CN109799934B - Preparation method of touch sensor - Google Patents
Preparation method of touch sensor Download PDFInfo
- Publication number
- CN109799934B CN109799934B CN201910067496.7A CN201910067496A CN109799934B CN 109799934 B CN109799934 B CN 109799934B CN 201910067496 A CN201910067496 A CN 201910067496A CN 109799934 B CN109799934 B CN 109799934B
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer
- conductive
- thermal evaporation
- vacuum thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Position Input By Displaying (AREA)
Abstract
The invention discloses a preparation method of a touch sensor. When the conductive film layer and the lead are arranged by using a vacuum thermal evaporation process, the substrate is placed in an evaporation table firstly, then a mask plate with corresponding hollow patterns is used for masking the substrate in a vacuum environment, finally, corresponding gas is generated by heating a target material, and the conductive film layer and the lead with a preset structure are deposited on the surface of the substrate through the mask plate. Compared with the yellow light process comprising the steps of arranging the conducting layer, coating the photoresist on the surface of the conducting layer, developing the photoresist, exposing and etching the conducting layer in the prior art, the manufacturing steps can be greatly reduced, and therefore the manufacturing cost of the touch sensor is reduced.
Description
Technical Field
The invention relates to the technical field of touch control, in particular to a preparation method of a touch sensor.
Background
With the continuous technological progress and the development of the touch display product industry in recent years, the touch sensor has made great progress in the aspects of size, performance and the like.
At the present stage, the structure of the touch sensor is generally complex, a conductive film layer with a relatively precise structure is generally provided in the touch sensor, a plurality of conductive units for sensing a touch area are generally provided in the conductive film layer, and meanwhile, lead wires electrically connected with the conductive units are generally provided around the conductive film layer.
In the prior art, a large number of complicated steps are usually required to prepare and complete the touch sensor when the touch sensor is prepared, so that how to simplify the preparation process of the touch sensor is a problem urgently needed to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a preparation method of a touch sensor, which can greatly reduce steps required by preparing the touch sensor.
In order to solve the above technical problem, the present invention provides a method for manufacturing a touch sensor, including:
arranging a conductive film layer in a visible area on the surface of the substrate through a vacuum thermal evaporation process; the conductive film layer comprises a plurality of conductive units for sensing touch areas;
and arranging a lead wire electrically connected with the conductive unit in a non-visible area on the surface of the substrate by a vacuum thermal evaporation process to manufacture the touch sensor.
Optionally, before the disposing the leads electrically connected to the conductive elements in the non-visible region of the substrate surface by the vacuum thermal evaporation process, the method further includes:
and arranging a shielding layer in a non-visible area on the surface of the substrate.
Optionally, the disposing a blocking layer on the non-visible region of the substrate surface includes:
and arranging a shielding layer on the non-visible area of the surface of the substrate by a yellow light process.
Optionally, the blocking layer is an ink layer.
Optionally, the blocking layer is a BM layer.
Optionally, after disposing the leads electrically connected to the conductive elements in the non-visible region of the substrate surface by a vacuum thermal evaporation process, the method further includes:
and arranging a protective layer covering the conductive film layer on the surface of the conductive film layer by a vacuum thermal evaporation process.
Optionally, the step of disposing the conductive film layer on the visible region on the surface of the substrate by a vacuum thermal evaporation process includes:
arranging the conductive units parallel to the first direction in a visible area of the first surface of the substrate through a vacuum thermal evaporation process;
arranging the conductive units parallel to the second direction in a visible area of the second surface of the substrate through a vacuum thermal evaporation process; wherein the first surface is disposed opposite the second surface, and the first direction intersects the second direction;
The disposing of the lead electrically connected to the conductive element in the non-visible region of the substrate surface by a vacuum thermal evaporation process includes:
arranging the lead electrically connected with the conductive unit in a non-visible area of the first surface through a vacuum thermal evaporation process;
and arranging the leads electrically connected with the conductive unit in a non-visible area of the second surface by a vacuum thermal evaporation process.
Optionally, the step of disposing the conductive film layer on the visible area on the surface of the substrate through a vacuum thermal evaporation process includes:
arranging latticed conductive units in a visible area on the surface of one side, facing the second substrate, of the first substrate through a vacuum thermal evaporation process to form a first netlike conductive latticed layer; the first substrate and the second substrate are arranged oppositely;
arranging latticed conductive units in a visible area on the surface of one side, back to the first substrate, of the second substrate through a vacuum thermal evaporation process to form a second netlike conductive latticed layer; wherein the first conductive mesh layer and the second conductive mesh layer are aligned with each other;
the disposing of the lead electrically connected to the conductive element in the non-visible region of the substrate surface by a vacuum thermal evaporation process includes:
Arranging the leads electrically connected with the conductive units in a non-visible area on the surface of one side, facing the second substrate, of the first substrate through a vacuum thermal evaporation process;
and arranging the lead electrically connected with the conductive unit in a non-visible area on the surface of one side, back to the first substrate, of the second substrate by a vacuum thermal evaporation process.
