CN109814313A - A kind of display module and mobile terminal - Google Patents
A kind of display module and mobile terminal Download PDFInfo
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- CN109814313A CN109814313A CN201910226150.7A CN201910226150A CN109814313A CN 109814313 A CN109814313 A CN 109814313A CN 201910226150 A CN201910226150 A CN 201910226150A CN 109814313 A CN109814313 A CN 109814313A
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- substrate
- display module
- guide part
- connecting portion
- flip chip
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Abstract
The invention discloses a kind of display module and mobile terminals.Display module includes: the substrate with first connecting portion, and first connecting portion is located at the first side of substrate;The back side of substrate is arranged in flexible circuit board with second connecting portion, and second connecting portion is located at the first side of flexible circuit board, and the first side of substrate and the first side of flexible circuit board are the same side of display module;Bend guide part, positioned at the first side of substrate and flexible circuit board, first connecting portion is between substrate and bending guide part, and second connecting portion is between flexible circuit board and bending guide part, and bend guide part has guide surface backwards to the side of substrate and flexible circuit board;And flip chip, one end is connected with first connecting portion, the other end around bending guide part and along guide surface towards substrate the back side bending after, be connected with second connecting portion, and flip chip are mutually attached with guide surface to carry out bending sizing, so that the form after flip chip bending is consistent.
Description
Technical field
Present document relates to technical field of mobile terminals, espespecially a kind of display module and a kind of mobile terminal.
Background technique
With the extensive use of flexible AMOLED, more and more products use the display module of AMOLED, this display
Mould group is that soft, hard integrated chip IC can not be directly bound on the backboard of display module, and flip chip COF is due to it
Flexibility and IC can be integrated, therefore be widely used in the display module of AMOLED, it may be assumed that one end of COF is connected with backboard,
The other end is connected after bending towards the back side of backboard with the flexible circuit board of display module, and form is inconsistent after COF bending.
Summary of the invention
At least one of in order to solve the above-mentioned technical problem, there is provided herein a kind of display modules, and it is curved to be able to solve COF
The inconsistent problem of form after folding.
The present invention also provides a kind of mobile terminals.
Display module provided by the invention, comprising: the substrate with first connecting portion, the first connecting portion are located at described
First side of substrate;The back side of the substrate, the second connecting portion position is arranged in flexible circuit board with second connecting portion
In the first side of the flexible circuit board, the first side of the substrate and the first side of the flexible circuit board are the display mould
The same side of group;Guide part is bent, positioned at the first side of the substrate and the flexible circuit board, the first connecting portion is in
Between the substrate and the bending guide part, the second connecting portion be in flexible circuit board and the bending guide part it
Between, the bending guide part has guide surface backwards to the side of the substrate and the flexible circuit board;And flip chip,
One end is connected with the first connecting portion, and the other end is around the bending guide part and along the guide surface towards the substrate
The back side bending after, be connected with the second connecting portion, and the flip chip mutually attached with the guide surface it is curved to carry out
Folding sizing.
Optionally, the bending guide part includes: curved surface guide section, and positioned at the first side of the substrate, the curved surface is led
There is guiding curved surface to the side backwards to the substrate of section;With face guide section directly, positioned at the substrate the back side and be in institute
It states between flexible circuit board and the curved surface guide section, the side backwards to the substrate for facing guide section directly has guiding straight
Face, the guide surface include that the guiding is faced directly and the guiding curved surface.
Optionally, the material of the bending guide part is silica gel, plastics or rubber.
Optionally, the first adhesive layer is provided on the guide surface, the flip chip are pasted onto first adhesive layer
On.
Optionally, the back side of the substrate is provided with the second adhesive layer, and it is viscous that the bending guide part is bonded in described second
It ties on layer.
Optionally, the display module further include: integrated chip is connected electrically in the flip chip.
Optionally, the integrated chip be located at the flip chip towards it is described bending guide part surface on, it is described
Bending guide part towards holding tank is provided on the surface of the flip chip, the integrated chip sinks to the holding tank
It is interior.
Optionally, the integrated chip is located on the surface of the bending guide part described backwards of the flip chip.
Optionally, the display module further include: sensor is arranged on the bending guide part, described for detecting
The contact area of flip chip and the guide surface.
Mobile terminal provided by the invention, including display module described in any of the above-described embodiment.
