CN109803489A - It is a kind of can effectively solve copper billet burr bury copper billet PCB plate production method - Google Patents
It is a kind of can effectively solve copper billet burr bury copper billet PCB plate production method Download PDFInfo
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- CN109803489A CN109803489A CN201910172413.0A CN201910172413A CN109803489A CN 109803489 A CN109803489 A CN 109803489A CN 201910172413 A CN201910172413 A CN 201910172413A CN 109803489 A CN109803489 A CN 109803489A
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- copper billet
- brownification
- burr
- carrier
- copper
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides what one kind can effectively solve copper billet burr to bury copper billet PCB plate production method, it is related to pcb board manufacture technology field, this method in turn includes the following steps: copper billet sawing sheet → brownification → removing single side brownification layer → stamping copper billet → copper billet is put into carrier → brownification → pressing → removing excessive glue and burr.Using this method, rush after copper billet can effectively recognize burr towards, prevent copper billet when being put into carrier before brownification towards misplacing, it is easy to operate.Special mill burr process is now eliminated, production efficiency is substantially increased, increases the feasibility of volume production.Process has lacked part manufacturing procedure compared to old process after optimization, has compressed production procedure, has saved production cost, improves production efficiency.Also hickie white point will not be generated by being completely secured after pressing when doing reliability test project.
Description
Technical field
The present invention relates to pcb board manufacture technology field, refer in particular to it is a kind of can effectively solve copper billet burr bury copper billet PCB
Board manufacturing method.
Background technique
Social now, electronic product volume is smaller and smaller, and power and density are increasing, PCB and the problem of electronic radiation
At a huge challenge.There are two types of currently used heat dissipating methods, is designed to metal substrate or buries the production of copper billet plate.The former
, can only be within the scope of single or double using relatively broad since technique limits, but multiple-plate production can not be broken through, only adapt to
It is some to require lower occasion.And bury copper billet due to use Embedded design, be copper billet is locally embedded on PCB, therefore
It can accomplish high multilayer on design scheme, solve the problems, such as PCB carrier volume and technique processing.
The copper billet size of copper billet plate is buried due to being embedded in pcb board, is influenced by PCB product volume, dimensions length one
As < 50mm, the general < 15mm of width belongs to the product of small size.And copper billet is all to be processed by one piece big copper sheet according to design
Small copper block, processing method generally has two kinds of techniques of CNC gong or stamping, since stamping mode efficiency is higher, is generally all used as volume production
Main processing method.It, can be outside the bottom of copper billet when mold rushes from top to bottom simultaneously again due to the characteristic of intermetallic composite coating
Shape side forms part outstanding, the i.e. common burr of wiring board, and this problem can not overcome and keep away in PCB industry at present
Exempt from.
The burr of copper billet cannot be embedded into pcb board, mainly due to the tiny too concentrated stress of burr, be easy cutting
E Glass Fiber sand in pressing structure PP, leads to the problem of hickie white point when doing reliability test project after pressing.Therefore it needs
Dedicated carrier is used, copper billet is embedded into and disposes the burr of copper billet in carrier in the way of mechanical nog plate and presses again
It closes.
But processing copper billet burr has following problem:
1, the general < 50um of the specification of burr is visually difficult to judge that burr in which face, therefore is encased in carrier
Copper billet cannot be guaranteed all burrs all in one direction, i.e., mechanical system processing burr when, the two sides of copper billet requires to grind
Plate.
2, when copper billet is put into carrier, carrier must paste layer protecting film and cling copper billet to protecting copper billet not fall out,
I.e. copper billet needs again pad pasting to be again put into the copper billet of the one side of non-nog plate in carrier upward and grinds in addition when completing single side nog plate
Burr on one side.
3, after the completion of the burr processing of copper billet, the burr ground off will form copper wire and be sticked on gummed paper, it is necessary to again by carrier
In copper billet taken off from gummed paper, the copper billet taken off is attached to again on clean carrier, guarantee it is normal cross press before palm fibre
Chemical industry sequence.
In conclusion processing copper billet burr is a very time-consuming process.Size itself due to copper billet is smaller, cannot
It is processed in the common equipment of PCB, can only be using carrier auxiliary production, and manual operation is required, to handle draping over one's shoulders for copper billet well
Cutting edge of a knife or a sword at least needs to repeat process of 2 copper-surfaced blocks into carrier.Production efficiency is very low.
Summary of the invention
The technical problems to be solved by the present invention are: burying the copper billet burr problem in copper billet PCB plate production method.
In order to solve the above-mentioned technical problem, the invention discloses what one kind can effectively solve copper billet burr to bury copper billet pcb board
Production method in turn includes the following steps: copper billet sawing sheet → brownification → removing single side brownification layer → stamping copper billet → copper billet is put into
In carrier → brownification → pressing → removing excessive glue and burr.
In further embodiment, after the brownification step, further includes the drill process of copper billet, remove single side after drilling again
Brownification layer.
