CN109799262A - A kind of novel heat-conducting parameter tester - Google Patents
A kind of novel heat-conducting parameter tester Download PDFInfo
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- CN109799262A CN109799262A CN201910038840.XA CN201910038840A CN109799262A CN 109799262 A CN109799262 A CN 109799262A CN 201910038840 A CN201910038840 A CN 201910038840A CN 109799262 A CN109799262 A CN 109799262A
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Abstract
A kind of novel heat-conducting parameter tester, tester overall structure is rectangular, handle is provided on outer cover, mainly by control chip, water tank, ultrasonic atomizatio probe, fan, semiconductor chilling plate, condensate film, humidity sensor, temperature sensor, heater, thermo-responsive, sample container, weight sensor, wireless WIFI module and long-range upper structure at, the humidity of test environment can be controlled, in sample heating process, measure sample inside and thermo-responsive surface point temperature, specific heat and thermal coefficient of the material under the conditions of different humidity are measured by the method for equation of heat conduction inverting；Compared with the prior device, present apparatus operand is small, and time of measuring is short, and structure is simple, at low cost, applied widely, can disposably measure two thermally conductive parameters, can also be conveniently used for teaching demonstration.
Description
Technical field
The present invention relates to physics field, especially a kind of novel heat-conducting parameter tester.
Background technique
The thermal coefficient and specific heat of material are directly related to material thermal conductivity characteristic, and the measurement of the two parameters is physics
With research topic important in engineering calorifics.
One, the thermal coefficient of material
Common measuring device has dynamic measuring method device and steady state measurement subtraction unit.
1, steady state method measuring device measures after the Temperature Distribution of sample to be tested reaches and stablizes, the starting point of analysis
It is Steady Heat-Conduction Differential Equation of Hollow(λ represents thermal coefficient in formula, and S represents the sectional area of material, and Q represents transmitting
Heat, T represent temperature).The characteristics of this device is that empirical formula is simple, at low cost, if needing to measure heat flow and doing
Temperature.Most common heat conductivity measuring device is that the instrument based on traditional stable state flat band method (for example survey by the big China's YBF series in Hangzhou
Measure instrument).The device is only applicable to the non-conductor of measurement heat, and experimental procedure is cumbersome, needs to carry out data manual processing,
Cause heat-flow measurement inaccurate with very big randomness when due to linear fit.Simultaneously as heat dissipation plate is in High Temperature and Stable State condition
Down it is not only heat transfer process, can also generates heat radiation, thus estimates that hot-fluid can have systematic deviation.It is lacked for these
Point has many inventions to improve steady state measurement experimental provision.Some carries out data processing using host computer, reduces artificial data
Handle error；Some obtains heat flow using electric thermal power method；Some obtains heat flow when stable state using recirculated water method.
However, steady state method measuring device there is problems by these improvement: (1) measurement heat flow can all exist systematic
Deviate.(2) experimental procedure is excessively cumbersome, takes long time.(3) the universal line of laboratory apparatus is more, and structure is complicated, it has not been convenient to move
It is dynamic, it is not used to the teaching demonstration of university's experiment.(4) steady state measurement device because use when need to heat sample when
Between it is long, wood materials or composite wooden material are heated 1 hour at 90-100 DEG C of temperature and will be cracked, and are not suitable for carrying out wooden
The performance of material is detected.
2, the starting point of dynamic method measuring device analysis is dynamic thermal conduction differential equation formula(c in formula
Specific heat is represented, ρ represents density).Usually apply lasting or mechanical periodicity hot-fluid in certain a part of sample, and in sample
Ground another part measurement temperature changes with time rate, the i.e. response of temperature, and then the thermal diffusivity for measuring sample (leads warm system
Number), if the specific heat of known materials, it can further calculate thermal coefficient.The advantages of dynamic measurement device, is that time of measuring is short, however
There is also following disadvantages: (1) many device restricted application systems, such as direct electro heating subtraction unit are only applicable to electric conductor,
Hot line subtraction unit is only applicable to dusty material, and thermoprobe method device is then only applicable to soil or discrete material, therefore is applicable in
The system of being limited in scope.(2) dynamic method measuring device is generally costly.And some dynamic measurement devices are gone back before measuring in the market
Need to know some other physical datas of material, if these data are unknown, measurement can not be carried out.
