CN109799883A - Memory modules - Google Patents
Memory modules Download PDFInfo
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- CN109799883A CN109799883A CN201711148614.4A CN201711148614A CN109799883A CN 109799883 A CN109799883 A CN 109799883A CN 201711148614 A CN201711148614 A CN 201711148614A CN 109799883 A CN109799883 A CN 109799883A
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- memory
- memory modules
- plug
- inserting slot
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Abstract
The invention discloses a kind of memory modules, include circuit board, plurality of slots structure and two first wall bodies.Plurality of slots parallelism structural is set on circuit board.Inserting slot construction is configured to allow a plurality of memory plug-in cards to be inserted in wherein.First wall body is relative to each other, and it is respectively arranged at two ends of inserting slot construction, first wall body has a plurality of perforation and a plurality of guidance parts, guidance part is perpendicular to inserting slot construction, correspondence is to allow one in memory plug-in card to be sticked in wherein between two guidance parts, and corresponding memory plug-in card is allowed to slide along guidance part, perforation is located between two adjacent guidance parts.The present invention can help the heat dissipation effect for promoting memory modules built-in storage plug-in card.
Description
Technical field
The present invention relates to a kind of memory modules, and especially with regard to a kind of two-wire memory module (Dual In-line
Memory Module；DIMM).
Background technique
With the development of science and technology the application of electronic device and the life of the mankind become closely bound up.Various forms of data
It is input in electronic device, and then just the data of input make relevant running and processing to electronic device.
In order to accelerate the running and processing of electronic device, electronic device has to be implanted into enough memories, also, memory
Cooling mechanism is also even more important, to allow electronic device to be able to maintain good operational paradigm.
Summary of the invention
One of the objects of the present invention is to provide a kind of memory modules, can promote dissipating for memory modules built-in storage plug-in card
Thermal effect.
According to an embodiment of the present invention, a kind of memory modules include circuit board, plurality of slots structure and two the
One wall body.Inserting slot construction is arranged in parallel on circuit board.Inserting slot construction is configured to allow a plurality of memory plug-in cards to be inserted in wherein.The
One wall body is relative to each other, and is respectively arranged at two ends of inserting slot construction, the first wall body have it is a plurality of perforation and it is a plurality of
Guidance part, guidance part allow one in memory plug-in card to be sticked in wherein perpendicular to inserting slot construction between corresponding two guidance part,
And corresponding memory plug-in card is allowed to slide along guidance part, perforation is located between two adjacent guidance parts.
In one or more embodiments of the invention, above-mentioned memory modules further include two second wall bodies.Second wall body point
The first wall body is not connected, and accommodating space is collectively formed in the second wall body and the first wall body, and memory plug-in card is located in accommodating space.
In one or more embodiments of the invention, above-mentioned memory modules further include top cover.This top cover is pivotally connected the second wall
One end far from inserting slot construction in body, top cover are configured to cover accommodating space.
In one or more embodiments of the invention, above-mentioned top cover abuts memory plug-in card.
In one or more embodiments of the invention, above-mentioned top cover has a plurality of marks, and it is separate that mark is located at top cover
The one side of accommodating space, mark position correspond to memory plug-in card.
In one or more embodiments of the invention, above-mentioned memory modules also include a plurality of demolition parts.Demolition part is set
It is placed in one end that the first wall body is respectively further from inserting slot construction, demolition part configuration makes memory plug-in card from right to push memory plug-in card
The inserting slot construction answered is detached from.
In one or more embodiments of the invention, above-mentioned demolition part includes transparent material.
In one or more of the invention embodiments, above-mentioned memory modules also include a plurality of sensors and a plurality of
Light emitting diode.Sensor is located between the end and circuit board of inserting slot construction.Light emitting diode is located on circuit board and corresponds to
Corresponding sensor is electrically connected in the lower section of demolition part, light emitting diode.
In one or more embodiments of the invention, above-mentioned sensor is pressure sensor.
In one or more embodiments of the invention, above-mentioned sensor is location aware device.
Above embodiment of the present invention has at least the following advantages:
(1) due to enter memory modules air-flow, can be divided evenly by the distribution of perforation to memory plug-in card with it is interior
It deposits between plug-in card, therefore the heat dissipation effect for promoting memory modules built-in storage plug-in card can be helped.
