CN109804276A - Antireflection material - Google Patents
Antireflection material Download PDFInfo
- Publication number
- CN109804276A CN109804276A CN201780063069.0A CN201780063069A CN109804276A CN 109804276 A CN109804276 A CN 109804276A CN 201780063069 A CN201780063069 A CN 201780063069A CN 109804276 A CN109804276 A CN 109804276A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- weight
- antireflection material
- porous inorganic
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 254
- 229920005989 resin Polymers 0.000 claims abstract description 132
- 239000011347 resin Substances 0.000 claims abstract description 132
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 112
- 239000011256 inorganic filler Substances 0.000 claims abstract description 91
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 91
- 230000003287 optical effect Effects 0.000 claims abstract description 91
- 239000004065 semiconductor Substances 0.000 claims abstract description 66
- 230000002401 inhibitory effect Effects 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims description 128
- 229920000647 polyepoxide Polymers 0.000 claims description 128
- 239000000203 mixture Substances 0.000 claims description 121
- 239000011342 resin composition Substances 0.000 claims description 55
- 238000004519 manufacturing process Methods 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 28
- 239000000945 filler Substances 0.000 claims description 26
- 238000007711 solidification Methods 0.000 claims description 25
- 230000008023 solidification Effects 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 19
- 238000011049 filling Methods 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 23
- 230000004907 flux Effects 0.000 abstract description 18
- -1 spinelle Substances 0.000 description 224
- 229920001296 polysiloxane Polymers 0.000 description 112
- 238000001723 curing Methods 0.000 description 106
- 150000001875 compounds Chemical class 0.000 description 67
- 239000003795 chemical substances by application Substances 0.000 description 60
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 57
- 125000000217 alkyl group Chemical group 0.000 description 52
- 125000003700 epoxy group Chemical group 0.000 description 45
- 125000003342 alkenyl group Chemical group 0.000 description 39
- 239000002585 base Substances 0.000 description 39
- 239000003054 catalyst Substances 0.000 description 39
- 239000004593 Epoxy Substances 0.000 description 38
- 229910052799 carbon Inorganic materials 0.000 description 34
- 230000006870 function Effects 0.000 description 27
- 239000000126 substance Substances 0.000 description 27
- 239000004925 Acrylic resin Substances 0.000 description 26
- 229920000178 Acrylic resin Polymers 0.000 description 26
- 125000003118 aryl group Chemical group 0.000 description 26
- 125000000962 organic group Chemical group 0.000 description 26
- 150000002118 epoxides Chemical class 0.000 description 25
- 150000001721 carbon Chemical group 0.000 description 24
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 24
- 229910052710 silicon Inorganic materials 0.000 description 23
- 239000003921 oil Substances 0.000 description 22
- 239000000377 silicon dioxide Substances 0.000 description 22
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 20
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 19
- 238000002156 mixing Methods 0.000 description 17
- 150000008065 acid anhydrides Chemical class 0.000 description 16
- 238000007259 addition reaction Methods 0.000 description 16
- 125000001118 alkylidene group Chemical group 0.000 description 16
- 125000002723 alicyclic group Chemical group 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 15
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 15
- 150000005846 sugar alcohols Polymers 0.000 description 15
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 230000005661 hydrophobic surface Effects 0.000 description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 13
- 238000003756 stirring Methods 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- 230000009102 absorption Effects 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 12
- 150000008064 anhydrides Chemical class 0.000 description 12
- 238000006482 condensation reaction Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 150000002148 esters Chemical group 0.000 description 11
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 11
- 238000007789 sealing Methods 0.000 description 11
- 239000003566 sealing material Substances 0.000 description 11
- 238000004381 surface treatment Methods 0.000 description 11
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- 230000008859 change Effects 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 125000001931 aliphatic group Chemical group 0.000 description 9
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 125000004450 alkenylene group Chemical group 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 8
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 8
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 150000002460 imidazoles Chemical class 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 8
- 150000002989 phenols Chemical class 0.000 description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- 229920002554 vinyl polymer Polymers 0.000 description 8
- 239000004215 Carbon black (E152) Substances 0.000 description 7
- 235000010724 Wisteria floribunda Nutrition 0.000 description 7
- 125000003710 aryl alkyl group Chemical group 0.000 description 7
- 238000004040 coloring Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 7
- 229930195733 hydrocarbon Natural products 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 238000005286 illumination Methods 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 229920001021 polysulfide Polymers 0.000 description 7
- 239000005077 polysulfide Substances 0.000 description 7
- 150000008117 polysulfides Polymers 0.000 description 7
- 229920005573 silicon-containing polymer Polymers 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001298 alcohols Chemical class 0.000 description 6
- 238000005984 hydrogenation reaction Methods 0.000 description 6
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 150000003961 organosilicon compounds Chemical class 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 238000010538 cationic polymerization reaction Methods 0.000 description 5
- 229930003836 cresol Natural products 0.000 description 5
- 238000006735 epoxidation reaction Methods 0.000 description 5
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 239000004848 polyfunctional curative Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 125000005372 silanol group Chemical group 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N N,N-Diethylethanamine Substances CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 4
- 229910020388 SiO1/2 Inorganic materials 0.000 description 4
- 229910020447 SiO2/2 Inorganic materials 0.000 description 4
- 229910020487 SiO3/2 Inorganic materials 0.000 description 4
- 229910020485 SiO4/2 Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 150000007973 cyanuric acids Chemical class 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 125000005842 heteroatom Chemical group 0.000 description 4
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 125000005647 linker group Chemical group 0.000 description 4
- 150000007524 organic acids Chemical class 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 235000013824 polyphenols Nutrition 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- 235000012222 talc Nutrition 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 3
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- 125000003302 alkenyloxy group Chemical group 0.000 description 3
- 239000010426 asphalt Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 239000013522 chelant Substances 0.000 description 3
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002285 radioactive effect Effects 0.000 description 3
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 3
- 238000006884 silylation reaction Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
- HOZMLTCHTRHKRK-UHFFFAOYSA-N 2-methyl-1-silylprop-2-en-1-one Chemical class CC(=C)C([SiH3])=O HOZMLTCHTRHKRK-UHFFFAOYSA-N 0.000 description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 2
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 2
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 2
- RRXFVFZYPPCDAW-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethoxymethyl)-7-oxabicyclo[4.1.0]heptane Chemical class C1CC2OC2CC1COCC1CC2OC2CC1 RRXFVFZYPPCDAW-UHFFFAOYSA-N 0.000 description 2
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- AFUWHLXUBJOPNO-UHFFFAOYSA-N CCCCCCCCCCCCCCCC[SiH3] Chemical compound CCCCCCCCCCCCCCCC[SiH3] AFUWHLXUBJOPNO-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229910002046 SYLYSIA SY430 Inorganic materials 0.000 description 2
- 229910020175 SiOH Inorganic materials 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910052771 Terbium Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 229940125717 barbiturate Drugs 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000002619 bicyclic group Chemical group 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 150000001642 boronic acid derivatives Chemical class 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical class NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000010459 dolomite Substances 0.000 description 2
- 229910000514 dolomite Inorganic materials 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000010433 feldspar Substances 0.000 description 2
- 150000004675 formic acid derivatives Chemical class 0.000 description 2
- 229910052839 forsterite Inorganic materials 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 210000004276 hyalin Anatomy 0.000 description 2
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 150000002940 palladium Chemical class 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000734 polysilsesquioxane polymer Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 150000003283 rhodium Chemical class 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- RAOIDOHSFRTOEL-UHFFFAOYSA-N tetrahydrothiophene Chemical group C1CCSC1 RAOIDOHSFRTOEL-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 229950004288 tosilate Drugs 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910052845 zircon Inorganic materials 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- VKMQKNJWQNCEQV-UHFFFAOYSA-N (4-methylphenyl)boron Chemical compound [B]C1=CC=C(C)C=C1 VKMQKNJWQNCEQV-UHFFFAOYSA-N 0.000 description 1
- 125000005837 1,2-cyclopentylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:1])C([H])([*:2])C1([H])[H] 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- 125000005838 1,3-cyclopentylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:2])C([H])([H])C1([H])[*:1] 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- ZVDSMYGTJDFNHN-UHFFFAOYSA-N 2,4,6-trimethylbenzene-1,3-diamine Chemical class CC1=CC(C)=C(N)C(C)=C1N ZVDSMYGTJDFNHN-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical class CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
- ICQLQVWXFUWFRI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)propanenitrile Chemical compound N#CC(C)N1C=CN=C1C ICQLQVWXFUWFRI-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KZMAWJRXKGLWGS-UHFFFAOYSA-N 2-chloro-n-[4-(4-methoxyphenyl)-1,3-thiazol-2-yl]-n-(3-methoxypropyl)acetamide Chemical compound S1C(N(C(=O)CCl)CCCOC)=NC(C=2C=CC(OC)=CC=2)=C1 KZMAWJRXKGLWGS-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- RQEOBXYYEPMCPJ-UHFFFAOYSA-N 4,6-diethyl-2-methylbenzene-1,3-diamine Chemical class CCC1=CC(CC)=C(N)C(C)=C1N RQEOBXYYEPMCPJ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- JDBDDNFATWXGQZ-UHFFFAOYSA-N 5-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1=CC(C)CC2C(=O)OC(=O)C12 JDBDDNFATWXGQZ-UHFFFAOYSA-N 0.000 description 1
- CSHJJWDAZSZQBT-UHFFFAOYSA-N 7a-methyl-4,5-dihydro-3ah-2-benzofuran-1,3-dione Chemical compound C1=CCCC2C(=O)OC(=O)C21C CSHJJWDAZSZQBT-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 241000551547 Dione <red algae> Species 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 206010018612 Gonorrhoea Diseases 0.000 description 1
- NDJKXXJCMXVBJW-UHFFFAOYSA-N Heptadecane Natural products CCCCCCCCCCCCCCCCC NDJKXXJCMXVBJW-UHFFFAOYSA-N 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- UIEXFJVOIMVETD-UHFFFAOYSA-N P([O-])([O-])[O-].[Pt+3] Chemical compound P([O-])([O-])[O-].[Pt+3] UIEXFJVOIMVETD-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical class C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical group C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- QYSYEILYXGRUOM-UHFFFAOYSA-N [Cl].[Pt] Chemical compound [Cl].[Pt] QYSYEILYXGRUOM-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 150000004729 acetoacetic acid derivatives Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001260 acyclic compounds Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000002820 allylidene group Chemical group [H]C(=[*])C([H])=C([H])[H] 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000005576 amination reaction Methods 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- ZRALSGWEFCBTJO-UHFFFAOYSA-N anhydrous guanidine Natural products NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052586 apatite Inorganic materials 0.000 description 1
- 125000005410 aryl sulfonium group Chemical group 0.000 description 1
- 125000004069 aziridinyl group Chemical group 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical compound [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- VZWXIQHBIQLMPN-UHFFFAOYSA-N chromane Chemical group C1=CC=C2CCCOC2=C1 VZWXIQHBIQLMPN-UHFFFAOYSA-N 0.000 description 1
- 229940075614 colloidal silicon dioxide Drugs 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- NZNMSOFKMUBTKW-UHFFFAOYSA-M cyclohexanecarboxylate Chemical compound [O-]C(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-M 0.000 description 1
- WVIIMZNLDWSIRH-UHFFFAOYSA-N cyclohexylcyclohexane Chemical compound C1CCCCC1C1CCCCC1 WVIIMZNLDWSIRH-UHFFFAOYSA-N 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical group C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- PWAPCRSSMCLZHG-UHFFFAOYSA-N cyclopentylidene Chemical group [C]1CCCC1 PWAPCRSSMCLZHG-UHFFFAOYSA-N 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- KEIQPMUPONZJJH-UHFFFAOYSA-N dicyclohexylmethanediamine Chemical compound C1CCCCC1C(N)(N)C1CCCCC1 KEIQPMUPONZJJH-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 125000001153 fluoro group Chemical class F* 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 125000003976 glyceryl group Chemical group [H]C([*])([H])C(O[H])([H])C(O[H])([H])[H] 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 150000002390 heteroarenes Chemical class 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052588 hydroxylapatite Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 125000003387 indolinyl group Chemical group N1(CCC2=CC=CC=C12)* 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052909 inorganic silicate Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- TVIDDXQYHWJXFK-UHFFFAOYSA-N n-Dodecanedioic acid Natural products OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 1
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 1
- 239000010434 nepheline Substances 0.000 description 1
- 229910052664 nepheline Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical group CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- YOURXVGYNVXQKT-UHFFFAOYSA-N oxacycloundecane-2,11-dione Chemical compound O=C1CCCCCCCCC(=O)O1 YOURXVGYNVXQKT-UHFFFAOYSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- DIVDFFZHCJEHGG-UHFFFAOYSA-N oxidopamine Chemical compound NCCC1=CC(O)=C(O)C=C1O DIVDFFZHCJEHGG-UHFFFAOYSA-N 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- JLFNLZLINWHATN-UHFFFAOYSA-N pentaethylene glycol Chemical compound OCCOCCOCCOCCOCCO JLFNLZLINWHATN-UHFFFAOYSA-N 0.000 description 1
- OYLRFHLPEAGKJU-UHFFFAOYSA-N phosphane silicic acid Chemical compound P.[Si](O)(O)(O)O OYLRFHLPEAGKJU-UHFFFAOYSA-N 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical compound P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 125000004193 piperazinyl group Chemical group 0.000 description 1
- 125000003386 piperidinyl group Chemical group 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical group [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011973 solid acid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- WHLUQAYNVOGZST-UHFFFAOYSA-N tifenamil Chemical group C=1C=CC=CC=1C(C(=O)SCCN(CC)CC)C1=CC=CC=C1 WHLUQAYNVOGZST-UHFFFAOYSA-N 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AKQNYQDSIDKVJZ-UHFFFAOYSA-N triphenylsilane Chemical compound C1=CC=CC=C1[SiH](C=1C=CC=CC=1)C1=CC=CC=C1 AKQNYQDSIDKVJZ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Elements Other Than Lenses (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The purpose of the present invention is to provide a kind of antireflection materials, the optical semiconductor device being sealed to form with photosemiconductor by the antireflection material, the antireflection material has sufficient anti-reflection function, and it can prevent the total light flux of light source from reducing, and there is high-fire resistance (especially hot water resistance).The purpose of the present invention is to provide a kind of antireflection materials, and the optical semiconductor device that photosemiconductor is sealed to form by the antireflection material, the antireflection material includes the solidfied material for being dispersed with the resin combination of hydrophobic porous inorganic filler, wherein, the bumps for inhibiting reflection are formed on the surface of the solidfied material.
Description
Technical field
The present invention relates to antireflection materials.In addition, the present invention relates to optical semiconductors sealed by the antireflection material and
Obtained optical semiconductor device.In addition, the present invention relates to the resin combination for being suitable for manufacturing the antireflection material and using
The manufacturing method of the antireflection material of the resin combination.The Japan proposed this application claims on October 11st, 2016 in Japan
The priority of Patent 2016-200397, and its contents are hereby incorporated herein by reference.
Background technique
In recent years, various within doors or in room outer display board, traffic signals, giant display unit etc., gradually adopt by
Light emitting device (optical semiconductor device) of the optical semiconductor (LED element) as light source.As such optical semiconductor device,
It has popularized usually on substrate (optical semiconductor board for mounting electronic) equipped with optical semiconductor, and photosemiconductor member
The optical semiconductor device that part is sealed to form by transparent sealing material.On the sealing material in such optical semiconductor device,
Reduction visual due to caused by the total reflection of the incident light from external illumination light, sunlight etc. in order to prevent,
Anti-reflex treated is implemented on surface.
In the past, the method for assigning anti-reflection function as the surface to resin layer, there is known: by bead, silica
Deng inorganic filler be dispersed in resin, to make the method for scatter incident light (for example, see patent document 1).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2007-234767
Summary of the invention
Technical problem solved by the invention
However, in the case where using in the resin of optical semiconductor sealing by the method for patent document 1, it is found that be difficult to assign
Sufficient anti-reflection function is given, and ensures the total light flux of light source.I.e., it was found that following equilibrium relations: an adequate amount of when adding
When inorganic filler is to obtain sufficient anti-reflection function, the significant reduction of the total light flux of light source, and matching when reduction inorganic filler
When resultant is to prevent the total light flux of light source from reducing, sufficient antireflection ability cannot be obtained.
In addition, in recent years, the high-output power of optical semiconductor device continues to develop, close in this optical semiconductor device
Closure material is also required to high-fire resistance (especially hot water resistance.Hereinafter, when referred to as " heat resistance ", also comprising " resistance to
It is heated aqueous ") etc. durabilities.
Therefore, it is an object of the present invention to provide a kind of antireflection material, which not only has adequately
Anti-reflection function, additionally it is possible to prevent the reduction of the total light flux of light source, and there is high-fire resistance, especially hot water resistance.
Further, it is another object of the present invention to provide the above-mentioned antireflection material for sealing photosemiconductor.
Further, it is another object of the present invention to provide a kind of optical semiconductor device, wherein optical semiconductor is above-mentioned
Antireflection material is sealed.
Further, it is another object of the present invention to provide be suitable for manufacture above-mentioned antireflection material resin combination and
The manufacturing method of the above-mentioned antireflection material of the resin combination is used.
Solve the technological means of technical problem
The inventors of the present invention's discovery: when the combined amount of inorganic filler is reduced, the original of sufficient antireflection ability cannot be obtained
Therefore first is that, inorganic filler is due to settling without being diffused on entire resin layer, as a result, will not be formed on the whole surface
Uniform concave-convex, therefore, incident light cannot be scattered effectively, on the other hand, when increase combined amount is so that even if inorganic fill out
Material can also be when obtaining antireflection ability even if generation sedimentation on the surface of entire resin layer, inorganic filler itself absorbs light,
The significant reduction of total light flux.
To solve the above-mentioned problems, the inventors of the present invention have made intensive studies, as a result, it has been found that, when being mixed into hydrophobic porous nothing
Machine filler as constitute antireflection material resin layer in filler when, sufficient antireflection can be assigned a small amount of addition
Function, and also there is high-fire resistance.It is provided as a result, with sufficient anti-reflection function and excellent heat resistance and light source
Total light flux will not significant reduced antireflection material, and it was found that above-mentioned material is highly suitable as to optical semiconductor device
In the material that is sealed of optical semiconductor, so as to complete the present invention.
That is, the present invention provides a kind of antireflection material, it includes the resin combinations for being dispersed with hydrophobic porous inorganic filler
The solidfied material of object, wherein the bumps for inhibiting reflection are formed on the surface of the solidfied material.