Two, the specific heat of solid material
It needs first to heat material, then cool down.Relatively common device can be obtained using direct method or comparison method
The thermal change of material, to measure the specific heat of material.The method that direct method instrument generallys use water heat absorption, is changed by water temperature
Obtain thermal change；Comparison method instrument generallys use while measuring the material temperature variation of the material and unknown specific heat of known specific heat
Method, the specific heat of unknown material is obtained by ratio calculation.Which kind of method is either used, this kind of measuring device is generally deposited
In apparatus structure complexity, the problem of taking long time.
Currently on the market, also few instruments can disposably measure the specific heat and thermal coefficient of material simultaneously, when measurement
It needs once measure simultaneously using two different instruments respectively.
In addition, many materials have cavernous structure, there is moisture absorbing, thus when ambient humidity variation, thermal coefficient
It can significant changes with specific heat.Research, which measures these material conducts heat parameters, has important meaning to engineering construction learning aid with the variation of humidity
Justice.However, existing instrument can only all measure under extraneous damp condition, damp condition can not be changed and measured, nothing
Method measures the thermally conductive parameter under the conditions of different humidity.
Summary of the invention
To solve the above problems, the invention discloses a kind of novel heat-conducting parameter tester, particular techniques
Scheme is as follows:
A kind of novel heat-conducting parameter tester, which is characterized in that including instrument base, instrument top cover and instrument side wall with
And water tank, the water tank bottom are fixedly connected with instrument base, and humidity controlled chamber is formed inside water tank；The instrument side wall is double
Layer organic glass is constituted, and the instrument sidewall bottom is fixedly connected with instrument base, instrument side wall side and water tank side wall
It is fixedly connected to form test cabinet, the test cabinet side is provided with gas vent；The instrument top cover and the instrument side wall are point
Body formula structure, the instrument top cover lid are closed in instrument top side wall；
The water tank side is provided with water inlet tap, and the water tank interior bottom portion is fixedly installed ultrasonic atomization head；It is described
There are two gas vents for setting at the top of the water tank cavity other side, and the gas vent side of top is provided with air blowing fan, the air blowing wind
A lateral roof is fanned to be fixedly connected with water tank inner top surface；The gas vent side of lower section is provided with moisture absorption module, the moisture absorption module packet
Include module outrigger, drawing fan, concatenated semiconductor chilling plate group and condensate film；The drawing fan, concatenated semiconductor
Cooling piece group and condensate film are successively fixed on module outrigger from the outside to the core, and drawing fan is located below gas vent one
Side, semiconductor chilling plate group series connection muti-piece semiconductor chilling plate, condensate film bottom is inserted into water；It is fixed outside the water tank side
It is provided with Temperature Humidity Sensor, the Temperature Humidity Sensor is located at two gas vent lower positions；
The test cabinet is internally provided with heated base, and the heated base is fixed at the top of the instrument base, described
Heated base is internally provided with heater strip；Sales kit (SK) is placed on the heated base, the sales kit (SK) is in hollow cylindrical body
Structure, the sales kit (SK) bottom are provided with thermo-contact pedestal, and top is opening setting；On the side wall of the sales kit (SK) side from upper and
There are three jack, being fitted into the jack has probe shape temperature sensor for lower vertical distribution；In use, sample is placed in sales kit (SK)
Jack interior, that cooperation sample same location is preset, is inserted into probe shape temperature sensor, measures sample interior temperature；Sample top
Portion places thermo-responsive, for measuring sample top surface temperature；
The instrument base top side is fixedly installed with sensor wire slot, and the instrument base is internally provided with master
Control chip, humid control chip, WIFI module and computer heating control chip；The main control chip passes through with sensor wire slot
I2C type bus is connected, and the probe shape temperature sensor and thermo-responsive connecting line are real by connection sensor wire slot
Now it is connect with main control chip；
Main control chip has multi-channel serial port, connects temperature sensor chip by serial ports, reads aciculiform temperature sensor in real time
The temperature value passed back with thermo-responsive；Serial ports all the way on main control chip is connect with serial ports type WIFI module, passes through serial ports type
WIFI module is communicated wirelessly with host computer；Humid control chip connects the motor of air blowing fan and drawing fan, realizes control
Fan rotation processed；Humid control chip connects semiconductor chilling plate group by metal-oxide-semiconductor；Humid control chip is connected by metal-oxide-semiconductor
Ultrasonic atomization probe；Humid control chip connects Temperature Humidity Sensor；Inside the computer heating control chip and heated base
Heater strip electrical connection；The main control chip is connected with humid control chip and computer heating control chip respectively by two-way serial ports, from
And it is communicated with humidity control module and heating control module.
