CN109834406B - Light metal joining method and joining filler therefor - Google Patents
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 123
- 239000002184 metal Substances 0.000 title claims abstract description 123
- 239000000945 filler Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000005304 joining Methods 0.000 title claims abstract description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000000843 powder Substances 0.000 claims abstract description 39
- 239000002245 particle Substances 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 238000007731 hot pressing Methods 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000005219 brazing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 239000010953 base metal Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum alloys Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
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Abstract
本发明涉及一种轻金属接合填料，其由一溶剂均匀混合轻金属粉末与银粉末而形成；其中，该轻金属粉末的粉末粒径为微米级，该银粉末的粉末粒径为纳米级或次微米级；本发明所述金属接合方法将上述的轻金属接合填料涂布于二待接合轻金属件的接合处；热压该二待接合轻金属件，使得该银粉末烧结黏着于该轻金属粉末及该二待接合轻金属件的表面，并于该银粉末冷凝后完成该二待接合金属件的接合。本发明提供的轻金属接合填料进行的轻金属接合方法，可在一般大气压力的环境中以低温加热进行金属接合，并同时降低低温接合的填料成本。
The invention relates to a light metal joint filler, which is formed by uniformly mixing light metal powder and silver powder with a solvent; wherein, the powder particle size of the light metal powder is micron, and the powder particle size of the silver powder is nano or submicron. The metal bonding method of the present invention applies the above-mentioned light metal bonding filler to the junction of the two light metal pieces to be joined; hot pressing the two light metal pieces to be joined, so that the silver powder is sintered and adhered to the light metal powder and the two light metal pieces to be joined the surface of the light metal parts, and after the silver powder is condensed, the joining of the two metal parts to be joined is completed. The light metal joining method by the light metal joining filler provided by the present invention can perform metal joining by heating at a low temperature in an environment of general atmospheric pressure, and at the same time reduce the cost of the filler for low temperature joining.
Description
技术领域technical field
本发明是关于一种金属接合方法及其接合填料，特别是关于一种低温接合的轻金属接合方法及其接合填料。The present invention relates to a metal bonding method and a bonding filler, in particular to a low-temperature bonding light metal bonding method and a bonding filler.
背景技术Background technique
目前轻金属的接合填料，以铝合金为例，可分为硬焊填料与纳米银膏。At present, the bonding fillers of light metals, such as aluminum alloys, can be divided into brazing fillers and nano-silver pastes.
硬焊填料须在真空条件或保护气氛下以介于580℃-600℃间的接合温度进行金属接合，焊材成本低(0.5～1.5NTD/g)，然而其接合温度高，易造成接合金属件变形，徒增焊后整形的成本，且接合温度相当接近母材熔点，制程精准度要求高。Brazing fillers must be metal-bonded at a bonding temperature between 580°C and 600°C under vacuum conditions or in a protective atmosphere. The cost of the welding material is low (0.5-1.5NTD/g). Parts are deformed, which only increases the cost of post-welding shaping, and the bonding temperature is quite close to the melting point of the base metal, so the process accuracy is required.
而纳米银膏的接合温度虽可在300℃以下的大气压力环境中进行，然而纳米银膏的成本高昂(>100NTD/g)，成为使用上的限制。Although the bonding temperature of nano-silver paste can be performed in an atmospheric pressure environment below 300°C, the cost of nano-silver paste is high (>100NTD/g), which is a limitation in use.
发明内容SUMMARY OF THE INVENTION
有鉴于此，本发明的目的在于提供一种降低成本又可进行低温接合的轻金属接合方法及其接合填料。In view of this, an object of the present invention is to provide a light metal bonding method and a bonding filler thereof that can reduce cost and enable low-temperature bonding.
为了达成上述的目的，本发明提供了一种轻金属接合填料，其由一溶剂均匀混合轻金属粉末与银粉末而形成；In order to achieve the above object, the present invention provides a light metal joint filler, which is formed by uniformly mixing light metal powder and silver powder with a solvent;
其中，该轻金属粉末的粉末粒径为微米级，该银粉末的粉末粒径为纳米级或次微米级；该些轻金属粉末的密度低于5g/cm3。Wherein, the powder particle size of the light metal powder is micron, and the powder particle size of the silver powder is nano or submicron; the density of these light metal powders is lower than 5 g/cm 3 .