Optionally, the step of disposing the conductive film layer on the visible region on the surface of the substrate by a vacuum thermal evaporation process includes:
arranging the conductive film layer in a visible area on the surface of the substrate through a vacuum thermal evaporation process; the conductive units positioned in the first area are mutually connected in series along a first direction;
arranging an isolation layer on the surface of the conductive film layer by a vacuum thermal evaporation process; the isolation layer comprises a plurality of isolation bridges, and two ends of each isolation bridge are respectively contacted with the conductive units in the second area adjacent to each other along the second direction;
arranging a connecting layer on the surface of the isolation layer through a vacuum thermal evaporation process; the connecting layer comprises a plurality of connecting lines, the connecting lines are located on the surface of one side, back to the substrate, of the isolation bridge, and two ends of each connecting line are electrically connected with the conductive units of the second area adjacent to each other along the second direction.
Optionally, the isolation bridge is a silicon nitride film or a PI film.
According to the preparation method of the touch sensor, the conductive film layer is arranged in the visible area of the surface of the substrate through the vacuum thermal evaporation process, and the lead is arranged in the invisible area of the surface of the substrate. When the conductive film layer and the lead are arranged by using a vacuum thermal evaporation process, the substrate is placed in an evaporation table firstly, then a mask plate with corresponding hollow patterns is used for masking the substrate in a vacuum environment, finally, corresponding gas is generated by heating a target material, and the conductive film layer and the lead with preset structures are deposited on the surface of the substrate through the mask plate. Compared with the yellow light process comprising the steps of arranging the conducting layer, coating the photoresist on the surface of the conducting layer, developing the photoresist, exposing and etching the conducting layer in the prior art, the manufacturing steps can be greatly reduced, and therefore the manufacturing cost of the touch sensor is reduced.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a touch sensor according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a touch sensor according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the operation of a vacuum thermal evaporation process;
fig. 4 is a flowchart illustrating a first specific touch sensor manufacturing method according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a first specific touch sensor according to an embodiment of the present invention;
fig. 6 is a flowchart illustrating a second specific touch sensor manufacturing method according to an embodiment of the invention;
fig. 7 is a schematic structural diagram of a second specific touch sensor according to an embodiment of the present invention;
fig. 8 is a flowchart illustrating a third specific touch sensor manufacturing method according to an embodiment of the invention;
fig. 9 is a schematic structural diagram of a third specific touch sensor according to an embodiment of the invention;
fig. 10 to 15 are process flow charts of a third specific touch sensor manufacturing method according to an embodiment of the invention.
In the figure: 1. the target comprises a substrate, 11, a first substrate, 12, a second substrate, 2, a target, 3, a mask, 4, a conductive film layer, 41, a conductive unit, 42, a first conductive grid layer, 43, a second conductive grid layer, 5, a lead, 6, a shielding layer, 7, a protective layer, 8, an isolation bridge and 9, connecting wires.
Detailed Description
The core of the invention is to provide a preparation method of the touch sensor. In the prior art, a yellow light process is usually used to fabricate the conductive film layer and the leads on the surface of the substrate. The yellow light process generally includes steps of disposing a conductive layer on a surface of a substrate, coating a photoresist on the surface of the conductive layer, developing the photoresist, exposing, and etching the conductive layer, and the like.
According to the preparation method of the touch sensor provided by the invention, the conductive film layer is arranged in the visible area on the surface of the substrate through the vacuum thermal evaporation process, and the lead is arranged in the invisible area on the surface of the substrate. When the conductive film layer and the lead are arranged by using a vacuum thermal evaporation process, the substrate is placed in an evaporation table firstly, then a mask plate with corresponding hollow patterns is used for masking the substrate in a vacuum environment, finally, corresponding gas is generated by heating a target material, and the conductive film layer and the lead with a preset structure are deposited on the surface of the substrate through the mask plate. Compared with the yellow light process comprising the steps of arranging the conducting layer, coating the photoresist on the surface of the conducting layer, developing the photoresist, exposing and etching the conducting layer in the prior art, the manufacturing steps can be greatly reduced, and therefore the manufacturing cost of the touch sensor is reduced.
