CN109791917A - Electronic building brick and method for manufacturing electronic building brick - Google Patents
Electronic building brick and method for manufacturing electronic building brick Download PDFInfo
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- CN109791917A CN109791917A CN201780063259.2A CN201780063259A CN109791917A CN 109791917 A CN109791917 A CN 109791917A CN 201780063259 A CN201780063259 A CN 201780063259A CN 109791917 A CN109791917 A CN 109791917A
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- region
- thermal coefficient
- covering material
- building brick
- electronic building
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
Abstract
Illustrate a kind of electronic building brick (5), comprising: substrate (10), the substrate has the electronic device (70-78) being arranged in the first side (12) of the substrate (10), it is characterized in that the multiple of the first side (12) pass through the region (20 separated from each other following intermediate region (40-44), 22, 24, 26, 28, 30), the intermediate region includes the intermediate region material with the first thermal coefficient, the wherein region (20 of the first side (12), 22, 24, 26, 28, 30) at least one region in has covering material, the flowable covering material especially before age-hardening, the covering material has the second thermal coefficient, the wherein corresponding region (20 of the first side (12), 2 2,24,26,28,30) covering material is covered each by a part of one or more devices and the first side (12) in device (70-78), and wherein first thermal coefficient is less than second thermal coefficient.
Description
Technical field
The present invention relates to a kind of electronic building bricks and a kind of method for manufacturing electronic building brick.
Background technique
Known a variety of electronic building bricks.In up to the present well known electronic building brick, epoxy resin is coated in electronics
On electronic device on the printed circuit board of component, so that these devices are by poured with epoxy resin and are protected from ring around
Border influences (medium or fluid of surrounding, temperature change etc.).
44 08 176 A1 of DE describes the saving space by the device with poured with epoxy resin to arrangement on substrate
Encapsulation.In this case, the wall 5 being made of the epoxy resin of high viscosity and high thixotropic is coated to around electronics
On the printed circuit board of device.And then, the volume 6 being filled in resin within wall 5, so that resin covers the electronic device
And protect the electronic device to prevent surrounding environment influence.
Change for the material for the electronic device being poured on printed circuit board or substrate often through filler, so that should
Material has high thermal conductivity ability (high thermal conductivity coefficient), to propagate or be distributed the heat or corresponding electronic component that are generated by device
Thermal losses power and by it is described by device generate heat or corresponding electronic component thermal losses power pass through big table
Face gives out.
In general, being poured multiple devices jointly with coherent covering material, thus make these device thermal couplings.This usually leads
It causes: discharging many heats or become awfully hot device and be transmitted to their waste heat not discharge so much heat or do not become
On so hot device.This is typically resulted in: although on the one hand some devices do not become such as in the case where being not covered with material
With it is hot not as in the case where the thermal coupling with other devices, but on the other hand some itself be not heated tempestuously
Or the device of release heat is heated by one or more of the other device.This causes again: these usual devices become than them at it
Maximum running temperature common (in the case where the thermal coupling not with other devices) is hotter in the case of it.Therefore, usually exist
Up to the present in well known electronic building brick, do not become awfully hot or devices without generating many heats must be directed to it is higher
Temperature designs, because the device is heated by other devices.This typically results in higher cost and leads to electronic device more
Frequent failure, and therefore cause the reliability of electronic building brick lower.
Therefore, the demand to following electronic building brick may be present, which has high service life and the electronics group
Part allows to make the maximum running temperature of the electronic device of the electronic building brick to determine parameter independently of each other.It also may be present to for making
Make the demand of the method for electronic building brick, this method is technically simple, and wherein the electronic building brick have high service life and
Allow to make the maximum running temperature of the electronic device of the electronic building brick to determine parameter independently of each other.This demand can pass through patent
Subject matter of the independent claims meet.
Summary of the invention
Advantages of the present invention
Embodiments of the present invention can be advantageously carried out: electronic device on a printed circuit there is no by other electricity
Sub- device (extraly) heating, but simultaneously for the big table existed for the electronic device for discharging many heats for heat dissipation
Face.
