CN109825811A - A kind of semiconductor chilling plate target cooling device - Google Patents
A kind of semiconductor chilling plate target cooling device Download PDFInfo
- Publication number
- CN109825811A CN109825811A CN201910272241.4A CN201910272241A CN109825811A CN 109825811 A CN109825811 A CN 109825811A CN 201910272241 A CN201910272241 A CN 201910272241A CN 109825811 A CN109825811 A CN 109825811A
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- China
- Prior art keywords
- semiconductor chilling
- target
- chilling plate
- water
- cooled copper
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000001816 cooling Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 238000009434 installation Methods 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 description 9
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of semiconductor chilling plate target cooling devices, it is characterized in that, including metal fixed station, metal fixed station center is equipped with installation space, water-cooled copper plate, semiconductor chilling plate and target are equipped in the installation space, the water-cooled copper plate, semiconductor chilling plate and target, which are sequentially overlapped, to be arranged in installation space, the semiconductor chilling plate includes chill surface and heat delivery surface, the chill surface of the semiconductor chilling plate is bonded setting with target, and the semiconductor chilling plate heat delivery surface is bonded setting with water-cooled copper plate；Beneficial effects of the present invention: it is ingenious in design, it is structurally reasonable, it is easy to use.
Description
Technical field
The invention belongs to sputter coating fields, and in particular to a kind of semiconductor chilling plate target cooling device.
Background technique
Sputtering is one kind of physical vapour deposition (PVD) (Physical Vapor Deposition, PVD).General sputtering method
It can be used for preparing more materials such as metal, semiconductor, insulator, and with equipment is simple, easily controllable, plated film area is big and attached
Put forth effort the advantages that strong, and the sputtering method that the 70's of last century grow up is even more to realize high speed, low temperature, low damage.Because
It is to carry out high-speed sputtering at low pressure, it is necessary to effectively improve the ionization level of gas.Sputtering in target cathode surface by introducing
Plasma density is improved to the constraint of charged particle using magnetic field to increase sputtering raste in magnetic field.
Currently, the mode that the target of sputtering mostly uses water cooling, but since the freezing point temperature of water is higher, can not achieve more
Low temperature cooling effect below, and the temperature of cooling water is not easily controlled, and this leads to the temperature of the target directly affected
Quality of forming film is not high.The present invention provides a kind of sputtering semiconductor chilling plate target refrigeration platform, can come at lower temperatures
So that target is cooled down, the temperature of target is made to keep stablizing.
Summary of the invention
For the above-mentioned problems in the prior art, the purpose of the present invention is to provide a kind of semiconductor chilling plate targets
Cooling device, to realize the temperature for rapidly, accurately controlling target.
The invention adopts the following technical scheme:
A kind of semiconductor chilling plate target cooling device, which is characterized in that including metal fixed station, metal fixed station center
Equipped with installation space, water-cooled copper plate, semiconductor chilling plate and target are equipped in the installation space, the water-cooled copper plate is partly led
Body cooling piece and target, which are sequentially overlapped, to be arranged in installation space, and the semiconductor chilling plate includes chill surface and heat delivery surface, institute
It states the chill surface of semiconductor chilling plate and target is bonded setting, the semiconductor chilling plate heat delivery surface is bonded with water-cooled copper plate to be set
It sets.
A kind of semiconductor chilling plate target cooling device, which is characterized in that in being equipped with inside the water-cooled copper plate
Cavity body, the water-cooled copper plate bottom are equipped with water inlet, the water outlet being connected respectively with hollow cavity.
A kind of semiconductor chilling plate target cooling device, which is characterized in that the metal fixed station uses cylinder
Body structure, the installation space are annular groove, and the water-cooled copper plate, semiconductor chilling plate and target are circular configuration, institute
Water-cooled copper plate, semiconductor chilling plate and target is stated to be equipped in annular groove.