In order that those skilled in the art will better understand the disclosure, reference will now be made in detail to the embodiments of the disclosure as illustrated in the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a flowchart illustrating a method for manufacturing a touch sensor according to an embodiment of the present invention; fig. 2 is a schematic structural diagram of a touch sensor according to an embodiment of the present invention; fig. 3 is a working principle diagram of the vacuum thermal evaporation process.
Referring to fig. 1, in an embodiment of the present invention, a method for manufacturing a touch sensor includes:
s101: and arranging a conductive film layer in a visible area on the surface of the substrate through a vacuum thermal evaporation process.
Referring to fig. 2, in the embodiment of the present invention, the conductive film layer 4 includes a plurality of conductive units 41 for sensing a touch area.
In the embodiment of the invention, the touch sensor is divided into a visible area and a non-visible area. The visible area is provided with an induction area mainly composed of a conductive film layer 4, and the induction area is used for positioning an area touched by a user; and a lead wire 5 electrically connected to the conductive film layer 4 is generally disposed in the non-visible region to transmit and recognize an electrical signal generated in the sensing region, thereby recognizing a user touch region. Generally, the visible area is usually located at the center of the touch sensor, and the non-visible area usually surrounds the visible area in a ring shape.
In this step, the conductive film layer 4 is provided by a vacuum thermal evaporation process. The structure of the conductive film layer 4 may be different according to different touch sensor structures. The detailed structure of the conductive film layer 4 and the related manufacturing process will be described in detail in the following embodiments of the invention, and will not be described herein again. In the embodiment of the present invention, the conductive film layer 4 is provided with a conductive unit 41 for sensing a touch area of a user, and the conductive unit 41 is an electrode in the touch sensor. When a user touches or approaches the conductive unit 41, the conductive unit 41 forms a capacitance with the touched portion of the user, thereby generating an electrical signal.
Referring to fig. 3, in the embodiment of the present invention, a target 2 and a substrate 1 whose surface needs to be deposited with a conductive film 4 are generally disposed in a vacuum vapor evaporation stage for a real-time vacuum thermal evaporation process, and a mask 3 corresponding to the conductive film 4 is disposed between the target 2 and the substrate 1, where the mask 3 generally has a first hollow pattern. When a vacuum vapor phase evaporation table is used, vacuum pumping is firstly carried out, so that the substrate 1 and the target material 2 are in a vacuum environment; reheating the target 2 to form a gas-phase target 2; the gas-phase target 2 is deposited on the surface of the substrate 1 through the mask 3 to form a conductive film 4 with a predetermined shape. The detailed structure of the conductive film layer 4 and the mask 3 will be described in detail in the following embodiments of the invention, and will not be described herein again.
S102: and arranging leads electrically connected with the conductive units in the non-visible area on the surface of the substrate by a vacuum thermal evaporation process to manufacture the touch sensor.
In this step, the lead 5 electrically connected to the conductive unit 41 is provided by a vacuum thermal evaporation process. The lead 5 can lead out the electric signal generated by the conductive unit 41, so that the electric signal can be recognized by other components, and the area touched by the user can be located. Normally, the conductive elements 41 in the conductive film layer 4 are electrically connected to the leads 5.
Specifically, in the embodiment of the present invention, a target 2 and a substrate 1 whose surface needs to be deposited with a lead 5 are disposed in a vacuum vapor evaporation stage, and a mask 3 corresponding to the lead 5 is disposed between the target 2 and the substrate 1, where the mask 3 generally has a second hollow pattern. The specific steps related to the use of the vacuum vapor evaporation stage are described in detail in the above steps, and will not be described herein again. In this step, the lead 5 is disposed in the non-visible region of the surface of the substrate 1 to form a touch sensor.
In the embodiment of the present invention, the substrate 1 used as described above may be a flexible substrate 1 or a rigid substrate 1. When the flexible substrate 1 is used, the prepared touch sensor is a flexible touch sensor and can be used for a flexible screen. When the rigid substrate 1 is used, the substrate 1 is usually a glass substrate 1 in order to impart good light transmittance to the substrate 1.
According to the preparation method of the touch sensor provided by the embodiment of the invention, the conductive film layer 4 is arranged in the visible area on the surface of the substrate 1 and the lead 5 is arranged in the non-visible area on the surface of the substrate 1 through the vacuum thermal evaporation process. When the conductive film layer 4 and the lead 5 are arranged by using a vacuum thermal evaporation process, the substrate 1 is only required to be placed in an evaporation table firstly, then the substrate 1 is masked by using the mask plate 3 with the corresponding hollow pattern in a vacuum environment, finally, the target 2 is heated to generate corresponding gas, and the conductive film layer 4 and the lead 5 with preset structures are deposited on the surface of the substrate 1 through the mask plate 3. Compared with the yellow light process comprising the steps of arranging the conducting layer, coating the photoresist on the surface of the conducting layer, developing the photoresist, exposing and etching the conducting layer in the prior art, the manufacturing steps can be greatly reduced, and therefore the manufacturing cost of the touch sensor is reduced.