According to a first aspect of the present invention it is proposed a kind of electronic building brick, the electronic building brick include: substrate, substrate tool
There is the electronic device in the first side for being arranged in the substrate, wherein the electronic building brick further includes that the multiple of the first side pass through
Following intermediate region region separated from each other, the intermediate region include the intermediate region material with the first thermal coefficient,
In the first side these regions at least one region have covering material, can especially be flowed before age-hardening
Covering material, which has the second thermal coefficient, wherein the covering material in the corresponding region of the first side point
A part of one or more devices and the first side in other covering device, and wherein the first thermal coefficient less than
Two thermal coefficients.
Its advantage is that: in general, the heat transfer from an electronic component to another electronic component is consumingly reduced or very
To being prevented from, these electronic components are in the region separated by intermediate region of the first side of substrate.Therefore, usually may be used
Can: the device of generation or many heats of release is covered with covering material, which provides high thermal conductivity coefficient, be used for
Heat is discharged into ambient enviroment by the whole surface in the corresponding region of first side, and heat is from first side simultaneously
The transformation or transfer in one region to the other regions separated by intermediate region of first side are reduced or are prevented from.Cause
This, usual heat is from the devices of many heats is generated to generating the transmitting of device of a small amount of heat up to not generating heat consumingly
It is reduced or is even prevented from.Another advantage is: in general, the maximum running temperature of each device therefore can be independently of each other
It is determined parameter.
The device for generating many heats for example can be choke coil, and the maximum running temperature which has is about 180
℃.The maximum running temperature that generating the device of a small amount of heat can for example have is about 80 DEG C.
Second aspect according to the invention, proposes a kind of method for manufacturing electronic building brick, and this method includes as follows
Step: providing substrate, which has the electronic device being arranged in the first side of the substrate；By intermediate region material, especially
It is that substantially not flowable intermediate region material is coated in first side before age-hardening, is used to form the first side
Multiple regions separated from each other in face, wherein the intermediate region material has the first thermal coefficient；It is filled out respectively with covering material
The region separated from each other of first side is filled, is covered as follows so that at least one region in these regions of the first side has
Cover material, which has the second thermal coefficient, wherein the first thermal coefficient is less than the second thermal coefficient.
Its advantage is that: electronic building brick usually can be technically simply manufactured, wherein from an electronic component to another electricity
The heat transfer of sub- component is consumingly reduced or is even prevented from, these electronic components are in passing through for the first side of substrate
In the separated part in intermediate region.Therefore, the device of generation or many heats of release, the covering are usually covered with covering material
Material provides high thermal conductivity coefficient, for heat to be discharged into ring around by the whole surface in the corresponding region of first side
Border, and the transformation in by intermediate region separated other regions of the heat from a region of first side to first side simultaneously
Or transfer is reduced or is prevented from.Therefore, in general, heat is from the devices of many heats is generated to generating a small amount of heat up to not
The transmitting for generating the device of heat is consumingly reduced or is even prevented from.Another advantage is: in general, the maximum of each device
Therefore running temperature can be determined parameter independently of each other.
The covering material usually may also comprise air.
The thinking of embodiments of the present invention can especially be considered as based on the thought and understanding then described.
The first side of substrate is set to be separated from each other (and therefore covering material being made to be separated from each other) due to existing or coating
Intermediate region, usually the heat transmitting from a device to another device are reduced or are prevented from.Therefore, electronic component is usually regarded
Depending on maximum running temperature, different covering materials can be used.Covering material can especially have high thermal conductivity coefficient, to make heat
Amount is well distributed in the surface in corresponding region, so that the heat is efficiently released to ambient enviroment.In general, first
In the part separated by intermediate region of side, the heat (as long as if needing) of corresponding electronic device can be by big
Surface is released to ambient enviroment, without transferring heat to adjacent electronic device.
According to an embodiment, intermediate region includes air-gap.In general, its advantage is that: in the first side of substrate
Between different parts and therefore between electronic device in the presence of also preferably heat-insulated.It is also contemplated that: intermediate region is only
It is made of air-gap.Particularly there may be first side between the region with covering material is not covered with the (larger of material
) region.