Further, the instrument base is internally provided with weight sensor, and the weight sensor is fixedly installed on institute
Heated base lower position is stated, weight sensor obtains the density of sample for survey calculation；The main control chip and weight pass
Sensor is connected.
Further, it is provided with cover plate on the outside of the water tank water intake mouth, for the on and off of water inlet tap.
Further, top cover handle is provided on the instrument top cover.
Further, there are two handles with setting on water tank for the instrument side wall.
Further, described thermo-responsive is thin rounded flakes, and material is that material known to specific heat is constituted；The external packet
Include one layer of adiabatic cotton；Inside is equipped with patch type temperature sensor.
Further, the patch type temperature sensor is encapsulated in inside patch by temperature sensor chip is made.
Further, the probe shape temperature sensor includes cylindrical metal shell and temperature sensor chip, described
Temperature sensor chip is fixed at cylindrical metal enclosure interior.
Further, the side wall of the sales kit (SK) is multilayer heat insulation wall, inside and outside the multilayer heat insulation wall two layers by heat
Non-conductor constitute, centre is provided with adiabatic cotton.
Further, the thermo-contact pedestal is made of the good conductor of heat.
Further, the module outrigger includes top plate and bottom plate and support plate, at the top of the support plate with the water tank
Inner top panel is fixedly connected, and the support plate bottom side is fixedly connected with top plate and bottom plate, the bottom plate side and the support plate
Bottom side is fixedly connected, the top plate with bottom plate be it is horizontally disposed, the top plate is located above the bottom plate, the air-breathing
One lateral roof of fan is fixedly connected with bottom plate；The semiconductor chilling plate group is fixed between top plate and bottom plate, described cold
It is fixedly connected at the top of solidifying piece with support plate, bottom stretches in water through bottom plate.
The beneficial effects of the present invention are:
1, by receiving the feedback signal of Temperature Humidity Sensor, humid control chip controls ultrasonic atomization with PWM mode
Probe is atomized the water in water tank, and humid control chip controls fan simultaneously and imports moisture in test box along stomata,
Make to test environment increase humidity.Instrument is allowed to measure the thermally conductive parameter under high humidity.
2, by receiving the feedback signal of Temperature Humidity Sensor, humid control microarray biochip PWM mode controls fan, half
The moisture absorption module that conductor cooling piece and condensate film are constituted makes to test environment reduction humidity, so that instrument can measure low humidity
Thermally conductive parameter under the conditions of degree.
3, by temperature sensor measurement sample interior and thermo-responsive temperature, sample weight is measured by weight sensor
Amount, reuses the host computer retrospectively calculate equation of heat conduction and obtains the specific heat and thermal coefficient of material.
4, in measurement heat transfer parametric process, temperature measuring data is sent to by host computer using WIFI module, is avoided
Connection line it is cumbersome, facilitate instrument mobile.
5, it is provided with cylindrical sample case in the device, can both place solid material in sales kit (SK), powder can also be placed
Last, loose pedotheque.
6, adiabatic wall is provided on the outside of cylindrical sample case, lower section is provided with thermo-contact pedestal, constructs for sample test
One-dimensional heat transfer environment reduces the calculation amount in host computer analytic process.
7, thermo-responsive is provided at sample upper surface, thermo-responsive periphery package heat-insulating material, inner surface is provided with
Patch-type temperature sensor, by thermo-responsive rate of temperature change of temperature sensor measurement, to obtain the wink of sample surfaces
When hot-fluid.
8, cylindrical sample case side is stayed there are three aperture, is cooperated the aperture of sample interior, can preferably be installed probe
Shape temperature sensor.
9, the surface heat flow and temperature value obtained by sensor measurement constitutes mixed boundary condition, is passed using material internal
The internal temperature values that sensor is measured establish the thermally conductive inversion equation of thermal coefficient and specific heat, small using calculation amount, formula simplicity
Optimal method obtains the thermal coefficient and specific heat of material.
10, the quality that sample is measured by weight sensor, divided by the volume inside sales kit (SK), so that sample be calculated
Density.
11, in order to make instrument can be used in experimental teaching demonstration, Instrument Design is rectangular, and handle is provided on outer cover
Hand is moved easily.
Detailed description of the invention
Fig. 1 is schematic diagram of the invention.
Fig. 2 is top view of the present invention.
Fig. 3 is sales kit (SK) structure chart of the present invention.
Fig. 4 is moisture absorption module diagram of the present invention.
Fig. 5 is probe shape temperature sensor diagrammatic cross-section.
Fig. 6 is thermo-responsive diagrammatic cross-section.
Fig. 7 is main control chip connection schematic diagram of the present invention.
Reference signs list: carrying handle 1, instrument top cover handle 2, instrument top cover 3, air blowing fan 4, water tank 5, ultrasonic wave
Atomising head 6, moisture absorption module 7, gas vent 8, probe shape temperature sensor 9,10,11, sensor wire slot 12, external insulated wall
13, thermo-responsive 14, adiabatic cotton 141, patch type temperature sensor 142, patch 143, temperature sensor chip 144, temperature and humidity
Sensor 15, heated base 16, instrument base 17, sample 18, thermo-contact pedestal 19, jack 20, jack 21, jack 22, module
Outrigger 23, top plate 231, bottom plate 232, support plate 233, drawing fan 24, concatenated semiconductor chilling plate group 35, condensate film 26,
Main control chip 27, computer heating control chip 29, WIFI module 30, instrument top cover 32, instrument side wall 33, is surveyed humid control chip 28
Try room 34, humidity controlled chamber 35, water inlet tap 36, temperature sensor chip 38, cylindrical metal shell 39.
Specific embodiment
Clear to be more clear technical solution of the present invention, the present invention is described further with reference to the accompanying drawing,
The technical characteristic of any pair of technical solution of the present invention carries out the scheme that equivalencing is obtained with conventional reasoning and each falls within guarantor of the present invention
Protect range.Being fixedly connected mentioned in the present embodiment, fixed setting, fixed structure are gluing, welding, screwing, spiral shell
The well-known techniques known to a person skilled in the art such as the connection of bolt nut, riveting.
Instrument side wall in the embodiment of the present invention is made of the double-deck organic glass, and conducting wire and connecting line can pass through side wall
Middle layer cabling is connected to main control chip.Temperature sensor and thermo-responsive conducting wire pass through wiring slot and main control chip phase
Even.The structural schematic diagram for controlling chipset and each sensor is as shown in Figure 5.
STM32 type single-chip microcontroller is selected in main control chip this example.WIFI module selects ESP8266 module in this example.In this example
Humid control chip selects STM32 type single-chip microcontroller.Humid control chip connects the humidity value that humidity sensor reads environment.This example
Middle selection SHT11 Temperature Humidity Sensor.Fan selects 12V fan in this example, and L298N type motor is selected between fan and single-chip microcontroller
Driver.Humid control chip connects semiconductor chilling plate group by metal-oxide-semiconductor, controls semiconductor chilling plate by PWM mode
Operation power, reach moisture absorption control function.Humid control chip connects ultrasonic atomization probe by metal-oxide-semiconductor, passes through PWM
Mode come control ultrasonic atomization probe operation power, reach humidification control function.In this example, ultrasonic atomization probe choosing
It is popped one's head in 12V ultrasonic atomization.
Computer heating control chip selects STM32 type single-chip microcontroller in this example, connects heater strip by metal-oxide-semiconductor.Heater strip is mounted on
In device heated base.
A kind of novel heat-conducting parameter tester, which is characterized in that including instrument base, instrument top cover and instrument side wall with
And water tank, the water tank bottom are fixedly connected with instrument base, and humidity controlled chamber is formed inside water tank；The instrument side wall is double
Layer organic glass is constituted, and the instrument sidewall bottom is fixedly connected with instrument base, instrument side wall side and water tank side wall
It is fixedly connected to form test cabinet, the test cabinet side is provided with gas vent；The instrument top cover and the instrument side wall are point
Body formula structure, the instrument top cover lid are closed in instrument top side wall；
The water tank side is provided with water inlet tap, and the water tank interior bottom portion is fixedly installed ultrasonic atomization head；It is described
There are two gas vents for setting at the top of the water tank cavity other side, and the gas vent side of top is provided with air blowing fan, the air blowing wind
A lateral roof is fanned to be fixedly connected with water tank inner top surface；The gas vent side of lower section is provided with moisture absorption module, the moisture absorption module packet
Include module outrigger, drawing fan, concatenated semiconductor chilling plate group and condensate film；The drawing fan, concatenated semiconductor
Cooling piece group and condensate film are successively fixed on module outrigger from the outside to the core, and drawing fan is located below gas vent one
Side, semiconductor chilling plate group series connection muti-piece semiconductor chilling plate, this example are inserted into water using 3 pieces of series connection, condensate film bottom；It is described
Temperature Humidity Sensor is fixedly installed outside water tank side, the Temperature Humidity Sensor is located at two gas vent lower positions；
The test cabinet is internally provided with heated base, and the heated base is fixed at the top of the instrument base, described
Heated base is internally provided with heater strip；Sales kit (SK) is placed on the heated base, the sales kit (SK) is in hollow cylindrical body
Structure, the sales kit (SK) bottom are provided with thermo-contact pedestal, and top is opening setting；On the side wall of the sales kit (SK) side from upper and
There are three jack, being fitted into the jack has probe shape temperature sensor for lower vertical distribution；In use, sample is placed in sales kit (SK)
Jack interior, that cooperation sample same location is preset, is inserted into probe shape temperature sensor, measures sample interior temperature；Sample top
Portion places thermo-responsive, for measuring sample top surface temperature；
The instrument base top side is fixedly installed with sensor wire slot, and the instrument base is internally provided with master
Control chip, humid control chip, WIFI module and computer heating control chip；The main control chip passes through with sensor wire slot
I2C type bus is connected, and the probe shape temperature sensor and thermo-responsive connecting line are real by connection sensor wire slot
Now it is connect with main control chip；
Main control chip has multi-channel serial port, connects temperature sensor chip by serial ports, serial ports reads aciculiform temperature biography in real time
Sensor and the thermo-responsive temperature value passed back；Serial ports all the way on main control chip is connect with serial ports type WIFI module, passes through serial ports
Type WIFI module is communicated wirelessly with host computer；Main control chip is connected with weight sensor, and weight sensor is used for meter
Calculation obtains the density of sample；Humid control chip connects the motor of air blowing fan and drawing fan, realizes control fan rotation；It is wet
Degree control chip connects semiconductor chilling plate group by metal-oxide-semiconductor；Humid control chip connects ultrasonic atomization by metal-oxide-semiconductor and visits
Head；Humid control chip connects Temperature Humidity Sensor；The computer heating control chip is electrically connected with the heater strip inside heated base；
The main control chip is connected with humid control chip and computer heating control chip respectively by two-way serial ports, thus with humid control mould
Block and heating control module communication.
The instrument base is internally provided with weight sensor, and the weight sensor is fixedly installed on the heated base
Lower position, weight sensor obtain the density of sample for survey calculation；The main control chip is connected with weight sensor.
It is provided with cover plate on the outside of the water tank water intake mouth, for the on and off of water inlet tap.It usually closes, when needing to infuse
When entering water, cover plate is opened.
Top cover handle is provided on the instrument top cover.Instrument top cover can be opened, be taken out by instrument top cover handle
Or place cylindrical sample case and temperature sensor, repair and maintenance instrument.
There are two handles for setting on the instrument side wall and water tank.Pass through two carrying handles, it may be convenient to which movement is whole
A square device.
Described thermo-responsive is thin rounded flakes, and material is that material known to specific heat is constituted, and selects copper sheet in this example；It is described
Outside includes one layer of adiabatic cotton；Inside is equipped with patch type temperature sensor.The patch type temperature sensor is by temperature sensor
Chip package is made inside patch.In order to easy to connect, temperature sensor chip is using small in size with high accuracy total with I2C
The temperature sensor chip of line interface selects LM75 type temperature sensor chip in this example.
The probe shape temperature sensor includes cylindrical metal shell and temperature sensor chip, the temperature sensor
Chip is fixed at cylindrical metal enclosure interior.In order to easy to connect, temperature sensor chip is using small in size with high accuracy
Temperature sensor chip with I2C bus interface selects LM75 type temperature sensor chip in this example.
The side wall of the sales kit (SK) is multilayer heat insulation wall, two layers of non-conductor structure by heat inside and outside the multilayer heat insulation wall
At for the insulation wall material used in this example for rubber, centre is provided with adiabatic cotton.
The thermo-contact pedestal is made of the good conductor of heat, and copper is selected in this example.
The module outrigger includes top plate and bottom plate and support plate, is consolidated at the top of the support plate with the water tank inner top panel
Fixed connection, the support plate bottom side are fixedly connected with top plate and bottom plate, the bottom plate side and the support plate bottom side
Be fixedly connected, the top plate with bottom plate be it is horizontally disposed, the top plate is located above the bottom plate, the drawing fan side
Top is fixedly connected with bottom plate；The semiconductor chilling plate group is fixed between top plate and bottom plate, at the top of the condensate film
It is fixedly connected with support plate, bottom stretches in water through bottom plate.
Present apparatus measurement process is as follows:
Sample is made according to the size of sample container, and has reserved the hole of sensor insertion, is put into sample container.
Probe shape temperature sensor is inserted into sample.And thermo-responsive will be fixed at sample surfaces.
Sample container is placed on device heated base, pickup wire is inserted into slot, covers instrument top cover.Make sensor
It is connected with control chip；Suitable water will be injected in water tank.
Power supply is opened, host computer and device pass through wireless network connection.Example weight is reached host computer by main control chip, on
The density p of sample is calculated in position machine.User sets the humidity of test environment by host computer.Host computer transmits humidity value
To main control chip.
Humidity value is sent to humid control chip by main control chip.Humid control chip passes the humidity value of setting and humidity
The environmental wet angle value that sensor is passed back is compared, and determination is humidified or needed moisture absorption.
If necessary to humidify, humid control chip starts ultrasonic atomization head, is atomized to the water in water tank, and start
Humid air is discharged into test cabinet by air blowing fan, the humidity value passed back by humidity sensor, controls humidification function with PWM mode
Rate makes humidity reach final setting value；If necessary to moisture absorption, humid control chip starts drawing fan and semiconductor refrigerating group,
Start air blowing fan simultaneously, after passing air through semiconductor refrigeration chip heating evaporation, condensation, the condensed water in air can be along cold
Solidifying piece flows into water tank, and dry air is drained into test cabinet by air blowing fan again, and humid control chip controls moisture absorption function by PWM
Rate, until humidity reaches sets requirement.
After humidity reaches preset condition, humid control chip sends information to main control chip, and main control chip receives letter
After breath, heating starting order is sent to computer heating control chip, computer heating control chip starting heater strip heats sales kit (SK).
Main control chip acquires the temperature signal that a temperature sensor chip 9,10,11,144 is passed back every 5s.And it will be warm
Angle value passes through WIFI module in real time and is transmitted back to host computer.After collecting 100 groups of data, main control chip terminates data transmission, concurrently
It send measurement end signal to humid control chip and computer heating control chip, stops humid control and computer heating control.
Host computer handles the temperature data received, the inverting equation of heat conduction, and operation obtains material current wet
Specific heat and thermal coefficient under the conditions of degree.
