CN109818255A - It is a kind of for improving the refrigerator, encapsulating structure and method of smile - Google Patents

It is a kind of for improving the refrigerator, encapsulating structure and method of smile Download PDF

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Publication number
CN109818255A
CN109818255A CN201910188916.7A CN201910188916A CN109818255A CN 109818255 A CN109818255 A CN 109818255A CN 201910188916 A CN201910188916 A CN 201910188916A CN 109818255 A CN109818255 A CN 109818255A
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China
Prior art keywords
refrigerator
reinforcing
reinforcing structure
smile
laser chip
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CN201910188916.7A
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CN109818255B (en
Inventor
赵森
王警卫
刘兴胜
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Focuslight Technologies Inc
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Focuslight Technologies Inc
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Abstract

The embodiment of the present invention discloses a kind of for improving the refrigerator, encapsulating structure and method of smile, the refrigerator is integral type multi-layer compound structure, it is provided with ruggedized construction inside it, the ruggedized construction is for improving smile by way of enhancing refrigerator intensity.Based on technical solution disclosed by the invention, the stress generated in encapsulation process due to thermal expansion coefficient mismatch can be effective against, the deformation of the laser chip due to caused by refrigerator deformation is also just accordingly considerably reduced, to effectively improve smile effect.

Description

Refrigerator, packaging structure and method for improving smile
Technical Field
The invention relates to the field of semiconductor laser packaging, in particular to a refrigerator, a packaging structure and a method for improving smile.
Background
In the field of semiconductor laser packaging, refrigerators, especially liquid refrigerators having a refrigeration circuit inside, are widely used for integration of high power semiconductor lasers due to their excellent heat dissipation performance, but such refrigerators have relatively thin thickness and dense refrigeration channels inside, and therefore such refrigerators have poor strength.
In the packaging process of the semiconductor laser, large stress is generated due to the fact that the thermal expansion coefficients of the refrigerator and the laser chip are not matched during bonding, and when the yield strength of the refrigerator cannot resist the generated stress, the refrigerator is deformed, so that the laser chip is greatly deformed in the fast axis direction, and a near field nonlinear effect (SMILE) is caused.
The current method for solving the problems is mainly to arrange a stress slow release layer on the refrigerator to balance the thermal stress so as to prevent the refrigerator from deforming. Although this approach can reduce SIMLE effect to some extent, it has the following disadvantages:
1. the stress slow release layer is bonded in the direction corresponding to the laser chip and the refrigerator to balance stress, so that the risk of overflow of the solder at the lower end is increased;
2. the arrangement of the stress slow release layer increases the thickness of the product and can influence the appearance of the product.
Disclosure of Invention
In view of the above, it is a primary object of embodiments of the present invention to provide a refrigerator, a package structure and a method for improving smile, which basically abandon the conventional considerations and design ideas of providing a stress slow-release layer, but from the viewpoint of the refrigerator, the strength of the refrigerator itself is enhanced by providing a reinforcing structure in the refrigerator, so that the stress generated due to mismatch of thermal expansion coefficients during the packaging process can be effectively resisted, and accordingly, the deformation of the laser chip caused by the deformation of the refrigerator is greatly reduced, thereby effectively improving the smile effect.
In addition, this application has thoroughly solved the risk that the solder spilled over among the prior art in the mode that sets up reinforced structure in the refrigerator to can not increase the thickness of refrigerator itself, can not influence the outward appearance of refrigerator yet.
The technical scheme of the embodiment of the invention is realized as follows:
the refrigerator for improving smile is characterized in that the refrigerator is of an integrated multi-layer composite structure, a reinforcing structure is arranged in the refrigerator, and the reinforcing structure is used for improving smile in a mode of enhancing the strength of the refrigerator.
In the above scheme, the refrigerator comprises an upper layer, at least one intermediate layer, and a lower layer; the reinforcing structure is arranged on the whole periphery or partial periphery of the at least one middle layer of the refrigerator in a pressing or welding mode.