In one embodiment, intermediate region material is included in substantially not flowable middle area before age-hardening
Domain material, it is preferable that the intermediate region material is made of intermediate region material substantially not flowable before age-hardening.
Its advantage is that: in general, the first side of substrate technically can simply be made by intermediate region region separated from each other
It makes.This can especially be achieved in that coating intermediate region material, and covering material is and then coated in lining
In the different parts of the first side at bottom.
In one embodiment, intermediate region material is respectively around the region of first side, especially entirely around
The region of first side.In this respect advantageously: in general, manufacture is technically simple.Usually, it is particularly possible in coating point
After boundary's material by covering material by it is flowing or before age-hardening it is flowable in the form of be coated to the region of first side
On.
According to an embodiment, at least one region in these regions of first side has following covering material,
The covering material has third thermal coefficient, and wherein third thermal coefficient is less than the second thermal coefficient.Its advantage is that: in general, only
The electronic device for generating a small amount of heat is equally protected by covering material, to prevent ambient enviroment, such as salt mist environment, water environment and/
Or oil environment and/or temperature change.
According to an embodiment, third thermal coefficient less than the second thermal coefficient and is less than or equal to the first thermally conductive system
Number, is especially substantially equivalent to the first thermal coefficient.In this respect advantageously: in general, generating or discharging especially more heats
The first device in the heats of some first devices can be given out well or in large area, and with having third thermally conductive
The other devices of the covering material covering of coefficient and the first device are heat-insulated well.
According to an embodiment, the first thermal coefficient be the second thermal coefficient at least 20%, especially 40%, preferably
60%, particularly preferably 80%.It is usually between the region of the first side of substrate and therefore real between electronic device through this
Show particularly preferred heat-insulated.
An embodiment in the method, fills the area separated from each other of first side with covering material respectively
Domain, so that at least one region in these regions of the first side has a following covering material, which has the
Three thermal coefficients, wherein third thermal coefficient is less than the second thermal coefficient.Its advantage is that: in general, only generating the electricity of a small amount of heat
Sub- device is equally protected by covering material, to prevent ambient enviroment, such as oil environment.
An embodiment in the method, third thermal coefficient is less than the second thermal coefficient and is less than or equal to first
Thermal coefficient is especially substantially equivalent to the first thermal coefficient.In this respect advantageously: in general, generating or discharging especially more
Heat the first device in the heats of some first devices can be given out well or in large area, and with having the
The other devices of the covering material covering of three thermal coefficients and the first device are heat-insulated well.
Point out: some feature and advantage in possible feature and advantage of the invention are herein with reference to the electronic building brick
Different embodiment describes.Those skilled in the art recognize: these features can combine in the right way, be adapted to or
Exchange, to obtain other embodiments of the present invention.
Detailed description of the invention
Then, embodiments of the present invention are described by with reference to the attached drawing of accompanying, wherein no matter attached drawing or specification all
It should not be designed to limit the invention.
Fig. 1 shows the cross-sectional view of the first embodiment of electronic building brick according to the invention；And
Fig. 2 shows the cross-sectional views of the second embodiment of electronic building brick according to the invention.
These attached drawings are only schematical and without pressing correct proportions.In the drawings, identical appended drawing reference
Indicate feature that is identical or playing phase same-action.
Specific embodiment
Fig. 1 shows the cross-sectional view of the first embodiment of electronic building brick 5 according to the invention.Electronic building brick 5 includes
Substrate 10.Substrate 10 can be printed circuit board.Printed circuit board 10 has first side 12 and opposed with first side 12
Second side.Electronic device 70-78 is disposed in first side 12.In second side opposed with first side 12 of substrate 10
On face, one or more electronic devices can also be arranged.Electronic device 70-78 at least partially through printed circuit board 10 each other
Connection.Electronic device 70-78 for example may include or can be one or more electrolytic capacitors, one or more choke coil, one
A or multiple field effect transistors and it may include when necessary or can be other electronic device 70-78.