In above-mentioned antireflection material, above-mentioned hydrophobic porous inorganic filler is perfectly even dispersed in entire above-mentioned solidfied material
In, and the bumps for inhibiting reflection are formed on the surface of the solidfied material.
In above-mentioned antireflection material, it is hydrophobic that above-mentioned hydrophobic porous inorganic filler is that the surface of porous inorganic filling materials have passed through
Property processing obtained from filler, the specific surface area of porous inorganic filling materials before hydrophobicity processing can be 200m2/ g or more.
In above-mentioned antireflection material, the average grain diameter of above-mentioned hydrophobic porous inorganic filler can be 1 μm~20 μm.
In above-mentioned antireflection material, above-mentioned hydrophobic porous inorganic filler is relative to antireflection material total amount (100 weights
Measure %) content can be 4~40 weight %.
In above-mentioned antireflection material, above-mentioned resin combination may include transparent hardening resin composition.
In above-mentioned antireflection material, above-mentioned hardening resin composition may include the composition containing epoxy resin.
Above-mentioned antireflection material can be used for sealing photosemiconductor.
In addition, the present invention provides a kind of optical semiconductor device, wherein optical semiconductor is close by above-mentioned antireflection material institute
Envelope.
In addition, the present invention provides a kind of resin combination, it is dispersed with hydrophobic porous inorganic filler, wherein the tree
Oil/fat composition is for manufacturing above-mentioned antireflection material.
Above-mentioned resin combination can be liquid.
In above-mentioned resin combination, total amount (100 weights of the component volatilized in solidification relative to above-mentioned resin combination
Measure %) amount can be 10 weight % or less.
In addition, the present invention provides a kind of manufacturing method of antireflection material, it is formed on the surface of above-mentioned antireflection material
Inhibit the bumps of reflection, the above method includes: to solidify above-mentioned resin combination.
The effect of invention
Antireflection material of the invention is due to above-mentioned technical characteristic, even if reducing hydrophobic porous inorganic filler
In the case where combined amount, it is also possible to obtain sufficient anti-reflection function, and the substantially drop of the total light flux of light source can be prevented
It is low, and also there is excellent heat resistance, especially hot water resistance.Therefore, by by antireflection material of the invention be used as pair
The material that optical semiconductor in optical semiconductor device is sealed, available high quality (such as inhibit gloss, and have
Have sufficient brightness and high-durability) optical semiconductor device.
In addition, resin combination of the invention is above-mentioned anti-due to above-mentioned technical characteristic, being highly suitable for manufacturing
Reflecting material.
Detailed description of the invention
Fig. 1 is the schematic diagram for indicating an embodiment of the optical semiconductor device comprising antireflection material of the invention.
Left figure (a) is perspective view, and right figure (b) is sectional view.
Specific embodiment
<antireflection material and resin combination>
Antireflection material of the invention is made of the solidfied material for being dispersed with the resin combination of hydrophobic porous inorganic filler,
The hydrophobic porous inorganic filler forms the bumps for inhibiting reflection on the surface of solidfied material.
In addition, being dispersed with hydrophobic porous inorganic filler in resin combination of the invention, and above-mentioned anti-for manufacturing
Reflecting material.
Due to the porous structure of hydrophobic porous inorganic filler, compared with non-porous filler, relative to resin combination
The apparent volume of object increases, and therefore, can spread and be dispersed in resin combination a small amount of addition or entire its is consolidated
In compound, and uniform and tiny bumps can be formed on the surface of solidfied material.In addition, resin combination penetrate into it is porous
In structure, the difference of the apparent specific gravity of hydrophobic porous inorganic filler and resin combination is reduced, therefore dispersity becomes stable,
And the interaction between hydrophobic porous inorganic filler surface is inhibited and is not easy to agglomerate, hydrophobic porous inorganic filler
It may be uniformly dispersed in resin combination or its entire solidfied material, to be formed on solidfied material surface uniform and tiny recessed
It is convex, incident light can be made effectively to scatter.
Further, since the surface exhibits of hydrophobic porous inorganic filler go out hydrophobicity, therefore the solidfied material containing the filler
It shows high-fire resistance, is not easily deteriorated under the violent heating condition such as boiling water, and excellent in te pins of durability.
It should be noted that in the present specification, the additive amount (usage amount) of hydrophobic porous inorganic filler is to be on a small quantity
Finger is less by weight, rather than is haggled over capacity (volume) few.
It,, can also be effective even if usage amount is reduced compared with non-porous filler when using hydrophobic porous inorganic filler
Inhibit reflection, therefore the significant drop of total light flux caused by the light absorption because of hydrophobic porous inorganic filler itself can be inhibited
It is low, and can true sufficient anti-reflection function.
Each constituent element is described in more detail below.
[hydrophobic porous inorganic filler]
Hydrophobic porous inorganic filler in antireflection material or resin combination of the invention is dispersed in resin group
It closes in object or its entire solidfied material, since dispersity is stablized, is as a result present in the hydrophobic porous of solidfied material surface and inorganic fills out
Material has the function of being formed for scattering the concave-convex of incident light.
The hydrophobic porous inorganic filler of antireflection material for use in the present invention or resin combination is that apparent specific gravity is small
In the true specific gravity of filler, and inside it with the inorganic filler of porous structure, surface have passed through hydrophobicity processing.
As the porous inorganic filling materials for constituting hydrophobic porous inorganic filler, (surface is by the porous nothing before hydrophobicity processing
Machine filler), well-known or conventional filler can be used, be not particularly limited, such as can enumerate: unorganic glass [such as borosilicate
Sour glass, sodium borosilicate glass, water soda glass, aluminum silicate glass, quartz etc.], silica, aluminium oxide, zircon iron oxide,
Zinc oxide, zirconium oxide, magnesia, titanium oxide, aluminium oxide, forsterite, talcum, spinelle, clay, kaolin, dolomite, hydroxyl
Base apatite, nepheline dodge feldspar, christobalite, wollastonite, diatomite, the powder such as talcum be have porous structure substance or it
Formed body (such as spherical bead etc.) etc..
Hydrophobic porous inorganic filler is, by known or conventional hydrophobic surface treatments agent [for example, metal aoxidizes
The agent of the hydrophobic surface treatments such as object, silane coupling agent, titanium coupling agent, organic acid, polyalcohol, organo-silicon compound], it is dredged to above-mentioned
Substance obtained from porous inorganic filling materials before hydration process are surface-treated.By carrying out at such hydrophobic surface
Reason, can be improved the compatibility and dispersibility with resin combination component, and the heat resistance of solidfied material can be improved.
Come from improving with the viewpoint of the compatibility of resin combination component and heat resistance that is dispersed and improving solidfied material
It sees, as hydrophobic surface treatments agent, preferably organo-silicon compound are (for example, trim,ethylchlorosilane, hexamethyldisiloxane, two
Dimethyl dichlorosilane (DMCS), prestox ring tetrasilane, dimethyl silicone polymer, cetyl silane, methacryl silanes, silicone oil
Deng), more preferable dimethyl silicone polymer etc..
Wherein, as hydrophobic porous inorganic filler, it is made to spread over resin combination or entire solidification from evenly dispersed
In object, and can effectively formed on solidfied material surface it is concave-convex show simultaneously excellent heat resistance from the perspective of,
It is preferred that hydrophobic porous unorganic glass or hydrophobic porous silica (hydrophobic porous silica filler).
It as hydrophobic porous silica, is not particularly limited, such as fused silica, crystalline silica can be used
Known in silicon, high-purity synthetic silica, colloidal silicon dioxide etc. or conventional porous silica passes through above-mentioned hydrophobicity
Substance obtained from surface treating agent processing.
In addition, the nothing by constituting above-mentioned hydrophobic porous inorganic filler can be used as hydrophobic porous inorganic filler
Machine object with, styrene resin, acrylic resin, organic silicon resin, acrylicstyrene resinoid, polyvinyl chloride-base tree
Rouge, vinylidene chloride like resin, amide resinoid, polyurethane based resin, phenolic resinoid, styrene-conjugated diene resinoid,
The mixing material structure that the organic matters such as the polymer such as acrylic acid-conjugated diene resinoid, olefine kind resin, cellulosic resin are formed
At hydrophobic porous inorganic-organic filler etc..
Above-mentioned hydrophobic porous inorganic filler can be made of homogenous material, can also be made of two or more materials.
Wherein, as hydrophobic porous inorganic filler, from can be evenly dispersed and spread in resin combination or its entire solidfied material,
And concave-convex viewpoint, the viewpoint with high-fire resistance and acquired and system can be effectively formed on solidfied material surface
From the perspective of making easiness, more preferable hydrophobic porous silica (hydrophobic porous silica filler).
The shape of hydrophobic porous inorganic filler is not particularly limited, and the example includes: powder, spherical, broken shape, fiber
Shape, needle-shaped, flakey.Wherein, can be evenly dispersed from hydrophobic porous inorganic filler and resin combination be spread over or its is whole
In a solidfied material, and easily from the perspective of forming uniform and subtle concaveconvex shape on solidfied material surface, preferred ball
The hydrophobic porous inorganic filler of shape or broken shape.
The average grain diameter (medium particle diameter) of hydrophobic porous inorganic fill is not particularly limited, but from hydrophobic porous inorganic
Disperse to uniform filling and throughout resin component or entire hardening thing, and is easy to be formed on the surface of hardening thing uniform and subtle
Concaveconvex shape it is such from the perspective of, preferably 1~20 μm of average grain diameter and more preferably 2~15 μm.In addition, above-mentioned average grain
Sub- diameter (medium particle diameter) refers to the particle volume diameter with the accumulated value 50% in laser diffraction/scattering method size distribution
(medium volume diameter)
The porous structure of hydrophobic porous inorganic filler can be limited by various parameters such as specific surface area, oil absorptions
System can select the rank with the parameter suitable for antireflection material or resin combination of the invention with being not particularly limited
Hydrophobic porous inorganic filler.In addition, above-mentioned parameter can also by the parameter of the porous inorganic filling materials before hydrophobic treatment come into
Row evaluation.
Constitute hydrophobic porous inorganic filler porous inorganic filling materials (surface pass through hydrophobic treatment before porous, inorganic fill out
Material) specific surface area be not particularly limited, it is evenly dispersed from hydrophobic porous inorganic filler and spread over resin combination or its
In entire solidfied material, it is easy to form uniform and subtle concaveconvex shape on the surface of solidfied material, and effectively prevent reflection
Viewpoint is set out, and specific surface area is preferably 200m2/ g or more, more preferably 200~2000m2/ g, further preferably 200~
1500m2/ g, particularly preferably 200~1000m2/g.If specific surface area is 200m2/ g or more, then it is hydrophobic porous inorganic to fill out
Material has following tendency: it is evenly dispersed and spread in resin combination or its entire solidfied material, and the anti-reflective on solidfied material surface
Function is penetrated to be improved.On the other hand, when specific surface area is 2000m2There is following tendency when/g or less: containing hydrophobic porous nothing
The viscosity of the resin combination of machine filler rises and thixotropy is inhibited, and ensures flowing when preparing antireflection material
Property.It should be noted that above-mentioned specific surface area refers to, root for surface is by the porous inorganic filling materials before hydrophobicity processing
According to JIS K6430 annex E, the N2 adsorption specific surface area acquired based on the BET formula obtained according to Nitrogen adsorption isotherm at -196 DEG C.
The oil absorption of hydrophobic porous inorganic filler is not particularly limited, evenly dispersed simultaneously from hydrophobic porous inorganic filler
It spreads in resin combination or its entire solidfied material, is easy to form uniform and subtle concave-convex on the surface of solidfied material
Shape, and effectively prevent from the perspective of reflection, oil absorption is preferably 10~2000mL/100g, more preferably 100~
1000mL/100g.If oil absorption is 10mL/100g or more, hydrophobic porous inorganic filler has following tendency: uniform point
It dissipates and spreads in resin combination or its entire solidfied material, and be easy to form concaveconvex shape on solidfied material surface.It is another
Aspect, when oil absorption is 2000mL/100g or less, hydrophobic porous inorganic filler has the tendency that mechanical strength raising.It needs
Illustrate, hydrophobic porous inorganic filler be 100g packing material absorbing to oil mass oil mass, can be carried out according to JIS K5101
Measurement.
In antireflection material or resin combination of the invention, hydrophobic porous inorganic filler be can be used alone,
It can be applied in combination two or more.In addition, well-known or conventional manufacture can be passed through for hydrophobic porous inorganic filler
Method is manufactured, and can be used for example: trade name " SYLOPHOBIC 702 ", " SYLOPHOBIC 4004 ",
“SYLOPHOBIC 505”、“SYLOPHOBIC 100”、“SYLOPHOBIC 200”、“SYLOPHOBIC 704”、
(the above are Fuji Silysia chemistry strain formula meetings for the SYLOPHOBIC such as " SYLOPHOBIC 507 ", " SYLOPHOBIC 603 " series
Society's manufacture)；(the above are Evonik for the Aerosil such as trade name " Aerosil RX200 ", " Aerosil RX300 " series
Degussa company manufacture)；The SUNSPHERE ET such as trade name " SUNSPHERE H-121-ET ", " SUNSPHERE H-51-ET "
Commercially available products such as serial (the above are the manufactures of AGC Sitech Co., Ltd.).
Content (combined amount) of the hydrophobic porous inorganic filler in antireflection material or resin combination of the invention does not have
There is special limitation, relative to antireflection material or the total amount (100 weight %) of resin combination, above-mentioned content is preferably 4~40
Weight %, more preferably 4~35 weight %, further preferably 4~30 weight %.Pass through containing for hydrophobic porous inorganic filler
Amount is 4 weight % or more, and hydrophobic porous inorganic filler is evenly dispersed and spreads over resin combination or constitutes the antireflection material
In the entire solidfied material of material, it is easy to form uniform concaveconvex shape on entire solidfied material surface.On the other hand, pass through hydrophobicity
The content of porous inorganic filling materials be 40 weight % hereinafter, use antireflection material or resin combination of the invention for example as
In the case where the sealing material of optical semiconductor device, there is following tendency: can substantially ensure sufficient illumination and prevent total light
Flux is substantially reduced.
Relative to the resin combination (100 parts by weight) for constituting antireflection material, antireflection material of the invention or resin
The content (combined amount) of hydrophobic porous inorganic filler in composition is usually 5~80 parts by weight, preferably 5~70 parts by weight,
More preferably 5~60 parts by weight.Content by hydrophobic porous inorganic filler is 5 parts by weight or more, hydrophobic porous inorganic
Uniform filling is dispersed and is spread in the resin combination or its entire solidfied material that constitute antireflection material, is easy to entirely solidifying
Uniform concaveconvex shape is formed on object surface.On the other hand, when the content of hydrophobic porous inorganic filler is 80 parts by weight or less
When, the case where using antireflection material or resin combination of the invention for example as the sealing material of optical semiconductor device
Under, there is following tendency: can substantially ensure sufficient illumination and prevent being substantially reduced for total light flux.
[resin combination]
Constitute the solidfied material in antireflection material of the invention resin combination be not particularly limited it is preferable to use
It is suitable as the sealing material of the optical semiconductor in optical semiconductor device, the i.e. object of optical semiconductor sealing resin combination
Matter, such as it is preferable to use the hardening resin compositions of following solidfied materials: solidified by heating or light, there is height thoroughly
Bright property, durability are (for example, being not easy the reduction transparency, the heat of application high temperature or thermal shock heating is not easy to produce crack
Or the characteristic etc. removed from adherend) excellent solidfied material.
It is not particularly limited, is can be used with thermosetting property or photo-curable as such hardening resin composition
Known or conventional resin combination can be enumerated, such as preferably comprise selected from least one of following compounds curability
Close the composition of object: epoxy resin (epoxide) (referred to as " epoxy resin (A) "), organic siliconresin (silicone
Object) (referred to as " polyorganosiloxane resin (B) ") and acrylic resin (acyclic compound) (referred to as " acrylic resin
(C)").It as such hardening resin composition, such as can enumerate: composition (the curability ring containing epoxy resin (A)
Epoxy resin composition), containing polyorganosiloxane resin (B) composition (curable silicone resin composition), contain acrylic acid
The composition (curability acrylic resin composition) of resinoid (C).Hereinafter, to the curable resin of these embodiments
Composition is illustrated.However, hardening resin composition of the invention is not limited to the composition of following embodiments.
In addition, antireflection material of the invention is not limited to the purposes of optical semiconductor sealing resin combination, such as may be used also
To be used in following various optical components etc., also can be used in the resin being fit for various uses (for example, polyolefin resin, poly-
Ester resin, polyamide, polyurethane resin etc.).
As the resin combination for constituting the solidfied material in antireflection material of the invention, the preferred heat resistance, transparency, resistance to
The excellent curable epoxy resin composition such as long property, curability polysiloxane resin composition, curability acrylic resin
Composition, more preferable curable epoxy resin composition.
1. curable epoxy resin composition
Curable epoxy resin composition (sometimes referred to as " curable epoxy resin composition of the invention ") is containing ring
Solidification compound of the oxygen resin (A) as necessary component.Curable epoxy resin composition of the invention also contains curing agent
(D) and curing accelerator (E) is as necessary component, or also containing curing catalysts (F) as necessary component.That is, of the invention
Curable epoxy resin composition is the group comprising epoxy resin (A), curing agent (D), curing accelerator (E) as necessary component
Close object, or the composition comprising epoxy resin (A) and curing catalysts (F) as necessary component.Curability ring of the invention
Epoxy resin composition may include the other components in addition to above-mentioned necessary component.
1-1. epoxy resin (A)
Epoxy resin (A) in curable epoxy resin composition of the invention is that have more than one epoxy in molecule
The compound of base (oxirane ring) can be optionally employed from known or conventional epoxide.As epoxy resin
(A), it such as can enumerate: aromatic epoxy compound (aromatic epoxy resin), aliphatic epoxy compound (aliphatic epoxy tree
Rouge), cycloaliphatic epoxy (alicyclic epoxy resin), hetero ring type epoxide (hetero ring type epoxy resin), in molecule
Silicone derivative etc. with more than one epoxy group.
As aromatic epoxy compound, can enumerate, such as: aromatic glycidyl ether based epoxy resin is [for example, bis-phenol
A type epoxy resin, bisphenol f type epoxy resin, bisphenol-type epoxy resin, phenolic resin varnish type epoxy resin are (for example, phenol novolac is clear
Paint shaped epoxy resin, cresol novolak type epoxy resin, the cresol novolak type epoxy resin of bisphenol-A) etc., naphthalene type ring oxygen
Resin, the epoxy resin obtained by triphenol methane etc.] etc..