进一步地，其中所述银粉末的粒径介于10～500nm。Further, the particle size of the silver powder is between 10 and 500 nm.
进一步地，所述轻金属粉末的粒径介于5～500μm。Further, the particle size of the light metal powder ranges from 5 to 500 μm.
进一步地，所述银粉末与轻金属粉末的重量百分比分别为：银粉末2～50wt％，轻金属粉末50～98wt％。Further, the weight percentages of the silver powder and the light metal powder are respectively: 2-50 wt % of the silver powder and 50-98 wt % of the light metal powder.
进一步地，所述轻金属粉末为铝粉末。Further, the light metal powder is aluminum powder.
进一步地，所述铝粉末的粒径介于5～500μm。Further, the particle size of the aluminum powder ranges from 5 to 500 μm.
进一步地，所述银粉末与铝粉末的重量百分比分别为：银粉末2～50wt％，铝粉末50～98wt％。Further, the weight percentages of the silver powder and the aluminum powder are respectively: 2-50 wt % of the silver powder and 50-98 wt % of the aluminum powder.
本发明同时公开了一种金属接合方法，包括：The invention also discloses a metal joining method, comprising:
将如上所述的任一轻金属接合填料涂布于二待接合轻金属件的接合处；热压该二待接合轻金属件，使得该银粉末烧结黏着于该轻金属粉末及该二待接合轻金属件的表面，并于该银粉末冷凝后完成该二待接合金属件的接合。Coating any of the above-mentioned light metal bonding fillers on the junction of the two light metal pieces to be joined; hot pressing the two light metal pieces to be joined, so that the silver powder is sintered and adhered to the light metal powder and the surfaces of the two light metal pieces to be joined , and the joining of the two metal parts to be joined is completed after the silver powder is condensed.
进一步地，所述低温加热为200℃～400℃的加热方式。Further, the low-temperature heating is a heating method of 200°C to 400°C.
进一步地，所述热压为在真空或大气压力下，对该些待接合金属施加2～10MPa的接合压力。Further, in the hot pressing, a joining pressure of 2-10 MPa is applied to the metals to be joined under vacuum or atmospheric pressure.
本发明具有以下有益效果：The present invention has the following beneficial effects:
经由本发明所述金属接合方法及其接合填料可在一般大气压力的环境中以低温加热进行金属接合，避免接合金属件遇高温接合会发生的金属件变形情形；同时利用成份比例的控制有效降低低温接合的填料成本。Through the metal bonding method and the bonding filler of the present invention, the metal bonding can be carried out by heating at a low temperature in the environment of general atmospheric pressure, so as to avoid the deformation of the metal parts that will occur when the metal parts are bonded at high temperature; at the same time, the control of the composition ratio is used to effectively reduce Filler cost for low temperature bonding.
附图说明Description of drawings
图1为本发明所述金属接合填料的成分示意图；FIG. 1 is a schematic diagram of the composition of the metal bonding filler according to the present invention;
图2A为本发明所述金属接合填料的应用示意图之一；2A is one of the schematic diagrams of the application of the metal bonding filler according to the present invention;
图2B为本发明所述金属接合填料的应用示意图之二；2B is the second schematic diagram of the application of the metal bonding filler according to the present invention;
图3为本发明所述金属接合方法的流程步骤图。FIG. 3 is a flow chart of the metal bonding method according to the present invention.
其中，in,
1-金属接合填料；A1-银粉末；A2-轻金属粉末；2A-第一金属件；2B-第二金属件；B-溶剂；H-加热；P-加压；S1-金属接合方法；S11～12-步骤。1-metal bonding filler; A1-silver powder; A2-light metal powder; 2A-first metal piece; 2B-second metal piece; B-solvent; H-heating; P-pressurization; S1-metal bonding method; S11 ~12-step.
具体实施方式Detailed ways
下列实施例将进一步说明本发明的其它特征和优点，但该等实施例仅为示例而用，并非对本发明的限制。The following examples will further illustrate other features and advantages of the present invention, but these examples are provided by way of example only, and are not intended to limit the present invention.
本发明所欲解决的主要问题，在于目前轻金属的接合填料使用的硬焊填料与纳米银膏分别有高温接合的金属件变形问题以及成本高昂的问题；而本发明即提供了一种可降低成本又可进行低温接合的金属接合填料。The main problem to be solved by the present invention is that the brazing filler and the nano-silver paste used in the current light metal bonding filler have the problem of high temperature bonding of metal parts and high cost respectively; and the present invention provides a cost-reducing solution. Metal bonding fillers that can also perform low-temperature bonding.