(2) air-flow in memory modules is directed to due to the perforation by the first wall body, it can be according to a other memory
Module and be considered as an independent unit to consider, therefore user can be allowed to be easier to grasp the electronics comprising including memory modules
The integral heat sink effect of system.
(3) due to top cover can opposite second walls body rotation to allow accommodating space to open, can facilitate user that memory is inserted
Card insertion is placed in inserting slot construction, or replaces to memory plug-in card.
(4) since light emitting diode can provide different light signals according to the sensing result of sensor, user can be with
Color shown by light emitting diode is simply and easily only transmitted, and learns and judges that memory plug-in card is inserted in the shape of inserting slot construction
Condition.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram for being painted the memory modules according to an embodiment of the present invention, wherein memory plug-in card not by
Installation.
Fig. 2 is the stereoscopic schematic diagram for being painted the memory modules of Fig. 1, and wherein memory plug-in card is installed.
Fig. 3 is the stereoscopic schematic diagram for being painted the memory modules of Fig. 1, and wherein top cover covers accommodating space.
Fig. 4 is the structural schematic diagram for being painted the demolition part of Fig. 1.
Fig. 5 is the explosive view for being painted the memory modules of Fig. 1.
Fig. 6 is the state vision decision flowchart for being painted the memory modules of Fig. 1.
100: memory modules
110: circuit board
120: inserting slot construction
130: the first wall bodies
131: guidance part
150: the second wall bodies
160: top cover
161: mark
170: demolition part
171: press section
172: pushing part
173: positioning region
174: fixed part
180: sensor
190: light emitting diode
200: memory plug-in card
H1: the first perforation
H2: the second perforation
S: accommodating space
Specific embodiment
A plurality of embodiments of the invention will be disclosed with schema below, it is as clearly stated, thin in many practices
Section will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.?
That is details in these practices is non-essential in some embodiments of the present invention.In addition, for the sake of simplifying schema,
Some known usual structures will be painted in a manner of simply illustrating in the drawings with component.And if being possible, difference on implementing
The feature system of embodiment can be with interactive application.
Please refer to Fig. 1 and Fig. 2.Fig. 1 is the three-dimensional signal for being painted the memory modules 100 according to an embodiment of the present invention
Figure, wherein memory plug-in card 200 is not mounted.Fig. 2 is the stereoscopic schematic diagram for being painted the memory modules 100 of Fig. 1, wherein memory plug-in card
200 is installed.In the present embodiment, as depicted in figs. 1 and 2, a kind of memory modules 100 include circuit board 110, a plurality of
Inserting slot construction 120 and two first wall bodies 130.Inserting slot construction 120 is arranged in parallel on circuit board 110, and inserting slot construction 120 configures
To allow a plurality of memory plug-in cards 200 to be inserted in wherein (see Fig. 2).First wall body 130 opposite to each other, and is respectively arranged at slot
Two ends of structure 120, the first wall body 130 have a plurality of first perforation H1 and a plurality of guidance parts 131, guidance part 131
Perpendicular to inserting slot construction 120, one in memory plug-in card 200 is allowed to be sticked in wherein between corresponding two guidance part 131, and hold
Perhaps corresponding memory plug-in card 200 is slided along guidance part 131, and the first perforation H1 is located between two adjacent guidance parts 131.By
By the guiding of guidance part 131, the process that memory plug-in card 200 is inserted in inserting slot construction 120 becomes more simply to be easy.In answering for practice
In, memory modules 100 can be two-wire memory module (Dual In-line MemoryModule；DIMM), memory plug-in card
200 can be dynamic random access memory (Random Access Memory；RAM), but the present invention is not limited thereto.
That is, when memory plug-in card 200 is installed in inserting slot construction 120, memory plug-in card 200 and memory plug-in card 200
Between space connection be located at the first wall body 130 first perforation H1, therefore, air-flow can be from one of those the first wall body 130
The first perforation H1, the space between 100 built-in storage plug-in card 200 of memory modules and memory plug-in card 200, then by another
First perforation H1 of a first wall body 130 leaves memory modules 100.It, can be by this way, into the air-flow of memory modules 100
It is divided evenly by the distribution of the first perforation H1 between memory plug-in card 200 and memory plug-in card 200, helping promotion memory modules
The heat dissipation effect of 100 built-in storage plug-in cards 200.