It as above-mentioned aliphatic epoxy compound, such as can enumerate: aliphatic glycidyl ether class epoxide [example
Such as, aliphatic polyglycidyl ether etc.] etc..
Above-mentioned alicyclic epoxide compound is that have more than one alicyclic ring (aliphatic hydrocarbon ring) and more than one ring in molecule
The compound of oxygroup (wherein, except the silicone derivative in above-mentioned molecule with more than one epoxy group).As alicyclic ring
Formula epoxide, such as can enumerate: have at least one (preferably more than two) ester ring oxygroup (by structure in (i) molecule
At alicyclic ring two adjacent carbon atoms and oxygen atom constitute epoxy group) compound；(ii) have and pass through singly-bound Direct Bonding
The compound of epoxy group on to alicyclic ring；(iii) there is alicyclic ring and the compound of glycidyl etc..
As in above-mentioned (i) molecule at least one ester ring oxygroup compound contained by ester ring oxygroup,
It is not particularly limited, wherein from the viewpoint of curability, preferably (two for constituting cyclohexane ring are adjacent for cyclohexene oxide base
The epoxy group that carbon atom and oxygen atom are constituted).In particular, as the change in (i) molecule at least one ester ring oxygroup
Object is closed, from the viewpoint of the transparency and heat resistance of solidfied material, there are more than two cyclohexene oxide bases preferably in molecule
Compound, more preferably following formula (1) compound represented.
[chemical formula 1]
In formula (1), X indicates singly-bound or linking group (bivalent group with more than one atom).As above-mentioned company
Connect group, can enumerate, such as: bivalent hydrocarbon radical, all or part of carbon-to-carbon double bond by alkenylene, carbonyl made of epoxidation,
Ehter bond, ester bond, carbonate group, amide groups, they it is multiple be connected made of group etc..It should be noted that the substituent groups such as alkyl
It can be bonded with more than one in the carbon atom of the alicyclic ring (ester ring oxygroup) in constitutional formula (1).
It is the compound of singly-bound as the X in formula (1), (3,4,3 ', 4 '-diepoxy) bicyclohexane can be enumerated.
As above-mentioned bivalent hydrocarbon radical, straight or branched alkylidene, the divalent ester ring type that carbon atom number is 1~18 can be enumerated
Alkyl etc..The straight or branched alkylidene for being 1~18 as carbon atom number, such as can enumerate: methylene, methylmethylene,
Dimethylmethylene, ethylidene, propylidene, trimethylene etc..It as above-mentioned divalent alicyclic type hydrocarbon, such as can enumerate: 1,2-
Cyclopentylene, 1,3- cyclopentylene, cyclopentylidene base, 1,2- cyclohexylidene, 1,3- cyclohexylidene, 1,4- cyclohexylidene, cyclohexylidene
The divalent such as base cycloalkylidene (pitching alkyl comprising ring) etc..
Pass through epoxidised alkenylene (sometimes referred to as " epoxidation Asia alkene as above-mentioned all or part of carbon-to-carbon double bond
Base ") in alkenylene can enumerate, such as: ethenylidene, allylidene, 1- butenylidene, 2- butenylidene, Aden's dialkylene,
Straight or branched alkenylene that the carbon atom numbers such as inferior pentenyl, sub- hexenyl, heptene base, sub- octenyl are 2~8 (including
Sub- polyene-based) etc..In particular, preferably whole carbon-to-carbon double bonds pass through epoxidised alkenylene as above-mentioned epoxidation alkenylene,
The alkenylene that more preferably whole carbon-to-carbon double bond passes through epoxidation and carbon atom number is 2~4.
As above-mentioned linking group X, particularly preferably containing the linking group of oxygen atom, specifically, can enumerate :-CO- ,-
O-CO-O- ,-COO- ,-O- ,-CONH-, epoxidation alkenylene；The group that these multiple groups are formed by connecting；One or two with
On the group that is formed by connecting of these groups and one or more bivalent hydrocarbon radical.Two can enumerate above as valency alkyl
Those of example.
By the representative example for the compound that above formula (1) indicates, can enumerate: 2,2- bis- (3,4- 7-oxa-bicyclo[4.1.0-1- bases)
Bis- (3,4- 7-oxa-bicyclo[4.1.0-1- base) ethane of propane, bis- (3,4- epoxycyclohexyl-methyl) ethers, 1,2-, 1,2- epoxy-1,2- are double
(3,4- 7-oxa-bicyclo[4.1.0-1- base) ethane, the compound etc. indicated by following formula (1-1)~(1-10).It should be noted that following formula
L, m in (1-5), (1-7) respectively indicate 1~30 integer.R in following formula (1-5) is the alkylidene of carbon atom number 1~8, can
It enumerates: methylene, ethylidene, propylidene, isopropylidene, butylidene, isobutylidene, sub- sec-butyl, pentylidene, hexylidene, Asia
The alkylidene of the straight or brancheds such as heptyl, octamethylene.Wherein, preferred carbon such as methylene, ethylidene, propylidene, isopropylidene
The straight or branched alkylidene that atomicity is 1~3.N in following formula (1-9), (1-10)1~n6Respectively indicate 1~30 it is whole
Number.
[chemical formula 2]
[chemical formula 3]
There is the compound for the epoxy group being bonded directly on alicyclic ring by singly-bound as above-mentioned (ii), such as can enumerate:
The compound etc. indicated by following formula (2).
[chemical formula 4]
In formula (2), R ' be by structural formula from the alcohol of p valence remove p hydroxyl (- OH) obtained by group (p valence
Organic group), p and q respectively indicate natural number.Alcohol [R ' (OH) as p valencep] can enumerate: bis- (the methylol) -1- fourths of 2,2-
Polyalcohols such as alcohol (alcohol etc. that carbon atom number is 1~15) etc..P is preferably that 1~6, q is preferably 1~30.When p is 2 or more, respectively
Q in a () in the group of (in the bracket in outside) can be identical or different.As the compound indicated by above formula (2), specifically
Can enumerate: 1,2- epoxy -4- (2- Oxyranyle) hexamethylene adduct of 2,2- bis- (methylol)-n-butyl alcohols is [for example, commodity
Name " EHPE3150 " (manufacture of Daicel Co., Ltd.) etc.] etc..
There is the compound of alicyclic ring and glycidyl as above-mentioned (iii), such as can enumerate: 2,2- bis- [4- (2,3- rings
Oxygen propoxyl group) cyclohexyl] propane, 2,2- bis- [3,5- dimethyl -4- (2,3- glycidoxy) cyclohexyl] propane, bisphenol A-type
Epoxy resin hydrogenated products (bisphenol-A epoxy resin) etc.；Bis- [2- (2,3- glycidoxy) cyclohexyl] methane, [2-
(2,3- glycidoxy)] cyclohexyl] [4- (2,3- glycidoxy) cyclohexyl] methane, bis- [4- (2,3- glycidoxy)
Cyclohexyl] methane, bis- [3,5- dimethyl -4- (2,3- glycidoxy) cyclohexyl] methane, bisphenol f type epoxy resin hydrogenation production
Object (A Hydrogenated Bisphenol A F type epoxy resin) etc.；A Hydrogenated Bisphenol A type epoxy resin；Hydrogenation phenolic resin varnish type epoxy resin (such as hydrogenate
Phenol novolak type epoxy resin, the hydrogenation cresol novolak type ring for hydrogenating cresol novolak type epoxy resin, bisphenol-A
Oxygen resin etc.)；Hydrogenate naphthalene type epoxy resin；By the hydrogenated epoxy resin etc. for the epoxy resin that triphenol methane obtains.
As above-mentioned cycloaliphatic epoxy, others can for example enumerate 1,2,8,9- bicyclic oxygen limonenes etc..
As above-mentioned hetero ring type epoxide, such as can enumerate: in the molecule have epoxy group (oxirane ring) with
Outer heterocycle is [for example, tetrahydrofuran ring, amylene oxide ring, morpholine ring, chroman ring, heterochromatic full ring, thiophane ring, tetrahydro thiophene
Mutter bicyclic [3.3.0] the octane ring of ring, aziridine ring, pyrrolidine ring, piperidine ring, piperazine ring, indoline ring, 2,6- dioxa,
The non-aromatics such as 1,3,5- Trianacyclohexane ring, 1,3,5- Trianacyclohexane -2,4,6- triketone ring (isocyanuric acid ring) are miscellaneous
Ring；The heteroaromatics such as thiphene ring, pyrrole ring, furan nucleus, pyridine ring] and epoxy group compound.
As above-mentioned hetero ring type epoxide, such as preferably using different with more than one epoxy group in molecule
Cyanurate (hereinafter sometimes called " isocyanuric acid ester containing epoxy group ").The above-mentioned isocyanuric acid ester containing epoxy group point
The quantity of the epoxy group contained in son is not particularly limited, and preferably 1~6, more preferably 1~3.
As the above-mentioned isocyanuric acid ester containing epoxy group, such as following formula (3) compound represented can be enumerated.
[chemical formula 5]
In formula (3), RX、RY、RZ(RX~RZ) identical or different, respectively indicate hydrogen atom or 1 valence organic group.Wherein,
RX~RZAt least one of be the 1 valence organic group containing epoxy group.It as above-mentioned 1 valence organic group, such as can enumerate: 1 valence
Aliphatic alkyl (for example, alkyl, alkenyl etc.)；1 valence aromatic hydrocarbyl (for example, aryl etc.)；1 valence heterocycle；Aliphatic alkyl,
Two or more in alicyclic type hydrocarbon, aromatic hydrocarbyl is bonded and the 1 valence group etc. of formation.It should be noted that 1 valence organic group
Group can have substituent group (for example, the substituent groups such as hydroxyl, carboxyl, halogen atom).As the 1 valence organic group containing epoxy group
Group, can enumerate: following 1 valences containing epoxy group such as epoxy group, glycidyl, 2- methylglycidyl, hexamethylene alkenyloxy group
Group etc..
More specifically, it as the above-mentioned isocyanuric acid ester containing epoxy group, can enumerate: the change indicated by following formula (3-1)
Close object, the compound indicated by following formula (3-2), by following formula (3-3) compound indicated etc..
[chemical formula 6]
[chemical formula 7]
[chemical formula 8]
In above formula (3-1), (3-2), (3-3) (formula (3-1)~(3-3)), R1And R2It is identical or different, indicate hydrogen atom
Or the alkyl that carbon atom number is 1~8.The alkyl for being 1~8 as carbon atom number, can enumerate, such as: it is methyl, ethyl, propyl, different
The alkyl of the straight or brancheds such as propyl, butyl, isobutyl group, sec-butyl, amyl, hexyl, heptyl, octyl.Wherein, preferred first
The alkyl for the straight or branched that the carbon atom numbers such as base, ethyl, propyl, isopropyl are 1~3.In above formula (3-1)~(3-3)
R1And R2Particularly preferably hydrogen atom.
As the representative example of the compound indicated by above formula (3-1), can enumerate: monoallyl diglycidyl is different
Bis- (2- methylglycidyl) isocyanuric acid esters of cyanurate, 1- allyl -3,5-, 1- (2- methylpropenyl) -3,5- two contracting
Water glyceryl isocyanuric acid ester, bis- (2- methylglycidyl) isocyanuric acid esters of 1- (2- methylpropenyl) -3,5- etc..
As the representative example of the compound indicated by above formula (3-2), can enumerate: diallyl list glycidyl is different
Bis- (2- the methylpropenyl) -5- contractings of cyanurate, 1,3- diallyl -5- (2- methylglycidyl) isocyanuric acid ester, 1,3-
Bis- (2- methylpropenyl) -5- (2- methylglycidyl) isocyanuric acid esters of water glyceryl isocyanuric acid ester, 1,3- etc..
It as the representative example of the compound indicated by above formula (3-3), can enumerate: triglycidyl group isocyanuric acid
Ester, three (2- methylglycidyl) isocyanuric acid esters etc..
It should be noted that the above-mentioned isocyanuric acid ester containing epoxy group can be in addition alcohol or acid anhydrides etc. and epoxy in advance
The compound of base reaction uses after being modified.
With silicone derivative (sometimes referred to as " the silicon oxygen containing epoxy group of more than one epoxy group in above-mentioned molecule
Alkane derivatives ") be, in the molecule with the siloxane backbone being made of siloxanes key (Si-O-Si) and with more than one
Epoxy group compound.It as above-mentioned siloxane backbone, such as can enumerate: annular siloxane skeleton；Linear chain or branched chain
The silicone matrix such as the polysilsesquioxane of the polysiloxanes (polysiloxanes of straight or branched) of shape, cage modle or ladder type
Deng.The quantity of the epoxy group contained in the molecule of the above-mentioned silicone derivative containing epoxy group is not particularly limited, and preferably 2
~4, more preferably 3 or 4.
Epoxy group contained by the above-mentioned silicone derivative containing epoxy group is not particularly limited, from can effectively make to solidify
Property epoxy resin composition and from the perspective of the superior solidfied material of intensity can be obtained, preferably at least one is rouge
Ring type epoxy group, wherein at least one of particularly preferred epoxy group is cyclohexene oxide base.
As the above-mentioned silicone derivative containing epoxy group, such as following formula (4) compound represented (cyclic annular silicon can be enumerated
Oxygen alkane).
[chemical formula 9]
In above formula (4), R3It is identical or different, indicate the 1 valence organic group containing alkyl or epoxy group.Wherein, by formula
(4) R in the compound indicated3In, at least one (preferably at least 2) be containing epoxy group 1 valence organic group (in particular,
The 1 valence organic group containing ester ring oxygroup).In addition, p in formula (4) indicate 3 or more integer (preferably 3~6 it is whole
Number).It should be noted that multiple R3It can be identical or different.
As the above-mentioned 1 valence organic group containing epoxy group, can enumerate, such as: epoxy group, glycidyl, methyl contracting
Water glyceryl ,-A-R4[A indicates alkylidene, R to the group of expression4Indicate ester ring oxygroup].As above-mentioned A (alkylidene), example
Can such as enumerate: methylene, methylmethylene, dimethylmethylene, ethylidene, propylidene, trimethylene carbon atom number be 1~
18 straight or branched alkylidene etc..As above-mentioned R4It can enumerate, such as: cyclohexene oxide base etc..
More specifically, it as the above-mentioned silicone derivative containing epoxy group, can enumerate: 2,4- bis- [2- (3- { oxa-s
Bicyclic [4.1.0] heptyl }) ethyl] -2,4,6,6,8,8- hexamethyl-cyclotetrasiloxane, the [2- (3- { oxabicyclo of 4,8- bis-
[4.1.0] heptyl }) ethyl] -2,2,4,6,6,8- hexamethyl-cyclotetrasiloxane, the [2- (3- { oxabicyclo [4.1.0] of 2,4- bis-
Heptyl }) ethyl] -6,8- dipropyl -2,4,6,8- tetramethyl-cyclotetrasiloxane, the [2- (3- { oxabicyclo [4.1.0] of 4,8- bis-
Heptyl }) ethyl] -2,6- dipropyl -2,4,6,8- tetramethyl-cyclotetrasiloxane, the [2- (3- { oxabicyclo of 2,4,8- tri-
[4.1.0] heptyl }) ethyl] -2,4,6,6,8- pentamethyl-cyclotetrasiloxane, the [2- (3- { oxabicyclo [4.1.0] of 2,4,8- tri-
Heptyl }) ethyl] -6- propyl -2,4,6,8- tetramethyl-cyclotetrasiloxane, the [2- (3- { oxabicyclo [4.1.0] of 2,4,6,8- tetra-
Heptyl }) ethyl] -2,4,6,8- tetramethyl-cyclotetrasiloxane etc..
In addition, as the above-mentioned silicone derivative containing epoxy group, for example, the compound indicated with following formula (5)
(chain polysiloxanes).
[chemical formula 10]
In above formula (5), R5And R6It is identical or different, indicate the 1 valence organic group containing epoxy group, alkoxy (for example,
The alkoxy etc. that the carbon atom numbers such as methoxyl group, ethyoxyl are 1~4), alkyl is (for example, the carbon atom numbers such as methyl, ethyl are 1~4
Alkyl etc.), aryl (for example, aryl that the carbon atom numbers such as phenyl, naphthalene are 6~12 etc.).Wherein, the change indicated by formula (5)
Close R in object5And R6At least one (preferably at least 2) be the 1 valence organic group containing epoxy group.As 1 containing epoxy group
Valence organic group can be enumerated and above formula (4) identical group.In particular, from the viewpoint of curability, preferably R6In it is any
One or two is the 1 valence organic group containing epoxy group.In addition, q in formula (5) indicate 1 or more integer (for example, 1~
500 integer).The structure being accompanied in the bracket of q can be respectively identical or different.In addition, when the knot being accompanied in the bracket of q
Structure there are it is two or more when, addition form is not particularly limited, and can be random or block type.
As the above-mentioned silicone derivative containing epoxy group, others can be enumerated, such as: the poly- silicon oxygen with epoxy group
Alkane resin (for example, the polyorganosiloxane resin containing ester ring oxygroup recorded in Japanese Unexamined Patent Publication 2008-248169 bulletin), tool
There is silsesquioxane of epoxy group etc. (for example, that records in Japanese Unexamined Patent Publication 2008-19422 bulletin has extremely in a molecule
Organic polysilsesquioxane resins etc. of few two epoxy functional groups) etc..
Wherein, as epoxy resin (A), from can more effectively make curable epoxy resin composition carry out cured sight
Point sets out, preferably bisphenol A type epoxy resin, in molecule with isocyanuric acid ester, the phenolic varnish type of more than one epoxy group
Epoxy resin, cycloaliphatic epoxy, aliphatic epoxy compound, in molecule with the siloxanes of more than one epoxy group
Derivative.In particular, from the viewpoint of it can obtain the solidfied material of the transparency and excellent in te pins of durability with high productivity, the present invention
Curable epoxy resin composition preferably contain cycloaliphatic epoxy in the form of necessary component as epoxy resin
(A).As above-mentioned cycloaliphatic epoxy, particularly preferred intramolecular has the compound of cyclohexene oxide base (in particular, dividing
There is the compound of 2 or more cyclohexene oxide bases in sub), the compound more preferably indicated by formula (1) is (in particular, by formula
The compound that (1-1) is indicated).
In curable epoxy resin composition of the invention, epoxy resin (A) be can be used alone, can also group
It closes using two or more.It should be noted that epoxy resin (A) can be manufactured by known or conventional method, it can also
To use commercially available product.