In the above scheme, the upper surface of one end of the refrigerator is provided with a bonding region for packaging a laser chip, and the reinforcing structure is at least arranged in a corresponding region right below the bonding region.
In the above scheme, the specific positions of the reinforcing structure at least arranged in the region corresponding to the right below the bonding region are as follows: in the width direction of the refrigerator, the size of the reinforcing structure is smaller than or equal to that of the refrigerator in the direction and is larger than or equal to that of the laser chip in the direction; in the length direction of the refrigerator, the size of the reinforcing structure is smaller than or equal to the width of the laser chip and larger than or equal to one-half width of the laser chip.
In the above solution, the form of the reinforcing structure includes a reinforcing bar or a reinforcing frame, and the reinforcing bar or the reinforcing frame is made of metal or nonmetal which has a thermal expansion coefficient consistent with that of the refrigerator.
In the above scheme, when the reinforcing structure is a reinforcing strip, the reinforcing strip is just arranged in the corresponding area under the bonding area.
In the above scheme, the reinforcing structure is a closed reinforcing frame which is consistent with the shape of the refrigerator, and the reinforcing frame surrounds the whole periphery of at least one layer in the middle of the refrigerator.
In the above scheme, the reinforcing structure is an unclosed U-shaped reinforcing frame, and the area corresponding to the right below the bonding area is located in the opening of the U-shaped reinforcing frame; wherein the length of the opening part of the U-shaped reinforcing frame satisfies: greater than or equal to one-half of the length of the refrigerator and less than or equal to the overall length of the refrigerator.
The embodiment of the invention also provides a packaging structure for improving smile, which comprises the refrigerator and the laser chip; wherein the laser chip is bonded to an upper surface of the refrigerator.
The embodiment of the invention also provides a method for improving smile, which comprises the following steps: the reinforcing structure is arranged in the refrigerator with the integrated multilayer composite structure, the strength of the refrigerator is enhanced through the reinforcing structure so as to resist the stress generated in the packaging process, and smile is improved.
Drawings
FIG. 1 is an overall schematic view of a refrigerator according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a refrigerator according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a refrigerator according to a second embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a refrigerator according to a third embodiment of the present invention;
fig. 5 is a schematic view of a third reinforcement structure according to an embodiment of the present invention.
Description of reference numerals: 1 is at least one layer in the middle of the refrigerator, 2 is a reinforced structure, 3 is a lower layer of the refrigerator, a is the width direction of the refrigerator, b is the length direction of the refrigerator, c is a bonding area, 4 is an upper layer of the refrigerator, 5 is an opening of a U-shaped reinforced frame, and 51 is an end part of the U-shaped reinforced frame.
Detailed Description
The embodiment of the invention mainly strengthens the strength of the refrigerator by arranging the reinforcing structure in the refrigerator, the strength is increased to ensure that the hardness and the rigidity of the refrigerator are higher, so that the capability of the refrigerator for resisting stress generated by mismatching of thermal expansion coefficients is enhanced, the risk of the refrigerator generating deformation is greatly reduced under the same stress condition, and the risk of the laser chip deformation caused by the refrigerator deformation can be further remarkably reduced, thereby realizing the beneficial technical effect of improving the smile effect.
The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is an overall schematic diagram of a refrigerator according to an embodiment of the present invention, as shown in fig. 1, the refrigerator is a conventional sheet-shaped long bar-shaped liquid refrigerator, a is a width direction of the refrigerator (a direction in which a short side of the refrigerator is located), b is a length direction of the refrigerator (a direction in which a long side of the refrigerator is located), c is a bonding region for bonding a laser chip, 4 is an upper layer of the refrigerator, and c is located on a surface of one end of the upper layer 4 of the refrigerator.
Fig. 2 is a schematic structural diagram of a first embodiment of the present invention, and as shown in fig. 2, the refrigerator is an integrated multilayer composite structure, which may be a micro-channel liquid refrigerator (MCC) or a macro-channel liquid refrigerator (MACC), and the embodiment of the present invention is illustrated with the refrigerator as the micro-channel liquid refrigerator (MCC).