Moreover, it is directed to the air-flow in memory modules 100 by the first perforation H1 of the first wall body 130, it can basis
A other memory modules 100 and be considered as an independent unit to consider, allow user to be easier to grasp comprising memory modules 100
The integral heat sink effect of electronic system inside.
More specifically, in the present embodiment, memory modules 100 further include two second wall bodies 150.Such as the 1st~2 figure institute
Showing, the second wall body 150 is separately connected the first wall body 130, and accommodating space S is collectively formed in the second wall body 150 and the first wall body 130,
Memory plug-in card 200 is located in accommodating space S.In this way, which the memory plug-in card 200 in accommodating space S can be by the first wall body
130 and second wall body 150 protection, thus will not be by the wire body or other groups outside the first wall body 130 and the second wall body 150
The interference of part (not shown) and influence in accommodating space S radiate effect.
Furthermore as depicted in figs. 1 and 2, memory modules 100 further include top cover 160.Top cover 160 is pivotally connected in the second wall body 150
The one end far from inserting slot construction 120, therefore, top cover 160 can the rotation of opposite second walls body 150 to allow accommodating space S to beat
It opens, to facilitate user that memory plug-in card 200 is inserted in inserting slot construction 120, or memory plug-in card 200 is replaced.
It referring to figure 3., is the stereoscopic schematic diagram for being painted the memory modules 100 of Fig. 1, wherein the covering of top cover 160 accommodating is empty
Between S.As shown in figure 3, top cover 160 covers the second wall body 150 and is collectively formed with the first wall body 130 when memory modules 100 operate
Accommodating space S.
More specifically, in the present embodiment, when top cover 160 covers accommodating space S, top cover 160 abuts memory and inserts
Card 200.In this way, which user can be directly in the table of top cover 160 when memory plug-in card 200 is inserted in inserting slot construction 120 by user
Face exerts a force and memory plug-in card 200 is seated in inserting slot construction 120, and on the indirect side for pressing on memory plug-in card 200.Due to
Top cover 160 provides bigger contact area to user, therefore is not easy during pressing the finger sense for allowing user to press
To local compression and pain.
Furthermore as shown in figure 3, top cover 160 has a plurality of marks 161, it is empty far from accommodating that mark 161 is located at top cover 160
Between S one side, and 161 position of mark corresponds to memory plug-in card 200.By the position of mark 161, user, which can be clear from, to be located at
The position of 160 lower section memory plug-in card 200 of top cover exerts a force so as to the position for mark 161.In the application of practice
In, mark 161 can be the pattern for slightly protruding or being slightly recessed, and user is allowed only to lean on finger also can be recognizable.
As shown in Figure 1 to Figure 3, memory modules 100 further include a plurality of demolition parts 170.Demolition part 170 is set to the first wall
Body 130 is respectively further from one end of inserting slot construction 120, and the configuration of demolition part 170 is to push memory plug-in card 200 to make memory plug-in card
200 are detached from from corresponding inserting slot construction 120.In the present embodiment, demolition part 170 also includes transparent material.
It referring to figure 4., is the structural schematic diagram for being painted the demolition part 170 of Fig. 1.In the present embodiment, such as Fig. 4 institute
Show, demolition part 170 is articulated in the first wall body 130 with the second perforation H2, and demolition part 170 has press section 171, pushing part 172
And positioning region 173.When user abuts press section 171 and exerts a force to press section 171, demolition part 170 is around the second perforation H2
Rotation, so that pushing part 172 and positioning region 173 also make pushing part 172 towards far from inserting slot construction also around the second perforation H2 rotation
120 direction pushes corresponding memory plug-in card 200, and memory plug-in card 200 is detached from from inserting slot construction 120.Work as demolition part
After the 170 preset angles of rotation, such as 70 degree, positioning region 173 will abut the first wall body 130, to prevent demolition part 170 further
Rotation.
Furthermore as shown in figure 4, demolition part 170 has more fixed part 174.When memory plug-in card 200 is inserted in inserting slot construction
120, and when demolition part 170 is not pressed, fixed part 174 is suitable for mutually buckling with top cover 160, to make top cover 160 and tear open
Inloading part 170 is so that the relative position of the first wall body 130 can be fixed.