为了解决上述问题，本发明提供了一种金属接合填料1，应用于金属件间的接合，如图1所示，其成分包括：其成分包括银粉末A1、轻金属粉末A2，以及溶剂B，该溶剂B均匀混合轻金属粉末A2与银粉末A1，其中，该银粉末A1的银粒子的粒径尺寸为纳米级或次微米级，该轻金属粉末A2的轻金属粒子的粒径尺寸为微米级，并且该些轻金属粉末的密度低于5g/cm3。In order to solve the above problems, the present invention provides a metal bonding filler 1, which is applied to the bonding between metal parts. As shown in FIG. 1, the composition includes: the composition includes silver powder A1, light metal powder A2, and solvent B. The solvent B uniformly mixes the light metal powder A2 and the silver powder A1, wherein the particle size of the silver particles of the silver powder A1 is nanoscale or submicron, the particle size of the light metal particles of the light metal powder A2 is micron, and the Some light metal powders have a density below 5 g/cm 3 .
在一实施例中，所述银粉末A1的粒径介于10～500nm。In one embodiment, the particle size of the silver powder A1 ranges from 10 to 500 nm.
在一实施例中，所述轻金属粉末A2的粒径介于5～500μm。In one embodiment, the particle size of the light metal powder A2 ranges from 5 to 500 μm.
在一实施例中，所述银粉末A1与轻金属粉末A2的重量百分比分别为：银粉末2～50wt％，轻金属粉末50～98wt％。In one embodiment, the weight percentages of the silver powder A1 and the light metal powder A2 are respectively 2-50 wt % of the silver powder and 50-98 wt % of the light metal powder.
在一实施例中，所述轻金属粉末A2为铝粉末。In one embodiment, the light metal powder A2 is aluminum powder.
在上述的实施例中，所述铝粉末的粒径介于5～500μm。In the above embodiment, the particle size of the aluminum powder is between 5 and 500 μm.
在上述的实施例中，所述银粉末A1与铝粉末的重量百分比分别为：银粉末2～50wt％，铝粉末50～98wt％。In the above embodiment, the weight percentages of the silver powder A1 and the aluminum powder are respectively: 2-50 wt % of the silver powder and 50-98 wt % of the aluminum powder.
亦即，本发明提供一种低操作温度的金属接合填料1，其中该金属接合填料1由银粉末A1、轻金属粉末A2(例如铝粉)与溶剂B所构成，其中银粉末A1的粒径介于10nm至500nm之间，比例介于2wt％～50wt％之间；轻金属粉末A2的粒径介于5μm～500μm之间，比例介于50wt％～98wt％之间。其中，该溶剂B可以为醇类，特别是如松油醇等多碳数化合物，使银粉末A1及轻金属粉末A2能充分均匀混合。That is, the present invention provides a low operating temperature metal bonding filler 1, wherein the metal bonding filler 1 is composed of silver powder A1, light metal powder A2 (such as aluminum powder) and solvent B, wherein the particle size of silver powder A1 is between Between 10nm and 500nm, the proportion is between 2wt% and 50wt%; the particle size of the light metal powder A2 is between 5μm and 500μm, and the proportion is between 50wt% and 98wt%. Wherein, the solvent B can be alcohols, especially compounds with multiple carbon numbers such as terpineol, so that the silver powder A1 and the light metal powder A2 can be sufficiently and uniformly mixed.
续请参阅图2A及图2B，图2A为本发明所述金属接合填料的应用示意图之一，图2B为本发明所述金属接合填料的应用示意图之二，如图所示，本发明适用于轻金属的非结构件的金属接合，例如进行第一金属件2A(如图为铝合金散热底板)及第二金属件2B(如图为铝合金散热鳍片)间的接合。Please refer to FIGS. 2A and 2B. FIG. 2A is a schematic diagram of one application of the metal bonding filler of the present invention, and FIG. 2B is a schematic diagram of the second application of the metal bonding filler of the present invention. As shown in the figures, the present invention is suitable for For metal bonding of light metal non-structural components, for example, a
在应用本发明所述的金属接合填料1进行金属件接合时，先如图2A所示，于第一金属件2A(铝合金散热底板)与第二金属件2B(铝合金散热鳍片)欲接合的接合处涂布金属接合填料1，接下来则是在接合第一金属件2A与第二金属件2B时，提供一低温加热H与加压P的环境。When using the metal bonding filler 1 of the present invention to join metal parts, as shown in FIG. 2A , firstly, as shown in FIG. The metal joint filler 1 is coated on the joint to be joined, and then an environment of low temperature heating H and pressure P is provided when the
在此一实施例中，进行200℃～400℃的低温加热，并施以2～10MPa的压力。In this embodiment, low temperature heating is performed at 200° C. to 400° C. and a pressure of 2 to 10 MPa is applied.