A kind of semiconductor chilling plate target cooling device, which is characterized in that metal fixed station top edge
Position is in the clamp clips of 120 ° of distributions there are three setting, and will be pressed abd fixed on metal fixed station at the top of target by clamp clip.
Beneficial effects of the present invention: it is ingenious in design, it is structurally reasonable, it is easy to use；Using the cooling target of the present apparatus, substantially subtract
Few cooling time, cooling efficiency is improved, ensure that the stability and exact controllability of target temperature, the research of film is led
Domain has great importance.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is water-cooled copper plate schematic diagram of internal structure of the invention；
In figure: 1- fastening nut, 2- clamp clip, 3- target, 4- semiconductor chilling plate, 5- water-cooled copper plate, 6- metal fixed station.
Specific embodiment
Technical solution of the present invention is further described below in conjunction with Figure of description:
As shown in Figs. 1-2, a kind of semiconductor chilling plate target cooling device, including fastening nut 1, clamp clip 2, target 3, partly lead
Body cooling piece 4, water-cooled copper plate 5 and metal fixed station 6.
Semiconductor chilling plate target cooling device, including metal fixed station 6,6 center of metal fixed station are equipped with installation space,
Be equipped with water-cooled copper plate 5, semiconductor chilling plate 4 and target 3 in installation space, water-cooled copper plate 5, semiconductor chilling plate 4 and target 3 according to
It is secondary to be superposed in installation space, 6 top edge position of metal fixed station set there are three in 120 ° distribution clamp clips 2, and
It will be pressed abd fixed on metal fixed station 6 at the top of target 3 by clamp clip 2；Semiconductor chilling plate 4 includes chill surface and heat release
Face, the chill surface of the semiconductor chilling plate 4 are bonded setting with target 3, and 4 heat delivery surface of semiconductor chilling plate and water-cooled copper plate 5 paste
Close setting, be equipped with hollow cavity 501 inside water-cooled copper plate 5,5 bottom of water-cooled copper plate be equipped be connected respectively with hollow cavity into
The mouth of a river 502, water outlet 503.
Wherein metal fixed station 6 uses cylindrical structure, and installation space is annular groove, water-cooled copper plate 5, semiconductor refrigerating
Piece 4 and target 3 are circular configuration, and water-cooled copper plate 5, semiconductor chilling plate 4 and target 3 are equipped in annular groove.
The course of work:
Target 3, semiconductor chilling plate 4 and water-cooled copper plate 5 are sequentially fixed on metal fixed station 6 first, then use clamp clip 2
Target 3 is fixed.Then, cooling water and cooling piece switch are opened, water-cooled copper plate 5 and semiconductor chilling plate 4 start work at this time
Make.Then, it opens Sputting film-plating apparatus and carries out plated film, the temperature of target 3 increases at this time, and the thermal temperature of target will be by partly leading
Body cooling piece 4, is transmitted to heat above semiconductor chilling plate 4 lower section, and last heat is water cooled the cooling flowed in copper sheet 5
Water is taken away.
Claims (4)
1. a kind of semiconductor chilling plate target cooling device, which is characterized in that including metal fixed station (6), the metal is fixed
Platform (6) center is equipped with installation space, is equipped with water-cooled copper plate (5), semiconductor chilling plate (4) and target (3) in the installation space,
The water-cooled copper plate (5), semiconductor chilling plate (4) and target (3), which are sequentially overlapped, to be arranged in installation space, the semiconductor system
Cold (4) include chill surface and heat delivery surface, and the chill surface of the semiconductor chilling plate (4) is bonded setting with target (3), and described half
Conductor cooling piece (4) heat delivery surface is bonded setting with water-cooled copper plate (5).
2. a kind of semiconductor chilling plate target cooling device according to claim 1, which is characterized in that the water-cooled copper plate
(5) internal to be equipped with hollow cavity (501), water-cooled copper plate (5) bottom is equipped with the water inlet being connected respectively with hollow cavity
(502), water outlet (503).