In addition, as noted previously, as demolition part 170 is set to first one end of wall body 130 far from inserting slot construction 120, because
This, is capable of providing more spaces between demolition part 170 and circuit board 110, allow user that can install other electricity on circuit board 110
Sub- part (not shown).
It referring to figure 5., is the explosive view for being painted the memory modules 100 of Fig. 1.In the present embodiment, as shown in figure 5,
Memory modules 100 also include a plurality of sensors 180 and a plurality of light emitting diodes 190.Sensor 180 is located at inserting slot construction
Between 120 end and circuit board 110, and configure to sense the situation that memory plug-in card 200 is inserted in inserting slot construction 120.It shines
Diode 190 is located on circuit board 110 and the lower section of corresponding demolition part 170, and light emitting diode 190 is electrically connected corresponding
Sensor 180, also, according to the sensing result of sensor 180, light emitting diode 190 can provide different light signals, allow user
Learn that memory plug-in card 200 is inserted in the situation of inserting slot construction 120.Furthermore as described above, demolition part 170 include transparent material, because
This, user can see the light signal of light emitting diode 190 through demolition part 170.Practice application in, citing and
Speech, sensor 180 can be pressure sensor or location aware device.
Fig. 6 is please referred to, is the state vision decision flowchart for being painted the memory modules 100 of Fig. 1.As shown in fig. 6, when passing
When sensor 180 is pressure sensor, user can learn and judge that memory plug-in card 200 is inserted in the situation of inserting slot construction 120.
For example, when memory plug-in card 200 is not also inserted in inserting slot construction 120, the pressure that sensor 180 is sensed is 0, then
Light emitting diode 190 shows orange lamp.When memory plug-in card 200, which is inserted in inserting slot construction 120, but installs not in place, sensor
180 pressure sensed are between 0~2, then light emitting diode 190 is displayed in red lamp.When memory plug-in card 200 is planted really
When inserting slot construction 120, the pressure that sensor 180 is sensed is greater than 2, then light emitting diode 190 shows green light.Such one
Come, user can simply and easily only transmit color shown by light emitting diode 190, and learn and judge memory plug-in card
200 are inserted in the situation of inserting slot construction 120.
In conclusion technical solution disclosed by above embodiment of the present invention has at least the following advantages:
(1) due to enter memory modules air-flow, can be divided evenly by the distribution of perforation to memory plug-in card with it is interior
It deposits between plug-in card, therefore the heat dissipation effect for promoting memory modules built-in storage plug-in card can be helped.
(2) air-flow in memory modules is directed to due to the perforation by the first wall body, it can be according to a other memory
Module and be considered as an independent unit to consider, therefore user can be allowed to be easier to grasp the electronics comprising including memory modules
The integral heat sink effect of system.
(3) due to top cover can opposite second walls body rotation to allow accommodating space to open, can facilitate user that memory is inserted
Card insertion is placed in inserting slot construction, or replaces to memory plug-in card.
(4) since light emitting diode can provide different light signals according to the sensing result of sensor, user can be with
Color shown by light emitting diode is simply and easily only transmitted, and learns and judges that memory plug-in card is inserted in the shape of inserting slot construction
Condition.
Although the present invention is disclosed above with embodiment, however, it is not to limit the invention, any to be familiar with this skill
Person, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore protection scope of the present invention is worked as
Subject to appended claims institute defender.
Claims (10)
1. a kind of memory modules, characterized by comprising:
One circuit board；
Plurality of slots structure is arranged in parallel on the circuit board, and the configuration of those inserting slot constructions is to allow a plurality of memory plug-in cards to insert
It is placed in one；And
Two first wall bodies, those first wall bodies are relative to each other, and are respectively arranged at two ends of those inserting slot constructions, each of
First wall body has a plurality of perforation and a plurality of guidance parts, those guidance parts are perpendicular to those inserting slot constructions, and corresponding two
Allow one in those memory plug-in cards to be sticked in wherein between those guidance parts, and allows the corresponding memory plug-in card along those
Guidance part sliding, those perforation are located between two those adjacent guidance parts.