Compared with prior art, display module provided by the invention, one end of flip chip and the first connecting portion of substrate
It is connected, the other ends of flip chip is around bending guide part and along guide surface towards after the bending of the back side of substrate, with flexible wires
The second connecting portion of road plate is connected, and flip chip are mutually attached with guide surface to carry out bending sizing, so that flip chip are curved
Form after folding is consistent.
The other feature and advantage of this paper will illustrate in the following description, also, partly become from specification
It is clear that by implementing to understand herein.The purpose of this paper and other advantages can be by specifications, claims
And specifically noted structure is achieved and obtained in attached drawing.
Detailed description of the invention
Attached drawing is used to provide to further understand this paper technical solution, and constitutes part of specification, with this Shen
Embodiment please is used to explain the technical solution of this paper together, does not constitute the limitation to this paper technical solution.
Fig. 1 is the schematic cross-sectional view of display module in mobile terminal described in one embodiment of the invention;
Fig. 2 is the schematic cross-sectional view of display module in mobile terminal described in another embodiment of the present invention;
Fig. 3 is the schematic cross-sectional view of display module in mobile terminal described in further embodiment of the present invention.
Wherein, corresponding relationship of the Fig. 1 into Fig. 3 between appended drawing reference and component names are as follows:
1 substrate, 11 first connecting portions, 2 flexible circuit board, 21 second connecting portions, 31 curved surface guide sections, 311 guiding curved surfaces,
32 face guide section directly, and 321 guiding are faced directly, 4 flip chip, 5 integrated chips, 6 foams.
Specific embodiment
For the purposes, technical schemes and advantages of this paper are more clearly understood, below in conjunction with attached drawing to the reality of this paper
Example is applied to be described in detail.It should be noted that in the absence of conflict, the spy in embodiment and embodiment in the application
Sign can mutual any combination.
Many details are explained in the following description in order to fully understand herein, still, can also be adopted herein
Implemented with other than the one described here mode, therefore, the protection scope of this paper is not by following public specific implementation
The limitation of example.
Mobile terminal provided by the invention, as shown in Figure 1 to Figure 3, including display module, display module include: with
The substrate 1 of one interconnecting piece 11, first connecting portion 11 are located at the first side of substrate;Flexible circuit board 2 with second connecting portion 21,
The back side of substrate 1 is set, and second connecting portion 21 is located at the first side of flexible circuit board 2, the first side of substrate 1 and flexible circuitry
First side of plate 2 is the same side of display module;Guide part is bent, while being located at the first side of substrate 1 and flexible circuit board 2,
First connecting portion 11 is between substrate 1 and bending guide part, and second connecting portion 21 is in flexible circuit board 2 and bending guide part
Between, bend guide part has guide surface backwards to the side of substrate 1 and flexible circuit board;With flip chip 4, one end and the
One interconnecting piece 11 is connected, the other end around bending guide part and along guide surface towards substrate 1 the back side bending after, with second connect
Socket part 21 is connected, and flip chip 4 are mutually attached with guide surface to carry out bending sizing.
Wherein, the first side of substrate 1 and the first side of flexible circuit board 2 are the same side of display module, can be display
Upside, downside, left or right side of mould group etc., can be achieved the purpose of the application, and objective is thought without departing from design of the invention
Think, details are not described herein, in the protection scope that should belong to the application.The back side of substrate 1 is behind substrate 1.The back of substrate 1
It is before substrate 1 to the front of flexible circuit board 2.
The mobile terminal, one end of flip chip 4 are connected with the first connecting portion 11 of substrate 1, flip chip 4 it is another
End is around bending guide part and along guide surface towards after the bending of the back side of substrate 1,21 phase of second connecting portion with flexible circuit board 2
Connection, and flip chip 4 are mutually attached with guide surface to carry out bending sizing, so that the form after flip chip 4 are bent is consistent.
It, can by above formula according to magnetic flux phi=B (magnetic induction intensity) * S (curved surface) when being applied to mobile terminal
To find out, magnetic flux is direct proportion correlation with surface area, and surface area is smaller, and magnetic flux is smaller, therefore is led by design of Simulation
Reduce the surface area after flip chip 4 are bent (form is also consistent after flip chip 4 are bent) to face, reduces antenna for mobile phone
(guide surface and flip chip 4 fit together, therebetween without gap, after flip chip 4 are bent for influence to display module
Surface area it is smaller, therefore antenna effect curved surface it is just smaller, be able to ascend anti-interference ability).
