CN109834406A - Light metal joint method and its engagement filler - Google Patents
Light metal joint method and its engagement filler Download PDFInfo
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- CN109834406A CN109834406A CN201711205315.XA CN201711205315A CN109834406A CN 109834406 A CN109834406 A CN 109834406A CN 201711205315 A CN201711205315 A CN 201711205315A CN 109834406 A CN109834406 A CN 109834406A
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- light metal
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Abstract
The present invention relates to a kind of light metals to engage filler, is uniformly mixed light metal powder and silver powder by a solvent and is formed；Wherein, the powder diameter of the light metal powder is micron order, and the powder diameter of the silver powder is nanoscale or sub-micron grade；Above-mentioned light metal engagement filler is coated on the joint of two light metal parts to be joined by metal bonding method of the present invention；The hot pressing two light metal part to be joined so that silver powder sintering is attached to the surface of the light metal powder and the two light metal part to be joined, and completes the engagement of two metalwork to be joined after silver powder condensation.The light metal joint method that light metal engagement filler provided by the invention carries out, can carry out metal bonding in the environment of general atmosphere pressure with low-temperature heat, and reduce the filler cost of low temperature engagement simultaneously.
Description
Technical field
The present invention relates to a kind of metal bonding method and its engagement fillers, especially with regard to a kind of light gold of low temperature engagement
Belong to joint method and its engagement filler.
Background technique
The engagement filler of light metal at present can be divided into hard solder filler and nano silver paste by taking aluminium alloy as an example.
Hard solder filler must carry out metal under vacuum condition or protective atmosphere with the junction temperature between 580 DEG C -600 DEG C
Engagement, wlding is (0.5~1.5NTD/g) at low cost, however its junction temperature is high, and jointing metal part is easily caused to deform, and increases postwelding on foot
The cost of shaping, and the fairly close base material fusing point of junction temperature, processing procedure precision require high.
Though and the junction temperature of nano silver paste can carry out in 300 DEG C of atmospheric pressure environments below, however nano silver paste
(> 100NTD/g) with high costs, become using upper limitation.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of light metal engagements that reduces cost again and can carry out low temperature engagement
Method and its engagement filler.
In order to reach above-mentioned purpose, the present invention provides a kind of light metals to engage filler, is uniformly mixed by a solvent
Light metal powder is formed with silver powder；
Wherein, the powder diameter of the light metal powder is micron order, and the powder diameter of the silver powder is nanoscale or secondary micro-
Meter level；The density of those light metal powder is lower than 5g/cm3。
Further, wherein the partial size of the silver powder is between 10~500nm.
Further, the partial size of the light metal powder is between 5~500 μm.
Further, the weight percent of the silver powder and light metal powder is respectively as follows: 2~50wt% of silver powder, gently
50~98wt% of metal powder.
Further, the light metal powder is aluminium powder.
Further, the partial size of the aluminium powder is between 5~500 μm.
Further, the weight percent of the silver powder and aluminium powder is respectively as follows: 2~50wt% of silver powder, aluminium powder
50~98wt%.
The present invention discloses a kind of metal bonding methods, comprising:
Any light metal engagement filler as described above is coated on to the joint of two light metal parts to be joined；Hot pressing this two
Light metal part to be joined, so that silver powder sintering is attached to the surface of the light metal powder and the two light metal part to be joined,
And the engagement of two metalwork to be joined is completed after silver powder condensation.
Further, the heating method that the low-temperature heat is 200 DEG C~400 DEG C.
Further, the hot pressing is to apply 2~10MPa's to those metals to be joined under vacuum or atmospheric pressure
Activating pressure.
The invention has the following advantages:
It can be in the environment of general atmosphere pressure with low temperature via metal bonding method of the present invention and its engagement filler
Heating carries out metal bonding, and jointing metal part is avoided to meet the metalwork deformation situation that high temperature engagement can occur；Composition is utilized simultaneously
The filler cost of low temperature engagement is effectively reduced in the control of ratio.