Temperature sensor 9,10,11,144 uses T9i in the temperature value that the t=ti moment measures respectively, T10i, T11i and
T144i indicates that thermo-responsive quality is m1, specific heat C1, sectional area S1.Data processing method is described as follows:
The heat flow density qi at ti moment is obtained by calculation in boundary temperature of the T9i as material.T9i and qi constitute ti
The boundary condition of the moment equation of heat conduction.
Heating starting moment, temperature initial value of the temperature value that temperature sensor is measured as sample, simultaneous boundary condition are given
The initial value of random sample product specific heat C and thermal coefficient λ, it can solve heat diffusion equation.Obtain under initial condition theoretically ti
Temperature value of the moment at temperature sensor 10,11 positions.The temperature value acquired with T10i ', T11i ' representation theory.
The problem is converted into a mathematical optimization problem: the distribution of two o'clock temperature at any time, specific heat in known spatial
Meet constraint condition with thermal coefficient, solve the specific heat and thermal coefficient solution of optimization, so that minimalization (meets precision to want
Asking F < e, e is preset precision).The optimization algorithm of mathematics can be calculated using common Suzanne Lenglen day Multiplier Method, heredity
Method etc..Selection principle is simple in this example, the lesser least square method of operand, when solving heat diffusion equation using calculating
Speed is fast, the implicit difference method of algorithmic stability, can be from initial value iteratively faster to optimal solution.To obtain the specific heat of material and lead
Hot coefficient.
Claims (10)
1. a kind of novel heat-conducting parameter tester, which is characterized in that including instrument base, instrument top cover and instrument side wall and
Water tank, the water tank bottom are fixedly connected with instrument base, and humidity controlled chamber is formed inside water tank；The instrument side wall is bilayer
Organic glass is constituted, and the instrument sidewall bottom is fixedly connected with instrument base, and instrument side wall side and water tank side wall are solid
Fixed connection forms test cabinet, and the test cabinet side is provided with gas vent；The instrument top cover is seperated with the instrument side wall
Formula structure, the instrument top cover lid are closed in instrument top side wall；
The water tank side is provided with water inlet tap, and the water tank interior bottom portion is fixedly installed ultrasonic atomization head；The water tank
There are two gas vents for setting at the top of the cavity other side, and the gas vent side of top is provided with air blowing fan, the air blowing fan one
Lateral roof is fixedly connected with water tank inner top surface；The gas vent side of lower section is provided with moisture absorption module, and the moisture absorption module includes mould
Block outrigger, drawing fan, concatenated semiconductor chilling plate group and condensate film；The drawing fan, concatenated semiconductor refrigerating
Piece group and condensate film are successively fixed on module outrigger from the outside to the core, and drawing fan is located below gas vent side, and half
Conductor cooling piece group series connection muti-piece semiconductor chilling plate, condensate film bottom is inserted into water；Fixed setting outside the water tank side
There is humidity sensor, the humidity sensor is located at two gas vent lower positions；
The test cabinet is internally provided with heated base, and the heated base is fixed at the top of the instrument base, the heating
Chassis interior is provided with heater strip；Sales kit (SK) is placed on the heated base, the sales kit (SK) is in hollow cylindrical structure,
The sales kit (SK) bottom is provided with thermo-contact pedestal, and top is opening setting；It is erected from top to bottom on the side wall of the sales kit (SK) side
There are three jack, being fitted into the jack has probe shape temperature sensor for straight distribution；In use, sample is placed in sales kit (SK),
The jack that cooperation sample same location is preset, is inserted into probe shape temperature sensor, measures sample interior temperature；It is put at the top of sample
Thermo-responsive is set, for measuring sample top surface temperature；
The instrument base top side is fixedly installed with sensor wire slot, and the instrument base is internally provided with master control core
Piece, humid control chip, WIFI module and computer heating control chip；The main control chip and sensor wire slot pass through I2C
Type bus is connected, the probe shape temperature sensor and thermo-responsive connecting line by connection sensor wire slot realize with
Main control chip connection；
Main control chip has multi-channel serial port, connects temperature sensor chip by serial ports, reads aciculiform temperature sensor and heat in real time
The temperature value that sensitive piece is passed back；Serial ports all the way on main control chip is connect with serial ports type WIFI module, passes through serial ports type WIFI mould
Block is communicated wirelessly with host computer；Humid control chip connects the motor of air blowing fan and drawing fan, realizes control fan
Rotation；Humid control chip connects semiconductor chilling plate group by metal-oxide-semiconductor, can；Humid control chip connects ultrasound by metal-oxide-semiconductor
Wave atomization probe；Humid control chip connects humidity sensor；Heater strip inside the computer heating control chip and heated base
Electrical connection；The main control chip is connected with humid control chip and computer heating control chip respectively by two-way serial ports, thus with wet
Spend control module and heating control module communication.
2. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that on the outside of the water tank water intake mouth
It is provided with cover plate, for the on and off of water inlet tap.
3. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that be arranged on the instrument top cover
There is top cover handle.
4. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that the instrument side wall and water tank
There are two handles for upper setting.
5. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that described thermo-responsive is circle
Thin slice, material are that material known to specific heat is constituted；The outside includes one layer of adiabatic cotton；Inside is equipped with patch type temperature sensing
Device.
6. a kind of novel heat-conducting parameter tester according to claim 5, which is characterized in that the patch type temperature sensing
Device is encapsulated in inside patch by temperature sensor chip and is made.
7. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that the probe shape temperature sensing
Device includes cylindrical metal shell and temperature sensor chip, and the temperature sensor chip is fixed at cylindrical metal shell
It is internal.
8. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that the side wall of the sales kit (SK) is
Multilayer heat insulation wall is made of for two layers the non-conductor of heat inside and outside the multilayer heat insulation wall, and centre is provided with adiabatic cotton.
9. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that set inside the instrument base
It is equipped with weight sensor, the weight sensor is fixedly installed on the heated base lower position, and weight sensor is for surveying
The density of sample is calculated in amount；The main control chip is connected with weight sensor.
10. a kind of novel heat-conducting parameter tester according to claim 1, which is characterized in that the module outrigger includes
Top plate and bottom plate and support plate, the support plate top are fixedly connected with the water tank inner top panel, the support plate bottom side
It is fixedly connected with top plate and bottom plate, the bottom plate side is fixedly connected with the support plate bottom side, and the top plate and bottom plate are equal
Be it is horizontally disposed, the top plate is located above the bottom plate, and one lateral roof of drawing fan is fixedly connected with bottom plate；Described half
Conductor cooling piece group is fixed between top plate and bottom plate, is fixedly connected at the top of the condensate film with support plate, bottom is run through
Bottom plate stretches in water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910038840.XA CN109799262A (en) | 2019-01-16 | 2019-01-16 | A kind of novel heat-conducting parameter tester |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910038840.XA CN109799262A (en) | 2019-01-16 | 2019-01-16 | A kind of novel heat-conducting parameter tester |
Publications (1)
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| CN109799262A true CN109799262A (en) | 2019-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910038840.XA Withdrawn CN109799262A (en) | 2019-01-16 | 2019-01-16 | A kind of novel heat-conducting parameter tester |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111458370A (en) * | 2020-05-29 | 2020-07-28 | 山东雪圣电器有限公司 | Performance testing device and system for total heat exchange membrane |
| CN112666211A (en) * | 2020-12-15 | 2021-04-16 | 国网内蒙古东部电力有限公司呼伦贝尔供电公司 | Device and method for measuring heat conductivity coefficient of transformer insulating oil under low temperature condition |
-
2019
- 2019-01-16 CN CN201910038840.XA patent/CN109799262A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111458370A (en) * | 2020-05-29 | 2020-07-28 | 山东雪圣电器有限公司 | Performance testing device and system for total heat exchange membrane |
| CN112666211A (en) * | 2020-12-15 | 2021-04-16 | 国网内蒙古东部电力有限公司呼伦贝尔供电公司 | Device and method for measuring heat conductivity coefficient of transformer insulating oil under low temperature condition |
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