Specifically, as shown in Figure 1 to Figure 3, bending guide part includes: curved surface guide section 31, positioned at the first side of substrate 1,
The side backwards to substrate 1 of curved surface guide section 31 has guiding curved surface 311;With face guide section 32 directly, positioned at substrate 1 the back side,
And in the side backwards to substrate 1 between flexible circuit board 2 and curved surface guide section 31, facing guide section 32 directly there is guiding to face directly
321, guide surface includes that guiding faces 321 and guiding curved surface 311 directly, reduces the area of guiding curved surface 311 by design of Simulation,
When applied to mobile terminal, interference of the antenna (electromagnetic wave of generation) to display module can be reduced.
Specifically, the material for bending guide part is silica gel, plastics or rubber etc., and the purpose of the application, ancestor can be achieved
Purport is without departing from design philosophy of the invention, and details are not described herein, in the protection scope that should belong to the application.
Specifically, the first adhesive layer is provided on guide surface, flip chip 4 are pasted on the first adhesive layer, by leading
It is preferably carried out shaping in face of flip chip 4.
Specifically, the back side of substrate 1 is provided with the second adhesive layer, and bending guide part is bonded on the second adhesive layer, with right
Flexible circuit board 2 and bending guide part are positioned on substrate 1.
The back side of substrate 1 is provided with foam 6, and flexible circuit board 2 is arranged on foam 6, and bending guide part is viscous by second
Knot layer is bonded on foam 6.First adhesive layer and the second adhesive layer are layers of two-sided.
Specifically, substrate 1 is the array substrate 1 of LCD display module or the backboard of OLED display module.
In one exemplary embodiment, as shown in Figures 2 and 3, display module further include: integrated chip 5 is connected electrically in and covers
On brilliant film 4, it can be and integrated chip 5 is integrated in flip chip 4.
It can be, as shown in Fig. 2, integrated chip 5 is located on the surface of direction bending guide part of flip chip 4, bending
Guide part towards holding tank is provided on the surface of flip chip 4, integrated chip 5 is sunk in holding tank.
Wherein, the thickness for bending guide part is greater than the thickness of integrated chip 5, hurts substrate 1 to avoid its top, bends guide part
It is attached on the foam 6 at 1 back side of substrate before the bending of flip chip 4, then flip chip 4 is bent, are wanted to flip chip 4
When bending, it is pasted onto flip chip 4 on guide surface and fixes.
Or can be, as shown in figure 3, integrated chip 5 is located on the surface of the guide part of bending backwards of flip chip 4.
When integrated chip 5 is placed on the surface of the guide part of bending backwards of flip chip 4,4 demand of flip chip
Crooked process radius can be reduced accordingly, and the radius of the guiding curved surface 311 designed in this case also reduces, and first bending guide part is pasted
On the foam 6 at 1 back side of substrate, then flip chip 4 are bent, when flip chip 4 are bent, keep flip chip 4 viscous
It is attached on guide surface and fixes.
It is worth noting that, no matter integrated chip 5 in which side of flip chip 4, bending guide part can be according to reality
Demand carry out size shape adjustment.A smallest crooked process radius can be obtained, then by emulating corresponding bending simulation
It draws up further according to this crease die and makees bending guide part, to reduce antenna when being applied to mobile terminal to the shadow of display module
It rings.
In one exemplary embodiment, display module further include: sensor (not shown), setting is in bending guide part
On, for detecting the contact area of flip chip 4 Yu guide surface.Flip chip 4 are bent by bending mechanism, and sensor can
To be pressure sensor, pressure sensor is electrically connected with the control device of bending mechanism.
When bending mechanism bends flip chip 4, the contact area in flip chip 4 and guide surface can be set to
When more than 80%, control device controls bending mechanism and stops bending flip chip 4.
In conclusion display module provided by the invention, one end of flip chip is connected with the first connecting portion of substrate,
The other end of flip chip around bending guide part and along guide surface towards after the bending of the back side of substrate, with flexible circuit board the
Two interconnecting pieces are connected, and flip chip are mutually attached with guide surface to carry out bending sizing, so that the shape after flip chip bending
State is consistent.