The specific steps of the method for manufacturing a touch sensor according to the present invention will be described in detail in the following embodiments of the invention.
Referring to fig. 4 and 5, fig. 4 is a flowchart illustrating a first specific touch sensor manufacturing method according to an embodiment of the invention; fig. 5 is a schematic structural diagram of a first specific touch sensor according to an embodiment of the present invention.
Referring to fig. 4, in an embodiment of the present invention, a method for manufacturing a touch sensor includes:
s201: a blocking layer is arranged on a non-visible area on the surface of the substrate.
Referring to fig. 5, in the embodiment of the invention, the shielding layer 6 is disposed on the non-visible area of the surface of the substrate 1 to shield the lead 5 and other structures disposed on the non-visible area, so that the touch sensor is more beautiful. Specifically, in this step, a masking layer 6 is usually disposed on the non-visible area on the surface of the substrate 1 through a yellow light process, that is, the masking layer 6 covering the non-visible area is disposed on the surface of the substrate 1 through steps of disposing a photoresist, exposing, developing, etching, and the like. Of course, other processes for disposing the shielding layer 6 may also be used in this step, and the specific process for disposing the shielding layer 6 is not limited in the embodiment of the present invention.
Specifically, in the embodiment of the present invention, the material of the shielding layer 6 may be ink or BM (Black Matrix), and the specific material of the shielding layer 6 may refer to the prior art, and is not described herein again.
S202: and arranging a conductive film layer in the visible area on the surface of the substrate through a vacuum thermal evaporation process.
S203: and arranging leads electrically connected with the conductive units in the non-visible area on the surface of the substrate by a vacuum thermal evaporation process.
S202 and S203 are substantially the same as S101 and S102 in the above embodiments, and for details, reference is made to the above embodiments, which are not repeated herein.
S204: and arranging a protective layer covering the conductive film layer on the surface of the conductive film layer by a vacuum thermal evaporation process.
In this step, an insulating protection layer 7 is disposed on a surface of the conductive film layer 4 opposite to the substrate 1 to protect the conductive film layer 4 from being damaged. Specifically, since the protective layer 7 needs to be disposed by a vacuum thermal evaporation process in the embodiment of the present invention, the material of the protective layer 7 is typically silicon oxide (SiO) specifically2) A thin film to protect the conductive film layer 4 from being damaged.
When the vacuum thermal deposition process is used in this step, the protective layer 7 is provided on the entire surface of the conductive film layer 4 without masking the conductive film layer 4 with the mask 3.
According to the preparation method of the touch sensor provided by the embodiment of the invention, the touch sensor can be more attractive by arranging the shielding layer 6; the conductive film layer 4 which mainly plays a role of induction can be effectively protected from being damaged by arranging the protective layer 7.
The following embodiments of the present invention will describe a method for manufacturing a first specific structure of a touch sensor in detail.
Referring to fig. 6 and 7, fig. 6 is a flowchart illustrating a second specific touch sensor manufacturing method according to an embodiment of the present invention; fig. 7 is a schematic structural diagram of a second specific touch sensor according to an embodiment of the disclosure.
Referring to fig. 6, in an embodiment of the present invention, a method for manufacturing a touch sensor includes:
s301: and arranging the conductive units parallel to the first direction in a visible area of the first surface of the substrate by a vacuum thermal evaporation process.
Referring to fig. 7, in the embodiment of the present invention, conductive elements 41, i.e., electrodes, are disposed on two opposite surfaces of the substrate 1, wherein the conductive elements 41 are generally rectangular. The conductive elements 41 on the first surface of the substrate 1 are parallel to the first direction, so that the conductive elements 41 on the first surface of the substrate 1 can position the touch area of the user in the first direction. The details of the vacuum thermal evaporation process are described in detail in the above embodiments of the invention, and are not repeated herein.
S302: and arranging a conductive unit parallel to the second direction in a visible area on the second surface of the substrate by a vacuum thermal evaporation process.
In an embodiment of the present invention, the first surface and the second surface are disposed opposite to each other, and the first direction intersects the second direction.