A reinforcing structure 2 is arranged inside the refrigerator, said reinforcing structure 2 being used to improve smile by increasing the refrigerator strength.
Further, the refrigerator comprises an upper layer 4, at least one intermediate layer 1, and a lower layer; the reinforcing structure 2 is specifically arranged on the whole periphery or partial periphery of at least one layer of the middle layer 1 of the refrigerator in a pressing or welding mode.
For example: the number of the refrigerators is three, and the reinforcing structure 2 is arranged on the middle layer; if the number of the refrigerators is four, the reinforcing structure 2 can be arranged on at least one of the two middle layers, that is to say, on one of the two middle layers, or on a position covering both of the two middle layers, and similar reasoning can be inferred if the number of the refrigerators is greater, which is not illustrated here. The height of the reinforcing structure should be consistent with the height of the intermediate layer it covers.
The embodiments and drawings of the present invention are only exemplified by the refrigerator having three layers, but this is not the only limitation of the present embodiment.
In the embodiment of the invention, the upper surface of one end of the refrigerator is provided with a bonding region c for packaging a laser chip, and the reinforcing structure is at least arranged in a corresponding region right below the bonding region c. Therefore, it can be understood that the basic position for the reinforcing structure in the region directly below the bonding region c is the basic position, and the reinforcing structure can be only arranged in the region directly below the bonding region c, and can also be arbitrarily expanded to other peripheries of the refrigerator based on the region.
Further, in order to substantially increase the strength of the refrigerator itself, the specific location where the reinforcing structure 2 is disposed at least in the region corresponding to directly below the bonding region may be:
in the refrigerator width direction a, the dimension of the reinforcing structure 2 (i.e. the length of the reinforcing structure 2 in this direction) is smaller than or equal to the dimension of the refrigerator in this direction, and is greater than or equal to the dimension of the laser chip in this direction (i.e. the length of the laser chip in this direction), where the dimension of the refrigerator specifically refers to the external dimension of the upper layer or the lower layer of the refrigerator (i.e. the external dimension of the refrigerator), that is, in this direction, the dimension of the reinforcing structure 2 should be the smallest enough to cover the laser chip, so that the effect of improving smile can be more fully exerted.
In the length direction b of the refrigerator, the size of the reinforcing structure 2 is smaller than or equal to the width of the laser chip and larger than or equal to one-half of the width of the laser chip. The size of the reinforcing structure only refers to a condition that the external dimension of the reinforcing structure should meet, and when the reinforcing structure 2 meets the size requirement, any one of two sides of the laser chip in the direction a (two long sides of the laser chip) may be specifically used as a reference.
It should be noted that the width direction of the laser chip is a direction in which a short side of the laser chip is located, that is, a length direction b of the refrigerator in the embodiment of the present invention, and similarly, the length direction of the laser chip is a direction in which a long side of the laser chip is located, that is, a width direction a of the refrigerator in the embodiment of the present invention.
The considerations for such a design are: in order to maintain the uniformity of the refrigerator size, the upper limit of the reinforcing structure in the region corresponding to just below the bonding region c in the refrigerator width direction is the refrigerator size (refrigerator width); in order to fully exert the function of the reinforcing structure and reduce the smile of the laser chip, the lower limit of the reinforcing structure in the area corresponding to the right below the bonding area c in the width direction of the refrigerator is the size of the laser chip (just covering the laser chip). Similarly, the design in the length direction of the refrigerator is also to fully enhance the strength of the refrigerator and reduce the smile of the laser chip to the maximum extent.
In particular, the form of the reinforcing structure 2 includes, but is not limited to, a reinforcing bar or frame made of metal or nonmetal having a coefficient of thermal expansion that is compatible with that of the refrigerator, where the "coefficient of thermal expansion is compatible", i.e., the coefficient of thermal expansion is matched; the metal or nonmetal should also have high yield strength and good thermal conductivity.
In practical applications, the cross-sectional area of the reinforcing structure in the region corresponding to the region directly below the bonding region c may vary according to the magnitude of the stress to be resisted, and when the stress is large, the cross-sectional area of the reinforcing structure may be designed to be increased, and similarly, when the stress is small, the cross-sectional area of the reinforcing structure may be designed to be decreased.
In the above, the basic position provided for the reinforcing structure in the region corresponding to the region directly below the bonding region is described, and the cross-sectional areas of the reinforcing structures at the other peripheries of the refrigerator intermediate layer outside the basic position are preferably consistent with the basic position, and different cross-sectional areas are allowed on the premise that the technical scheme and the technical effect of the present invention can be achieved.
Furthermore, based on the basic position of the reinforcement structure, other similar structural forms capable of achieving similar technical objectives, besides the reinforcement structure in the form of the reinforcement bar and the reinforcement frame, should also be included in the protection scope of the present invention.
The design of the reinforcing structure should not affect the shape, size, structure and function of the refrigerator itself, and the overall size of the reinforcing structure should preferably be exactly wrapped inside the refrigerator. Of course, if the reinforcing structure has an extended outer wall, the reinforcing structure can be exposed after being pressed under the condition that the packaging condition allows, and the reinforcing structure can also be wrapped in the outer surface of the refrigerator through pressing under the condition that the appearance and the size of the refrigerator are not changed.
In one embodiment, as shown in fig. 2, the reinforcing structure 2 is a closed reinforcing frame conforming to the shape of the refrigerator, the reinforcing frame surrounds the whole periphery of at least one layer of the refrigerator, and in fig. 2, the reinforcing frame 2 surrounds the whole periphery of the middle layer.
Fig. 3 is a schematic structural view of a second embodiment of the present invention, and as shown in fig. 3, the reinforcing structure is in the form of a reinforcing strip, and according to the above, the reinforcing strip is disposed in the corresponding region right below the bonding region c, and the reinforcing strip surrounds a partial periphery of the intermediate layer.
Fig. 4 is a schematic structural view of a third embodiment of the present invention, in which the reinforcing structure is an unclosed U-shaped reinforcing frame, a corresponding area right below the bonding region c is located in an opening of the U-shaped reinforcing frame, and the reinforcing frame surrounds a partial periphery of the middle layer.
Further, the length of the opening part of the U-shaped reinforcing frame satisfies: the length of the refrigerator is more than or equal to one half of the length of the refrigerator and is less than or equal to the whole length of the refrigerator; in the case where this condition is satisfied, the lengths of both end portions 51 of the U-shaped reinforcing frame may be the same or different. Fig. 5 is a schematic view of a third reinforcing structure according to an embodiment of the present invention, which is exemplified by taking the length of the opening portion of the U-shaped reinforcing frame as one half of the length of the refrigerator.
The embodiment of the invention also provides a packaging structure for improving smile, which comprises the refrigerator and the laser chip; wherein the laser chip is bonded to an upper surface of the refrigerator.
The embodiment of the invention also provides a method for improving smile, which comprises the following steps: the reinforcing structure is arranged in the refrigerator with the integrated multilayer composite structure, the strength of the refrigerator is enhanced through the reinforcing structure so as to resist the stress generated in the packaging process, and smile is improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A refrigerator for improving smile, characterized in that the refrigerator is a one-piece multi-layer composite structure provided with a reinforcing structure inside thereof for improving smile by enhancing refrigerator strength.
2. The refrigerator according to claim 1, wherein the refrigerator comprises an upper layer, at least one intermediate layer, and a lower layer; the reinforcing structure is arranged on the whole periphery or partial periphery of the at least one middle layer of the refrigerator in a pressing or welding mode.
3. A refrigerator according to claim 2, characterized in that the upper surface of one end of the refrigerator is provided with a bonding zone for packaging a laser chip, and the reinforcing structure is provided at least in a corresponding region directly below the bonding zone.
4. A refrigerator according to claim 3, characterized in that the reinforcing structure is provided at least in the area corresponding directly below the bonding zone at the specific locations:
in the width direction of the refrigerator, the size of the reinforcing structure is smaller than or equal to that of the refrigerator in the direction and is larger than or equal to that of the laser chip in the direction;
in the length direction of the refrigerator, the size of the reinforcing structure is smaller than or equal to the width of the laser chip and larger than or equal to one-half width of the laser chip.
5. A refrigerator according to claim 4, characterized in that the reinforcing structure is in the form of a reinforcing bar or frame, consisting of metal or non-metal conforming to the thermal expansion coefficient of the refrigerator.
6. The refrigerator according to claim 5, wherein when the reinforcing structure is a reinforcing strip, the reinforcing strip is disposed in a corresponding region directly below the bonding region.
7. A refrigerator according to claim 5, characterized in that the reinforcing structure is a closed reinforcing frame conforming to the contour of the refrigerator, said reinforcing frame surrounding the entire periphery of at least one layer in the middle of the refrigerator.
8. The refrigerator according to claim 5, wherein the reinforcing structure is an unclosed U-shaped reinforcing frame, and the corresponding area right below the bonding area is located in the opening of the U-shaped reinforcing frame; wherein,
the length of the opening part of the U-shaped reinforcing frame satisfies the following conditions: greater than or equal to one-half of the length of the refrigerator and less than or equal to the overall length of the refrigerator.
9. A package structure for improving smile, characterized in that the package structure comprises the refrigerator, laser chip of any one of the above claims 1 to 8; wherein the laser chip is bonded to an upper surface of the refrigerator.
10. A method for improving smile, the method comprising: the reinforcing structure is arranged in the refrigerator with the integrated multilayer composite structure, the strength of the refrigerator is enhanced through the reinforcing structure so as to resist the stress generated in the packaging process, and smile is improved.
CN201910188916.7A 2019-03-13 2019-03-13 Refrigerator, packaging structure and method for improving smile Active CN109818255B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112713498A (en) * 2019-10-25 2021-04-27 山东华光光电子股份有限公司 Water-cooling heat sink for improving smile effect of laser and packaging method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232055A (en) * 2001-01-31 2002-08-16 Hamamatsu Photonics Kk Semiconductor laser device, and fastening method of lens position thereof
CN1531156A (en) * 2003-03-17 2004-09-22 松下电器产业株式会社 Semiconductor laser device and optical picker therewith
JP2009283778A (en) * 2008-05-23 2009-12-03 Sony Corp Semiconductor laser module and projection type display device
CN101789560A (en) * 2009-01-23 2010-07-28 索尼公司 Semiconductor laser apparatus
CN102097743A (en) * 2010-12-10 2011-06-15 长春理工大学 Method for assembling double-side mounting soldering matching sheets of centimeter-grade strip-shaped semiconductor laser
CN205212175U (en) * 2015-10-21 2016-05-04 宜兴市大元电子科技有限公司 Cooling of semiconductor laser microchannel is heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232055A (en) * 2001-01-31 2002-08-16 Hamamatsu Photonics Kk Semiconductor laser device, and fastening method of lens position thereof
CN1531156A (en) * 2003-03-17 2004-09-22 松下电器产业株式会社 Semiconductor laser device and optical picker therewith
JP2009283778A (en) * 2008-05-23 2009-12-03 Sony Corp Semiconductor laser module and projection type display device
CN101789560A (en) * 2009-01-23 2010-07-28 索尼公司 Semiconductor laser apparatus
CN102097743A (en) * 2010-12-10 2011-06-15 长春理工大学 Method for assembling double-side mounting soldering matching sheets of centimeter-grade strip-shaped semiconductor laser
CN205212175U (en) * 2015-10-21 2016-05-04 宜兴市大元电子科技有限公司 Cooling of semiconductor laser microchannel is heat sink

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王媛媛等: "复合型微通道热沉设计与制作技术研究", 《微纳电子技术》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112713498A (en) * 2019-10-25 2021-04-27 山东华光光电子股份有限公司 Water-cooling heat sink for improving smile effect of laser and packaging method

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