In description herein, term " installation ", " connected ", " connection ", " fixation " etc. be shall be understood in a broad sense, for example,
" connection " may be fixed connection or may be dismantle connection, or integral connection;It can be directly connected, can also lead to
Intermediary is crossed to be indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning herein.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of this paper
In example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.
Moreover, the particular features, structures, materials, or characteristics of description can be in any one or more of the embodiments or examples with suitable
Mode combine.
Although embodiment disclosed herein is as above, the content only implementation of use herein for ease of understanding
Mode is not limited to herein.Technical staff in any this paper fields, do not depart from spirit disclosed herein and
Under the premise of range, any modification and variation, but the patent protection model of this paper can be carried out in the form and details of implementation
It encloses, still should be subject to the scope of the claims as defined in the appended claims.
Claims (10)
1. a kind of display module characterized by comprising
Substrate with first connecting portion, the first connecting portion are located at the first side of the substrate;
Flexible circuit board with second connecting portion, is arranged in the back side of the substrate, and the second connecting portion is located at described soft
Property wiring board the first side, the first side of the first side of the substrate and the flexible circuit board is the same of the display module
Side;
Guide part is bent, positioned at the first side of the substrate and the flexible circuit board, the first connecting portion is in the base
Between plate and the bending guide part, the second connecting portion is between the flexible circuit board and the bending guide part,
The bending guide part has guide surface backwards to the side of the substrate and the flexible circuit board;With
Flip chip, one end are connected with the first connecting portion, and the other end is led around the bending guide part and along described
To after being bent facing towards the back side of the substrate, it is connected with the second connecting portion, and the flip chip and the guiding
Face mutually attaches to carry out bending sizing.
2. display module according to claim 1, which is characterized in that the bending guide part includes:
Curved surface guide section, positioned at the first side of the substrate, the side backwards to the substrate of the curved surface guide section, which has, is led
To curved surface;With
Face guide section directly, positioned at the substrate the back side and between the flexible circuit board and the curved surface guide section, institute
State face directly guide section backwards to the substrate side have guiding face directly, the guide surface include it is described guiding face directly with it is described
It is oriented to curved surface.
3. display module according to claim 1, which is characterized in that the material of the bending guide part is silica gel, plastics
Or rubber.
4. display module according to claim 1, which is characterized in that be provided with the first adhesive layer, institute on the guide surface
Flip chip are stated to be pasted on first adhesive layer.
5. display module according to claim 1, which is characterized in that the back side of the substrate is provided with the second adhesive layer,
The bending guide part is bonded on second adhesive layer.
6. display module according to any one of claim 1 to 5, which is characterized in that further include:
Integrated chip is connected electrically in the flip chip.
7. display module according to claim 6, which is characterized in that the integrated chip is located at the court of the flip chip
To on the surface of the bending guide part, the bending guide part towards being provided with receiving on the surface of the flip chip
Slot, the integrated chip are sunk in the holding tank.
8. display module according to claim 6, which is characterized in that the integrated chip is located at the back of the flip chip
To on the surface of the bending guide part.
9. display module according to any one of claim 1 to 5, which is characterized in that further include:
Sensor is arranged on the bending guide part, for detecting the contact area of the flip chip Yu the guide surface.
10. a kind of mobile terminal, which is characterized in that include display module as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
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CN201910226150.7A CN109814313B (en) | 2019-03-25 | 2019-03-25 | Display module assembly and mobile terminal |
Applications Claiming Priority (1)
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CN201910226150.7A CN109814313B (en) | 2019-03-25 | 2019-03-25 | Display module assembly and mobile terminal |
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CN109814313A true CN109814313A (en) | 2019-05-28 |
CN109814313B CN109814313B (en) | 2022-04-22 |
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CN201910226150.7A Active CN109814313B (en) | 2019-03-25 | 2019-03-25 | Display module assembly and mobile terminal |
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Cited By (2)
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CN110767092A (en) * | 2019-11-05 | 2020-02-07 | 京东方科技集团股份有限公司 | Display device |
CN112201154A (en) * | 2020-10-30 | 2021-01-08 | 京东方科技集团股份有限公司 | Display module and display device |
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CN108986661A (en) * | 2018-06-04 | 2018-12-11 | 昆山国显光电有限公司 | Flexible base board, production method and display device |
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CN109814313B (en) | 2022-04-22 |
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