CN109819600A - A kind of oxidation resistant method for manufacturing circuit board - Google Patents
A kind of oxidation resistant method for manufacturing circuit board Download PDFInfo
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- CN109819600A CN109819600A CN201910207826.8A CN201910207826A CN109819600A CN 109819600 A CN109819600 A CN 109819600A CN 201910207826 A CN201910207826 A CN 201910207826A CN 109819600 A CN109819600 A CN 109819600A
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- insulating layer
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- printed wire
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Abstract
A kind of oxidation resistant method for manufacturing circuit board, the wiring board includes the PCB substrate set gradually from top to bottom, first insulating layer, printed wire layer and second insulating layer, heat release hole is provided in the second insulating layer, the surface of the printed wire layer is sprayed with tin layers, small via hole is provided between the printed wire, the printed wire end is provided with big via hole, the printed wire side is provided with mini-fan and mini-fan is located in first insulating layer and the second insulating layer, it is described the preparation method is as follows: step 1:PCB substrate heavy copper pre-treatment；Step 2: full plate copper plating treatment is carried out to the printed wiring board；Step 3: first insulating layer is provided with epoxy resin layer；Step 4: covering upper oxidation-resistant material on the second insulating layer.The present invention is covered with the anti oxidation layer of resistance on the surface of second insulating layer, and wiring board surface layer can be effectively prevent to be scratched, and can significantly reduce the probability that oxidation occurs, gets rusty.
Description
Technical field
The present invention relates to printed-board technology fields, and in particular to a kind of oxidation resistant method for manufacturing circuit board.
Background technique
Inoxidizability, refer to metal material resist at high temperature oxidizing atmosphere corrosiveness ability it is referred to as anti-oxidant
Property, in many fields of industry, the service life of extend as far as possible metal is required, therefore the inoxidizability of metal will be enhanced, but
It is more time-consuming to material overall processing, therefore usually carries out anti-oxidant treatment in metal surface or apply anti-oxidant material
Material.It is short that current oxidation-resistant material is usually present the service life, and failure is fast, the problem of being easy to fall off.
Pcb board Chinese is printed circuit board, also known as printed circuit board, is the offer of electronic component electric appliance connection
Person can greatly reduce the mistake of wiring and assembly using circuit board, improve the gentle productive labor rate of Automated water, and existing
Pcb board antioxygenic property is poor, and heat-sinking capability is poor, inconvenient for use, for this purpose, it is proposed that a kind of PCB that antioxygenic property is high
Plate.
Summary of the invention
The object of the present invention is to provide a kind of oxidation resistant method for manufacturing circuit board, solve that wiring board is easy to oxidize to ask
Topic.
The technical problem to be solved by the present invention is to what is be achieved through the following technical solutions, a kind of oxidation resistant wiring board system
Make method, the wiring board includes that the PCB substrate set gradually from top to bottom, the first insulating layer, printed wire layer and second are exhausted
Edge layer, it is characterised in that: heat release hole is provided in the second insulating layer, the surface of the printed wire layer is sprayed with tin layers, institute
It states and is provided with small via hole between printed wire, the printed wire end is provided with big via hole, the printed wire side
It is provided with mini-fan and mini-fan is located in first insulating layer and the second insulating layer, the preparation method is such as
Under: the heavy copper pre-treatment of step 1:PCB substrate；Step 2: full plate copper plating treatment is carried out to the printed wiring board；Step 3:
First insulating layer is provided with epoxy resin layer；Step 4: covering upper oxidation-resistant material on the second insulating layer.
A further improvement of the present invention is that: the heavy copper pre-treatment concrete operations process in the step 1: successively use overflow
Water and potassium pyrophosphate aqueous cleaning PCB substrate, the PCB substrate are the plates by copper-coating.
A further improvement of the present invention is that: the concentration of the potassium pyrophosphate aqueous solution is 29 ~ 35g/L
A further improvement of the present invention is that: oxidation-resistant material in the step 4 the production method is as follows:
Step 1: carrying out purification process after 5 ~ 7 parts and 4 ~ 6 parts of hydrogen furans mixing of lignin；Step 2: 5 ~ 9 parts of ceramic powders,
After 9 ~ 11 parts of diatomite and 7 ~ 9 parts of polyphenol mixing, 1.5 hours are reacted in reaction kettle, 250 ~ 270 degrees Celsius of temperature, pressure 150
~ 190Mpa, 120 ~ 200Mpa of vacuum degree, it is cooling after reaction；Third step, 12 ~ 18 parts of resin, 22 ~ 25 parts of methanol, the first step and
Second obtained material mixing heats 200 fusings Celsius, then carries out finishing processing, obtains oxidation-resistant material after cooling.
