CN109801869B - 一种高效的电子标签封装工艺及设备 - Google Patents
一种高效的电子标签封装工艺及设备 Download PDFInfo
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- CN109801869B CN109801869B CN201910051636.1A CN201910051636A CN109801869B CN 109801869 B CN109801869 B CN 109801869B CN 201910051636 A CN201910051636 A CN 201910051636A CN 109801869 B CN109801869 B CN 109801869B
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- 238000012858 packaging process Methods 0.000 title claims abstract description 13
- 238000012546 transfer Methods 0.000 claims abstract description 178
- 239000003292 glue Substances 0.000 claims abstract description 129
- 238000007731 hot pressing Methods 0.000 claims abstract description 83
- 238000009826 distribution Methods 0.000 claims abstract description 44
- 238000004806 packaging method and process Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 29
- 238000007650 screen-printing Methods 0.000 claims description 20
- 238000013459 approach Methods 0.000 claims description 5
- 230000017105 transposition Effects 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 27
- 238000001514 detection method Methods 0.000 description 12
- 230000033001 locomotion Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000005570 vertical transmission Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000036544 posture Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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CN201910051636.1A CN109801869B (zh) | 2019-01-18 | 2019-01-18 | 一种高效的电子标签封装工艺及设备 |
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CN201910051636.1A CN109801869B (zh) | 2019-01-18 | 2019-01-18 | 一种高效的电子标签封装工艺及设备 |
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CN109801869A CN109801869A (zh) | 2019-05-24 |
CN109801869B true CN109801869B (zh) | 2020-10-09 |
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CN110690152A (zh) * | 2019-08-28 | 2020-01-14 | 苏州均华精密机械有限公司 | 大尺寸晶片接合装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200620610A (en) * | 2004-12-13 | 2006-06-16 | Gofac Technologies Co Ltd | Gluing machine of wafer and lead frame for LOC package |
CN101025796A (zh) * | 2006-02-17 | 2007-08-29 | 李树群 | 一种电子标签的倒封装工艺 |
CN101324933A (zh) * | 2008-07-11 | 2008-12-17 | 焦林 | 一种rfid标签inlay的同步连续制做工艺 |
CN102339411A (zh) * | 2011-10-18 | 2012-02-01 | 无锡邦普氿顺微电子有限公司 | 超高频rfid标签的制造方法 |
CN204088279U (zh) * | 2014-08-08 | 2015-01-07 | 深圳市新晶路电子科技有限公司 | 一种双点胶四邦定头倒封装装置 |
CN105826225A (zh) * | 2016-05-10 | 2016-08-03 | 刘宁 | 一种电子标签封装设备 |
CN106447008A (zh) * | 2016-10-15 | 2017-02-22 | 广州明森科技股份有限公司 | 一种多芯片接触式智能卡铣槽封装个人化生产线 |
CN108107163A (zh) * | 2018-02-02 | 2018-06-01 | 巨心物联网实验室(深圳)有限公司 | Inlay电子标签芯片封装实验机 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US7704346B2 (en) * | 2004-02-23 | 2010-04-27 | Checkpoint Systems, Inc. | Method of fabricating a security tag in an integrated surface processing system |
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- 2019-01-18 CN CN201910051636.1A patent/CN109801869B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200620610A (en) * | 2004-12-13 | 2006-06-16 | Gofac Technologies Co Ltd | Gluing machine of wafer and lead frame for LOC package |
CN101025796A (zh) * | 2006-02-17 | 2007-08-29 | 李树群 | 一种电子标签的倒封装工艺 |
CN101324933A (zh) * | 2008-07-11 | 2008-12-17 | 焦林 | 一种rfid标签inlay的同步连续制做工艺 |
CN102339411A (zh) * | 2011-10-18 | 2012-02-01 | 无锡邦普氿顺微电子有限公司 | 超高频rfid标签的制造方法 |
CN204088279U (zh) * | 2014-08-08 | 2015-01-07 | 深圳市新晶路电子科技有限公司 | 一种双点胶四邦定头倒封装装置 |
CN105826225A (zh) * | 2016-05-10 | 2016-08-03 | 刘宁 | 一种电子标签封装设备 |
CN106447008A (zh) * | 2016-10-15 | 2017-02-22 | 广州明森科技股份有限公司 | 一种多芯片接触式智能卡铣槽封装个人化生产线 |
CN108107163A (zh) * | 2018-02-02 | 2018-06-01 | 巨心物联网实验室(深圳)有限公司 | Inlay电子标签芯片封装实验机 |
Non-Patent Citations (1)
Title |
---|
《各向异性导电胶倒装封装电子标签的可靠性》;陶军磊,安兵,蔡雄辉,吴懿平;《电子工艺技术》;20100918;第31卷(第5期);第249-第252页 * |
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Denomination of invention: An efficient electronic label packaging process and equipment Effective date of registration: 20220322 Granted publication date: 20201009 Pledgee: China Co. truction Bank Corp Guangzhou Tianhe subbranch Pledgor: Guangzhou Mingsen Technologies Co.,Ltd. Registration number: Y2022980002986 |
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