CN109796929A - A kind of organic silicon potting adhesive and preparation method thereof - Google Patents
A kind of organic silicon potting adhesive and preparation method thereof Download PDFInfo
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- CN109796929A CN109796929A CN201910069425.0A CN201910069425A CN109796929A CN 109796929 A CN109796929 A CN 109796929A CN 201910069425 A CN201910069425 A CN 201910069425A CN 109796929 A CN109796929 A CN 109796929A
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Abstract
The invention discloses a kind of organic silicon potting adhesive and preparation method thereof, electronic polymer material field is to solve the problem of the bad leakproofness difference of existing organic silicon potting adhesive heat resistance.This product includes component A and B component, and the mass ratio of component A and B component is 3-5:1, and component A includes the raw material of following parts by weight: 96-102 parts of both-end vinyl silicone oil, 0.5-1 parts of coupling agent；80-120 parts of reinforcing material, 5-10 parts of thixotropic agent and 0.01-0.02 parts of catalyst, B component includes the raw material of following parts by weight: 10-20 parts of containing hydrogen silicone oil, 50-70 parts of Vinyl MQ silicon resin and 0.1-0.15 parts of inhibitor.Preparation process of the present invention is simple, environmentally friendly, and the casting glue after solidification has good high temperature resistance, while being provided with good air-tightness and service life is longer, and the casting glue after solidification is flexible material, especially suitable for nuclear power sensor class equipment packages.
Description
Technical field
The present invention relates to electronic polymer material field, specifically a kind of organic silicon potting adhesive.
Background technique
Casting glue is mainly used for bonding, sealing, encapsulating and the coating protection of electronic component.With space travel, aircraft
The industrial expansions such as manufacture and electronics, it is desirable that the sealing material for having novel fire resistant stability good.Especially in terms of nuclear industry,
Nuclear power class sensor device proposes higher performance requirement to casting glue.
Traditional epoxies, polyurethanes casting glue, since hardness is excessive after solidification, the reasons such as poor heat resistance can not
It is used widely.Organosilicon has simultaneously because having good thermal stability, cold resistance, electrical property and excellent weatherability
Good process characteristic, and it is environmentally friendly in operating process, the material after solidification has good toughness, can effectively disappear
Except internal stress, avoid generating harm to nuclear power sensor class equipment internal element, route.So exploitation has high-fire resistance
Become hot spot with the organic silicon potting adhesive of good air-tightness.
Organic silicon potting adhesive cohesive strength is low, adhesive force is weak, while cure shrinkage is big, causes leakproofness poor, preparation process
It is limited, limit the development of organic silicon potting adhesive.Chinese patent CN 109161375 discloses a kind of utilization both-end vinyl silicon
The organic silicon potting adhesive of oil preparation, has good heating conduction, thermal stability and mechanical property, but the invention is after solidification
One component casting glue, curing process are difficult to control.108192562 A of Chinese patent CN discloses a kind of utilization poly- silicon of dihydroxy
Organosilicon material made of oxygen alkane polycondensation, the material good weatherability after being fully cured, caking property is good, but produces during preparation
Small molecule compound is given birth to, it is more likely that harm is generated to electronic device.104119832 A of Chinese patent CN discloses one kind
The epoxy being mixed with using epoxy group dialkoxysiloxanes, dialkoxysiloxanes, binary silanol, silicon diol class compound
Silicone polymer solidifies in the UV lamp, avoids the problems such as platinum metal catalyst is easily poisoned and pollutes environment, preparation
Organic silicon potting adhesive has good caking property and dielectric properties, but entire preparation process is complicated, and the organosilicon synthesized fills
Closure material spread in performance is uneven.
Summary of the invention
The purpose of the present invention is to provide a kind of organic silicon potting adhesives, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme:
The mass ratio of a kind of organic silicon potting adhesive, including component A and B component, component A and B component is 3-5:1, component A
Raw material including following parts by weight: 96-102 parts of both-end vinyl silicone oil, 0.5-1 parts of coupling agent；80-120 parts of reinforcing material, touching
Become agent 5-10 parts and catalyst 0.01-0.02 parts, B component includes the raw material of following parts by weight: 10-20 parts of containing hydrogen silicone oil, ethylene
50-70 parts and inhibitor 0.1-0.15 parts of base MQ silicone resin.
As a further solution of the present invention: coupling agent uses silane coupling agent, and thixotropic agent is fumed silica.
As a further solution of the present invention: the viscosity of both-end vinyl silicone oil is 500-1500mPas in component A；Institute
The viscosity for stating containing hydrogen silicone oil in B component is 20-500mPas.
As a further solution of the present invention: it is 5 μm that reinforcing material, which includes the ball-aluminium oxide that partial size is 5 μm, partial size,
One of aluminium hydroxide that preparing spherical SiO 2 and partial size are 5 μm is a variety of.
As a further solution of the present invention: catalyst is chloroplatinic acid, and inhibitor is pyridine.
As a further solution of the present invention: both-end vinyl silicone oil include viscosity be 500mPas vinyl silicone oil,
The vinyl silicone oil that the vinyl silicone oil and viscosity that viscosity is 1200mPas are 1500mPas；Containing hydrogen silicone oil includes that viscosity is
The containing hydrogen silicone oil that 20mPas containing hydrogen silicone oil, viscosity are 200mPas containing hydrogen silicone oil and viscosity is 500mPas.
The preparation method of the organic silicon potting adhesive, the specific steps are as follows:
Both-end vinyl silicone oil, thixotropic agent and coupling agent are added in blender by step 1, with revolving speed for 200 revs/min
After mixing evenly, then reinforcing material is added in clock in batches, with revolving speed be 1500 revs/min high-speed stirred 30-40 minutes, finally plus
Enter catalyst, continues stirring until uniformly, obtaining component A；
Containing hydrogen silicone oil, Vinyl MQ silicon resin and inhibitor are 200 revs/min in another revolving speed and stirred by step 2
It is uniformly mixed in device, obtains B component；
Component A and B component are 200 revs/min with revolving speed and continuesd to mix in new blender by step 3, until mixed
It closes uniformly, obtains finished product, dip finished product with glass bar, observe that not occurring granular material uniformly proves to be uniformly mixed.
Compared with prior art, the beneficial effects of the present invention are:
Raw material sources of the present invention are extensive, and preparation process is simple, environmentally friendly, and the casting glue after solidification is good in addition to having
High temperature resistance outside, while being provided with good air-tightness and service life is longer, the casting glue after solidification is flexible material
Other components especially suitable for nuclear power sensor class equipment packages, while guaranteeing elevated-temperature seal, will not be caused to hurt by material
Evil, has broad application prospects.
Detailed description of the invention
Fig. 1 is the flow chart of the preparation method of organic silicon potting adhesive.
Fig. 2 is percent weight loss of the curing materials made from embodiment 1 in 200 DEG C of processing in organic silicon potting adhesive.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
Embodiment 1
A kind of organic silicon potting adhesive is grouped as by two kinds of groups of component A and B component, and wherein component A includes: according to parts by weight
50 parts of both-end vinyl silicone oil that 50 parts of the both-end vinyl silicone oil that viscosity is 500mPas, viscosity are 1200mPas, silane
1 part of coupling agent, 5 parts, 5 μm of fumed silica 50 parts, 5 μm of preparing spherical SiO 2 80 parts of ball-aluminium oxide, catalyst 0.015
Part.
B component includes each component of following parts by weight: viscosity is 10 parts of containing hydrogen silicone oil, the vinyl MQ silicon of 500mPas
60 parts of resin, 0.15 part of inhibitor.
Both-end vinyl silicone oil, fumed silica and silane coupling agent are added in blender, with revolving speed for 200
Rev/min after mixing evenly, then reinforcing material is added in batches, with revolving speed be 1500 revs/min high-speed stirred 30 minutes, finally
Catalyst is added, continues stirring until uniformly；It is in another revolving speed by Vinyl MQ silicon resin, containing hydrogen silicone oil and inhibitor
It is uniformly mixed in 200 revs/min of blenders；Component A and B component are blended in new blender according to the ratio of 4:1, turned
Speed is to be uniformly mixed under 200 revs/min；Castable after being sufficiently mixed is poured into aluminium alloy exemplar, to its exemplar in vacuum
Carry out deaeration processing in 30 minutes；After deaeration, exemplar is placed in 80 DEG C of convection oven, completes solidification.
Test: the exemplar for the aluminium alloy ware for being poured encapsulating is placed in progress thermal weight loss test at 200 DEG C；Will casting encapsulating in
After handling a hour at present 200 DEG C of exemplar in aluminium-alloy pipe, pressure 1 hour air tight theory of pressure maintaining at 0.65MPa
Bright air-tightness is good；Hardness after solidifying according to U.S. material and test association ASTM D2240 measurement organic silicon potting adhesive；It presses
According to the thermal expansion coefficient of ASTM D3386 measurement organic silicon potting adhesive；According to the bonding of ASTM D3144 measurement organic silicon potting adhesive
Intensity, test result are shown in Table 1.
Embodiment 2
A kind of organic silicon potting adhesive is grouped as by two kinds of groups of component A and B component, and component A includes each group of following parts by weight
Part: 40 parts of both-end vinyl silicone oil that 60 parts of the both-end vinyl silicone oil that viscosity is 500mPas, viscosity are 1500mPas,
1 part of silane coupling agent, 5 parts, 5 μm of fumed silica 50 parts, 5 μm of preparing spherical SiO 2 70 parts of ball-aluminium oxide, catalyst
0.015 part.
B component includes each component of following parts by weight: viscosity is 10 parts of containing hydrogen silicone oil, the vinyl MQ silicon of 200mPas
50 parts of resin, 0.15 part of inhibitor.
According to preparation process described in embodiment 1, component A and B component are mixed with casting glue castable and prepare to survey
Sample coupon.According to the test method of embodiment 1, test sample is tested for the property, the results are shown in Table 1.
Embodiment 3
A kind of organic silicon potting adhesive is grouped as by two kinds of groups of component A and B component, and component A includes each group of following parts by weight
Part: 40 parts of both-end vinyl silicone oil that 60 parts of the both-end vinyl silicone oil that viscosity is 1200mPas, viscosity are 1500mPas,
1 part of silane coupling agent, 5 parts, 5 μm of fumed silica 50 parts, 5 μm of preparing spherical SiO 2 50 parts of ball-aluminium oxide, catalyst
0.01 part.
B component includes each component of following parts by weight: viscosity is 10 parts of the containing hydrogen silicone oil of 20mPas, vinyl MQ silicon tree
70 parts of rouge, 0.15 part of inhibitor.
According to preparation process described in embodiment 1, component A and B component are mixed with casting glue castable and prepare to survey
Sample coupon.According to the test method of embodiment 1, test sample is tested for the property, the results are shown in Table 1.
Embodiment 4
A kind of organic silicon potting adhesive is grouped as by two kinds of groups of component A and B component, and component A includes each group of following parts by weight
Part: 40 parts of both-end vinyl silicone oil that 60 parts of the both-end vinyl silicone oil that viscosity is 1200mPas, viscosity are 1500mPas,
1 part of silane coupling agent, 2 parts, 5 μm of fumed silica 20 parts, 5 μm of preparing spherical SiO 2 80 parts of ball-aluminium oxide, catalyst
0.015 part.
B component includes each component of following parts by weight: viscosity is 10 parts of containing hydrogen silicone oil, the vinyl MQ silicon of 200mPas
70 parts of resin, 0.15 part of inhibitor.
According to preparation process described in embodiment 1, component A and B component are mixed with casting glue castable and prepare to survey
Sample coupon.According to the test method of embodiment 1, test sample is tested for the property, the results are shown in Table 1.
Comparative example 1
It is grouped as by two kinds of groups of component A and B component, component A includes each component of following parts by weight: viscosity is
60 parts of the both-end vinyl silicone oil of 1200mPas, 40 parts of both-end vinyl silicone oil, the catalyst that viscosity is 1500mPas
0.02 part.
B component includes each component of following parts by weight: viscosity is 10 parts of containing hydrogen silicone oil, the vinyl MQ silicon of 200mPas
70 parts of resin, 0.15 part of inhibitor.
According to preparation process described in embodiment 1, A and B component are mixed with casting glue castable and setup test sample
Part.According to the test method of embodiment 1, test sample is tested for the property, the results are shown in Table 1.