The content (combined amount) of epoxy resin (A) in curable epoxy resin composition of the invention does not limit especially
System, the total amount (100 weight %) relative to curable epoxy resin composition is preferably 25~99.8 weight % (for example, 25
~95 weight %), more preferably 30~90 weight %, further preferably 35~85 weight %, particularly preferably 40~60 weights
Measure %.By the way that the content of epoxy resin (A) is set as 25 weight % or more, cured tendency can be more effectively carried out by having.
On the other hand, by the way that the content of epoxy resin (A) is set as 99.8 weight % hereinafter, there is the intensity for further increasing solidfied material
's.
The content (combined amount) of cycloaliphatic epoxy in curable epoxy resin composition of the invention is without spy
It does not limit, the total amount (100 weight %) relative to curable epoxy resin composition is preferably 20~99.8 weight %, more excellent
It is selected as 40~95 weight % (for example, 40~60 weight %), further preferably 50~95 weight %, particularly preferably 60~90
Weight %, most preferably 70~85 weight %.By the way that the content of cycloaliphatic epoxy is set as 20 weight % or more, deposit
In following tendencies: solidification can be more effectively carried out, and can be further improved the transparency and durability of solidfied material.It is another
Aspect, by the way that the content of cycloaliphatic epoxy is set as 99.8 weight % hereinafter, the intensity of solidfied material has further mentions
High tendency.
The cycloaliphatic epoxy for including in curable epoxy resin composition of the invention is relative to epoxide
Total amount (whole epoxides；For example, the total amount of epoxy resin (A)) ratio of (100 weight %) is not particularly limited, preferably
For 40~100 weight % (for example, 40~90 weight %), more preferably 80~100 weight %, further preferably 90~100
Weight %, particularly preferably 95~100 weight %.By by the ratio of cycloaliphatic epoxy be set as 40 weight % with
On, there are following tendencies: solidification can be more effectively carried out, and can be further improved the transparent and durable of solidfied material
Property.
1-2. curing agent (D)
The curing agent (D) of one of necessary component as curable epoxy resin composition of the invention be have by with
Epoxide reacts and makes the compound of the cured effect of curable epoxy resin composition.Curing agent (D) does not limit especially
System, can be used known conventional hardener for epoxy resin as hardener for epoxy resin, such as can enumerate: anhydride
(acid anhydride type curing agent), amine (amine curing agent), polyamide, imidazoles (imidazole curing agent), polysulfide alcohols (polysulfide
Alcohols curing agent), phenols (phenols curing agent), polybasic carboxylic acid class, dicyandiamide class, organic acid hydrazides etc..
As the anhydride (acid anhydride type curing agent) of curing agent (D), known or conventional acid anhydride type curing agent can be used,
It is not particularly limited, such as can enumerate: methyl tetrahydrophthalic anhydride (4- methyl tetrahydrophthalic anhydride, 3- methyl four
Hydrogen phthalic anhydride etc.), methylhexahydrophthalic anhydride (4- methylhexahydrophthalic anhydride, 3- methyl hexahydro neighbour's benzene
Dicarboxylic acid anhydride etc.), dodecenylsuccinic anhydride, methylendomethylene tetrabydrophthalic anhydride, phthalic anhydride, maleic acid
Acid anhydride, tetrabydrophthalic anhydride, hexahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, pyromellitic anhydride, inclined benzene
Three acid anhydrides, benzophenone tetracarboxylic anhydride, carbic anhydride, methylnadic anhydride, hydrogenating methyl carbic anhydride, 4- (4- first
Base -3- pentenyl) tetrabydrophthalic anhydride, succinic anhydride, adipic anhydride, sebacic anhydride, dodecanedioic acid acid anhydride, methyl cyclohexane
Tetracarboxylic anhydride, vinyl ether-maleic acid copolymer, ring-alkylated styrenes-copolymer-maleic anhydride etc..Wherein, from operability
Viewpoint is set out, and the acid anhydrides at preferably 25 DEG C for liquid is [for example, methyl tetrahydrophthalic anhydride, methylhexahydrophthaacid acid
Acid anhydride, dodecenylsuccinic anhydride, methylendomethylene tetrabydrophthalic anhydride etc.].On the other hand, about at 25 DEG C be solid-state
Acid anhydrides, such as be dissolved at 25 DEG C as mixture to form liquid in the acid anhydrides of liquid, thus there are following tendencies: improving
Operability as the curing agent (D) in curable epoxy resin composition of the invention.From the heat resistance of solidfied material and transparent
Property from the viewpoint of, acid anhydride type curing agent is preferably to be saturated the acid anhydrides of monocyclic hydrocarbon dicarboxylic acids (including to be bonded with alkyl on ring etc. and take
The compound of Dai Ji).
As the amine (amine curing agent) of curing agent (D), known or conventional amine curing agent can be used, without spy
Do not limit, such as can enumerate: ethylenediamine, diethylenetriamines, trien, tetren, dipropylenediamine,
The aliphatic polyamines such as diethyl amino propylamine, polytrimethylene triamine；Diphenylmethanediamiand, isophorone diamine, bis- (4- ammonia
Base -3- methyldicyclohexyl) methane, diamino-dicyclohexyl methane, bis- (amino methyl) hexamethylenes, N- aminoethylpiperazine,
The ester ring types polyamines such as bis- (3- aminopropyl) -3,4,8,10- four oxaspiro [5,5] hendecanes of 3,9-；M-phenylene diamine (MPD), to benzene two
Amine, Toluene-2,4-diisocyanate, 4- diamines, Toluene-2,4-diisocyanate, 6- diamines, mesitylene -2,4- diamines, 3,5- diethyltoluene -2,4- diamines, 3,5-
The monokaryons polyamines such as diethyltoluene -2,6- diamines, benzidine, 4,4- diaminodiphenyl-methane, 2,5- naphthylene diamine, 2,
Aromatic polyamines such as 6- naphthylene diamine etc..
As the phenols (phenols curing agent) of curing agent (D), known or conventional phenols curing agent can be used, without spy
Do not limit, such as can enumerate: novolak phenolics, phenolic varnish type cresol resin, paraxylene phenol-formaldehyde resin modified,
The aralkyl resins such as paraxylene/meta-xylene phenol-formaldehyde resin modified, terpene modified phenolic resin, dicyclopentadiene-modified phenolic aldehyde
Resin, trisphenol propane etc..
As the polyamide of curing agent (D), such as intramolecular can be enumerated with any in primary amino group and secondary amino group
The polyamide etc. of one or two.
As the imidazoles (imidazole curing agent) of curing agent (D), known or conventional imidazole curing agent can be used,
It is not particularly limited, such as can enumerate: 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- undecyl imidazole, 2- heptadecane
Base imidazoles, 2- phenylimidazole, 1 benzyl 2 methyl imidazole, 1- cyano ethyl -2-methylimidazole, 1- cyano ethyl -2- ethyl -
4-methylimidazole, 1- cyano ethyl -2- undecyl imidazole, 1- cyano ethyl -2- undecyl imidazole trimellitate, 1- cyanogen
Base ethyl -2- phenylimidazole trimellitate, 2-methylimidazole isocyanuric acid ester, 2- phenylimidazole isocyanuric acid ester,
2,4- diamino -6- [2-methylimidazole base-(1)]-ethyl-s-triazine, 2,4- diamino -6- [2-ethyl-4-methylimidazole
Base-(1)]-ethyl-s-triazine etc..
As the polysulfide alcohols (polysulfide alcohols curing agent) of curing agent (D), can enumerate, such as: the polymercaptan of liquid, polysulfide
Resin.
As the polybasic carboxylic acid class of curing agent (D), can enumerate, such as: adipic acid, decanedioic acid, terephthalic acid (TPA), inclined benzene three
Acid, polyester containing carboxyl etc..
Wherein, as curing agent (D), from the viewpoint of curability, the heat resistance of solidfied material and the transparency, preferred anhydrides
Class (acid anhydride type curing agent).It should be noted that in curable epoxy resin composition of the invention, curing agent (D) can be with
One kind is used alone, can also be applied in combination two or more.In addition, being used as curing agent (D), commercially available product can be used.For example, making
For the commercially available product of anhydride, trade name " RIKACID MH-700 ", " RIKACID MH-700F " can be enumerated (above by new day
This physics and chemistry Co., Ltd. manufacture)；Trade name " HN-5500 " (Hitachi Chemical Co., Ltd.'s manufacture) etc..
The content (combined amount) of curing agent (D) in curable epoxy resin composition of the invention is not particularly limited,
Its total amount (whole epoxide relative to the epoxide contained in curable epoxy resin composition；For example, epoxy
The total amount of resin (A)) 100 parts by weight are preferably 50~200 parts by weight, more preferably 75~150 parts by weight, further preferably
100~120 parts by weight.More specifically, when anhydride is used as curing agent (D), relative to curability epoxy of the invention
1 equivalent epoxy group in the whole epoxides for including in resin combination is preferably carried out with the ratio of 0.5~1.5 equivalent
It uses.By the way that the content of curing agent (D) is set as 50 parts by weight or more, solidification, and solidfied material can be more effectively carried out
Toughness have the tendency that further increasing.On the other hand, by the way that the content of curing agent (D) is set as 200 parts by weight hereinafter, having
It is easy to get the excellent solidfied material of non-coloring (or coloring is less), form and aspect.
1-3. curing accelerator (E)
The curing accelerator (E) of one of necessary component as curable epoxy resin composition of the invention is that have to promote
Into the change of the function of the reaction rate of epoxide reaction (in particular, reacting between epoxy resin (A) and curing agent (D))
Close object.As curing accelerator (E), can be used as epoxy resin conventional known in epoxy resin curing accelerator with admittedly
Change promotor, is not particularly limited, such as can enumerate: 1,8- diazabicyclo [5.4.0] endecatylene -7 (DBU) and its salt
(for example, phenates, caprylate, tosilate, formates, tetraphenyl borate salts etc.)；1,5- diazabicyclo [4.3.0] nonyl
Alkene -5 (DBN) and its salt (for example, phenates, caprylate, tosilate, formates, tetraphenyl borate salts etc.)；Benzyl two
Methyl amine, 2,4,6- tri- (dimethylaminomethyl) phenol, N, the tertiary amines such as N- dimethyl cyclohexyl amine；2-ethyl-4-methylimidazole,
The imidazoles such as 1- cyano ethyl -2-ethyl-4-methylimidazole；The phosphines such as phosphate, triphenylphosphine；Tetraphenylphosphoniphenolate (p-methylphenyl) boron
Hydrochlorate Deng phosphonium compounds；The organic metal salts such as tin octoate, zinc octoate；Metallo-chelate etc..
It should be noted that curing accelerator (E) can individually make in curable epoxy resin composition of the invention
With one kind, can also be applied in combination two or more.
As the curing accelerator (E) in curable epoxy resin composition of the invention, such as can be used following commercially available
Product: (exploitation produces by trade name " U-CAT SA 506 ", " U-CAT SA 102 ", " U-CAT 5003 ", " U-CAT 18X ", " 12XD "
Product) (being manufactured above by San Apro Co., Ltd.)；Trade name " TPP-K ", " TPP-MK " are (above by the emerging chemical industry strain formula in north
Commercial firm's manufacture)；Trade name " PX-4ET " (being manufactured by Nippon Chemical Ind) etc..
The content (combined amount) of curing accelerator (E) in curable epoxy resin composition of the invention does not limit especially
System, total amount (whole epoxides relative to the epoxide contained in curable epoxy resin composition；For example,
The total amount of epoxy resin (A)) 100 parts by weight are preferably 0.05~5 parts by weight, more preferably 0.1~3 parts by weight, and it is further excellent
It is selected as 0.2~3 parts by weight, particularly preferably 0.25~2.5 parts by weight.By the way that the content of curing accelerator (E) is set as
More than 0.05 parts by weight, has the tendency that obtaining more fully solidification facilitation effect.On the other hand, by by curing accelerator (E)
Content be set as 5 parts by weight hereinafter, having acquisition non-coloring (or coloring less) and the excellent solidfied material of form and aspect.
1-4. curing catalysts (F)
The curing catalysts (F) of one of necessary component as curable epoxy resin composition of the invention are followingization
Close object: (polymerization is instead for the curing reaction with the cationically polymerizable compound by initiation and/or promotion epoxide etc.
Answer) make the compound of the cured effect of curable epoxy resin composition.It is not particularly limited as curing catalysts (F),
It such as can enumerate: cationic seed is generated by heat, (hot cationic polymerization draws to cause the cationic polymerization initiators polymerizeing
Send out agent), lewis acid-amine complex, Bronsted Barbiturates, imidazoles etc..
Specifically, as curing catalysts (F), such as can enumerate: aryl diazonium salts, aryl salt, aryl sulfonium salt,
Allene-ionic complex etc., preferably use following commercially available products: trade name " PP-33 ", " CP-66 ", " CP-77 " are (above equal
It is manufactured by ADEKA Corp.)；Trade name " FC-509 " (is manufactured) by 3M company；Trade name " UVE 1014 " is (by G.E. system
It makes)；Trade name " Sun Aid SI-60L ", " Sun Aid SI-80L ", " Sun Aid SI-100L ", " Sun Aid SI-
110L ", " Sun Aid SI-150L " (being manufactured above by three new chemical industry Co., Ltd.)；Trade name " CG-24-61 " (by
BASF Co., Ltd. manufacture).In addition, as curing catalysts (F), such as can enumerate: the metals such as aluminium or titanium and acetoacetate or
Metals and the acetoacetates or diketone such as compound, aluminium or the titanium that the chelate compound and tri-phenyl-silane alcohol that diones are formed are formed
The compound etc. that the phenols such as chelate compound and bisphenol S that class is formed are formed.
As lewis acid-amine complex of curing catalysts (F), known or conventional lewis acid-amine can be used
Complex solidifying catalyst, is not particularly limited, such as can enumerate: BF3N-hexylamine, BF3Mono aminoethane, BF3Benzylamine, BF3- two
Ethamine, BF3Piperidines, BF3Triethylamine, BF3Aniline, BF4N-hexylamine, BF4Mono aminoethane, BF4Benzylamine, BF4Diethylamine, BF4-
Piperidines, BF4Triethylamine, BF4Aniline, PF5Ethamine, PF5Isopropylamine, PF5Butylamine, PF5Lauryl amine, PF5Benzylamine, AsF5-
Lauryl amine etc..
As the Bronsted Barbiturates of curing catalysts (F), known or conventional Bronsted acid can be used
Salt is not particularly limited, such as can enumerate: aliphatic sulfonium salt, aromatic series sulfonium salt, salt compounded of iodine, phosphonium salt etc..
As the imidazoles of curing catalysts (F), known or conventional imidazoles can be used, be not particularly limited, example
It can such as enumerate: 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- undecyl imidazole, 2- heptadecyl imidazole, 2- phenyl miaow
Azoles, 1 benzyl 2 methyl imidazole, 1- 1-cyanoethyl-2-methylimidazole, 1- cyanoethyl -2-ethyl-4-methylimidazole, 1- cyanoethyl -
2- undecyl imidazole, 1- cyanoethyl -2- undecyl imidazole trimellitate, the inclined benzene of 1-cyanoethyl-2-phenylimidazole
Three acid esters, 2-methylimidazole isocyanuric acid ester, 2- phenylimidazole isocyanuric acid ester, 2,4- diamino -6- [2-methylimidazole
Base-(1)]-ethyl-s-triazine, 2,4- diamino -6- [2-ethyl-4-methylimidazole base-(1)]-ethyl-s-triazine etc..
In addition, curing catalysts (F) can be used alone in curable epoxy resin composition of the invention, it can also
It is two or more to be applied in combination.It should be noted that as described above, can be used for example commercially available as curing catalysts (F)
Product.
The content (combined amount) of curing catalysts (F) in curable epoxy resin composition of the invention does not limit especially
System, total amount (whole epoxides relative to the epoxide contained in curable epoxy resin composition；For example,
The total amount of epoxy resin (A)) 100 parts by weight are preferably 0.01~15 parts by weight, more preferably 0.01~12 parts by weight, further
Preferably 0.05~10 parts by weight, particularly preferably 0.05~8 parts by weight.By the way that the content of curing catalysts (F) is set as
More than 0.01 parts by weight, curing reaction has the tendency that more fully carrying out.On the other hand, by by curing catalysts (F)
Content be set as 15 parts by weight hereinafter, having the tendency that being easy to get the excellent solidfied material of non-coloring (or coloring less), form and aspect.
That is, by the way that the content control of curing catalysts (F) within the above range, to have following tendency: improve curable epoxy resin group
The solidification rate of object is closed, and is easy to get the solidfied material of the balancing good of the transparency and durability.
It should be noted that curable epoxy resin composition of the invention can substantially contain the irradiation by light
Generate the light cationic polymerization initiator of the initiation seed (acid etc.) of cationic polymerization.When curable epoxy resin group of the invention
When conjunction object contains light cationic polymerization initiator, content is relative to the epoxy compound contained in curable epoxy resin composition
Total amount (whole epoxides of object；For example, the total amount of epoxy resin (A)) 100 parts by weight, e.g., about 0.01~20 weight
Part, preferably 0.1~10 parts by weight.
1-5. polyalcohol
Curable epoxy resin composition of the invention can contain polyalcohol.In particular, working as curability epoxy of the invention
It is excellent from the viewpoint of it can be more effectively carried out solidification when resin combination contains curing agent (D) and curing accelerator (E)
Choosing also contains polyalcohol.As polyalcohol, known or conventional polyalcohol can be used, be not particularly limited, such as can enumerate:
Ethylene glycol, propylene glycol, butanediol, 1,3 butylene glycol, 1,4- butanediol, 1,6-HD, diethylene glycol, triethylene glycol, new penta
Glycol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, trimethylolpropane, glycerol, pentaerythrite, dipentaerythritol etc..
Wherein, the viewpoint of the solidfied material of rupture and removing is not likely to produce from can control to solidify and be easy to get well
Set out, above-mentioned polyalcohol be preferably carbon atom number be 1~6 alkyl diol, more preferably carbon atom number be 2~4 alkyl two
Alcohol.
Polyalcohol in curable epoxy resin composition of the invention may be used alone, can also be used in combination two kinds
More than.
The content (combined amount) of polyalcohol in curable epoxy resin composition of the invention is not particularly limited, phase
Total amount (whole epoxides for the epoxide contained in curable epoxy resin composition；For example, epoxy resin
(A) total amount) 100 parts by weight are preferably 0.05~5 parts by weight, more preferably 0.1~3 parts by weight, further preferably 0.2~
3 parts by weight, particularly preferably 0.25~2.5 parts by weight.By the way that the content of polyalcohol is set as 0.05 parts by weight or more, there is energy
Enough it is more effectively carried out cured tendency.On the other hand, it is easy to by the way that the content of polyalcohol is set as 5 parts by weight hereinafter, having
Control the tendency of above-mentioned cured reaction rate.