3. a kind of semiconductor chilling plate target cooling device according to claim 1, which is characterized in that the metal is fixed
Platform (6) use cylindrical structure, the installation space be annular groove, the water-cooled copper plate (5), semiconductor chilling plate (4) and
Target (3) is circular configuration, and the water-cooled copper plate (5), semiconductor chilling plate (4) and target (3) are equipped in annular
In groove.
4. a kind of semiconductor chilling plate target cooling device according to claim 1, which is characterized in that the metal is fixed
Platform (6) top edge position is in the clamp clips (2) of 120 ° of distributions there are three setting, and passes through clamp clip (2) for pressure at the top of target (3)
It fastens on metal fixed station (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910272241.4A CN109825811A (en) | 2019-04-04 | 2019-04-04 | A kind of semiconductor chilling plate target cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910272241.4A CN109825811A (en) | 2019-04-04 | 2019-04-04 | A kind of semiconductor chilling plate target cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109825811A true CN109825811A (en) | 2019-05-31 |
Family
ID=66874159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910272241.4A Pending CN109825811A (en) | 2019-04-04 | 2019-04-04 | A kind of semiconductor chilling plate target cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109825811A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114717523A (en) * | 2022-03-03 | 2022-07-08 | 四川艾庞机械科技有限公司 | Columnar target water-cooling rotary unit |
| CN114717523B (en) * | 2022-03-03 | 2024-05-31 | 四川艾庞机械科技有限公司 | Columnar target water-cooling rotary unit |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1098354A2 (en) * | 1999-11-08 | 2001-05-09 | Applied Materials, Inc. | Apparatus for controlling temperature in a semiconductor processing system |
| CN101543924A (en) * | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | Method for welding target material and back board |
| CN102760749A (en) * | 2012-07-13 | 2012-10-31 | 京东方科技集团股份有限公司 | Light-emitting device and manufacture method thereof |
| CN104943433A (en) * | 2015-07-05 | 2015-09-30 | 林志苹 | Pattern transferring template and preparing method thereof |
| CN206033869U (en) * | 2016-10-15 | 2017-03-22 | 凯盛光伏材料有限公司 | Novel target cooling system device |
| CN108130516A (en) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | A kind of Vacuum Deposition cathode target using foam metal enhancing cooling |
| CN207778860U (en) * | 2018-01-18 | 2018-08-28 | 刘文艳 | Semiconductor refrigerating module for X-ray equipment |
| CN209722290U (en) * | 2019-04-04 | 2019-12-03 | 浙江工业大学 | A kind of semiconductor chilling plate target cooling device |
-
2019
- 2019-04-04 CN CN201910272241.4A patent/CN109825811A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1098354A2 (en) * | 1999-11-08 | 2001-05-09 | Applied Materials, Inc. | Apparatus for controlling temperature in a semiconductor processing system |
| CN101543924A (en) * | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | Method for welding target material and back board |
| CN102760749A (en) * | 2012-07-13 | 2012-10-31 | 京东方科技集团股份有限公司 | Light-emitting device and manufacture method thereof |
| CN104943433A (en) * | 2015-07-05 | 2015-09-30 | 林志苹 | Pattern transferring template and preparing method thereof |
| CN206033869U (en) * | 2016-10-15 | 2017-03-22 | 凯盛光伏材料有限公司 | Novel target cooling system device |
| CN108130516A (en) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | A kind of Vacuum Deposition cathode target using foam metal enhancing cooling |
| CN207778860U (en) * | 2018-01-18 | 2018-08-28 | 刘文艳 | Semiconductor refrigerating module for X-ray equipment |
| CN209722290U (en) * | 2019-04-04 | 2019-12-03 | 浙江工业大学 | A kind of semiconductor chilling plate target cooling device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114717523A (en) * | 2022-03-03 | 2022-07-08 | 四川艾庞机械科技有限公司 | Columnar target water-cooling rotary unit |
| CN114717523B (en) * | 2022-03-03 | 2024-05-31 | 四川艾庞机械科技有限公司 | Columnar target water-cooling rotary unit |
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