CN109813730A - A kind of chipping method for quickly detecting after sapphire substrate sheet slice - Google Patents
A kind of chipping method for quickly detecting after sapphire substrate sheet slice Download PDFInfo
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- CN109813730A CN109813730A CN201910103297.7A CN201910103297A CN109813730A CN 109813730 A CN109813730 A CN 109813730A CN 201910103297 A CN201910103297 A CN 201910103297A CN 109813730 A CN109813730 A CN 109813730A
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- Prior art keywords
- sapphire substrate
- substrate sheet
- wafer case
- binder
- quickly detecting
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Abstract
The invention discloses the chipping method for quickly detecting after a kind of sapphire substrate sheet slice, the method is as follows: the sapphire substrate sheet after cutting successively being taken out and is put in wafer case in order；Wafer case is placed on binder, binder is shaken, the sapphire substrate sheet pingbian in wafer case is shaken to top；It is irradiated using strong light in wafer case oblique upper；Sapphire substrate sheet marginal portion is examined with the presence or absence of shining point, stops shaking binder after finding the part of shining point, flash portion is identified with marking pen；Continue to shake binder, until sapphire substrate sheet completes 360 ° of rotations in wafer case；It repeats the above steps；Sapphire substrate sheet with color identifier is taken out out of wafer case and completes checking procedure.The method increase the checkabilities after sapphire substrate sheet slice, have saved cost of human resources, have reduced fragment rate, the sliver rate of grinding process, improve the processing efficiency and product yield of grinding process.
Description
Technical field
The invention belongs to sapphire manufacture fields, and in particular to the chipping after a kind of sapphire substrate sheet slice is quickly examined
Method.
Background technique
Sapphire (Sapphire) crystal has excellent optical property, physical property and stable chemical property, extensively
Applied to high-brightness LED substrate material.Sapphire substrate sheet generallys use the method for diamond wire cutting sapphire crystal bar to prepare,
Due to the hard brittleness of sapphire material itself, after dicing during (especially cutting process exist broken string when), in indigo plant
Jewel substrate slice edge will form chipping defect, and the sapphire substrate sheet with chipping circulates to grinding process, grind
Process easily causes sliver, fragmentation.In the prior art, the inspection using artificial monolithic is examined in sapphire substrate sheet chipping after slice
Mode, it is low that there are working efficiencies, picks and places sapphire substrate sheet repeatedly, can collide during pick-and-place, generates new chipping and lacks
Fall into
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides the quick inspection party of chipping after a kind of sapphire substrate sheet slice
Method is changed to every 25 boxes by original monolithic inspection and tests, need not pick and place repeatedly Sapphire Substrate in checkout procedure
Piece avoids and generates new chipping defect, and the method increase the checkabilities after sapphire substrate sheet slice, has saved manpower
Resources costs reduce fragment rate, the sliver rate of grinding process, improve the processing efficiency and product yield of grinding process.
The present invention is achieved by the following technical solutions:
A kind of chipping method for quickly detecting after sapphire substrate sheet slice, comprising the following steps:
After step 1) diamond wire multi-line cutting machine cutting process automatic running, by the sapphire substrate sheet after cutting according to
Secondary taking-up is simultaneously put in wafer case in order；
Wafer case is placed on binder by step 2), binder is shaken, by the sapphire substrate sheet pingbian in wafer case
It shakes to top；
Step 3) is irradiated for 40~60 ° using strong light in wafer case oblique upper；
Step 4) shakes binder with the speed of 50~80 °/min；
Step 5) examines sapphire substrate sheet marginal portion with the presence or absence of shining point, stops after finding the part of shining point
Binder is only shaken, flash portion is identified with marking pen；
Step 6) continues to shake binder, until sapphire substrate sheet completes 360 ° of rotations in wafer case；
Step 7) is placed on binder after wafer case is overturn 180 °, repeats step 3) to step 6)；
Step 8) takes out the sapphire substrate sheet with color identifier out of wafer case, which is that marginal portion is deposited
In the sapphire substrate sheet of chipping.
Preferably, it is 25 that the sapphire substrate sheet after the step 1) cutting, which puts the quantity in wafer case,.
Preferably, mobile phone or flashlight can be used in step 3) the strong light.
Beneficial effects of the present invention are as follows:
Chipping method for quickly detecting after sapphire substrate sheet slice of the invention, every 25 boxes are tested, are examined
Sapphire substrate sheet need not be picked and placed repeatedly in the process, avoid and generate new chipping defect, can quickly have edge
The sapphire substrate sheet of chipping is picked out, and the checkability after improving sapphire substrate sheet slice has saved human resources
Cost；Meanwhile the fragment rate of grinding process, sliver rate are reduced, improve the processing efficiency and product yield of grinding process.