In further embodiment, in the stamping copper billet step, keep the brownification to stamping copper billet face-up, then again into
Row stamping.
In further embodiment, when the copper billet described in step is put into carrier, so that the brownification of copper billet is face-up, to have
Effect identification copper billet without burr towards.
In further embodiment, in the pressing step, the brownification of copper billet is faced in plate and is placed, and copper billet is had burr
It arranges outside plate on one side.
In further embodiment, in the removing single side brownification layer and the beneficial glue of removing and burr step, nog plate is all used
Mode is removed.
Compared to the prior art, application scheme has following advantage:
1, brownification is carried out before rushing copper billet and single side removes brownification layer and is layers of copper on one side, rushes copper billet to there is brownification layer on one side
After can effectively recognize burr towards, prevent copper billet when being put into carrier before brownification towards misplacing, it is easy to operate.
2, since the requirements of process of conventional mill burr is repeated 2 times production, and copper billet is put into carrier manually to complete, and is taken
When it is laborious, now eliminate mill burr process, substantially increase production efficiency, increase the feasibility of volume production.
3, process has lacked part manufacturing procedure compared to old process after optimizing, and has compressed production procedure, has saved and be produced into
This, improves production efficiency.
Detailed description of the invention
Specific structure of the invention is described in detail with reference to the accompanying drawing
Fig. 1 is that copper billet is embedded in pcb board schematic diagram in pressing of the invention；
Fig. 2 is the structural schematic diagram of carrier.
Specific embodiment
In order to describe the technical content, the structural feature, the achieved object and the effect of this invention in detail, below in conjunction with embodiment
And attached drawing is cooperated to be explained in detail.
In one embodiment, open one kind buries copper billet PCB plate production method, and this method can effectively solve copper billet burr
Brought problem can specifically pass through following technique.
Copper billet sawing sheet first carries out sawing sheet to raw material copper billet, obtains the copper billet raw material of larger size.
Brownification carries out brownification processing to the copper billet raw material of the obtained larger size of sawing sheet, is formed on copper billet raw material surface
Brownification layer.
Drilling, drill process can form the location hole of subsequent step on copper billet raw material, as when subsequent stamping copper billet
Positioning.It can certainly carry out the positioning operation of subsequent technique in other manners, therefore the drill process not necessarily step,
But it can be used as preferred processing step.
Single side brownification layer is removed, the brownification layer of copper billet ingredient upper surface such as can be only removed and retain the brownification layer of lower surface,
It, can be clearly using the upper surface or small surface for visually directly telling copper billet, in order to rear so in subsequent operation
Operation in afterflow journey.Meanwhile the specific method for removing single side brownification layer, it can be and carried out by the way of nog plate, it will be as
The brownification layer whole nog plate of upper surface is ground off.
Stamping copper billet is punched copper billet raw material using mold, with specification size needed for formation for being embedded into pcb board
Lesser copper billet.It, can be in the obtained bottom shape compared with small dimension copper billet due to the limitation of the technique itself in the die-cutting step
At copper billet burr.In this way, if thering is the one side of brownification layer to be punched out upward according to copper billet raw material in cross cutting, then it is acquired
Relatively small copper block upper surface have brownification layer, there is burr in lower surface.If the one side in cross cutting, according to copper billet raw material without brownification layer
It is punched out upward, then it is obtained to be located at same surface compared with the burr of small copper block and brownification layer.Certainly, for ease of operation,
When being preferably punched copper billet raw material, upward by the one side for having brownification layer.In this way, in subsequent operation, compared with the copper billet of small dimension, one
There is brownification layer in face, there is burr on another opposite, is convenient for subsequent operation.
Copper billet is put into carrier, and copper billet size is too small, it is necessary to which machine production could be crossed by being put into dedicated carrier.In conjunction with Fig. 2, carry
Tool is since batch places copper billet, and carrier itself is difficult to fix copper billet well, and copper billet can only be fixed in carrier by protective film, protects
Cuticula is generally covered in the lower surface of carrier, so that being put into the lower surface of the copper billet of carrier is in contact with protective film.
Therefore in the prior art mill burr can only single side processing, have the one side of protective film that can not handle.Certainly, in this programme step
In, gained copper billet will be punched by, which temporarily only needing, is put into carrier.It is preferably that the brownification of copper billet is face-up meanwhile in the step, to have
Effect identification without burr towards.Copper billet burr face then contacts downward and with protective film, and protective film herein plays fixed copper
The effect of block, while but also the one side that copper billet is contacted with protective film can not be processed, it such as can not be by brownification.
Brownification carries out brownification processing to the copper billet of merging carrier.When copper billet in carrier is placed, brownification is face-up, drapes over one's shoulders
Sharp side is downward.Because of the effect of protective film, when handling in the brownification step copper billet in carrier, burr face directed downwardly can not be by
Brownification, in order to can be to have burr face without brownification level Direct Recognition when subsequent pressing.Although just having palm fibre after copper billet sawing sheet
Change step and simultaneously forms brownification layer, it is contemplated that in subsequent operating process, the problems such as brownification face can be scratched, pollute, institute
To carry out brownification processing again before PCB pressing, in favor of combination when pressing between copper billet and pcb board, with bursting diaphragm.After brownification
Gained copper billet has brownification face and non-brownification face, and brownification face is without burr face, and non-brownification face is to have burr face.
Pressing, copper billet and pcb board are pressed, and final copper billet is embedded into pcb board.Specific pressing knot
Structure can be as shown in Figure 1, being followed successively by L2 layers, CORE layers, L3 layers, PP layers, CORE layers, L4 layers, and copper billet is then embedded in wherein.And
Wherein, L2 layers towards internal layer, and L4 layers towards outer layer.Therefore when preventing copper billet, brownification face is preferably faced into inner layer without burr and is set
It sets, and will there is burr to face outer layers setting.Because copper billet can contact internal layer PP close to inner layer surface, it is necessary to without burr.And copper billet
The burr of contact outer layer is then subjected to.
Beneficial glue and burr are removed, i.e., disposably removes beneficial glue and burr after pressing.The specific side for preferably using nog plate
Formula is removed, so that obtain no burr buries copper billet plate.
Copper billet pcb board is buried made from such process can remove effectively copper billet burr, and guaranteeing to do after pressing can
By hickie white point will not be generated when property test item.The processing method of this burr simultaneously, it is possible to reduce process, raising efficiency.
Herein, up, down, left, right, before and after only represents its relative position without indicating its absolute position.The foregoing is merely
The embodiment of the present invention is not intended to limit the scope of the invention, all to utilize description of the invention and accompanying drawing content institute
The equivalent structure or equivalent flow shift of work is applied directly or indirectly in other relevant technical fields, and is similarly included in
In scope of patent protection of the invention.
Claims (6)
1. what one kind can effectively solve copper billet burr buries copper billet PCB plate production method, which is characterized in that successively include following step
Rapid: copper billet sawing sheet → brownification → removing single side brownification layer → stamping copper billet → copper billet is put into carrier → brownification → pressing → removing
Excessive glue and burr.
2. the method as described in claim 1, it is characterised in that: further include the drill process of copper billet after the brownification step, bore
Kong Houzai removes single side brownification layer.
3. method according to claim 1 or 2, it is characterised in that: in the stamping copper billet step, make the palm fibre to stamping copper billet
Change up, then carries out stamping again.
4. method as claimed in claim 3, it is characterised in that: when the copper billet described in step is put into carrier, so that copper billet
Brownification is face-up, with effectively recognize copper billet without burr towards.
5. method as claimed in claim 4, it is characterised in that: in the pressing step, the brownification of copper billet is faced in plate and is placed,
There is the one side of burr to arrange outside plate copper billet.
6. the method as described in claim 1, it is characterised in that: the removing single side brownification layer and the beneficial glue of removing and burr step
In, all removed using nog plate mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910172413.0A CN109803489B (en) | 2019-03-07 | 2019-03-07 | Manufacturing method of copper block-embedded PCB capable of effectively solving copper block burrs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910172413.0A CN109803489B (en) | 2019-03-07 | 2019-03-07 | Manufacturing method of copper block-embedded PCB capable of effectively solving copper block burrs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109803489A true CN109803489A (en) | 2019-05-24 |
| CN109803489B CN109803489B (en) | 2021-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910172413.0A Active CN109803489B (en) | 2019-03-07 | 2019-03-07 | Manufacturing method of copper block-embedded PCB capable of effectively solving copper block burrs |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2030170A1 (en) * | 1969-01-21 | 1970-10-30 | Western Electric Co | |
| JP2008172029A (en) * | 2007-01-11 | 2008-07-24 | Tdk Corp | Method of manufacturing multilayer ceramic substrate |
| CN103273266A (en) * | 2013-05-14 | 2013-09-04 | 东莞生益电子有限公司 | Contour machining method of metal heat conduction block |
| CN109327967A (en) * | 2018-11-23 | 2019-02-12 | 开平依利安达电子第三有限公司 | A kind of resin plate buries the production technology of copper billet |
-
2019
- 2019-03-07 CN CN201910172413.0A patent/CN109803489B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2030170A1 (en) * | 1969-01-21 | 1970-10-30 | Western Electric Co | |
| JP2008172029A (en) * | 2007-01-11 | 2008-07-24 | Tdk Corp | Method of manufacturing multilayer ceramic substrate |
| CN103273266A (en) * | 2013-05-14 | 2013-09-04 | 东莞生益电子有限公司 | Contour machining method of metal heat conduction block |
| CN109327967A (en) * | 2018-11-23 | 2019-02-12 | 开平依利安达电子第三有限公司 | A kind of resin plate buries the production technology of copper billet |
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| Publication number | Publication date |
|---|---|
| CN109803489B (en) | 2021-08-24 |
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