Detailed description of the invention
Fig. 1 is the ingredient schematic diagram of metal bonding filler of the present invention；
Fig. 2A is one of the application schematic diagram of metal bonding filler of the present invention；
Fig. 2 B is the two of the application schematic diagram of metal bonding filler of the present invention；
Fig. 3 is the process step figure of metal bonding method of the present invention.
Wherein,
1- metal bonding filler；A1- silver powder；A2- light metal powder；The first metalwork of 2A-；The second metalwork of 2B-；B-
Solvent；H- heating；P- pressurization；S1- metal bonding method；S11~12- step.
Specific embodiment
The following example will be further illustrated the embodiments such as other features and advantages of the present invention, but this it is merely illustrative and
With not limitation of the present invention.
The main problem of the invention to be solved, is the hard solder filler and nanometer that the engagement filler of current light metal uses
The metalwork problem on deformation and problem with high costs that silver paste has high temperature to engage respectively；And the present invention provides one kind and can drop
Low cost can carry out the metal bonding filler of low temperature engagement again.
To solve the above-mentioned problems, the present invention provides a kind of metal bonding filler 1, applied to the engagement between metalwork,
As shown in Figure 1, it includes silver powder A1, light metal powders A 2 and solvent B that its ingredient, which includes: its ingredient, solvent B is uniformly mixed
Close light metal powders A 2 and silver powder A1, wherein the particle size of the silver particles of silver powder A1 is nanoscale or sub-micron grade,
The particle size of the light metal particle of the light metal powders A 2 is micron order, and the density of those light metal powder is lower than 5g/
cm3。
In one embodiment, the partial size of the silver powder A1 is between 10~500nm.
In one embodiment, the partial size of the light metal powders A 2 is between 5~500 μm.
In one embodiment, the weight percent of the silver powder A1 and light metal powders A 2 be respectively as follows: silver powder 2~
50wt%, 50~98wt% of light metal powder.
In one embodiment, the light metal powders A 2 is aluminium powder.
In the above-described embodiment, the partial size of the aluminium powder is between 5~500 μm.
In the above-described embodiment, the weight percent of the silver powder A1 and aluminium powder be respectively as follows: silver powder 2~
50wt%, 50~98wt% of aluminium powder.
Also that is, the present invention provides a kind of metal bonding filler 1 of low operating temperature, wherein the metal bonding filler 1 is by silver
Powders A 1, light metal powders A 2 (such as aluminium powder) are constituted with solvent B, and wherein the partial size of silver powder A1 is between 10nm to 500nm
Between, ratio is between 2wt%~50wt%；The partial size of light metal powders A 2 between 5 μm~500 μm, ratio between
Between 50wt%~98wt%.Wherein, solvent B can be alcohols, the especially more carbon number compounds of such as terpinol, make silver powder
Last A1 and light metal powders A 2 can full and uniform mixing.
Continuous to please refer to Fig. 2A and Fig. 2 B, Fig. 2A is one of the application schematic diagram of metal bonding filler of the present invention, Fig. 2 B
It is the two of the application schematic diagram of metal bonding filler of the present invention, as shown, the present invention is suitable for the non-structural of light metal
The metal bonding of part, such as the first metalwork 2A (if figure is aluminium alloy radiating bottom plate) and the second metalwork 2B are carried out (as figure is
Aluminium alloy radiating fin) between engagement.
When application metal bonding filler 1 of the present invention carries out metalwork engagement, first as shown in Figure 2 A, in the first gold medal
Belong to part 2A (aluminium alloy radiating bottom plate) to connect with the second metalwork 2B (aluminium alloy radiating fin) joint coating metal to be engaged
Filler 1 is closed, is next then that one low-temperature heat H is provided and pressurizes P's when engaging the first metalwork 2A and the second metalwork 2B
Environment.
In this embodiment, 200 DEG C~400 DEG C of low-temperature heat is carried out, and imposes the pressure of 2~10MPa.