The utility model has the advantages that
The wiring board made using this material it is high-quality, the service life is long, not vulnerable and fall off, and is formulated simple, energy
Protection metal is not easy to be oxidized well, the service life of extension wire plate.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is further introduced and illustrates
Embodiment 1: a kind of oxidation resistant method for manufacturing circuit board, the wiring board include the PCB base set gradually from top to bottom
Plate, the first insulating layer, printed wire layer and second insulating layer, it is characterised in that: it is provided with heat release hole in the second insulating layer,
The surface of the printed wire layer is sprayed with tin layers, and small via hole, the printed wire end are provided between the printed wire
It is provided with big via hole, the printed wire side is provided with mini-fan and mini-fan is located at first insulating layer and institute
State in second insulating layer, it is described the preparation method is as follows: step 1:PCB substrate heavy copper pre-treatment；Step 2: to the track
Road plate carries out full plate copper plating treatment；Step 3: first insulating layer is provided with epoxy resin layer；Step 4: described second
Upper oxidation-resistant material is covered on insulating layer.Heavy copper pre-treatment concrete operations process in the step 1: overflow water and coke are successively used
Aqueous potassium phosphate solution cleans PCB substrate, and the PCB substrate is the plate by copper-coating.The potassium pyrophosphate aqueous solution
Concentration is 29g/L, the oxidation-resistant material in the step 4 the production method is as follows: step 1: 5 parts of lignin and hydrogen furans
Purification process is carried out after 4 parts of mixing；Step 2: after 5 parts of ceramic powders, 9 parts of diatomite and 7 parts of polyphenol mixing, it is anti-in reaction kettle
It answers 1.5 hours, 250 degrees Celsius of temperature, pressure 150Mpa, vacuum degree 120Mpa, it is cooling after reaction；Third step, 12 parts of resin,
The material mixing that 22 parts of methanol, the first step and second step obtain heats 200 fusings Celsius, finishing processing is then carried out, after cooling
Obtain oxidation-resistant material.
Embodiment 2: a kind of oxidation resistant method for manufacturing circuit board, the wiring board include setting gradually from top to bottom
PCB substrate, the first insulating layer, printed wire layer and second insulating layer, it is characterised in that: be provided in the second insulating layer scattered
Hot hole, the surface of the printed wire layer are sprayed with tin layers, and small via hole, the printed wire are provided between the printed wire
End is provided with big via hole, and the printed wire side is provided with mini-fan and mini-fan is located at first insulating layer
In the second insulating layer, it is described the preparation method is as follows: step 1:PCB substrate heavy copper pre-treatment；Step 2: to the print
Brush wiring board carries out full plate copper plating treatment；Step 3: first insulating layer is provided with epoxy resin layer；Step 4: described
Upper oxidation-resistant material is covered in second insulating layer.Heavy copper pre-treatment concrete operations process in the step 1: overflow water is successively used
With potassium pyrophosphate aqueous cleaning PCB substrate, the PCB substrate is the plate by copper-coating.The potassium pyrophosphate is water-soluble
The concentration of liquid be the oxidation-resistant material described in 35g/L in step 4 the production method is as follows: step 1: 7 parts of lignin and hydrogen
Purification process is carried out after 6 parts of furans mixing；Step 2: after 9 parts of ceramic powders, 11 parts of diatomite and 9 parts of polyphenol mixing, anti-
Kettle is answered to react 1.5 hours, it is 270 degrees Celsius of temperature, 150 ~ 190Mpa of pressure, vacuum degree 200Mpa, cooling after reaction；Third
The material mixing that step, 18 parts of resin, 25 parts of methanol, the first step and second obtain heats 200 fusings Celsius, then carries out finishing
Processing obtains oxidation-resistant material after cooling.
Embodiment 3: a kind of oxidation resistant method for manufacturing circuit board, the wiring board include setting gradually from top to bottom
PCB substrate, the first insulating layer, printed wire layer and second insulating layer, it is characterised in that: be provided in the second insulating layer scattered
Hot hole, the surface of the printed wire layer are sprayed with tin layers, and small via hole, the printed wire are provided between the printed wire
End is provided with big via hole, and the printed wire side is provided with mini-fan and mini-fan is located at first insulating layer
In the second insulating layer, it is described the preparation method is as follows: step 1:PCB substrate heavy copper pre-treatment；Step 2: to the print
Brush wiring board carries out full plate copper plating treatment；Step 3: first insulating layer is provided with epoxy resin layer；Step 4: described
Upper oxidation-resistant material is covered in second insulating layer.Heavy copper pre-treatment concrete operations process in the step 1: overflow water is successively used
With potassium pyrophosphate aqueous cleaning PCB substrate, the PCB substrate is the plate by copper-coating.The potassium pyrophosphate is water-soluble
The concentration of liquid be the oxidation-resistant material described in 32g/L in step 4 the production method is as follows: step 1: 6 parts of lignin and hydrogen
Purification process is carried out after 5 parts of furans mixing；Step 2: after 7 parts of ceramic powders, 10 parts of diatomite and 8 parts of polyphenol mixing, anti-
Kettle is answered to react 1.5 hours, it is 260 degrees Celsius of temperature, pressure 170Mpa, vacuum degree 160Mpa, cooling after reaction；Third step, resin
The material mixing that 15 parts, 23 parts of methanol, the first step and second obtain heats 200 fusings Celsius, then carries out finishing processing, cold
But oxidation-resistant material is obtained afterwards.