2. memory modules as described in claim 1, which is characterized in that the memory modules also include:
Two second wall bodies are separately connected those the first wall bodies, and an accommodating is collectively formed in those second wall bodies and those first wall bodies
Space, those memory plug-in cards are located in the accommodating space.
3. memory modules as claimed in claim 2, which is characterized in that the memory modules also include:
One top cover, is pivotally connected one in those second wall bodies one end far from those inserting slot constructions, which configures to cover this
Accommodating space.
4. memory modules as claimed in claim 3, which is characterized in that the top cover abuts those memory plug-in cards.
5. memory modules as claimed in claim 4, which is characterized in that the top cover has a plurality of marks, is located at the top cover
One side far from the accommodating space, those mark positions correspond to those memory plug-in cards.
6. memory modules as described in claim 1, which is characterized in that the memory modules also include:
A plurality of demolition parts are set to one end that those first wall bodies are respectively further from those inserting slot constructions, the configuration of those demolition parts
To push those memory plug-in cards to make those memory plug-in cards be detached from from those corresponding inserting slot constructions.
7. memory modules as claimed in claim 6, which is characterized in that the demolition part includes transparent material.
8. memory modules as claimed in claim 7, which is characterized in that the memory modules also include:
A plurality of sensors, between those ends and the circuit board of those inserting slot constructions；And
A plurality of light emitting diodes, on the circuit board and the lower section of those corresponding demolition parts, those light emitting diodes are distinguished
It is electrically connected the corresponding sensor.
9. memory modules as claimed in claim 8, which is characterized in that the sensor is pressure sensor.
10. memory modules as claimed in claim 8, which is characterized in that the sensor is location aware device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711148614.4A CN109799883A (en) | 2017-11-17 | 2017-11-17 | Memory modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711148614.4A CN109799883A (en) | 2017-11-17 | 2017-11-17 | Memory modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109799883A true CN109799883A (en) | 2019-05-24 |
Family
ID=66554970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711148614.4A Pending CN109799883A (en) | 2017-11-17 | 2017-11-17 | Memory modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109799883A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5214570A (en) * | 1992-04-03 | 1993-05-25 | Clearpoint Research Corporation | Compact memory module |
| CN201497937U (en) * | 2009-09-29 | 2010-06-02 | 英业达股份有限公司 | Wind deflector fixing structure |
| CN202003284U (en) * | 2011-04-08 | 2011-10-05 | 北京立华莱康平台科技有限公司 | Control case |
| CN202975941U (en) * | 2012-12-20 | 2013-06-05 | 浪潮电子信息产业股份有限公司 | Memory baffle structure |
| CN204856341U (en) * | 2015-08-25 | 2015-12-09 | 龙芯中科技术有限公司 | Processing apparatus and computer equipment are listened to memory |
| CN206274378U (en) * | 2016-11-15 | 2017-06-23 | 东华理工大学 | The data processing server of data algorithm |
| CN206363226U (en) * | 2016-12-20 | 2017-07-28 | 深圳市鑫赛科科技发展有限公司 | A kind of new industrial PC memory bar plug assembly |
-
2017
- 2017-11-17 CN CN201711148614.4A patent/CN109799883A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5214570A (en) * | 1992-04-03 | 1993-05-25 | Clearpoint Research Corporation | Compact memory module |
| CN201497937U (en) * | 2009-09-29 | 2010-06-02 | 英业达股份有限公司 | Wind deflector fixing structure |
| CN202003284U (en) * | 2011-04-08 | 2011-10-05 | 北京立华莱康平台科技有限公司 | Control case |
| CN202975941U (en) * | 2012-12-20 | 2013-06-05 | 浪潮电子信息产业股份有限公司 | Memory baffle structure |
| CN204856341U (en) * | 2015-08-25 | 2015-12-09 | 龙芯中科技术有限公司 | Processing apparatus and computer equipment are listened to memory |
| CN206274378U (en) * | 2016-11-15 | 2017-06-23 | 东华理工大学 | The data processing server of data algorithm |
| CN206363226U (en) * | 2016-12-20 | 2017-07-28 | 深圳市鑫赛科科技发展有限公司 | A kind of new industrial PC memory bar plug assembly |
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Application publication date: 20190524 |