Specific embodiment
Present invention is further elaborated in following combination specific embodiment.
Embodiment 1
A kind of chipping method for quickly detecting after sapphire substrate sheet slice, comprising the following steps:
(1) after diamond wire multi-line cutting machine cutting process automatic running, successively by the sapphire substrate sheet after cutting
It takes out and is put in wafer case (25, every box) in order；
(2) wafer case is placed on binder, shakes binder, the sapphire substrate sheet pingbian in wafer case is shaken
To top；
(3) it is irradiated for 40~60 ° with strong light mobile phone or flashlight in wafer case oblique upper；
(4) binder is shaken with the speed of 50~80 °/min；
(5) sapphire substrate sheet marginal portion is examined with the presence or absence of shining point, is stopped after finding the part of shining point
Binder is shaken, flash portion is identified with marking pen；
(6) continue to shake binder, until sapphire substrate sheet completes 360 ° of rotations in wafer case；
(7) it is placed on binder after wafer case being overturn 180 °, repeats step (3)~(6)；
(8) sapphire substrate sheet with color identifier is taken out out of wafer case, which is that marginal portion exists
The sapphire substrate sheet of chipping.
Claims (3)
1. the chipping method for quickly detecting after a kind of sapphire substrate sheet slice, which comprises the following steps:
After step 1) diamond wire multi-line cutting machine cutting process automatic running, the sapphire substrate sheet after cutting is successively taken
It puts in wafer case out and in order；
Wafer case is placed on binder by step 2), shakes binder, the sapphire substrate sheet pingbian in wafer case is shaken
To top；
Step 3) is irradiated for 40~60 ° using strong light in wafer case oblique upper；
Step 4) shakes binder with the speed of 50~80 °/min；
Step 5) examines sapphire substrate sheet marginal portion with the presence or absence of shining point, stops shaking after finding the part of shining point
Dynamic binder, is identified flash portion with marking pen；
Step 6) continues to shake binder, until sapphire substrate sheet completes 360 ° of rotations in wafer case；
Step 7) is placed on binder after wafer case is overturn 180 °, repeats step 3) to step 6)；
Step 8) takes out the sapphire substrate sheet with color identifier out of wafer case, which is that marginal portion presence is collapsed
The sapphire substrate sheet on side.
2. the chipping method for quickly detecting after a kind of sapphire substrate sheet slice according to claim 1, which is characterized in that
It is 25 that sapphire substrate sheet after the step 1) cutting, which puts the quantity in wafer case,.
3. the chipping method for quickly detecting after a kind of sapphire substrate sheet slice according to claim 1, which is characterized in that
Mobile phone or flashlight can be used in step 3) the strong light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910103297.7A CN109813730A (en) | 2019-02-01 | 2019-02-01 | A kind of chipping method for quickly detecting after sapphire substrate sheet slice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910103297.7A CN109813730A (en) | 2019-02-01 | 2019-02-01 | A kind of chipping method for quickly detecting after sapphire substrate sheet slice |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109813730A true CN109813730A (en) | 2019-05-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910103297.7A Pending CN109813730A (en) | 2019-02-01 | 2019-02-01 | A kind of chipping method for quickly detecting after sapphire substrate sheet slice |
Country Status (1)
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| CN (1) | CN109813730A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110441322A (en) * | 2019-08-29 | 2019-11-12 | 江苏吉星新材料有限公司 | A kind of padding inspection gimmick of sapphire ingot |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203658283U (en) * | 2014-01-14 | 2014-06-18 | 山东天岳先进材料科技有限公司 | Sapphire ingot detection device |
| CN106461573A (en) * | 2014-04-03 | 2017-02-22 | 纬图有限责任公司 | Method and system for optical inspection of sapphire element |
-
2019
- 2019-02-01 CN CN201910103297.7A patent/CN109813730A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203658283U (en) * | 2014-01-14 | 2014-06-18 | 山东天岳先进材料科技有限公司 | Sapphire ingot detection device |
| CN106461573A (en) * | 2014-04-03 | 2017-02-22 | 纬图有限责任公司 | Method and system for optical inspection of sapphire element |
Non-Patent Citations (1)
| Title |
|---|
| 徐晓明 等: "蓝宝石衬底基片工艺质量检测指标及方法的研究进展", 《现代制造工程》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110441322A (en) * | 2019-08-29 | 2019-11-12 | 江苏吉星新材料有限公司 | A kind of padding inspection gimmick of sapphire ingot |
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Application publication date: 20190528 |