The conductive elements 41 on the second surface of the substrate 1 are parallel to the second direction, so that the conductive elements 41 on the second surface of the substrate 1 can position the touch area of the user in the second direction. The conductive elements 41 on the first surface and the conductive elements 41 on the second surface cooperate with each other to locate the area touched by the user from two directions, so as to precisely locate the area touched by the user. Usually, the first direction and the second direction are perpendicular to each other.
It should be noted that, in the embodiment of the present invention, the conductive unit 41 is usually a transparent conductive medium, so that the touch sensor manufactured in the embodiment of the present invention can be used in cooperation with a display screen. In general, the conductive unit 41 is typically an ITO (indium tin oxide) thin film. Of course, other conductive media may also be selected as the conductive element 41 in the embodiment of the present invention, and the specific material of the conductive element 41 is not particularly limited in the embodiment of the present invention.
S303: and arranging a lead electrically connected with the conductive unit in the non-visible area of the first surface by a vacuum thermal evaporation process.
In this step, the leads 5 electrically connected to the conductive elements 41 are disposed on the first surface of the substrate 1 by a vacuum thermal evaporation process, so as to lead the electrical signals generated by the conductive elements 41 disposed on the first surface of the substrate 1 out of the conductive film layer 4.
S304: and arranging leads electrically connected with the conductive units in the non-visible area of the second surface by a vacuum thermal evaporation process.
In this step, the leads 5 electrically connected to the conductive units 41 are disposed on the second surface of the substrate 1 by a vacuum thermal evaporation process, so as to lead the electrical signals generated by the conductive units 41 disposed on the second surface of the substrate 1 out of the conductive film layer 4.
In the embodiment of the present invention, if the protective layer 7 is required to be disposed to protect the conductive film layer 4 disposed in the above steps S301 to S302, the protective layer 7 is generally required to be divided into two layers, and the two protective layers 7 are required to respectively cover the conductive elements 41 disposed on the first surface of the substrate 1 and the conductive elements 41 disposed on the second surface of the substrate 1. In the embodiment of the present invention, when the conductive elements 41 and the leads 5 on the first surface of the substrate 1 and the conductive elements 41 and the leads 5 on the second surface of the substrate 1 are disposed by a vacuum thermal evaporation process, the hollow patterns of the mask 3 used are usually different.
According to the preparation method of the touch sensor provided by the embodiment of the invention, the touch sensor similar to a DITO (double-sided ITO) structure can be prepared through an evaporation thermal evaporation process, so that the steps of preparing the DITO structure are reduced, and the manufacturing cost of the touch sensor is reduced.
The following embodiments of the present invention will describe a method for manufacturing a second specific structure of a touch sensor in detail.
Referring to fig. 8 and 9, fig. 8 is a flowchart illustrating a third specific touch sensor manufacturing method according to an embodiment of the invention; fig. 9 is a schematic structural diagram of a third specific touch sensor according to an embodiment of the invention.
Referring to fig. 8, in an embodiment of the present invention, a method for manufacturing a touch sensor includes:
s401: and arranging latticed conductive units in a visible area on the surface of one side, facing the second substrate, of the first substrate through a vacuum thermal evaporation process to form a first netlike conductive latticed layer.
Referring to fig. 9, in the embodiment of the present invention, the first substrate 11 is disposed opposite to the second substrate 12. In the embodiment of the present invention, a total of two substrates 1 are disposed, which are a first substrate 11 and a second substrate 12, respectively, wherein the first substrate 11 and the second substrate 12 are disposed opposite to each other. In this step, a plurality of conductive cells 41 in a grid shape are disposed on a visible region of a surface of the first substrate 11 facing the second substrate 12, and the plurality of conductive cells 41 are generally in contact with each other and uniformly arranged on the surface of the first substrate 11 to form a first conductive grid layer 42 on the surface of the first substrate 11.
S402: and arranging latticed conductive units in a visible area on the surface of one side, back to the first substrate, of the second substrate through a vacuum thermal evaporation process to form a second netlike conductive latticed layer.
In an embodiment of the present invention, the first conductive mesh layer 42 and the second conductive mesh layer 43 are aligned with each other.
In this step, a plurality of conductive units 41 in a grid shape are disposed on a visible area of a side surface of the second substrate 12 opposite to the first substrate 11, and the plurality of conductive units 41 are generally in contact with each other and uniformly arranged on the surface of the second substrate 12 to form a second conductive grid layer 43 on the surface of the second substrate 12.
