment is two-dimensional ultrasonic polishing.

According to a specific object, the detachable workpiece clamping mechanism 12 can be replaced, after a workpiece is clamped, the linkage mechanism is adjusted, the polishing head is adjusted to the designated position, the polishing pressure is adjusted, the polishing path is converted and input into the control system in a code mode, and operation can be carried out.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (7)

1. A high-precision four-dimensional ultrasonic polishing device is characterized by comprising: the polishing machine comprises a base, an ultrasonic polishing mechanism, a polishing solution spraying and atomizing mechanism, a linkage mechanism, a dual piezoelectric stack ultrasonic vibration generating device, a polishing solution recycling mechanism and a workpiece clamping mechanism, wherein the base is placed on a horizontal working surface, the ultrasonic polishing mechanism is used for contacting with a workpiece, the linkage mechanism is used for moving a polishing head, and the workpiece clamping mechanism is used for clamping the workpiece and generating two-dimensional elliptic ultrasonic vibration on the workpiece;

the polishing solution recovery mechanism comprises a positioning hole regularly arranged at the upper part of the machine base and a waste liquid collecting hole communicated with the positioning hole;

the workpiece clamping mechanism and the double-piezoelectric-stack ultrasonic vibration generating device are arranged at the center of the upper surface of the machine base through a positioning hole;

a mechanical arm slide rail is arranged on the front end surface of the base, and the polishing solution spraying and atomizing mechanism for spraying polishing solution to a workpiece is arranged on the mechanical arm slide rail and can move on the mechanical arm slide rail;

the linkage mechanism comprises an x-axis stepping motor II, an x-axis lead screw I and an x-axis stepping motor I;

the X-axis lead screw I and the X-axis lead screw II are respectively arranged at the upper ends of two side walls of the base, the end part of the X-axis lead screw I is connected with an X-axis stepping motor I in a transmission manner, and the end part of the X-axis lead screw II is connected with an X-axis stepping motor II in a transmission manner;

the X-axis lead screw I and the X-axis lead screw II are respectively provided with a sliding seat, and the two same sliding seats are connected through a cross beam, so that the sliding seats can move back and forth in the axis direction of the X-axis lead screw I and the X-axis lead screw II;

a y-axis lead screw is arranged between the two sliding seats, and the end part of the y-axis lead screw is connected with a y-axis stepping motor in a transmission way; the y-axis screw is provided with a z-axis moving device, so that the z-axis moving device can move back and forth in the axis direction of the y-axis screw;

the z-axis moving device is provided with an ultrasonic polishing mechanism and can drive the ultrasonic polishing mechanism to move up and down in the vertical direction;

the dual piezoelectric stack ultrasonic vibration generating device comprises a base, a piezoelectric stack I, a piezoelectric stack II, a flexible mechanism I, a stepping motor, a flexible mechanism II, an assembling hole and a turntable;

the base is arranged on the positioning hole through a turntable, the piezoelectric stack I and the piezoelectric stack II are arranged in two channels of the base, and the outlet positions of the two channels are respectively provided with a flexible mechanism I and a flexible mechanism II;

the outer ends of the flexible mechanism I and the flexible mechanism II are connected with stepping motors through mounting seats, the stepping motors are fixedly connected with the workpiece clamping mechanism through connectors, so that the stepping motors rotate to drive the workpiece clamping mechanism to rotate, the included angle between a workpiece and the vertical direction is adjusted, and the machining of different angles of the workpiece is realized;

when the double piezoelectric stack ultrasonic vibration mechanism receives an excitation model with a certain phase difference, the piezoelectric stacks I and II can generate vibration in a staggered mode, the two-dimensional elliptical vibration parallel to the basal plane can be formed when the piezoelectric stacks I and II are synthesized on the workpiece clamping mechanism through motion, and the workpiece clamping mechanism drives the workpiece to vibrate elliptically.

2. The high precision four-dimensional ultrasonic polishing apparatus according to claim 1,

the workpiece clamping mechanism comprises a clamp base, a clamp clamping jaw, a set screw, a compression screw, a sliding groove and an assembling hole;

a sliding groove is processed on the clamp base with the fixed clamping jaw, the pressing screw rod is arranged on the sliding groove, the clamp clamping jaw is assembled on the pressing screw rod, and the positioning and fixing of the clamp clamping jaw are realized through a set screw;

the end part of the clamp base is provided with an assembling hole for connecting a stepping motor.