亦即，通过本发明提供的金属接合填料1进行的金属接合，通过加热H、加压P程序将两待接合金属件(第一金属件2A、第二金属件2B)进行热压处理，待金属接合填料1中的溶剂B汽化，使该纳米或次微米银粉末A1到达熔点而形成表面熔融，进而与轻金属粉末A2及待接合金属件(第一金属件2A、第二金属件2B)产生黏着，而轻金属粉末A2仍保持固体状态，并消弭金属粉末间的空孔；冷却之后银金属凝固并接合两待接合金属件，即可使两个接合金属件形成良好的金属结合，并具有良好的剪切强度表现。实验数据如下列表1所示：That is, in the metal bonding performed by the metal bonding filler 1 provided by the present invention, the two metal pieces to be joined (the
表1Table 1
亦即，本发明同时公开了一种金属接合方法S1，如图3所示，包括：That is, the present invention also discloses a metal bonding method S1, as shown in FIG. 3, including:
步骤S11：将轻金属接合填料涂布于二待接合轻金属件的接合处；以及Step S11: coating the light metal joint filler on the joint of the two light metal pieces to be joined; and
步骤S12：热压该二待接合轻金属件，使得该银粉末烧结黏着于该轻金属粉末及该二待接合轻金属件的表面，并于该银粉末冷凝后完成该二待接合金属件的接合。Step S12 : hot pressing the two light metal pieces to be joined, so that the silver powder is sintered and adhered to the light metal powder and the surfaces of the two light metal pieces to be joined, and the joining of the two light metal pieces to be joined is completed after the silver powder is condensed.
本发明与硬焊接合制程相比较，本发明可以用较低的接合温度操作，较轻金属硬焊所需的温度低，以铝合金接合为例，本发明的接合温度(200～400℃)较传统铝合金硬焊制程温度(>580℃)低，节省制程成本与焊后工件整形成本，且接合温度低于母材熔点200℃以上，也不需于真空环境下操作，制程精准度要求较低，设备投资成本下降；而本发明与纳米银膏接合制程相比，由于掺入了铝金属粉末，所需的材料成本(约5NTD/g)远低于全纳米银金属膏的成本(>100NTD/g)。Compared with the brazing process of the present invention, the present invention can be operated at a lower joining temperature, and the temperature required for brazing of lighter metals is lower. The traditional aluminum alloy brazing process temperature (>580°C) is low, which saves the cost of the process and the cost of post-welding workpiece shaping, and the bonding temperature is 200°C lower than the melting point of the base metal. It does not need to be operated in a vacuum environment, and the process accuracy is required. Compared with the nano-silver paste bonding process, the material cost (about 5NTD/g) required by the present invention is much lower than that of the full nano-silver metal paste (> 100NTD/g).
综上所述，本发明所公开的金属接合方法及其接合填料可在一般大气压力的环境中以低温加热进行金属接合，避免接合金属件遇高温接合会发生的金属件变形情形；同时利用成份比例的控制有效降低低温接合的填料成本。To sum up, the metal bonding method and the bonding filler disclosed in the present invention can perform metal bonding by heating at a low temperature in an environment of general atmospheric pressure, so as to avoid the deformation of the metal parts that will occur when the metal parts are bonded at high temperatures; The control of the ratio effectively reduces the cost of fillers for low temperature bonding.
综上所述，以上所述仅为本发明的较佳实施例，并非因此而限制本发明的专利保护范围，故举凡本发明说明书及附图所作等效变化等，皆应包括于本发明的保护范围内。To sum up, the above are only preferred embodiments of the present invention, and are not intended to limit the scope of patent protection of the present invention. Therefore, any equivalent changes made in the description and drawings of the present invention shall be included in the scope of the present invention. within the scope of protection.
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