1-6. fluorophor
Curable epoxy resin composition of the invention can contain fluorophor.When curable epoxy resin of the invention combines
When object contains fluorophor, particularly preferably it is used as the seal applications (sealing material use of optical semiconductor in optical semiconductor device
On the way), that is, as optical semiconductor sealing resin combination.As above-mentioned fluorophor, known or conventional fluorophor can be used
(in particular, for fluorophor in the seal applications of optical semiconductor), is not particularly limited, such as can enumerate: by general formula
A3B5O12: M [in formula, A indicates the element selected from one or more of Y, Gd, Tb, La, Lu, Se, Sm, B indicate selected from Al, Ga,
The element of one or more of In, M indicate the element selected from one or more of Ce, Pr, Eu, Cr, Nd, Er] the YAG class that indicates
Phosphor particles are (for example, Y3Al5O12: Ce phosphor particles, (Y, Gd, Tb)3(Al,Ga)5O12: Ce phosphor particles etc.), silicic acid
Salt phosphor particles are (for example, (Sr, Ca, Ba)2SiO4: Eu etc.) etc..It should be noted that in order to improve dispersibility, fluorophor
Such as it can be the fluorophor that surface is modified by organic group (for example, chain alkyl, phosphate group etc.) etc..At this
In the curable epoxy resin composition of invention, fluorophor can individually a kind of use, can also be applied in combination two or more.This
Outside, it can be used commercially available product as fluorophor.
The content (combined amount) of fluorophor in curable epoxy resin composition of the invention is not particularly limited, phase
For the total amount (100 weight %) of curable epoxy resin composition, it is appropriate to carry out in the range of 0.5~20 weight %
Selection.
1-7. other components
Curable epoxy resin composition of the invention will not cause biggish unfavorable shadow to curability or transparency etc.
In loud range, other components apart from the above can be contained.It as above-mentioned other components, such as can enumerate: there is straight chain
Or polysiloxanes resinoid, the polysiloxanes resinoid with alicyclic ring, polysiloxanes resinoid, the cage with aromatic rings of branch
The silane coupling agents, polysiloxanes such as type/ladder type/random silsesquioxane, γ-glycidoxypropyltrime,hoxysilane
Class or fluorine class defoaming agent etc..The content (combined amount) of above-mentioned other components is not particularly limited, relative to curability asphalt mixtures modified by epoxy resin
The total amount (100 weight %) of oil/fat composition, preferably 5 weight % or less (for example, 0~3 weight %).
Curable epoxy resin composition of the invention is not particularly limited, such as can according to need in a heated state
Above-mentioned each component is stirred and mixed to be prepared.It should be noted that curable epoxy resin composition of the invention can be with
Single liquid system: compositions that be all components directly use by being pre-mixed, be also possible to for example to be divided into it is more than two at
Divide in the composition using the preceding more liquid systems (for example, Double liquid state system) used with predetermined ratio mixing.It stirs and mixes
Method is not particularly limited, it is, for example, possible to use the various mixers such as dissolvers, homogenizer, kneader, roller, ball mill and
Known in rotation-revolution formula agitating device etc. and conventional stirring and mixing arrangement.In addition, can depressurized after stirring and mixing
Or deaerated under vacuum.
2. curability polysiloxane resin composition
Curability polysiloxane resin composition (sometimes referred to as " curability polysiloxane resin composition of the invention ")
It is, in the form of necessary component and containing polyorganosiloxane resin (B) as the solidification compound of curability compound.This hair
Bright curability polysiloxane resin composition can contain the component in addition to polyorganosiloxane resin (B).
It as polyorganosiloxane resin (B), such as can enumerate: also be wrapped in addition to-Si-O-Si- (siloxanes key) as main chain
Containing-Si-RA- Si- (silicon alkylene bond: RAIndicate alkylidene) poly-organosilicon alkylene radical siloxane；Not siliceous alkylene bond conduct
The curability polysiloxanes such as polysiloxane of main chain.
In addition, (the solidification of known or conventional curability polyorganosiloxane resin can be used as polyorganosiloxane resin (B)
Property polysiloxanes), it is not particularly limited, such as can enumerate: add-on type (addition reaction curing type) polyorganosiloxane resin, condensed type
(condensation reaction curing type) polyorganosiloxane resin etc..When curability polysiloxane resin composition of the invention contains the former,
The composition may be used as addition reaction curability polysiloxane resin composition, when the composition contains the latter, the combination
Object may be used as condensation reaction curability polysiloxane resin composition.Hereinafter, these addition reaction curability will be described
Polysiloxane resin composition and condensation reaction curability polysiloxane resin composition, but curability polysiloxanes of the invention
Resin combination is not limited to these, for example, may include addition type polysiloxane resin and condensed type polyorganosiloxane resin this two
Person, and pass through addition reaction and the cured polysiloxane resin composition of condensation reaction.That is, in above-mentioned curing process
The solidification of curability polysiloxane resin composition, can be by reacting selected from least one of addition reaction and condensation reaction
Come carry out.
2-1. addition reaction curability polysiloxane resin composition
As above-mentioned addition reaction curability polysiloxane resin composition, such as following curability polysiloxanes can be enumerated
Resin combination: being used as polyorganosiloxane resin (B) containing the polysiloxanes (B1) in the molecule with more than two alkenyls, and
And also contain the polysiloxanes and gold of the hydrosilyl in the molecule with 1 or more (preferably more than two) as needed
Belong to curing catalysts etc..
Above-mentioned polysiloxanes (B1) is divided into polysiloxane (B1-1) and poly-organosilicon alkylene radical siloxane (B1-2).?
In this specification, poly-organosilicon alkylene radical siloxane (B1-2) refers to, has more than two alkenyls in the molecule, and as master
Chain also includes-Si-R in addition to-Si-O-Si- (siloxanes key)A- Si- (silicon alkylene bond: RAIndicate alkylidene) polysiloxanes.
Also, the polysiloxane (B1-1) in this specification refers to, has more than two alkenyls in the molecule, but without containing above-mentioned
Polysiloxanes of the silylation key as main chain.
It as polysiloxane (B1-1), can enumerate: with straight-chain or the branched (straight chain with part branch
Shape, branched, netted etc.) molecular structure polysiloxanes.It should be noted that polysiloxane (B1-1) can individually make
With one kind, can also be applied in combination two or more.Furthermore, it is possible to be applied in combination two or more poly- with different molecular structures
Organosiloxane (B1-1), such as straight-chain polysiloxane (B1-1) and branched polysiloxane can be applied in combination
(B1-1)。
As the alkenyl that polysiloxane (B1-1) has in the molecule, can enumerate: vinyl, allyl, cyclobutenyl,
The substituted or unsubstituted alkenyl such as pentenyl, hexenyl.As substituent group, can enumerate, such as: halogen atom, hydroxyl, carboxyl
Deng.Wherein, as alkenyl, preferred vinyl.It, can also be in addition, polysiloxane (B1-1) can only have a kind of alkenyl
With two or more alkenyls.The alkenyl contained in polysiloxane (B1-1) is not particularly limited, preferably with silicon atom key
The alkenyl of conjunction.
Being not particularly limited with the group of silicon atom bonding in addition to the alkenyl possessed by polysiloxane (B1-1),
It can be mentioned, for example hydrogen atom, 1 valence organic groups etc..As 1 valence organic group, such as can enumerate: alkyl is [for example, methyl, second
Base, propyl, butyl, amyl, hexyl etc.], naphthenic base is [for example, cyclopropyl, cyclobutyl, cyclopenta, cyclohexyl, cyclo-dodecyl
Deng], aryl [for example, phenyl, tolyl, xylyl, naphthalene etc.], naphthenic base-alkyl is [for example, cyclohexyl methyl, methyl ring
Hexyl etc.], aralkyl [for example, benzyl, phenethyl etc.], the more than one hydrogen atom in alkyl be substituted with halogen atoms and obtain
1 valences such as the halohydrocarbyl [for example, chloromethyl, 3- chloropropyl, 3, halogenated alkyls such as 3,3- trifluoro propyls etc.] arrived replace or do not take
The alkyl etc. in generation.It should be noted that in the present specification, " group with silicon atom bonding " typically refers to not silicon atoms
Group.
In addition, can have hydroxyl and alkoxy as the group with silicon atom bonding.
The character of polysiloxane (B1-1) is not particularly limited, and can be liquid or solid-state.
As polysiloxane (B1-1), preferably by following averaged unit formulas: (R7SiO3/2)a1(R7 2SiO2/2)a2
(R7 3SiO1/2)a3(SiO4/2)a4(ZO1/2)a5The polysiloxane of expression.In above-mentioned averaged unit formula, R7It is identical or different,
It is the substituted or unsubstituted alkyl of 1 valence, above-mentioned specific example can be enumerated (for example, alkyl, alkenyl, aryl, aralkyl, halogenated hydrocarbons
Base etc.).Wherein, R7A part be alkenyl (especially vinyl), and its ratio is controlled in 2 or more in the molecule
In range.For example, alkenyl and R7The ratio of total amount (100 moles of %) be preferably 0.1~40 mole of %.By by the ratio of alkenyl
Within the above range, the curability of curability polysiloxane resin composition has the tendency that further increasing for example control.In addition, making
For the R other than alkenyl7, optimizing alkyl (especially methyl), aryl (especially phenyl).
In above-mentioned averaged unit formula, Z is hydrogen atom or alkyl.It as alkyl, can enumerate: methyl, ethyl, propyl, fourth
Base, amyl, hexyl etc., particularly preferred methyl.
In above-mentioned averaged unit formula, a1 is 0 or positive number, and a2 is 0 or positive number, and a3 is 0 or positive number, and a4 is 0 or positive number, a5
For 0 or positive number, and (a1+a2+a3) is positive number.
As described above, poly-organosilicon alkylene radical siloxane (B1-2) is that have more than two alkenyls in the molecule, and make
For main chain also comprising the polysiloxane of silicon alkylene bond in addition to siloxanes key.It should be noted that sub- as above-mentioned silicon
Alkylidene in alkyl, preferably C2~4Alkylidene (especially ethylidene).Compared with polysiloxane (B1-1), above-mentioned poly- have
Machine silicon alkylene radical siloxane (B1-2) is not easy to form the ring of low molecular weight in preparation section, and not easily pass through heating etc. and divide
Solution forms silanol group (- SiOH), therefore, when using poly-organosilicon alkylene radical siloxane (B1-2), curability polysiloxanes
The surface viscosity (adherence) of the solidfied material of resin combination has the tendency that reduction, and is not susceptible to xanthochromia.
As poly-organosilicon alkylene radical siloxane (B1-2), can enumerate (has part branch with straight-chain or branched
Straight-chain, branched, netted etc.) molecular structure substance.It should be noted that poly-organosilicon alkylene radical siloxane (B1-2)
It can be used alone, can also be applied in combination two or more.For example, can be applied in combination two or more has different points
The poly organo alkyl Asia silane (B1-2) of minor structure, such as straight-chain poly organo alkyl Asia silane can be applied in combination
(B1-2) and branched poly organo alkyl Asia silane (B1-2).
As the alkenyl that poly-organosilicon alkylene radical siloxane (B1-2) has in the molecule, above-mentioned specific example can be enumerated,
Wherein, preferred vinyl.In addition, poly-organosilicon alkylene radical siloxane (B1-2) can only have a kind of alkenyl, it is possible to have
Two or more alkenyls.Alkenyl contained in poly-organosilicon alkylene radical siloxane (B1-2) is not particularly limited, preferably with silicon atom
The alkenyl of bonding.
Do not have in addition to the alkenyl possessed by the poly-organosilicon alkylene radical siloxane (B1-2) with the group of silicon atom bonding
Especially limitation, can enumerate, such as: hydrogen atom, 1 valence organic group etc..As 1 valence organic group, such as above-mentioned 1 valence can be enumerated
Substituted or unsubstituted alkyl etc..Wherein, optimizing alkyl (especially methyl), aryl (especially phenyl).
In addition, can have hydroxyl and alkoxy as the group with silicon atom bonding.
The character of poly-organosilicon alkylene radical siloxane (B1-2) is not particularly limited, and can be liquid or solid-state.
As poly-organosilicon alkylene radical siloxane (B1-2), preferably by following averaged unit formulas: (R8 2SiO2/2)b1
(R8 3SiO1/2)b2(R8SiO3/2)b3(SiO4/2)b4(RA)b5(ZO1/2)b6The poly-organosilicon alkylene radical siloxane of expression.Above-mentioned flat
In modular, R8It is identical or different, be the substituted or unsubstituted alkyl of 1 valence, can enumerate above-mentioned specific example (for example, alkyl,
Alkenyl, aryl, aralkyl, halohydrocarbyl etc.).Wherein, R8A part be alkenyl (especially vinyl), and the ratio exists
It is controlled in molecule in 2 or more ranges.For example, alkenyl and R8Total amount (100 moles of %) ratio be preferably 0.1~
40 moles of %.By the way that the ratio control of alkenyl within the above range, is further increased the combination of curability polyorganosiloxane resin
The tendency of the curability of object.In addition, as the R other than alkenyl8, optimizing alkyl (especially methyl), aryl (especially phenyl).
In above-mentioned averaged unit formula, RAIt is alkylidene as described above.Particularly preferably ethylidene.
In above-mentioned averaged unit formula, Z is same as described above, is hydrogen atom or alkyl.It as alkyl, can enumerate: methyl, second
Base, propyl, butyl, amyl, hexyl etc., particularly preferred methyl.
In above-mentioned averaged unit formula, b1 is positive number, and b2 is positive number, and b3 is 0 or positive number, and b4 is 0 or positive number, and b5 is just
Number, b6 is 0 or positive number.Wherein, it be preferably 1~200, b3 be preferably 0~10, b4 is preferably 0~5 that b1, which is preferably 1~200, b2,
B5 is preferably 1~100.In particular, the mechanical strength of solidfied material has the tendency that further increasing when (b3+b4) is positive number.
As described above, above-mentioned addition reaction curability polysiloxane resin composition is that also have more than one in molecule
Polysiloxanes (otherwise referred to as " the poly- silicon containing hydrosilyl of (preferably more than two) hydrosilyl (Si-H)
Oxygen alkane ").The above-mentioned polysiloxanes containing hydrosilyl is divided into the polysiloxane containing hydrosilyl and contains
The poly-organosilicon alkylene radical siloxane of hydrosilyl.In the present specification, the poly-organosilicon containing hydrosilyl is sub-
Alkylsiloxane refers to there is more than one hydrosilyl in the molecule, and remove-Si-O-Si- (silicon oxygen as main chain
Alkane key) it outside also include-Si-RA- Si- (silicon alkylene bond: RAIndicate alkylidene) polysiloxanes.Also, containing in this specification
There is the polysiloxane of hydrosilyl to refer to, there is more than one hydrosilyl in the molecule, and as master
Chain does not contain the polysiloxanes of above-mentioned silicon alkylene bond.It should be noted that as RA(alkylidene), as described above, for example may be used
Enumerate the C of straight or branched1~12Alkylidene, the preferably C of straight or branched2~4Alkylidene (in particular, ethylidene).
It as the above-mentioned polysiloxane containing hydrosilyl, can enumerate: there is straight-chain, branched (to have
The straight-chain of part branch, branched, netted etc.) molecular structure substance.It should be noted that above-mentioned contain silyl hydride
The polysiloxane of base can be used alone, and can also be applied in combination two or more.It can be applied in combination two or more
The polysiloxane containing hydrosilyl with different molecular structures, such as containing for straight-chain can be applied in combination
There are the polysiloxane of hydrosilyl and the polysiloxane containing hydrosilyl of branched.
With the group of silicon atom bonding possessed by the polysiloxane containing hydrosilyl, hydrogen atom is removed
Group in addition is not particularly limited, such as can enumerate the above-mentioned substituted or unsubstituted alkyl of 1 valence and more specifically can enumerate
Alkyl, aryl, aralkyl, halohydrocarbyl etc..Wherein, optimizing alkyl (especially methyl), aryl (especially phenyl).In addition,
The above-mentioned polysiloxane containing hydrosilyl can have alkenyl (such as vinyl) as in addition to hydrogen atom
With the group of silicon atom bonding.
The character of the above-mentioned polysiloxane containing hydrosilyl is not particularly limited, and can be liquid or solid
Body.Wherein, preferred liquid, the liquid that viscosity is 0.1~1000000000mPas at more preferable 25 DEG C.
As the above-mentioned polysiloxane containing hydrosilyl, preferably by following averaged unit formulas:
(R9SiO3/2)c1(R9 2SiO2/2)c2(R9 3SiO1/2)c3(SiO4/2)c4(ZO1/2)c5The polysiloxane of expression.Above-mentioned average
In modular, R9It is identical or different, it is hydrogen atom or the substituted or unsubstituted alkyl of 1 valence, hydrogen atom, above-mentioned specific reality can be enumerated
Example (for example, alkyl, alkenyl, aryl, aralkyl, halohydrocarbyl etc.).Wherein, R9A part be hydrogen atom (constitute hydrogenation first
The hydrogen atom of silylation), and its ratio is controlled in the range of 1 or more (preferably 2 or more) in the molecule.For example,
Hydrogen atom and R9The ratio of total amount (100 moles of %) be preferably 0.1~40 mole of %.By the way that the ratio control of hydrogen atom is existed
In above range, have the tendency that further increasing the curability of curability polysiloxane resin composition.In addition, as hydrogen atom
R in addition9, optimizing alkyl (especially methyl), aryl (especially phenyl).
In above-mentioned averaged unit formula, Z is as described above, be hydrogen atom or alkyl.It as alkyl, can enumerate: methyl, second
Base, propyl, butyl, amyl, hexyl etc., particularly preferred methyl.
In above-mentioned averaged unit formula, c1 is 0 or positive number, and c2 is 0 or positive number, and c3 is 0 or positive number, and c4 is 0 or positive number, c5
For 0 or positive number, and (c1+c2+c3) is positive number.
As described above, the above-mentioned poly-organosilicon alkylene radical siloxane containing hydrosilyl is that have one in the molecule
Above hydrosilyl groups, and as main chain other than siloxanes key also include silicon alkylene bond polysiloxane.