In the embodiment of the present invention, the first conductive mesh layer 42 and the second conductive mesh layer 43 need to be aligned with each other. The term "aligning" generally means that the points where the conductive lines constituting the conductive units 41 intersect with each other in the first conductive mesh layer 42 need to be aligned with the centers of the meshes formed by the conductive lines constituting the conductive units 41 in the second conductive mesh layer 43, so that the projections of the conductive lines constituting the first conductive mesh layer 42 and the conductive lines constituting the second conductive mesh layer 43 on the horizontal plane intersect with each other to form a capacitor, and finally, the positioning for the touch region is achieved.
It should be noted that the first substrate 11 and the second substrate 12 are generally transparent insulating substrates 1 to isolate the first conductive mesh layer 42 and the second conductive mesh layer 43 from each other, so as to form a capacitor between the first conductive mesh layer 42 and the second conductive mesh layer 43. The conductive unit 41 is generally formed of Metal wires to form a Metal Mesh (Metal Mesh) touch sensor.
S403: and arranging a lead electrically connected with the conductive unit in a non-visible area on the surface of one side, facing the second substrate, of the first substrate by a vacuum thermal evaporation process.
In this step, the leads 5 electrically connected to the conductive elements 41 are disposed on the surface of the first substrate 11 facing the second substrate 12 by a vacuum thermal evaporation process, so as to lead the electrical signals generated by the conductive elements 41 disposed on the surface of the first substrate 11 out of the conductive film layer 4.
S404: and arranging a lead electrically connected with the conductive unit in a non-visible area on the surface of one side, back to the first substrate, of the second substrate by a vacuum thermal evaporation process.
In this step, the leads 5 electrically connected to the conductive elements 41 are disposed on the surface of the second substrate 12 opposite to the first substrate 11 by a vacuum thermal evaporation process, so as to lead the electrical signals generated by the conductive elements 41 disposed on the surface of the second substrate 12 out of the conductive film layer 4.
It should be noted that, in the embodiment of the present invention, if the protection layer 7 is required to be disposed to protect the conductive film layer 4 disposed in the above-mentioned S401 to S402, only one protection layer 7 is usually disposed, wherein the surface of the first conductive mesh layer 42 opposite to the first substrate 11 contacts with the second substrate 12, and the surface of the second conductive mesh layer 43 opposite to the second substrate 12 contacts with the protection layer 7.
The method for manufacturing the touch sensor provided by the embodiment of the invention can be used for manufacturing the touch sensor with a similar Metal Mesh structure through a steam thermal evaporation process, so that the steps for manufacturing the Metal Mesh structure are reduced, and the manufacturing cost of the touch sensor is reduced.
The method for manufacturing the third specific structure of the touch sensor will be described in detail in the following embodiments of the invention.
Referring to fig. 10 to 15, fig. 10 to 15 are process flow charts of a third specific touch sensor manufacturing method according to an embodiment of the present invention.
Referring to fig. 10, in an embodiment of the present invention, a method for manufacturing a touch sensor includes:
s501: and arranging a conductive film layer in the visible area on the surface of the substrate through a vacuum thermal evaporation process.
Referring to fig. 11, in the embodiment of the present invention, the conductive units 41 located in the first region are connected in series with each other in the first direction. The conductive film layer 4 is generally provided with a plurality of conductive elements 41, and the conductive elements 41 are generally in a block shape. The plurality of conductive units 41 are generally uniformly distributed in the conductive film layer 4, and the conductive units 41 located in the first area contact each other along the first direction to be connected in series, so that the conductive units 41 located in the first area can position the user touch area in the first direction.
S502: and arranging an isolation layer on the surface of the conductive film layer by a vacuum thermal evaporation process.
Referring to fig. 12 and 13, in the embodiment of the present invention, the isolation layer includes a plurality of isolation bridges 8, and both ends of each of the isolation bridges 8 are respectively in contact with the conductive units of the second region adjacent to each other in the second direction.
The isolation bridge 8 is generally rectangular, the isolation bridge 8 generally spans the conductive elements 41 in the first area of the conductive film 4 along the second direction, two ends of the isolation bridge 8 respectively contact the conductive elements 41 in the second area of the conductive film 4, and the conductive elements 41 in the second area of the conductive film 4 that contact the same isolation bridge 8 are adjacent to each other along the second direction.
It should be noted that the isolation bridge 8 mainly serves as an insulation to prevent the electric signal generated by the conductive units 41 connected in series with each other in the second direction from being transmitted to the conductive units 41 connected in series with each other in the first direction. In the embodiment of the present invention, since the isolation layer needs to be disposed by a vacuum thermal evaporation process, the isolation bridge 8 is usually made of silicon nitride (SiN)x) Thin film, or PI (polyimide) film. It will be appreciated that the barrier layer is typically a transparent film layer.