According to above three embodiments obtain as a result, oxidation resistant wiring board that the ingredient of embodiment 3 is made
Longest-lived, preferred embodiment 3.
The utility model has the advantages that
The wiring board made using this material it is high-quality, the service life is long, not vulnerable and fall off, and is formulated simple, energy
Protection metal is not easy to be oxidized well, the service life of extension wire plate.
It is illustrated according to above-described embodiment, it should be understood that above-described embodiment does not limit the present invention in any form, all
Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on should be included in guarantor of the invention
Within the scope of shield.
Claims (4)
1. a kind of oxidation resistant method for manufacturing circuit board, the wiring board includes the PCB substrate set gradually from top to bottom, first
Insulating layer, printed wire layer and second insulating layer, it is characterised in that: heat release hole, the print are provided in the second insulating layer
The surface of brush line layer is sprayed with tin layers, and small via hole is provided between the printed wire, and the printed wire end is provided with
Big via hole, the printed wire side is provided with mini-fan and mini-fan is located at first insulating layer and described second
In insulating layer, it is described the preparation method is as follows: step 1:PCB substrate heavy copper pre-treatment；Step 2: to the printed wiring board into
The full plate copper plating treatment of row；Step 3: first insulating layer is provided with epoxy resin layer；Step 4: in the second insulating layer
Oxidation-resistant material in upper covering.
2. a kind of oxidation resistant method for manufacturing circuit board according to claim 1, it is characterised in that: in the step 1
Heavy copper pre-treatment concrete operations process: it is with overflow water and potassium pyrophosphate aqueous cleaning PCB substrate, the PCB substrate successively
By the plate of copper-coating.
3. a kind of oxidation resistant method for manufacturing circuit board according to claim 2, it is characterised in that: the potassium pyrophosphate water
The concentration of solution is 29 ~ 35g/L.
4. a kind of oxidation resistant method for manufacturing circuit board according to claim 1, it is characterised in that: in the step 4
Oxidation-resistant material the production method is as follows:
Step 1: carrying out purification process after 5 ~ 7 parts and 4 ~ 6 parts of hydrogen furans mixing of lignin；Step 2: 5 ~ 9 parts of ceramic powders,
After 9 ~ 11 parts of diatomite and 7 ~ 9 parts of polyphenol mixing, 1.5 hours are reacted in reaction kettle, 250 ~ 270 degrees Celsius of temperature, pressure 150 ~
190Mpa, 120 ~ 200Mpa of vacuum degree, it is cooling after reaction；Third step, 12 ~ 18 parts of resin, 22 ~ 25 parts of methanol, the first step and
Two obtained material mixings heat 200 fusings Celsius, then carry out finishing processing, obtain oxidation-resistant material after cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910207826.8A CN109819600A (en) | 2019-03-19 | 2019-03-19 | A kind of oxidation resistant method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910207826.8A CN109819600A (en) | 2019-03-19 | 2019-03-19 | A kind of oxidation resistant method for manufacturing circuit board |
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| Publication Number | Publication Date |
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| CN109819600A true CN109819600A (en) | 2019-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910207826.8A Pending CN109819600A (en) | 2019-03-19 | 2019-03-19 | A kind of oxidation resistant method for manufacturing circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050276911A1 (en) * | 2004-06-15 | 2005-12-15 | Qiong Chen | Printing of organometallic compounds to form conductive traces |
| CN103694900A (en) * | 2013-12-03 | 2014-04-02 | 苏永龙 | Anti-oxidation material and manufacturing method thereof |
| CN106686901A (en) * | 2017-02-23 | 2017-05-17 | 深圳崇达多层线路板有限公司 | Anti-oxidation manufacturing method of circuit board |
| CN207560452U (en) * | 2017-12-12 | 2018-06-29 | 东莞文殊电子科技有限公司 | A kind of high pcb board of antioxygenic property |
-
2019
- 2019-03-19 CN CN201910207826.8A patent/CN109819600A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050276911A1 (en) * | 2004-06-15 | 2005-12-15 | Qiong Chen | Printing of organometallic compounds to form conductive traces |
| CN103694900A (en) * | 2013-12-03 | 2014-04-02 | 苏永龙 | Anti-oxidation material and manufacturing method thereof |
| CN106686901A (en) * | 2017-02-23 | 2017-05-17 | 深圳崇达多层线路板有限公司 | Anti-oxidation manufacturing method of circuit board |
| CN207560452U (en) * | 2017-12-12 | 2018-06-29 | 东莞文殊电子科技有限公司 | A kind of high pcb board of antioxygenic property |
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Application publication date: 20190528 |
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