Also that is, the metal bonding that the metal bonding filler 1 provided through the invention carries out, passes through heating H, pressurization P program
Two metalworks (the first metalwork 2A, the second metalwork 2B) to be joined are subjected to hot-pressing processing, to molten in metal bonding filler 1
Agent B vaporization, makes the nanometer or secondary micro-silver powder end A1 reach fusing point and form melt surface, so with light metal powders A 2 and to
Jointing metal part (the first metalwork 2A, the second metalwork 2B) generation is sticked together, and light metal powders A 2 still keeps solid state, and
The emptying aperture prevented between metal powder；Silver metal solidifies and engages two metalworks to be joined after cooling, can make two engagement gold
Belong to part and form good metal bonding, and there is the performance of good shear strength.Experimental data is as shown in following table 1:
Table 1
Also that is, the present invention discloses a kind of metal bonding method S1, as shown in Figure 3, comprising:
Step S11: light metal engagement filler is coated on to the joint of two light metal parts to be joined；And
Step S12: the hot pressing two light metal part to be joined, so that silver powder sintering is attached to the light metal powder and should
The surface of two light metal parts to be joined, and the engagement of two metalwork to be joined is completed after silver powder condensation.
Compared with hard solder connection process, the present invention can be operated the present invention with lower junction temperature, hard compared with light metal
Temperature needed for weldering is low, by taking aluminium alloy engages as an example, junction temperature of the invention (200~400 DEG C) more traditional aluminium alloy hard solder
Process temperatures (> 580 DEG C) are low, save processing procedure cost and postwelding workpiece shaping cost, and junction temperature is lower than 200 DEG C of base material fusing point
More than, it is also not required to operate under vacuum environment, processing procedure precision requires lower, equipment investment cost decline；And the present invention with receive
Rice silver paste connection process is compared, and due to being mixed with aluminum metal powder, required material cost (about 5NTD/g) is far below full nanometer
The cost (> 100NTD/g) of silver metal cream.
In conclusion metal bonding method disclosed in this invention and its engagement filler can be in the environment of general atmosphere pressure
In with low-temperature heat carry out metal bonding, avoid jointing metal part meet high temperature engagement can occur metalwork deformation situation；Simultaneously
The filler cost of low temperature engagement is effectively reduced using the control of component ratio.
In conclusion the foregoing is merely presently preferred embodiments of the present invention, not thereby limits patent of the invention and protect
Shield range, therefore description of the invention and the made equivalence changes of attached drawing etc. such as, should all be included in protection scope of the present invention.
Claims (10)
1. a kind of light metal engages filler, light metal powder and silver powder are uniformly mixed by a solvent and is formed；
It is characterized in that, the powder diameter of the light metal powder is micron order, the powder diameter of the silver powder is nanoscale or secondary
Micron order.
2. light metal as described in claim 1 engages filler, which is characterized in that the partial size of the silver powder between 10~
500nm。
3. light metal as described in claim 1 engages filler, which is characterized in that the partial size of the light metal powder between 5~
500μm。
4. light metal as described in claim 1 engages filler, which is characterized in that the weight of the silver powder and light metal powder
Percentage is respectively as follows: 2~50wt% of silver powder, 50~98wt% of light metal powder.
5. light metal as described in claim 1 engages filler, which is characterized in that the light metal powder is aluminium powder.
6. light metal as claimed in claim 5 engages filler, which is characterized in that the partial size of the aluminium powder is between 5~500 μ
m。
7. light metal as claimed in claim 6 engages filler, which is characterized in that the weight percent of the silver powder and aluminium powder
Than being respectively as follows: 2~50wt% of silver powder, 50~98wt% of aluminium powder.
8. a kind of light metal joint method characterized by comprising
Any light metal engagement filler as described in claim 1 to 7 is coated on to the joint of two light metal parts to be joined；
Hot pressing two light metal part to be joined, so that silver powder sintering is attached to the light metal powder and the two light gold to be joined
Belong to the surface of part, and completes the engagement of two metalwork to be joined after silver powder condensation.