S503: and arranging a connecting layer on the surface of the isolation layer by a vacuum thermal evaporation process.
In the embodiment of the present invention, the connection layer includes a plurality of connection lines 9, the connection lines 9 are located on a surface of the isolation bridge 8 opposite to the substrate 1, and two ends of each connection line 9 are electrically connected to the conductive units 41 of the second region adjacent to each other along the second direction.
In this step, a connection layer is disposed on the surface of the isolation layer, that is, a connection line 9 is disposed on the surface of the isolation bridge 8, and two ends of the connection line 9 need to be electrically connected to the conductive units 41 of the second region adjacent to each other along the second direction, so that the conductive units 41 located in the second region are connected in series along the second direction, and thus the conductive units 41 located in the first region can realize the positioning of the user touch region in the first direction. The conductive elements 41 in the first area and the conductive elements 41 in the second area cooperate with each other to locate the area touched by the user from two directions, so as to precisely locate the area touched by the user. Usually, the first direction and the second direction are perpendicular to each other.
In general, the conductive unit 41 is generally formed of a bulk ITO thin film to form a touch sensor of a SITO (single-sided ITO) structure.
S504: and arranging a lead wire electrically connected with the conductive unit in a non-visible area on the surface of the substrate by a vacuum thermal evaporation process to manufacture the touch sensor.
Referring to fig. 14 and fig. 15, in this step, a part of the leads 5 needs to be electrically connected to the conductive elements 41 located in the first region of the conductive film layer 4, and another part needs to be electrically connected to the conductive elements 41 located in the second region of the conductive film layer 4, so as to precisely locate the touch region. This step may be completed in the same step as S503. That is, the lead 5 is provided at the same time as the connecting wire 9. In this case, the hollow pattern of the mask 3 used in the vacuum thermal deposition process needs to correspond to the connecting wires 9 and the leads 5.
According to the preparation method of the touch sensor provided by the embodiment of the invention, the touch sensor similar to the SITO (single-sided ITO) structure can be prepared through a steam thermal evaporation process, so that the steps for preparing the SITO structure are reduced, and the manufacturing cost of the touch sensor is reduced.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other.
Those of skill would further appreciate that the various illustrative components and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the various examples have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the technical solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The method for manufacturing the touch sensor provided by the invention is described in detail above. The principles and embodiments of the present invention have been described herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (7)
1. A method for manufacturing a touch sensor is characterized by comprising the following steps:
arranging a conductive film layer in a visible area on the surface of the substrate through a vacuum thermal evaporation process; the conductive film layer comprises a plurality of conductive units for sensing touch areas;
arranging a lead wire electrically connected with the conductive unit in a non-visible area on the surface of the substrate through a vacuum thermal evaporation process to manufacture the touch sensor;
the setting of the conductive film layer in the visible area of the substrate surface through the vacuum thermal evaporation process comprises:
arranging the conductive film layer in a visible area on the surface of the substrate through a vacuum thermal evaporation process; the conductive units positioned in the first area are mutually connected in series along a first direction;
Arranging an isolation layer on the surface of the conductive film layer by a vacuum thermal evaporation process; the isolation layer comprises a plurality of isolation bridges, and two ends of each isolation bridge are respectively contacted with the conductive units in the second area adjacent to each other along the second direction;
arranging a connecting layer on the surface of the isolation layer through a vacuum thermal evaporation process; the connecting layer comprises a plurality of connecting lines, the connecting lines are located on the surface of one side, back to the substrate, of the isolation bridge, and two ends of each connecting line are electrically connected with the conductive units of the second area adjacent to each other along the second direction.
2. The method of claim 1, wherein prior to said disposing leads electrically connected to said conductive elements in non-visible areas of said substrate surface by a vacuum thermal evaporation process, said method further comprises:
and arranging a shielding layer in a non-visible area on the surface of the substrate.
3. The method of claim 2, wherein disposing a blocking layer on the non-visible area of the substrate surface comprises:
and arranging a shielding layer on the non-visible area of the surface of the substrate by a yellow light process.
4. The method of claim 3, wherein the masking layer is an ink layer.
5. The method of claim 3, wherein the blocking layer is a BM layer.
6. The method of claim 1, wherein after the disposing of the leads electrically connected to the conductive elements in the non-visible areas of the substrate surface by a vacuum thermal evaporation process, the method further comprises:
and arranging a protective layer covering the conductive film layer on the surface of the conductive film layer through a vacuum thermal evaporation process.
