CN202975941U - Memory baffle structure - Google Patents

Abstract

The utility model discloses a memory baffle structure, which is a rectangular plate, the outer dimensions of the rectangular plate are consistent with the common memory module, the rectangular plate is provided with reinforcing ribs, and the two ends of the rectangular plate Several buckles are provided, and the structure of the buckles matches the structure of the fixed end of the memory slot. Install the baffle on the memory slot without memory installed on the motherboard to simulate the shape and ventilation after the memory is installed, effectively solve the problem of electromagnetic wave interference between the memory, improve the cooling efficiency of the whole machine, and reduce working noise and fan power consumption ; and the baffle is easy to install and disassemble, and has the characteristics of simple structure, reasonable design, low cost, etc., which improves the competitiveness of the product.

Description

A memory baffle structure

technical field

The utility model relates to a baffle, in particular to a memory baffle structure.

Background technique

Usually, the printed circuit board of the server is provided with several memory slots, and the memory sticks are installed on these memory slots during use, but the situation that the memory slots are not fully installed often occurs, that is to say, some memory slots are empty. At this time, the electromagnetic waves between the memory slots inserted into the memory slots interfere with each other. At the same time, because the area where the memory slots are not installed is concentrated in the air flow, it is not conducive to the ventilation and heat dissipation of other high-power heat-generating parts, which increases the local heat dissipation pressure. affect the stability of the system.

Utility model content

The utility model discloses a memory baffle structure aiming at the shortcomings of the prior art.

The memory baffle structure disclosed by the utility model is applied to the memory slot of the motherboard without memory installed. The baffle adopts the following technical solution to solve the problem: its structure is a rectangular plate, and the rectangular plate is the same as that of an ordinary memory module. The external dimensions of the rectangular plate are consistent with each other, the rectangular plate is provided with reinforcing ribs, and the two ends of the rectangular plate are provided with several buckles.

The number of reinforcing ribs is not fixed, and the vertical and horizontal reinforcing ribs can be arranged in a cross or in other configurations.

The structure of the buckle matches the structure of the two fixed ends of the memory slot.

The beneficial effect of the memory baffle structure disclosed by the utility model is: the baffle is installed on the memory slot on the motherboard where the memory is not installed, and the shape and ventilation after the memory is installed are simulated, effectively solving the mutual interference of electromagnetic waves between the memory It improves the heat dissipation efficiency of the whole machine, reduces working noise and fan power consumption; and the baffle is easy to install and disassemble, and has the characteristics of simple structure, reasonable design, and low cost, which improves the competitiveness of the product.

Description of drawings

Accompanying drawing 1 is the external structural schematic diagram of the embodiment of memory baffle of the present utility model;

Accompanying drawing 2 is the installation diagram of embodiment of memory baffle of the present utility model;

Notes on drawings: 1. Rectangular plate, 2. Rib, 3. Buckle, 4. Memory slot, 5. Fixed end of slot.

Detailed ways

A memory baffle structure disclosed by the utility model will be described in further detail below in conjunction with the accompanying drawings and embodiments.

The memory baffle structure disclosed by the utility model is applied to the main board memory slot without memory installed, and its structure is a rectangular plate 1, and the external dimensions of the rectangular plate 1 are consistent with the common memory module, and the rectangular plate 1 is provided with reinforcing ribs 2 to simulate the surface structure of the memory module to enhance the heat dissipation effect. The two ends of the rectangular plate 1 are respectively provided with several buckles 3, and the structure of the buckles 3 is the same as that of the fixed end 5 of the slot. match to ensure that the buckle 3 can be fastened and fixed with the fixed end 5 of the slot, and the memory baffle is installed in the memory slot 4.

The number of reinforcing ribs 2 is not fixed, and the vertical and horizontal reinforcing ribs 2 can be placed in a cross or in other forms.

Example:

The structure of the memory baffle disclosed by the utility model is shown in Figure 1. On the memory baffle, one reinforcing rib 2 is arranged horizontally, five reinforcing ribs 2 are arranged vertically, and the five reinforcing ribs 2 are evenly arranged. The two ends of the rectangular plate 1 have the same structure and are respectively provided with four buckles 3 . When in use, the memory baffle is installed on the memory slot 4 where no memory stick is installed, and the buckles 3 at both ends of the memory baffle are fastened and fixed with the fixed end 5 of the slot, as shown in Figure 2, so that Simulating the shape and ventilation after installing the memory can effectively block the electromagnetic wave interference between the memory, prevent the area where the memory is not installed from being concentrated and shunted by wind, ensure sufficient air flow through other high-power heating devices, reduce heat dissipation pressure and improve system stability.

In the end view of the memory slot shown in FIG. 2 , the structure of the memory slot shown is only a schematic diagram of a common memory slot, and a specific memory slot structure is not demonstrated.

The embodiments of the utility model described above do not constitute a limitation to the protection scope of the utility model. Any modifications, equivalent replacements and improvements made within the spirit and principle of the utility model shall be included in the protection scope of the claims of the utility model.

Claims (3)

1. internal memory baffle arrangement, be applied to not install on the mainboard memory bank of internal memory, form and the ventilation after internal memory installed in simulation, its structure is a rectangular slab, it is characterized in that, described rectangular slab is consistent with the external dimensions of memory modules, is provided with reinforcement on described rectangular slab, and the two ends of described rectangular slab are provided with some buckles.

2. internal memory baffle arrangement according to claim 1, is characterized in that, it is unfixing that described reinforcement arranges number, and reinforcement can become the right-angled intersection setting in length and breadth, also can form be set for other.

3. internal memory baffle arrangement according to claim 1, is characterized in that, the structure of described buckle is complementary with the structure of memory bank stiff end.

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