It should be noted that as the alkylidene in above-mentioned silicon alkylene bond, such as preferred C2~4Alkylidene (in particular, ethylidene).Just
It is poly- containing hydrosilyl compared to above-mentioned for the above-mentioned poly-organosilicon alkylene radical siloxane containing hydrosilyl
Organosiloxane is not easy to form the ring of low molecular weight in preparation section, and not easily pass through heating etc. and be decomposed to form silane
Alcohol radical (- SiOH), therefore, when using the above-mentioned poly-organosilicon alkylene radical siloxane containing hydrosilyl, curability is poly-
The surface viscosity of the solidfied material of silicone resin composition has the tendency that reduction, and is less susceptible to that xanthochromia occurs.
As the above-mentioned poly-organosilicon alkylene radical siloxane containing hydrosilyl, can enumerate with straight-chain, branch
The substance of shape (straight-chain of part branch, branched, netted etc.) molecular structure.It should be noted that above-mentioned contain hydrogenation first
The poly-organosilicon alkylene radical siloxane of silylation can be used alone, and can also be applied in combination two or more.It can combine
Using the two or more poly-organosilicon alkylene radical siloxanes containing hydrosilyl with different molecular structures, such as can
Contain silyl hydride so that poly-organosilicon alkylene radical siloxane that straight-chain contains hydrosilyl and branched is applied in combination
The poly-organosilicon alkylene radical siloxane of base.
In addition to the hydrogen atom possessed by the above-mentioned poly-organosilicon alkylene radical siloxane containing hydrosilyl and silicon
The group of atomistic binding is not particularly limited, such as 1 valence organic group can be enumerated etc..As 1 valence organic group, such as can enumerate
The substituted or unsubstituted alkyl etc. of above-mentioned 1 valence.Wherein, optimizing alkyl (especially methyl), aryl (especially phenyl).
The character of the above-mentioned poly-organosilicon alkylene radical siloxane containing hydrosilyl is not particularly limited, and can be liquid
State or solid-state.
As the above-mentioned poly-organosilicon alkylene radical siloxane containing hydrosilyl, preferably by following averaged unit formulas:
(R10 2SiO2/2)d1(R10 3SiO1/2)d2(R10SiO3/2)d3(SiO4/2)d4(RA)d5(ZO1/2)d6The poly-organosilicon alkylidene silicon of expression
Oxygen alkane.In above-mentioned averaged unit formula, R10It is identical or different, it is hydrogen atom or the substituted or unsubstituted alkyl of 1 valence, hydrogen can be enumerated
Atom, above-mentioned specific example (for example, alkyl, alkenyl, aryl, aralkyl, halohydrocarbyl etc.).Wherein, R10A part be hydrogen
The atom hydrogen atom of hydrosilyl (constitute), and its ratio be controlled in the molecule 1 or more (preferably 2 with
On) in the range of.For example, hydrogen atom and R10The ratio of total amount (100 moles of %) be preferably 0.1~50 mole of %, more preferably
For 5~35 moles of %.By the way that by the ratio control of hydrogen atom, within the above range, curability polysiloxane resin composition is consolidated
The property changed has the tendency that further increasing.In addition, as the R other than hydrogen atom10, optimizing alkyl (especially methyl), aryl are (especially
It is phenyl).In particular, aryl (especially phenyl) and R10The ratio of total amount (100 moles of %) be preferably 5 moles of % or more
(such as 5~80 moles of %), more preferably 10 moles of % or more.
In above-mentioned averaged unit formula, RAIt is alkylidene as described above.Particularly preferably ethylidene.
In above-mentioned averaged unit formula, Z is same as described above, is hydrogen atom or alkyl.It as alkyl, can enumerate: methyl, second
Base, propyl, butyl, amyl, hexyl etc., particularly preferred methyl.
In above-mentioned averaged unit formula, d1 is positive number, and d2 is positive number, and d3 is 0 or positive number, and d4 is 0 or positive number, and d5 is just
Number, d6 is 0 or positive number.Wherein, it be preferably 1~50, d3 be preferably 0~10, d4 is preferably 0~5, d5 that d1, which is preferably 1~50, d2,
Preferably 1~30.
As the poly- silicon oxygen containing hydrosilyl in above-mentioned addition reaction curability polysiloxane resin composition
The polysiloxane containing hydrosilyl can be used only in alkane, can also be used only poly- containing hydrosilyl
Organosilicon alkylene radical siloxane, further, it is also possible to which the polysiloxane containing hydrosilyl is applied in combination and contains hydrogen
Change the poly-organosilicon alkylene radical siloxane of silicyl.When the polysiloxane containing hydrosilyl is applied in combination and contains
When having the poly-organosilicon alkylene radical siloxane of hydrosilyl, their ratio is not particularly limited, and can suitably set.
Above-mentioned addition reaction curability polysiloxane resin composition is not particularly limited, and combines relative to curable resin
The composition (mixing composition) that 1 molar silicyl present in object, preferably alkenyl are 0.2~4 mole, more preferable 0.5~
1.5 moles, further preferred 0.8~1.2 mole.By controlling the ratio of hydrosilyl and alkenyl in above range
It is interior, it is the heat resistance of solidfied material, the transparency, thermal shock resistance, resistance to reflow and to corrosive gas (for example, SOx gas etc.)
Barrier property have the tendency that further increasing.
As described above, above-mentioned addition reaction curability polysiloxane resin composition can contain metallic curing catalyst.Make
It for metallic curing catalyst, can enumerate: silyl hydride well known to platinum-type catalyst, rhodium class catalyst, palladium class catalyst etc.
Anti- applications catalyst, specifically, can enumerate: platinum powder end, platinum black, platinum nonloaded silica powder, platinum load type active carbon, chlorine platinum
The platinum such as the complex compound of formation, the alkene complex of platinum, platinum-the carbonyl ethenyl methyl complex such as sour, chloroplatinic acid and alcohol, aldehyde, ketone
The platinum such as carbonyl complex, platinum-divinyl tetramethyl disiloxane complex compound and platinum-cyclovinylmethylsiloxane complex compound
Platinum-type catalysts such as vinyl methyl siloxane complex compound, platinum-phosphine complex compound, platinum-phosphite complex compound and former containing palladium
Son or rhodium atom replace the palladium class catalyst or rhodium class catalyst of the pt atom in above-mentioned platinum-type catalyst.Wherein, as hydrogenation
Silylating catalyst, platinum vinyl methyl siloxane complex compound, platinum-carbonyl ethenyl methyl complex, chloroplatinic acid and alcohol, aldehyde
The reaction rate of the complex compound of formation is good, therefore it is preferred that.
It should be noted that the metallic curing catalyst in above-mentioned addition reaction curability polysiloxane resin composition
(hydrosilylation catalyst) can be used alone, and can also be applied in combination two or more.
Metallic curing catalyst in above-mentioned addition reaction curability polysiloxane resin composition (urge by silyl hydride
Agent) content (combined amount) be not particularly limited, relative to containing in addition reaction curability polysiloxane resin composition
1 mole of total amount of alkenyl, preferably 1 × 10-8~1 × 10-2Mol, more preferably 1.0 × 10-6~1.0 × 10-3mol.Pass through
Content is set as 1 × 10-8Mol or more, it is intended to can more effectively form solidfied material.On the other hand, by setting content
It is set to 1 × 10-2Mol or less, it is intended to the solidfied material with better form and aspect (coloring is less) can be obtained.
Above-mentioned addition reaction curability polysiloxane resin composition can contain component in addition to the components described above.
2-2. condensation reaction curability polysiloxane resin composition
It as above-mentioned condensation reaction curability polysiloxane resin composition, such as can enumerate: containing having in the molecule
The polysiloxanes (B2) of more than two silanol groups (Si-OH) or siloxy (Si-OR) is used as polyorganosiloxane resin (B2),
It and as needed include the curability polysiloxane resin composition of metallic curing catalyst etc..It should be noted that poly-
Siloxanes (B2) can be only with any one in silanol group and siloxy, it is possible to have silanol group and silane oxygen
Base both.When with silanol group and siloxy both when, their sums in the molecule are two or more.
As polysiloxanes (B2), can enumerate, such as: the polysiloxane indicated by following average composition formulas.
R11 eSi(OR12)f(OH)gO(4-e-f-g)/2
[in above-mentioned average composition formula, R11It is identical or different, indicate that carbon atom number is 1~20 1 valence organic group.R12
It is identical or different, indicate that carbon atom number is 1~4 1 valence organic group.E is 0.8~1.5 number, and f is 0~0.3 number, and g is 0
~0.5 number.F+g is 0.001 number more than and less than 1.2.In addition, e+f+g is 0.801 number more than and less than 2.]
As the R in above-mentioned average composition formula111 valence organic group, such as can enumerate: 1 valence aliphatic alkyl (for example,
Alkyl, alkenyl etc.)；1 valence aromatic hydrocarbyl (for example, aryl etc.)；1 valence heterocycle；Aliphatic alkyl, alicyclic type hydrocarbon, two kinds
1 valence group made of above aromatic hydrocarbyl bonding etc..It should be noted that these 1 valence organic groups can have substitution
Base (for example, the substituent groups such as hydroxyl, carboxyl, halogen atom).Wherein, as R11, preferably carbon atom number be 1~20 alkyl, carbon
The aryl that alkenyl that atomicity is 1~20, carbon atom number are 6~20.In addition, as the R in above-mentioned average composition formula121 valence
Organic group, such as can enumerate: it can have 1 valence aliphatic alkyl (for example, alkyl, alkenyl etc.) of substituent group etc..Wherein, make
For R12, preferably carbon atom number be 1~4 alkyl, carbon atom number be 2~4 alkenyl.
In above-mentioned condensation reaction curability polysiloxane resin composition, polysiloxanes (B2) can be used alone one
Kind, it can also be applied in combination two or more.
As described above, above-mentioned condensation reaction curability polysiloxane resin composition can contain metallic curing catalyst.Make
For such metallic curing catalyst, known or conventional condensation catalyst can be enumerated, such as can be enumerated: organic metatitanic acid
Salt, Organo-Titanate Chelates, organo-aluminum compound, organic zirconate, organo-tin compound, the metal salt of organic carboxyl acid, amination
Close object or its salt, quaternary ammonium salt, the lower aliphatic hydrochlorate of alkali metal, dialkylhydroxyamines, the organo-silicon compound containing guanidine radicals etc..Its
In, from the viewpoint of reactivity, preferred organic zirconate.They can be used alone, and can also be applied in combination two
Kind or more.Metallic curing catalyst (condensation catalyst) in above-mentioned condensation reaction curability polysiloxane resin composition
Content (combined amount) be not particularly limited, such as relative to 100 parts by weight of total amount of polysiloxanes (B2), can 0.01~
It is suitably selected in the range of 20 parts by weight.
Above-mentioned condensation reaction curability polysiloxane resin composition can contain component in addition to the components described above.
Curability polysiloxane resin composition of the invention is (for example, above-mentioned addition reaction curability polyorganosiloxane resin
Composition, condensation reaction curability polysiloxane resin composition etc.) other components can be contained.As other components, such as
The component etc. contained in curable epoxy resin composition of the invention can be enumerated.Its content is it is not also specifically limited, can be with
Appropriate selection.For example, when curability polysiloxane resin composition of the invention is optical semiconductor sealing resin combination,
Preferably comprise above-mentioned fluorophor.The content (combined amount) of fluorophor in curability polysiloxane resin composition of the invention does not have
There is special limitation, it, can be in 0.5~20 weight relative to the total amount (100 weight %) of curability polysiloxane resin composition
It is suitably selected in the range of amount %.
Curability polysiloxane resin composition of the invention is not particularly limited, such as can according to need in heating shape
Above-mentioned each component is stirred and mixed under state to prepare.It should be noted that curability polysiloxane resin composition of the invention
Can be all components through being pre-mixed and single liquid system: compositions for directly using, be also possible to be divided into two groups of ingredients with
On, and using before with predetermined ratio mixing come the composition of the more liquid systems (for example, Double liquid state system) used.Stirring and mixing
Method be not particularly limited, it is, for example, possible to use the various mixers such as dissolvers, homogenizer, kneader, roller, ball mill, with
And known in rotation-revolution formula agitating device etc. and conventional stirring and mixing arrangement.In addition, can subtract after stirring and mixing
Pressure or deaerated under vacuum.Further, it is also possible to directly use commercially available product as curability polysiloxane resin composition of the invention
Or its constituent component.
3. curability acrylic resin composition
Above-mentioned curability acrylic resin composition (is properly termed as " curability acrylic resin of the invention sometimes
Composition ") it is the solidification compound for containing acrylic resin (C) using necessary component as curability compound.The present invention
Curability acrylic resin composition contain component in addition to acrylic resin (C).
As acrylic resin (C), can enumerate, such as: there is (the choosing of more than one (methyl) acryloyl group in molecule
From at least one of acryloyl group and methylacryloyl group) compound.As acrylic resin (C), can enumerate,
Such as: only with (methyl) acryl compound of (methyl) acryloyl group in molecule；There is two or more in molecule
Multifunctional (methyl) acryl compound of (methyl) acryloyl group.It should be noted that only having one in above-mentioned molecule
In (methyl) acryl compound of (methyl) acryloyl group, include: not having the polymerism other than (methyl) acryloyl group
Simple function (methyl) acryl compound of functional group；And other than (methyl) acryloyl group, also have more than one
Multifunctional (methyl) acryloyl group of other polymerizable functional groups of epoxy group, oxetanyl, vinyl, ethyleneoxy etc.
Compound.Acrylic resin (C) can be used alone, and can also be applied in combination two or more.It should be noted that this
The content of acrylic resin (C) in the curability acrylic resin composition of invention is not particularly limited, can be appropriate
Selection.
Curability acrylic resin composition of the invention for example may include for gathering acrylic resin (C)
Close the initiator of reaction.Polymerization initiator known in thermal polymerization etc. or conventional can be enumerated as initiator.They can be with
It is used alone, can also be used in combination of two or more.In addition, the content of initiator is not particularly limited, can suitably select.
Curability acrylic resin composition of the invention can contain other components.As other components, such as can lift
The component contained in curable epoxy resin composition of the invention out.Its content is it is not also specifically limited, can suitably select
It selects.For example, preferably being wrapped when curability acrylic resin composition of the invention is optical semiconductor sealing resin combination
Containing above-mentioned fluorophor.The content (combined amount) of fluorophor in curability acrylic resin composition of the invention is without special
Limitation, can be in the model of 0.5~20 weight % relative to the total amount (100 weight %) of curability acrylic resin composition
Enclose appropriate selection.
Curability acrylic resin composition of the invention is not particularly limited, such as can according to need in heating shape
Above-mentioned each component is stirred and mixed under state to prepare.It should be noted that curability acrylic resin composition of the invention
Can be all components through being pre-mixed and single liquid system: compositions for directly using, be also possible to be divided into two groups of ingredients with
On, and using before with predetermined ratio mixing come the composition of the more liquid systems (for example, Double liquid state system) used.Stirring and mixing
Method be not particularly limited, it is, for example, possible to use the various mixers such as dissolvers, homogenizer, kneader, roller, ball mill, with
And known in rotary agitator device etc. and conventional stirring and mixing arrangement.In addition, after stirring and mixing, can in decompression or
Deaerated under vacuum.Further, it is also possible to directly use commercially available product as curability acrylic resin composition of the invention or its
Constituent component.
[solidfied material and concaveconvex shape]
In antireflection material of the invention, above-mentioned hydrophobic porous inorganic filler is evenly dispersed and spreads over above-mentioned resin
In composition or its entire solidfied material, since dispersity is stablized, be present on solidfied material surface hydrophobic porous inorganic is filled out
Material forms concaveconvex shape, and makes incident light that scattering occur to show anti-reflection function.In addition, hydrophobic porous inorganic filler table
Porous structure on face can also scatter incident light, and further increase anti-reflection function.
Further, since the surface exhibits of hydrophobic porous inorganic filler go out hydrophobicity, even if therefore containing its solidfied material
The high-fire resistance being not easily deteriorated, especially hot water resistance, excellent in te pins of durability are also shown under boiling water etc. acutely heating condition.
Disperse above-mentioned hydrophobic porous inorganic filler and the method spread in entire solidfied material is not particularly limited, example
It can such as enumerate, hydrophobic porous inorganic filler is dispersed in the resin combination for constituting solidfied material and then carried out is cured
Method etc..In order to be effectively prepared antireflection material of the invention, preferably by hydrophobic porous inorganic filler it is evenly dispersed after make
Its cured method.
Hereinafter, being illustrated to an embodiment of the manufacturing method of antireflection material of the invention, but the present invention is not
It is limited to this.
Hydrophobic porous inorganic filler can be added in resin combination, by mix and stirring make it is hydrophobic porous
Inorganic filler is evenly dispersed.Stirring and mixed method are not particularly limited, and it is each that it is, for example, possible to use dissolvers, homogenizers etc.
Known in kind of mixer, kneader, roller, ball mill and rotation-revolution agitating device etc. and conventional stirring and mixing arrangement.This
It outside, can be in decompression or deaerated under vacuum after stirring and mixing.
The character of resin combination before curing of the invention is not particularly limited, preferably liquid.Of the invention is resisted
It, can be to add on a small quantity just by using hydrophobic porous inorganic filler for the resin combination before curing of reflecting material
Anti-reflection function is shown, therefore it is preferred that is also easy to become liquid without using toluene equal solvent.
[curing process]
Antireflection material of the invention is obtained by following manner: making the evenly dispersed tree for having hydrophobic porous inorganic filler
Oil/fat composition solidification, obtains solidfied material (hereinafter sometimes called " solidfied material of the invention ").
Relative to the total amount (100 weight %) of resin combination before curing, the amount for the component volatilized in solidification does not have
Especially limitation, preferably 10 weight % hereinafter, more preferably 8 weight % hereinafter, further preferably 5 weight % or less.When solid
When the amount for the component volatilized in change is 10 weight % or less, the dimensional stability enhancing of solidfied material, therefore it is preferred that.Of the invention is consolidated
For resin combination before change, by using hydrophobic porous inorganic filler, antireflection can be shown to add on a small quantity
Function, therefore be set as being also easy to become liquid without using the volatile component of solvent (toluene etc.), and can reduce and solidified
The amount of the component of middle volatilization.
As solidification means, known or conventional means, such as heat treatment or photo-irradiation treatment etc. can be used.Pass through
Temperature (solidification temperature) when heating is solidified is not particularly limited, preferably 45~200 DEG C, more preferably 50~190 DEG C,
Further preferably 55~180 DEG C.In addition, the heating time (curing time) when solidifying is not particularly limited, preferably 30~
600 minutes, more preferably 45~540 minutes, further preferably 60~480 minutes.If solidification temperature and curing time are low
In the lower limit of above range, then solidify it is insufficient, on the contrary, if be higher than above range the upper limit, resin Composition may occur
Decomposition, therefore not preferably.Although condition of cure depends on various conditions, such as when solidification temperature increases, can pass through
Shorten curing time suitably to be adjusted, when solidification temperature reduces, can suitably be adjusted by extending curing time
Section etc..In addition, solidification can be carried out by a step, can also be carried out by multisteps more than two steps.