7. The method of claim 1, wherein the isolation bridge is a silicon nitride film or a PI film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910067496.7A CN109799934B (en) | 2019-01-24 | 2019-01-24 | Preparation method of touch sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910067496.7A CN109799934B (en) | 2019-01-24 | 2019-01-24 | Preparation method of touch sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109799934A CN109799934A (en) | 2019-05-24 |
| CN109799934B true CN109799934B (en) | 2022-06-28 |
Family
ID=66560252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910067496.7A Active CN109799934B (en) | 2019-01-24 | 2019-01-24 | Preparation method of touch sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109799934B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111156892B (en) * | 2019-12-23 | 2021-09-24 | 陕西电器研究所 | Preparation improvement method of ion beam sputtering coating blocking piece sensor |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214042A (en) * | 2011-06-07 | 2011-10-12 | 南京福莱克斯光电科技有限公司 | Method for manufacturing sensor structure based on charge transfer |
| CN102200654A (en) * | 2011-06-07 | 2011-09-28 | 南京福莱克斯光电科技有限公司 | Integrated touch display device and making method thereof |
| CN102289315A (en) * | 2011-06-07 | 2011-12-21 | 南京福莱克斯光电科技有限公司 | Sensor structure based on charge transfer |
| CN102207792B (en) * | 2011-06-07 | 2012-10-03 | 南京福莱克斯光电科技有限公司 | Manufacturing method of touch sensor structure based on charge transfer |
| CN202120233U (en) * | 2011-06-07 | 2012-01-18 | 南京福莱克斯光电科技有限公司 | Sensor structure based on electric charge shifting |
| US20130154994A1 (en) * | 2011-12-15 | 2013-06-20 | Kai-Ti Yang | Transparent capacitive touch panel with electromagnetic shielding effect |
| CN103558939B (en) * | 2013-10-31 | 2016-08-31 | 南昌欧菲光学技术有限公司 | Nesa coating, its preparation method and use the contactor control device of this nesa coating |
| WO2015132694A1 (en) * | 2014-03-07 | 2015-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Touch sensor, touch panel, and manufacturing method of touch panel |
| JP6027633B2 (en) * | 2015-01-13 | 2016-11-16 | 日本写真印刷株式会社 | Method for manufacturing touch input sensor and photosensitive conductive film |
| US11043543B2 (en) * | 2015-07-07 | 2021-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Touch sensor and touch panel |
| CN208240004U (en) * | 2018-06-11 | 2018-12-14 | 蓝思科技（长沙）有限公司 | A kind of touch-control sensor |
-
2019
- 2019-01-24 CN CN201910067496.7A patent/CN109799934B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109799934A (en) | 2019-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10331283B2 (en) | Method of reducing the visibility of metal conductors in a capacitive touch panel | |
| CN106201145B (en) | A kind of touch screen, its production method and display device | |
| US9153385B2 (en) | Electrode structure of the touch panel, method thereof and touch panel | |
| CN102955628B (en) | The manufacture method of contact panel | |
| US9081462B2 (en) | Touch panel and manufacturing method thereof | |
| CN101859213B (en) | Making method of capacitor-type touch panel | |
| CN103092414B (en) | A kind of external hanging type touch-screen and preparation method thereof, display device | |
| CN106020562B (en) | A kind of touch screen and preparation method thereof, external hanging type touch screen | |
| US20110304582A1 (en) | Touch sensing circuit and method for making the same | |
| CN108228014B (en) | Touch module, preparation method thereof and touch screen | |
| KR20090058072A (en) | One-layer type touch screen and its method | |
| WO2020001098A1 (en) | Touch panel and touch display device | |
| CN108241456A (en) | Touch-control sensing module and preparation method thereof and apply its touch-control display panel | |
| CN106933398A (en) | Contact panel and electronic installation | |
| JP2020531932A (en) | Touch panel, its manufacturing method and touch display device | |
| KR20130072402A (en) | Fabrication method of electrode-pattern of touch panel | |
| CN106681559A (en) | Touch control panel, manufacturing method thereof and touch control display device | |
| CN104503636A (en) | Touch module | |
| CN109799934B (en) | Preparation method of touch sensor | |
| CN207123824U (en) | Contact panel and touch control display apparatus | |
| CN106033275B (en) | Touch panel and its manufacturing method | |
| CN109375829A (en) | A kind of production method of the display device using the double touch-control sensors of metal mesh | |
| EP3674863A1 (en) | Method for preparing touch-control structure, and touch-control structure | |
| CN109683745A (en) | Touch panel and its manufacturing method | |
| KR101513672B1 (en) | Manufacturing Method for Touch Screen Panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |