CN1098166C - 印制设备用的自动进纸装置 - Google Patents

印制设备用的自动进纸装置 Download PDF

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Publication number
CN1098166C
CN1098166C CN96120850A CN96120850A CN1098166C CN 1098166 C CN1098166 C CN 1098166C CN 96120850 A CN96120850 A CN 96120850A CN 96120850 A CN96120850 A CN 96120850A CN 1098166 C CN1098166 C CN 1098166C
Authority
CN
China
Prior art keywords
gear
idle pulley
lock
paper
conveying roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN96120850A
Other languages
English (en)
Chinese (zh)
Other versions
CN1153712A (zh
Inventor
朴辰昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Lexmark International Inc
Original Assignee
Samsung Electronics Co Ltd
Lexmark International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd, Lexmark International Inc filed Critical Samsung Electronics Co Ltd
Publication of CN1153712A publication Critical patent/CN1153712A/zh
Application granted granted Critical
Publication of CN1098166C publication Critical patent/CN1098166C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/0231—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to electromagnetic radiation, e.g. UV light

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
CN96120850A 1995-10-13 1996-11-25 印制设备用的自动进纸装置 Expired - Fee Related CN1098166C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1019950035419A KR0172031B1 (ko) 1995-10-13 1995-10-13 반도체장치의 층간 절연막 형성방법
KR35419/95-U 1995-11-24
KR35419/95U 1995-11-24

Publications (2)

Publication Number Publication Date
CN1153712A CN1153712A (zh) 1997-07-09
CN1098166C true CN1098166C (zh) 2003-01-08

Family

ID=19430196

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96120850A Expired - Fee Related CN1098166C (zh) 1995-10-13 1996-11-25 印制设备用的自动进纸装置

Country Status (2)

Country Link
KR (1) KR0172031B1 (ko)
CN (1) CN1098166C (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100208795B1 (ko) * 1997-08-30 1999-07-15 윤종용 레이져 빔 프린터의 용지급지장치
KR100486235B1 (ko) * 1998-03-23 2005-06-16 삼성전자주식회사 도핑되지않은실리콘유리(usg)막의형성방법
JP4470163B2 (ja) * 2003-09-03 2010-06-02 株式会社エンプラス 成形プラスチック歯車及びこれを使用した間歇回転伝達機構、成形プラスチック歯車の使用方法
US7172091B2 (en) * 2004-05-07 2007-02-06 Sweports Limited Mop dispenser
CN100372681C (zh) * 2004-05-10 2008-03-05 中国印钞造币总公司 用于在线检测的吸风停纸方法及其装置
CN103538453B (zh) * 2013-10-11 2016-07-06 北京白云朵朵科技有限公司 车用防护车衣收放装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717139A (en) * 1985-03-29 1988-01-05 Canon Kabushiki Kaisha Sheet feeding apparatus
EP0401807A2 (en) * 1989-06-08 1990-12-12 Canon Kabushiki Kaisha Driving force transmitting apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717139A (en) * 1985-03-29 1988-01-05 Canon Kabushiki Kaisha Sheet feeding apparatus
EP0401807A2 (en) * 1989-06-08 1990-12-12 Canon Kabushiki Kaisha Driving force transmitting apparatus

Also Published As

Publication number Publication date
KR970023826A (ko) 1997-05-30
CN1153712A (zh) 1997-07-09
KR0172031B1 (ko) 1999-03-30

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Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: LEXMARK INTERNATIONAL INC.

Free format text: FORMER OWNER: NONE

Effective date: 20020721

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20020721

Address after: Gyeonggi Do, South Korea

Applicant after: Samsung Electronics Co., Ltd.

Co-applicant after: Lexmark International, Inc.

Address before: Gyeonggi Do, South Korea

Applicant before: Samsung Electronics Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20030108

Termination date: 20141125

EXPY Termination of patent right or utility model