Electronic device 70-78 is coated cover material respectively and covers or cover.Covering material for media-resistant (such as oil thickly
And/or relative to salt fog and/or watertight feud) and/or resistance to temperature alternatively encasing electronic components 70-78.Substrate 10 or printing
The first side 12 of circuit board 10 is divided into multiple regions 20,22,24,26,28,30 by intermediate region 40-44.Printed circuit
The region 20,22,24,26,28,30 of the first side 12 of plate 10 is respectively provided with covering material.The region 20 of first side 12,
22,24,26,28,30 each covering material covers at least one electronic device 70-78.The region 20 of first side 12,
22,24,26,28,30 covering material can also collectively cover multiple electronic device 70-78, such as four electronic device 70-
78.The covering material in the region 20,22,24,26,28,30 of first side 12 is covered each by the first side of printed circuit board 10
12 following part, this extends with partially surrounding one or more electronic device 70-78.The different regions of first side 12
20,22,24,26,28,30 or the covering material in different regions 20,22,24,26,28,30 of first side 12 pass through centre
Region 40-44 is separated from each other.This means that: have one (at least) intermediate region 40-44 be in two of first side 12 that
The region next to each other 20 in the region 20,22,24,26,28,30 or first side 12 that this is located next to, 22,24,26,28,
Between 30 covering material.
Intermediate region 40-44 includes intermediate region material with the first thermal coefficient or by having the first thermal coefficient
Intermediate region material composition.Covering material equally has thermal coefficient.Intermediate region 40-44 or intermediate region material can be
(viscosity is high for so-called dam material or so-called dam material；Cannot be flowed before age-hardening), by so-called viscosity it is low (when
Effect hardening before can flow) packing material be filled into the region 20,22,24,26,28,30 surrounded by dam material before, this
Dam material or dam material completely about one or more electronic device 70-78 are arranged respectively.In this way, by the first side
The part surrounded by dam material or region 20,22,24,26,28,30 in face 12 are complete and cover without gap.Especially
Corresponding electronic device 70-78 is not covered with having gap, which is surrounded by intermediate region 40-44 or dam material.It covers
Cover material can be so-called packing material.At least one region 20,22,24,26,28,30 of first side 12 has as follows
Covering material, the covering material have the second thermal coefficient.
First thermal coefficient is less than the second thermal coefficient.Through this, from the region of first side 12 20,22,24,26,28,30
Or first other regions 20,22,24,26,28,30 of the electronic device 70-78 to first side 12 or the second electronic device 70-78
Heat transmitting be consumingly reduced or be even prevented from.
In Fig. 1, there are multiple electronic device 70-78, these electronics devices in the first side 12 of printed circuit board 10
In part, each electronic device generates heat or waste heat.An electrolytic capacitor, a choke coil and four is shown in FIG. 1
Field effect transistor.Electrolytic capacitor is by the first covering material in the first area 20 of the first side 12 of printed circuit board 10
Covering.Region 20 around the electrolytic capacitor of first side 12 is also coated cover material (packing material) covering.Intermediate region 40-
44 around printed circuit board 10 first side 12 first area 20 or extend around the first covering material, among this
Region is made of intermediate region material or including the intermediate region material.
Choke coil is equally in the covering of the covering material in the second area 22 of first side 12.Four field effect transistors
Pipe is surrounded by intermediate region material jointly, which makes the third region 24 of first side 12 and first side 12
Second area 22 separates.
Therefore, exist between the first area of first side 12 20 and the second area 22 of first side 12 by middle area
The intermediate region 40-44 that domain material is constituted.First side 12 second area 22 and first side 12 third region 24 it
Between there is also the intermediate region 40-44 being made of intermediate region material.
By covering material, it is distributed in the waste heat of corresponding one or more electronic device 70-78 (with electronic device
The size of 70-78 is compared) in relatively large surface, heat is allowed well or to be efficiently released to ambient enviroment.However,
Intermediate region 40-44 or intermediate region material reduce or prevent from the first area of first side 12 to the second of first side 12
Region 22 or between the first area of first side 12 20 and the third region 24 of first side 12 or in first side 12
Heat transmitting between second area 22 and the third region 24 of first side 12.Therefore, in electrolytic capacitor, choke coil and field-effect
Hot transmitting does not occur between transistor.Field-effect in the same area 20,22,24,26,28,30 for being at first side
Heat transmitting occurs between transistor.