9. light metal joint method as claimed in claim 8, which is characterized in that the low-temperature heat is 200 DEG C~400 DEG C
Heating method.
10. light metal joint method as claimed in claim 8, which is characterized in that the hot pressing is in vacuum or atmospheric pressure
Under, those metals to be joined are applied with the activating pressure of 2~10MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711205315.XA CN109834406B (en) | 2017-11-27 | 2017-11-27 | Light metal joining method and joining filler therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711205315.XA CN109834406B (en) | 2017-11-27 | 2017-11-27 | Light metal joining method and joining filler therefor |
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| Publication Number | Publication Date |
|---|---|
| CN109834406A true CN109834406A (en) | 2019-06-04 |
| CN109834406B CN109834406B (en) | 2022-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711205315.XA Active CN109834406B (en) | 2017-11-27 | 2017-11-27 | Light metal joining method and joining filler therefor |
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Citations (8)
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|---|---|---|---|---|
| JP2007319896A (en) * | 2006-05-31 | 2007-12-13 | Honda Motor Co Ltd | Method for joining aluminum-based members |
| JP2010234401A (en) * | 2009-03-31 | 2010-10-21 | Dowa Metaltech Kk | Brazing filler metal, method for joining brazing filler metal, and substrate joined with brazing filler metal |
| JP2011240406A (en) * | 2010-03-15 | 2011-12-01 | Dowa Electronics Materials Co Ltd | Bonding material and bonding method using the same |
| CN103406685A (en) * | 2011-11-02 | 2013-11-27 | 兰州大学 | One-dimensional tin and silver binary nanometer welding flux for micrometer/nanometer welding |
| CN103639614A (en) * | 2013-12-04 | 2014-03-19 | 马鑫 | Nanoscale/micron size particle mixing type lead-free solder paste with size effect and manufacturing method thereof |
| WO2016038965A1 (en) * | 2014-09-10 | 2016-03-17 | 富士電機株式会社 | Metal material and electronic component in which same is used |
| CN107175433A (en) * | 2017-04-19 | 2017-09-19 | 天津大学 | A kind of preparation method of low sintering tin dope nano mattisolda |
| CN107350663A (en) * | 2017-08-30 | 2017-11-17 | 桂林电子科技大学 | Liquid metal enhancing base nano mattisolda thermal interfacial material and preparation method thereof |
-
2017
- 2017-11-27 CN CN201711205315.XA patent/CN109834406B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007319896A (en) * | 2006-05-31 | 2007-12-13 | Honda Motor Co Ltd | Method for joining aluminum-based members |
| JP2010234401A (en) * | 2009-03-31 | 2010-10-21 | Dowa Metaltech Kk | Brazing filler metal, method for joining brazing filler metal, and substrate joined with brazing filler metal |
| JP2011240406A (en) * | 2010-03-15 | 2011-12-01 | Dowa Electronics Materials Co Ltd | Bonding material and bonding method using the same |
| CN103406685A (en) * | 2011-11-02 | 2013-11-27 | 兰州大学 | One-dimensional tin and silver binary nanometer welding flux for micrometer/nanometer welding |
| CN103639614A (en) * | 2013-12-04 | 2014-03-19 | 马鑫 | Nanoscale/micron size particle mixing type lead-free solder paste with size effect and manufacturing method thereof |
| WO2016038965A1 (en) * | 2014-09-10 | 2016-03-17 | 富士電機株式会社 | Metal material and electronic component in which same is used |
| CN107175433A (en) * | 2017-04-19 | 2017-09-19 | 天津大学 | A kind of preparation method of low sintering tin dope nano mattisolda |
| CN107350663A (en) * | 2017-08-30 | 2017-11-17 | 桂林电子科技大学 | Liquid metal enhancing base nano mattisolda thermal interfacial material and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN109834406B (en) | 2022-01-18 |
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