3. The high precision four-dimensional ultrasonic polishing apparatus according to claim 1,

the sliding seat comprises a sliding seat support, a sliding seat flange, a y-axis lead screw nut, an x-axis lead screw nut and an x-axis sliding block;

the sliding seat flange is positioned at the upper end of the sliding seat support, and a y-axis lead screw nut for mounting a y-axis lead screw is arranged inside the sliding seat flange;

the x-axis screw nut and the x-axis sliding block are sequentially arranged at the lower end of the sliding seat support.

4. The high precision four-dimensional ultrasonic polishing apparatus according to claim 1,

the polishing solution spraying and atomizing mechanism comprises a three-degree-of-freedom mechanical arm and an ultrasonic close spraying nozzle, wherein the three-degree-of-freedom mechanical arm comprises a mechanical arm sliding seat, a mechanical arm I, a mechanical arm II and a mechanical arm III;

the mechanical arm sliding seat is mounted on the mechanical arm sliding rail and can move on the mechanical arm sliding rail; the bottom of the mechanical arm I is connected with a rotating end at the upper part of the mechanical arm sliding seat, and the mechanical arm I can rotate relative to the mechanical arm sliding seat under the drive of the rotating end;

the upper end of the mechanical arm I is hinged with a mechanical arm II, the upper end of the mechanical arm II is hinged with a mechanical arm III, and the front end of the mechanical arm III is provided with an ultrasonic wave close spraying nozzle.

5. The high precision four-dimensional ultrasonic polishing apparatus according to claim 1,

the upper end of the cross beam is provided with a y-axis slide rail I, and the lower end of the cross beam is provided with a y-axis slide rail II;

the z-axis moving device comprises a z-axis moving device base, a y-axis sliding rail sliding block, a y-axis lead screw nut II, an ultrasonic electric spindle base, a z-axis sliding rail sliding block, a z-axis sliding rail and an ultrasonic electric spindle turntable;

a y-axis slide rail sliding block and a y-axis lead screw nut are arranged on the z-axis moving device base, wherein the y-axis slide rail sliding block is assembled on the y-axis slide rail I and the y-axis slide rail II;

the ultrasonic polishing device is characterized in that a z-axis sliding rail is arranged on the z-axis moving device base, the ultrasonic electric spindle base is installed on the z-axis sliding rail through a z-axis sliding rail sliding block, and the ultrasonic electric spindle base is provided with an ultrasonic polishing mechanism through an ultrasonic electric spindle turntable.

6. The high precision four-dimensional ultrasonic polishing apparatus according to claim 5,

the ultrasonic polishing mechanism comprises an ultrasonic electric spindle, an ultrasonic polishing head and a spindle holding seat for fixing;

the ultrasonic electric spindle is arranged on the ultrasonic electric spindle turntable through a spindle holding seat, and the ultrasonic polishing head is arranged at the front end of the ultrasonic electric spindle.

7. A method for using the high-precision four-dimensional ultrasonic polishing device according to claim 1, comprising the steps of:

the ultrasonic polishing mechanism performs one-dimensional ultrasonic polishing, and the polishing solution spraying and atomizing mechanism performs one-dimensional ultrasonic motion;

when a plane part is polished, signals with phase difference are transmitted to the double piezoelectric stack ultrasonic vibration generating device, a connected workpiece vibrates in a two-dimensional elliptical manner, the vibration direction of the vibration plane of the workpiece is perpendicular to that of an ultrasonic electric spindle in the ultrasonic polishing mechanism, and four-dimensional ultrasonic polishing is performed at the moment;

when a regular cylindrical curved surface part is machined, a signal without phase difference is transmitted to the double piezoelectric stack elliptical vibration generating device, the double piezoelectric stack elliptical vibration generating device performs one-dimensional ultrasonic vibration at the moment, and three-dimensional ultrasonic polishing is performed at the moment;

when a complex curved surface is machined, signals are not input into the double piezoelectric stack elliptical vibration generating device, and the workpiece clamping mechanism and the double piezoelectric stack elliptical vibration generating device are regarded as common clamps and are subjected to two-dimensional ultrasonic polishing.

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