In addition, in the case where injecting the cured situation of row by illumination, for example, by that will include i- line (365nm), h- line
The light (radioactive ray) of (405nm), g- line (436nm) etc. is with 10~1200mW/cm of illumination2, 20~2500mJ/cm of irradiate light quantity2Into
Row irradiation is to obtain antireflection material of the invention.The viewpoint of deterioration and production because of caused by radioactive ray from inhibition solidfied material
From the perspective of property, the irradiate light quantity of radioactive ray is preferably 20~600mJ/cm2, more preferably 20~300mJ/cm2.In irradiation,
High-pressure sodium lamp, xenon lamp, carbon arc lamp, metal halide lamp, laser etc. can be used as irradiation source.
[antireflection material]
As described above, antireflection material of the invention other than with high transparency and excellent anti-reflection function, is gone back
High-fire resistance (especially hot water resistance) is had both, therefore can be preferably used as optical material (is used to form optical material
Purposes) resin.Optical material is the material for showing the various optical functions such as light diffusing, photopermeability, light reflective.Pass through
Using antireflection material of the invention, the optical component including at least solidfied material (optical material) of the invention can be obtained.It needs
It is noted that the optical component can be only made of antireflection material of the invention, this hair can also be used with only a part
Bright antireflection material.It as optical component, can enumerate: show the various optics such as light diffusing, photopermeability, light reflective
Device or component of machine of above-mentioned optical function etc. is utilized in the component of function, composition, is not particularly limited, such as can enumerate
For known in following purposes or conventional optical component: optical semiconductor device, organic el device, bonding agent, electrically insulating material,
Laminated plate, coating, ink, coating, sealant, resist, composite material, transparent substrate, slide, hyaline membrane, optical element,
Optical lens, optical mode, Electronic Paper, touch tablet, solar cell substrate, optical waveguide, light guide plate, holographic memory, optics pick up
Take sensor etc..
Since hydrophobic porous inorganic filler is evenly dispersed and spreads in entire solidfied material, antireflection material of the invention
On surface on there is the subtle and uniform concaveconvex shape that is formed by hydrophobic porous inorganic filler, incident light is due to the bumps
Shape and occur scatter but be not totally reflected, therefore, gloss can be inhibited and improve visuality.In antireflection of the invention
The equal surface roughness Ra of the number of the concaveconvex shape formed on material is preferably in 0.1~1.0 μm of range, more preferably 0.2~0.8
μm range.If the equal surface roughness Ra of the number of concaveconvex shape is in the range, there are following tendencies: can be in not significant drop
In the case where low total light flux, sufficient anti-reflection function is shown.
It should be noted that in the present invention, the equal surface roughness Ra of number is the number as defined in JIS B 0601-2001
Value, and refer to the numerical value for measuring and being calculated by the method recorded in aftermentioned embodiment.
The resin combination of antireflection material of the invention is constituted, for example, optical semiconductor sealing tree can be preferably used as
Oil/fat composition.That is, resin combination of the invention can be preferably used as to the optical semiconductor in optical semiconductor device
The composition (sealing material of the optical semiconductor in optical semiconductor device) being sealed.By using resin of the invention
The antireflection material that composition (optical semiconductor sealing resin combination) manufactures obtains the light half that optical semiconductor is sealed
Conductor device (for example, 104 in Fig. 1 be the optical semiconductor device being made of antireflection material of the invention).Such as it can incite somebody to action
In the specified shaping dies of the evenly dispersed resin combination injection for having hydrophobic porous inorganic filler, carry out in predefined conditions
It is heating and curing or photocuring carrys out encapsulating optical semiconductor element.Solidification temperature, curing time, condition of photocuring etc., can with
Preparing for above-mentioned antireflection material is appropriately configured in identical range.For the optical semiconductor device of aforementioned present invention,
Excellent anti-reflection function can be especially shown in the case where not reducing total light flux, and has high-fire resistance (special
It is not hot water resistance).It should be noted that in the present specification, " optical semiconductor device of the invention " refers to, it will be of the invention
Antireflection material is used at least one of the component parts (for example, sealing material, chip grafting material etc.) of optical semiconductor device
Optical semiconductor device made of point.
Embodiment
Hereinafter, will be based on embodiment come the present invention will be described in more detail, but the present invention is not limited to these Examples.It needs
Illustrate, the unit of the component of resin combination shown in composition table 1,2 is parts by weight.
Production Example 1
Use rotation-revolution formula agitating device (trade name " Awatori practices Taro AR-250 ", by Thinky Co. Ltd. system
It makes, same as below), by the curing agent (trade name " Rikacid MH-700 ", by New Japan Chem Co., Ltd of 100 parts by weight
Manufacture), the curing accelerator (trade name " U-CAT 18X ", manufactured by San-Apro Co., Ltd.) of 0.5 parts by weight, 1 parts by weight
Ethylene glycol (being manufactured by Wako Pure Chemicals Co., Ltd.) mixed, prepare epoxy hardener (K agent).
Embodiment 1
Using rotation type agitating device, by the cycloaliphatic epoxy (trade name " Celloxide of 100 parts by weight
2021P " is manufactured as Daicel Co., Ltd.), epoxy hardener obtained in the preparation examples 1 of 101.5 parts by weight mixed,
Defoaming, prepares curable epoxy resin composition.
Using rotation type agitating device, by the curable epoxy resin composition obtained above of 100 parts by weight, 20 weight
Hydrophobic porous inorganic filler (the trade name " SYLOPHOBIC 702 ", by Fuji Silysia Chemical Co., Ltd. of part
Manufacture) mixing, degassing, obtained curable epoxy resin composition, and cast in drawing for photosemiconductor shown in Fig. 1
On wire frame (InGaN element, 3.5mm × 2.8mm), then heated 5 hours in 150 DEG C of curing furnace, to manufacture
The optical semiconductor device sealed with optical semiconductor by antireflection material of the invention.It should be noted that
In Fig. 1,100 it is reflector, 101 is metal line, 102 is optical semiconductor, 103 is closing line, 104 is sealing material
(antireflection material), hydrophobic porous inorganic filler is evenly dispersed and spreads in entire 104, by existing on surface to its upper
Hydrophobic porous inorganic filler form subtle and uniform concaveconvex shape (concaveconvex shape is not shown).
Embodiment 2~13, comparative example 1~13
In addition to by curable epoxy resin composition, hydrophobic porous inorganic filler, porous inorganic filling materials (without hydrophobic
Change the filler of processing) composition changed as shown in table 1,2 except, in the same manner as example 1, manufacture light half
Conductor device.
[evaluation]
Following evaluations are carried out to the optical semiconductor device of above-mentioned manufacture.As a result it is shown in table 1,2.
(1) hot water resistance test (heat resistance in boiling water)
The optical semiconductor device obtained in embodiment, comparative example is immersed in boiling water 30 minutes, is then observed by the naked eye
Appearance is evaluated.The case where appearance is zero with identical situation before test, becomes gonorrhoea for ×.
(2) fluorescent lamp mirrors
The fluorescent lamp lighted is shone to the upper surface (sealing of Fig. 1 of embodiment, the optical semiconductor device obtained in comparative example
The upper surface of material 104) and when observing reflection, it observes by the naked eye and commenting for three phases is carried out to the clarity of fluorescent lamp
Valence.
The case where the case where cannot identifying the profile of fluorescent lamp is zero, and profile is not known but can be identified is △, and wheel is cleaned up
Chu and the case where capable of identifying be ×.
(3) the equal surface roughness Ra of number
Use laser microscope (trade name " measuring shape laser microscope VK-8710 ", by Keyence Co. Ltd. system
Make), measure the upper surface (upper surface of the sealing material 104 of Fig. 1) of optical semiconductor device obtained in embodiment, comparative example.
(4) total light flux
Use total light flux measuring machine (trade name " more light splitting radioassay system OL771 ", by Optotronic
The manufacture of Laboratories company) measurement embodiment, each optical semiconductor device for obtaining in comparative example is under conditions of 5V, 20mA
Total light flux when energization.
(5) comprehensive judgement
For each optical semiconductor device obtained in embodiment, comparative example, it will all meet the feelings of following (a)~(d)
The case where condition is determined as zero (good), is unsatisfactory for any one of following (a)~(d) is determined as × (bad).
(a) hot water resistance measured in above-mentioned (1) is zero.
(b) mirroring for the fluorescent lamp measured in above-mentioned (2) is zero or Δ.
(c) the equal surface roughness Ra of number measured in above-mentioned (3) is 0.10~1.0 μm.
(d) total light flux measured in above-mentioned (4) is 0.60lm or more.
The each component of antireflection material shown in composition table 1,2 is described below.
(hydrophobic porous inorganic filler)
SYLOPHOBIC702: trade name " SYLOPHOBIC702 ", by Fuji Silysia Chemical Co. Ltd. system
It makes, porous silica filler obtained by hydrophobic surface treatments is carried out by dimethyl silicone polymer, volume average particle size:
4.1μm；The specific surface area of porous silica filler before hydrophobic surface treatments: 350m2/g；Oil absorption: 170mL/100g
SYLOPHOBIC4004: trade name " SYLOPHOBIC4004 ", by Fuji Silysia Chemical Co., Ltd.
Manufacture, porous silica filler, volume obtained from having carried out hydrophobic surface treatments as dimethyl silicone polymer are average
Partial size: 8.0 μm；The specific surface area of porous silica filler before hydrophobic surface treatments: 350m2/g；Oil absorption: 165mL/
100g
SYLOPHOBIC505: trade name " SYLOPHOBIC505 ", by Fuji Silysia Chemical Co. Ltd. system
It makes, porous silica filler obtained from having carried out hydrophobic surface treatments as dimethyl silicone polymer, volume is averaged grain
Diameter: 3.9 μm；The specific surface area of porous silica filler before hydrophobic surface treatments: 500m2/g；Oil absorption: 110mL/
100g
(porous inorganic filling materials)
SYLYSIA430: trade name " SYLYSIA430 " is manufactured, body by Fuji Silysia Chemical Co., Ltd.
Product average grain diameter: 4.1 μm；Specific surface area: 350m2/g；Average pore size: 17nm；Pore volume: 1.25mL/g；Oil absorption: 230mL/
100g
SYLOSPHERE C-1504: trade name " SYLOSPHERE C-1504 ", by Chemical plants of Fuji Silysia
The manufacture of formula commercial firm, volume average particle size: 4.5 μm；Specific surface area: 520m2/g；Average pore size: 12nm；Pore volume: 1.5mL/g；
Oil absorption: 290mL/100g
SUNSPHER H-52: trade name " SUNSPHER H-52 " is manufactured by AGC SITEC Co., Ltd., and volume is average
Partial size: 5 μm；Specific surface area: 700m2/g；Average pore size: 10nm；Pore volume: 2mL/g；Oil absorption: 300mL/100g
(epoxy resin)
CELLOXIDE 2021P: trade name " CELLOXIDE 2021P " [3,4- epoxycyclohexyl-methyl (3,4- epoxy
Base) cyclohexane carboxylate], manufactured by Daicel Co., Ltd.
YD-128: trade name " YD-128 " [bisphenol A type epoxy resin] is manufactured by Nippon Steel & Sumitomo Metal Corporation
TEPIC-VL: trade name " TEPIC-VL " [triglycidyl group isocyanuric acid ester], by Nissan Chemical Industries strain formula
Commercial firm's manufacture
152: trade name " 152 " [phenol novolak type epoxy resin] is manufactured by Mitsubishi chemical Co., Ltd
YL7410: trade name " YL7410 " [aliphatic epoxy compound] is manufactured by Mitsubishi chemical Co., Ltd
X-22-169AS: [(two ends have the poly dimethyl of hexamethylene alkenyloxy group to modified silicon oil to trade name " X-22-169AS "
Siloxanes)], it is manufactured by Shin-Etsu Chemial Co., Ltd
X-40-2670: trade name " X-40-2670 " [annular siloxane with hexamethylene alkenyloxy group], by SHIN-ETSU HANTOTAI's chemistry work
The manufacture of industry Co., Ltd.
(epoxy hardener)
MH-700: trade name " RIKACID MH-700 " [4- methylhexahydrophthalic anhydride/hexahydrophthalic anhydride
=70/30], manufactured by New Japan Chem Co., Ltd
U-CAT 18X: trade name " U-CAT 18X " (curing accelerator) is manufactured by San Apro Co., Ltd.
Ethylene glycol: it is manufactured by Wako Pure Chemicals Co., Ltd..
As shown in table 1, just there is the light of the antireflection material of the embodiment added with hydrophobic porous inorganic filler partly to lead
For body device, hot water resistance test is zero, and mirroring for fluorescent lamp is zero or △ evaluation, and the equal surface roughness Ra of number exists
In the range of 0.10~1.0 μm, total light flux in the range of 0.60lm or more, have both excellent anti-reflection function and illumination,
Excellent heat resistance, particularly hot water resistance.
On the other hand, as shown in table 2, just it is mixed with the light of the comparative example of the porous inorganic filling materials without silicic acid anhydride
For semiconductor device, show excellent anti-reflection function and illumination, but hot water resistance test be ×, hot water resistance compared with
Difference.
Hereinafter, the variation of aforementioned present invention will be attached.
[1] a kind of antireflection material, it includes the solidfied material for the resin combination for being dispersed with hydrophobic porous inorganic filler,
Wherein, the bumps for inhibiting reflection are formed on the surface of the solidfied material.
[2] antireflection material according to above-mentioned [1], wherein the hydrophobic porous inorganic filler is evenly dispersed simultaneously
It spreads in the entire solidfied material, and is formed with the bumps for inhibiting reflection on the surface of the solidfied material.
[3] antireflection material according to above-mentioned [1] or [2], wherein constitute the porous of hydrophobic porous inorganic filler
Inorganic filler (porous inorganic filling materials that surface is passed through before hydrophobic treatment) is selected from unorganic glass [such as pyrex, borosilicate
Sour soda-lime glass, water soda glass, aluminum silicate glass, quartz etc.], silica, aluminium oxide, zircon iron oxide, zinc oxide, oxidation
Zirconium, magnesia, titanium oxide, aluminium oxide, forsterite, talcum, spinelle, clay, kaolin, dolomite, hydroxyapatite, rosy clouds
Stone dodges at least one of feldspar, christobalite, wollastonite, diatomite, talcum etc. powder, i.e., the substance with porous structure or
Their formed body (such as spherical bead etc.).
[4] antireflection material according to above-mentioned [3], wherein above-mentioned hydrophobic porous inorganic filler is with selected from gold
Belong at least one of oxide, silane coupling agent, titanium coupling agent, organic acid, polyalcohol, organo-silicon compound hydrophobic surface
Substance obtained from inorganic agent is surface-treated above-mentioned porous inorganic filling materials.
[5] antireflection material according to above-mentioned [4], wherein above-mentioned hydrophobic surface treatments agent is organosilicon compound
Object.
[6] antireflection material according to above-mentioned [5], wherein above-mentioned organo-silicon compound are selected from trimethylchloro-silicane
Alkane, hexamethyldisiloxane, dimethyldichlorosilane, prestox ring tetrasilane, dimethyl silicone polymer, cetyl silane,
At least one of methacryl silanes, silicone oil (preferably dimethyl silicone polymer).
[7] antireflection material according to any one of above-mentioned [1]~[6], wherein above-mentioned hydrophobic porous inorganic to fill out
Material is to be selected from hydrophobic porous unorganic glass and hydrophobic porous silica (hydrophobic porous silica filler) extremely
Few one kind (preferably hydrophobic porous silica filler).
[8] antireflection material according to above-mentioned [7], wherein above-mentioned hydrophobic porous silica filler is to use
Hydrophobic surface treatments agent processing is stated selected from fused silica, crystalline silica, high-purity synthetic silica, colloidal state two
Substance obtained from least one of silica porous silica.
[9] antireflection material according to any one of above-mentioned [1]~[8], wherein above-mentioned hydrophobic porous inorganic to fill out
The shape of material is (preferably spherical or broken selected from least one of powder, spherical, broken shape, threadiness, needle-shaped, flakey
Shape).
[10] antireflection material according to any one of above-mentioned [1]~[9], wherein above-mentioned hydrophobic porous inorganic
Filler is that the surface of porous inorganic filling materials have passed through filler obtained from hydrophobicity processing, and the porous, inorganic before hydrophobicity processing is filled out
The specific surface area of material is 200m2/ g or more (preferably 200~2000m2/ g, more preferable 200~1500m2/ g, further preferred 200
~1000m2/g)。
[11] antireflection material according to any one of above-mentioned [1]~[10], wherein above-mentioned hydrophobic porous inorganic
The average grain diameter of filler is 1 μm~20 μm (preferably 2 μm~15 μm).
[12] antireflection material according to any one of above-mentioned [1]~[11], wherein above-mentioned hydrophobic porous inorganic
The oil absorption of filler is 10~2000mL/100g (preferably 100~1000mL/100g).
[13] antireflection material according to any one of above-mentioned [1]~[12], wherein above-mentioned hydrophobic porous inorganic
Filler relative to above-mentioned antireflection material total amount (100 weight %) content be 4~40 weight % (preferably 4~35 weight %, more
It is preferred that 4~30 weight %).
[14] antireflection material according to any one of above-mentioned [1]~[13], wherein above-mentioned hydrophobic porous inorganic
Filler is that 5~80 parts by weight are (excellent relative to the content (combined amount) for the resin combination (100 parts by weight) for constituting antireflection material
Select 5~70 parts by weight, more preferable 5~60 parts by weight).
[15] antireflection material according to any one of above-mentioned [1]~[14], wherein above-mentioned resin combination includes
Transparent hardening resin composition.
[16] antireflection material according to above-mentioned [15], wherein above-mentioned hardening resin composition includes comprising choosing
From the combination of at least one of epoxy resin (A), polyorganosiloxane resin (B), acrylic resin (C) curability compound
Object.
[17] antireflection material according to above-mentioned [16], wherein above-mentioned hardening resin composition contains ring
The composition (curable epoxy resin composition) of oxygen resin (A).
[18] antireflection material according to above-mentioned [16] or [17], wherein above-mentioned epoxy resin (A) is selected from bis-phenol
With isocyanuric acid ester, the phenolic resin varnish type epoxy resin, ester ring of more than one epoxy group in A type epoxy resin, molecule
At least one of oxygen compound, aliphatic epoxy compound, silicone derivative in molecule with more than one epoxy group
(preferably cycloaliphatic epoxy).