The performance test results of table 1 embodiment 1-4 and comparative example 1
| Number | Leakproofness | Hardness/shore A | Thermal expansion coefficient/10-6·℃-1 | Adhesion strength/MPa |
| Embodiment 1 | Well | 32 | 297 | 0.37 |
| Embodiment 2 | Well | 34 | 302 | 0.35 |
| Embodiment 3 | Well | 37 | 331 | 0.41 |
| Embodiment 4 | Well | 41 | 299 | 0.36 |
| Comparative example 1 | Well | 22 | 553 | 0.28 |
From table 1 it follows that the hardness and adhesion strength of embodiment 1-4 are above comparative example 1, the heat of embodiment 1-4
The coefficient of expansion is lower than comparative example 1, and the product of embodiment 1-4 and the product of comparative example 1 all have good leakproofness.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.No
It should treat any reference in the claims as limiting the claims involved.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. the mass ratio of a kind of organic silicon potting adhesive, including component A and B component, component A and B component is 3-5:1, feature
It is, component A includes the raw material of following parts by weight: 96-102 parts of both-end vinyl silicone oil, 0.5-1 parts of coupling agent；Reinforcing material
80-120 parts, 5-10 parts of thixotropic agent and 0.01-0.02 parts of catalyst, B component includes the raw material of following parts by weight: containing hydrogen silicone oil
10-20 parts, 50-70 parts of Vinyl MQ silicon resin and 0.1-0.15 parts of inhibitor.
2. organic silicon potting adhesive according to claim 1, which is characterized in that the coupling agent uses silane coupling agent, touching
Change agent is fumed silica.
3. organic silicon potting adhesive according to claim 1, which is characterized in that both-end vinyl silicone oil in the component A
Viscosity is 500-1500mPas；The viscosity of containing hydrogen silicone oil is 20-500mPas in the B component.
4. organic silicon potting adhesive according to claim 1, which is characterized in that the reinforcing material includes that partial size is 5 μm
One of aluminium hydroxide that the preparing spherical SiO 2 and partial size that ball-aluminium oxide, partial size are 5 μm are 5 μm is a variety of.
5. organic silicon potting adhesive according to claim 1, which is characterized in that the catalyst is chloroplatinic acid, and inhibitor is
Pyridine.
6. organic silicon potting adhesive according to claim 1 or 4, which is characterized in that the both-end vinyl silicone oil includes viscous
Spend the vinyl silicone oil for being 500mPas, the vinyl silicone oil that viscosity is 1200mPas and the second that viscosity is 1500mPas
Alkenyl silicone oil；Containing hydrogen silicone oil include viscosity be 20mPas containing hydrogen silicone oil, viscosity is 200mPas containing hydrogen silicone oil and viscosity is
The containing hydrogen silicone oil of 500mPas.
7. a kind of preparation method of the organic silicon potting adhesive as described in claim 1-6 is any, which is characterized in that specific steps are such as
Under:
After mixing evenly by both-end vinyl silicone oil, thixotropic agent and coupling agent, then reinforcing material is added in step 1 in batches, high
Speed stirring 30-40 minutes, is eventually adding catalyst, continues stirring until uniformly, obtaining component A；
Step 2, containing hydrogen silicone oil, Vinyl MQ silicon resin and inhibitor mixed is uniform, obtain B component；
Step 3 continuess to mix component A and B component, until being uniformly mixed, obtains finished product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910069425.0A CN109796929A (en) | 2019-01-24 | 2019-01-24 | A kind of organic silicon potting adhesive and preparation method thereof |
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| CN201910069425.0A CN109796929A (en) | 2019-01-24 | 2019-01-24 | A kind of organic silicon potting adhesive and preparation method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110085226A (en) * | 2010-01-19 | 2011-07-27 | (주)에버텍엔터프라이즈 | Transparent silicone composition for optical semiconductor die bonding |
| CN106221666A (en) * | 2016-08-17 | 2016-12-14 | 株洲时代新材料科技股份有限公司 | A kind of high heat conduction, high-adhesive-strength organosilicon casting glue and preparation method thereof and the method for its encapsulated motor end |
-
2019
- 2019-01-24 CN CN201910069425.0A patent/CN109796929A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110085226A (en) * | 2010-01-19 | 2011-07-27 | (주)에버텍엔터프라이즈 | Transparent silicone composition for optical semiconductor die bonding |
| CN106221666A (en) * | 2016-08-17 | 2016-12-14 | 株洲时代新材料科技股份有限公司 | A kind of high heat conduction, high-adhesive-strength organosilicon casting glue and preparation method thereof and the method for its encapsulated motor end |
Non-Patent Citations (1)
| Title |
|---|
| 孙酣经 等: "《化工新材料产品及应用手册》", 31 January 2002, 中国石化出版社 * |
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Application publication date: 20190524 |