[19] antireflection material according to above-mentioned [18], wherein above-mentioned cycloaliphatic epoxy includes in molecule
Compound (compound preferably in molecule with more than two cyclohexene oxide bases) with cyclohexene oxide base.
[20] antireflection material according to above-mentioned [19], wherein above-mentioned cycloaliphatic epoxy includes following formula (1)
Compound represented.
[chemical formula 11]
[in formula (1), X indicates singly-bound or linking group (bivalent group with more than one atom).Substituent group is (excellent
Select alkyl) it can be with the more than one carbon atom bonding on the alicyclic ring in constitutional formula (1).]
[21] antireflection material according to above-mentioned [20], wherein the compound by above formula (1) expression is selected from 2,2-
Bis- (3,4- 7-oxa-bicyclo[4.1.0-1- base) propane, bis- (3,4- epoxycyclohexyl-methyl) ethers, the bis- (3,4- 7-oxa-bicyclo[4.1.0-1- of 1,2-
Base) ethane, bis- (3,4- 7-oxa-bicyclo[4.1.0-1- base) ethane of 1,2- epoxy-1,2- and the change indicated by following formula (1-1)~(1-10)
Close at least one of object cycloaliphatic epoxy.
[chemical formula 12]
[chemical formula 13]
[l, m in formula (1-5), (1-7) respectively indicate 1~30 integer.R in formula (1-5) is carbon atom number 1~8
Alkylidene.N in following formula (1-9), (1-10)1~n6Respectively indicate 1~30 integer.]
[22] antireflection material according to above-mentioned [21], wherein above-mentioned cycloaliphatic epoxy includes above formula (1-
1) compound indicated.
[23] antireflection material according to any one of above-mentioned [17]~[22], wherein above-mentioned epoxy resin (A) phase
For curable epoxy resin composition total amount (100 weight %) content (combined amount) be 25~99.8 weight % (for example,
25~95 weight %) (preferably 30~90 weight %, more preferably 35~85 weight %, further preferably 40~60 weights
Measure %).
[24] antireflection material according to any one of above-mentioned [18]~[23], wherein above-mentioned alicyclic epoxy
It is 20~99.8 weight % that object, which is closed, relative to the content (combined amount) of the total amount (100 weight %) of curable epoxy resin composition
(preferably 40~95 weight % (for example, 40~60 weight %), more preferably 50~95 weight %, further preferably 60~
90 weight %, most preferably 70~85 weight %).
[25] antireflection material according to any one of above-mentioned [18]~[24], wherein cycloaliphatic epoxy
The ratio of total amount (100 weight %) relative to the epoxide for including in above-mentioned curable epoxy resin composition be 40~
100 weight % (for example, 40~90 weight %) (preferably 80~100 weight %, more preferably 90~100 weight %, further
Preferably 95~100 weight %).
[26] antireflection material according to any one of above-mentioned [17]~[25], wherein above-mentioned curability asphalt mixtures modified by epoxy resin
Oil/fat composition also includes curing agent (D) and curing accelerator (E), or also includes curing catalysts (F) (preferred consolidation agent (D)
With curing accelerator (E)).
[27] antireflection material according to above-mentioned [26], wherein above-mentioned curing agent (D) is that (anhydride is solid for anhydride
Agent), amine (amine curing agent), polyamide, imidazoles (imidazole curing agent), polysulfide alcohols (polysulfide alcohols solidification
Agent), phenols (phenols curing agent), polybasic carboxylic acid class, at least one of dicyandiamide class and organic acid hydrazides (preferred anhydrides
Class curing agent).
[28] antireflection material according to above-mentioned [27], wherein above-mentioned acid anhydride type curing agent is at 25 DEG C for liquid
The acid anhydrides of state, or will be that solid acid anhydrides is dissolved in the mixing of liquid obtained from the acid anhydrides for being liquid at 25 DEG C at 25 DEG C
Object.
[29] antireflection material according to any one of above-mentioned [26]~[28], wherein above-mentioned curing agent (D) is opposite
The content (combined amount) of 100 parts by weight of total amount for the epoxide for including in curable epoxy resin composition be 50~
200 parts by weight (preferably 75~150 parts by weight, more preferable 100~120 parts by weight).
[30] antireflection material according to any one of above-mentioned [26]~[29], wherein above-mentioned curing accelerator (E)
The content (combined amount) of 100 parts by weight of total amount relative to the epoxide for including in curable epoxy resin composition is
0.05~5 parts by weight (preferably 0.1~3 parts by weight, more preferable 0.2~3 parts by weight, further preferred 0.25~2.5 parts by weight).
[31] antireflection material according to any one of above-mentioned [17]~[30], wherein above-mentioned curability asphalt mixtures modified by epoxy resin
Oil/fat composition include polyalcohol (preferably carbon atom number be 2~4 alkyl diol).
[32] antireflection material according to above-mentioned [31], wherein above-mentioned polyalcohol is relative to curable epoxy resin
The content (combined amount) of 100 parts by weight of total amount for the epoxide for including in composition is 0.05~5 parts by weight (preferably 0.1
~3 parts by weight, more preferable 0.2~3 parts by weight, further preferred 0.25~2.5 parts by weight).
[33] antireflection material according to any one of above-mentioned [1]~[32], wherein above-mentioned curable epoxy resin
Composition includes fluorophor.
[34] antireflection material according to above-mentioned [33], wherein above-mentioned fluorophor is relative to curable epoxy resin
The content (combined amount) of the total amount (100 weight %) of composition is 0.5~20 weight %.
[35] antireflection material according to any one of above-mentioned [1]~[34], wherein shape in above-mentioned antireflection material
At concaveconvex shape range of the equal surface roughness Ra of number at 0.1~1.0 μm (preferably in 0.2~0.8 μm of range).
[36] antireflection material according to any one of above-mentioned [1]~[35], is used to seal photosemiconductor.
[37] a kind of optical semiconductor device, wherein optical semiconductor antireflection material described in above-mentioned [36] institute is close
Envelope.
[38] a kind of resin combination, wherein be dispersed with for manufacturing anti-reflective described in any one of above-mentioned [1]~[36]
Penetrate the hydrophobic porous inorganic filler of material.
[39] resin combination according to above-mentioned [38], is liquid.
[40] resin combination according to above-mentioned [38] or [39], wherein the component volatilized in solidification relative to
The amount of the total amount (100 weight %) of above-mentioned resin combination is 10 weight % or less.
[41] a kind of manufacturing method of antireflection material is formed on the surface of above-mentioned antireflection material and inhibits the recessed of reflection
Convex, the above method includes:
Solidify resin combination described in any one of above-mentioned [38]~[40].
Industrial applicibility
Antireflection material of the invention in addition to high transparency and anti-reflection function it is excellent other than, also have both high heat resistance
Property, especially hot water resistance, therefore (purposes for being used to form optical material) resin of optical material can be suitable for.As
Optical component can be enumerated: showing the component of the various optical functions such as light diffusing, optical clarity, light reflective, or be utilized
Above-mentioned optical function and constituent apparatus or the component of machine etc., are not particularly limited, such as can enumerate the public affairs for following purposes
Know or conventional optical component: optical semiconductor device, organic el device, bonding agent, electrically insulating material, laminated plate, coating, oil
Ink, coating, sealant, resist, composite material, transparent substrate, slide, hyaline membrane, optical element, optical lens, optics
Mould, Electronic Paper, touch tablet, solar cell substrate, optical waveguide, light guide plate, holographic memory, optical pick off sensor etc..
Symbol description
100: reflector (light reflection resin combination)
101: metal line (electrode)
102: optical semiconductor
103: closing line
104: sealing material (antireflection material)
Claims (13)
1. a kind of antireflection material, it includes the solidfied materials for the resin combination for being dispersed with hydrophobic porous inorganic filler, wherein
The bumps for inhibiting reflection are formed on the surface of the solidfied material.
2. antireflection material according to claim 1, wherein
The hydrophobic porous inorganic filler is evenly dispersed and spreads in the entire solidfied material, and in the solidfied material
The bumps for inhibiting reflection are formed on surface.
3. antireflection material according to claim 1 or 2, wherein
The hydrophobic porous inorganic filler is that the surface of porous inorganic filling materials have passed through filler obtained from hydrophobicity processing,
The specific surface area of porous inorganic filling materials before hydrophobicity processing is 200m2/ g or more.
4. antireflection material described in any one of claim 1 to 3, wherein
The average grain diameter of the hydrophobic porous inorganic filler is 1 μm~20 μm.
5. antireflection material according to any one of claims 1 to 4, wherein
The hydrophobic porous inorganic filler is 4~40 weight % relative to the content of antireflection material total amount (100 weight %).
6. antireflection material according to any one of claims 1 to 5, wherein
The resin combination includes transparent hardening resin composition.
7. antireflection material according to claim 6, wherein
The hardening resin composition includes the composition containing epoxy resin.
8. antireflection material according to any one of claims 1 to 7 is used to seal photosemiconductor.
9. a kind of optical semiconductor device, wherein
Optical semiconductor is sealed by antireflection material according to any one of claims 8.
10. a kind of resin combination is dispersed with hydrophobic porous inorganic filler, wherein
The resin combination is for antireflection material described in any one of manufacturing claims 1~8.
11. resin combination according to claim 10 is liquid.
12. resin combination described in 0 or 11 according to claim 1, wherein
The component volatilized in solidification relative to the total amount (100 weight %) of the resin combination amount be 10 weight % with
Under.
13. a kind of manufacturing method of antireflection material, the bumps for inhibiting reflection, institute are formed on the surface of the antireflection material
The method of stating includes:
Solidify resin combination described in any one of claim 10~12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311727599.4A CN117849914A (en) | 2016-10-11 | 2017-10-03 | Anti-reflective material |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016200397 | 2016-10-11 | ||
| JP2016-200397 | 2016-10-11 | ||
| PCT/JP2017/035957 WO2018070300A1 (en) | 2016-10-11 | 2017-10-03 | Anti-reflective material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311727599.4A Division CN117849914A (en) | 2016-10-11 | 2017-10-03 | Anti-reflective material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109804276A true CN109804276A (en) | 2019-05-24 |
Family
ID=61905462
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780063069.0A Pending CN109804276A (en) | 2016-10-11 | 2017-10-03 | Antireflection material |
| CN202311727599.4A Pending CN117849914A (en) | 2016-10-11 | 2017-10-03 | Anti-reflective material |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311727599.4A Pending CN117849914A (en) | 2016-10-11 | 2017-10-03 | Anti-reflective material |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7481802B2 (en) |
| KR (1) | KR20190059969A (en) |
| CN (2) | CN109804276A (en) |
| TW (1) | TWI829625B (en) |
| WO (1) | WO2018070300A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024048406A1 (en) * | 2022-08-31 | 2024-03-07 | 三菱瓦斯化学株式会社 | Anti-glare laminate |
| WO2024048407A1 (en) * | 2022-08-31 | 2024-03-07 | 三菱瓦斯化学株式会社 | Anti-glare laminate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101458343A (en) * | 2007-09-28 | 2009-06-17 | 大日本印刷株式会社 | Optical laminates, polarizing paltes and image display devices |
| CN101501046A (en) * | 2006-08-28 | 2009-08-05 | 3M创新有限公司 | Perfluoropolyether silanes and use thereof |
| CN103048705A (en) * | 2011-10-12 | 2013-04-17 | 株式会社腾龙 | Anti-reflective film and method for manufacturing anti-reflective film |
| CN103764663A (en) * | 2011-06-29 | 2014-04-30 | 嶋田丰司 | (Meth) allylsilane compound, silane coupling agent therefor, and functional material using same |
| CN104231893A (en) * | 2013-06-06 | 2014-12-24 | 信越化学工业株式会社 | Surface modifier and article |
| CN104762005A (en) * | 2014-01-08 | 2015-07-08 | 信越化学工业株式会社 | Surface modifier and article |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3862413B2 (en) * | 1998-05-12 | 2006-12-27 | 富士フイルムホールディングス株式会社 | Antireflection film and image display device using the same |
| TW200630716A (en) | 2004-12-24 | 2006-09-01 | Matsushita Electric Works Ltd | Liquid crystal display apparatus |
| JP2007192866A (en) | 2006-01-17 | 2007-08-02 | Nippon Kasei Chem Co Ltd | Light diffusion resin composition, light diffusing member, and backlight device and liquid crystal display using the same |
| JP5082259B2 (en) | 2006-02-28 | 2012-11-28 | 日亜化学工業株式会社 | Matte protective member and light emitting device having the protective member |
| CN100582818C (en) * | 2006-04-26 | 2010-01-20 | 日东电工株式会社 | Hard-coated antiglare film, polarizing plate, image display, and method of manufacturing hard-coated antiglare film |
| JP2008032824A (en) * | 2006-07-26 | 2008-02-14 | Kyodo Printing Co Ltd | Light diffusing sheet |
| KR20100014624A (en) * | 2007-03-29 | 2010-02-10 | 다이니폰 인사츠 가부시키가이샤 | Hardening resin composition for antiglare layer and antiglare film |
| JP5145819B2 (en) * | 2007-08-10 | 2013-02-20 | 大日本印刷株式会社 | Anti-glare film |
| JP5530158B2 (en) | 2009-11-30 | 2014-06-25 | 日揮触媒化成株式会社 | Substrate with transparent film and coating liquid for forming transparent film |
| KR20120129643A (en) * | 2011-05-20 | 2012-11-28 | 동우 화인켐 주식회사 | Coating composition for anti-glare and anti-reflection, film using the same, polarizing plate, and display device |
| JP2013001840A (en) * | 2011-06-17 | 2013-01-07 | Kao Corp | Coating material composition |
| WO2013054805A1 (en) * | 2011-10-12 | 2013-04-18 | 大日本印刷株式会社 | Anti-glare sheet for image display device |
| JP6064406B2 (en) * | 2012-07-26 | 2017-01-25 | 大日本印刷株式会社 | Optical laminate, polarizing plate, and image display device |
| JP5974709B2 (en) * | 2012-07-26 | 2016-08-23 | 大日本印刷株式会社 | Anti-glare film, polarizing plate and image display device |
| JP2014130871A (en) * | 2012-12-28 | 2014-07-10 | Konica Minolta Inc | Light emitting device |
| JP2015048543A (en) * | 2013-08-30 | 2015-03-16 | アキレス株式会社 | Fiber substrate and heat insulation mat including fiber substrate |
| JP6484846B2 (en) * | 2014-03-11 | 2019-03-20 | 大日本印刷株式会社 | Touch panel, display device, optical sheet, optical sheet sorting method, and optical sheet manufacturing method |
| JP2016071971A (en) * | 2014-09-26 | 2016-05-09 | 有限会社シマテック | LED lighting device |
| KR20180103862A (en) * | 2016-01-15 | 2018-09-19 | 주식회사 다이셀 | Antireflective material |
-
2017
- 2017-10-03 JP JP2018544967A patent/JP7481802B2/en active Active
- 2017-10-03 CN CN201780063069.0A patent/CN109804276A/en active Pending
- 2017-10-03 KR KR1020197013178A patent/KR20190059969A/en not_active Application Discontinuation
- 2017-10-03 CN CN202311727599.4A patent/CN117849914A/en active Pending
- 2017-10-03 WO PCT/JP2017/035957 patent/WO2018070300A1/en active Application Filing
- 2017-10-11 TW TW106134742A patent/TWI829625B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101501046A (en) * | 2006-08-28 | 2009-08-05 | 3M创新有限公司 | Perfluoropolyether silanes and use thereof |
| CN101458343A (en) * | 2007-09-28 | 2009-06-17 | 大日本印刷株式会社 | Optical laminates, polarizing paltes and image display devices |
| CN103764663A (en) * | 2011-06-29 | 2014-04-30 | 嶋田丰司 | (Meth) allylsilane compound, silane coupling agent therefor, and functional material using same |
| CN103048705A (en) * | 2011-10-12 | 2013-04-17 | 株式会社腾龙 | Anti-reflective film and method for manufacturing anti-reflective film |
| CN104231893A (en) * | 2013-06-06 | 2014-12-24 | 信越化学工业株式会社 | Surface modifier and article |
| CN104762005A (en) * | 2014-01-08 | 2015-07-08 | 信越化学工业株式会社 | Surface modifier and article |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7481802B2 (en) | 2024-05-13 |
| JPWO2018070300A1 (en) | 2019-07-25 |
| TW201827510A (en) | 2018-08-01 |
| TWI829625B (en) | 2024-01-21 |
| CN117849914A (en) | 2024-04-09 |
| KR20190059969A (en) | 2019-05-31 |
| WO2018070300A1 (en) | 2018-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102686634B (en) | Curable epoxy resin composition | |
| CN103154073B (en) | Curable epoxy resin composition | |
| CN103374206B (en) | Thermosetting silicone resin composition for reflector of led, reflector for led using the same and optical semiconductor apparatus | |
| CN107001583A (en) | Light and hot curing resin composition, solidfied material and laminate | |
| JP5549789B1 (en) | Thermosetting resin composition, method for producing the same, method for producing resin cured product, and method for generating self-polymerization of epoxy compound | |
| JPWO2005100445A1 (en) | Optical semiconductor sealing composition, optical semiconductor sealing material, and method for producing optical semiconductor sealing composition | |
| CN102985458A (en) | Method for producing cured product and cured product | |
| CN106715593A (en) | Curable silicone resin composition, and cured product thereof | |
| CN109844571A (en) | Antireflection material | |
| CN106574038A (en) | Thermosetting resin composition and molded body thereof | |
| CN109804276A (en) | Antireflection material | |
| CN103154072A (en) | Curable epoxy resin composition | |
| TWI739790B (en) | Anti-reflective material | |
| JP2016224338A (en) | Antireflection material and method for producing the same | |
| JP2016212269A (en) | Antireflection material | |
| JP7241653B2 (en) | Antireflection material | |
| JP5523816B2 (en) | Modified resin composition, method for producing the same, and curable resin composition containing the same | |
| JP2017126045A (en) | Antireflection material | |
| JP6571923B2 (en) | Method for producing cured product by laser light irradiation | |
| JP2017092258A (en) | Remote phosphor type semiconductor light emitting device and method of manufacturing the same | |
| CN101993593A (en) | Composition for packaging optical semiconductor | |
| JP2016117822A (en) | Liquid resin composition | |
| JP2020070392A (en) | Curable epoxy resin composition | |
| JP2020070391A (en) | Curable epoxy resin composition | |
| JP7329319B2 (en) | Curable epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190524 |
|
| RJ01 | Rejection of invention patent application after publication |