Therefore it prevents: if for example choke coil is particularly strongly heated (such as it is heated to about 180 DEG C；It is maximum
Running temperature), then it is usually only heated to about 80 DEG C (maximum running temperature) of electrolytic capacitor and is heated more than 80 DEG C, and
And therefore parameter must be designed or determined for higher (operation) temperature.
Intermediate region 40-44 may include air-gap.For this purpose, the dam material to each other with air-gap is arranged in printing electricity
In the first side 12 of road plate 10.This leads to the much better of the different regions 20,22,24,26,28,30 of first side 12
It is heat-insulated.
Fig. 2 shows the cross-sectional views of the second embodiment of electronic building brick 5 according to the invention.In addition to electrolytic capacitor
70, except choke coil 71 and four field effect transistor 72-75, electronic building brick 5 shown in figure 2 is in printed circuit board 10
It further include three other electronic device 76-78 in first side 12.Electrolytic capacitor 70, choke coil 71 and four field effect transistors
72-75 generates many heats or waste heat respectively.Three other electronic device 76-78 only generate a small amount of waste heat.This means that: this three
A other electronic device 76-78 generate less heat than electrolytic capacitor 70, choke coil 71 and field effect transistor 72-75 respectively
Amount.
These three other electronic device 76-78 are arranged in the region 26,28,30 of oneself of first side 12, i.e.,
The fourth region 26, the 5th region 28 of first side 12 and the 6th region 30 of first side 12 of first side 12.Therefore, exist
There are six regions 20,22,24,26,28,30 of first side 12, each of this six region opposite first sides 12 in Fig. 2
Other regions 20,22,24,26,28,30 are all separated by one or more intermediate region 40-44 respectively.The of first side 12
The fourth region 26 in two regions 22, the third region 24 of first side 12 and first side 12 is all respectively provided with following covering material
Material, the covering material have the thermal coefficient (third thermal coefficient) smaller than the second thermal coefficient.Third thermal coefficient can be with
It is big as the first thermal coefficient, or can be less than the first thermal coefficient.
Therefore, in Fig. 2, the first area 20(of first side 12 Far Left in Fig. 2), the secondth area of first side 12
Domain 22(is among Fig. 2) and the third region 24 of first side 12 there is following covering material, which, which has, first leads
Hot coefficient or first thermal coefficient.First thermal coefficient is relatively high, thus by three be previously mentioned in first side 12
The heat that electronic device 70-78 in region 20,22,24 is generated is distributed in the corresponding whole region of first side 12, with
Just heat or waste heat are efficiently discharged into ambient enviroment.Other three regions 26 of first side 12,28,30, that is
The fourth region 26(of first side 12 is in Fig. 2 middle upper part), the 5th region 28 of first side 12 and first side 12
Six regions 30 have following covering material, which has third thermal coefficient, which leads less than second
Hot coefficient.Therefore, from electronic device, i.e. electrolytic capacitor 70, choke coil 71 and the field effect transistor 72-75 for generating many heats
Heat transmitting to the other electronic device 76-78 for only generating a small amount of heat or waste heat is consumingly reduced or is even prevented from.
It is also contemplated that: these three other electronic device 76-78, that is in the fourth region of first side 12
26, the device in the 5th region 28 of first side 12 and the 6th region 30 of first side 12 is not covered with material covering.
Therefore, the first area of first side 12 20 and first side 12 second area 22 and first side 12 third area
There can be relatively wide air-gap between domain 24.This can consumingly be improved in the region with electrolytic capacitor of first side 12
20, between the region 22 with choke coil of first side 12 and the region 24 with field effect transistor of first side 12
It is heat-insulated.
In order to manufacture electronic building brick 5, dam rings of material is arranged in printed circuit board 10 around electronic device 70-78 first
First side 12 on.And then, filled respectively with covering material the first side 12 of printed circuit board 10 by dam material
The region 20,22,24,26,28,30 of encirclement or part, and corresponding electronic device 70- is therefore covered with the covering material
78.These covering materials can be different respectively or with different thermal coefficients.For discharging the electronics device of many heats
For part 70-78, the covering material for selecting thermal coefficient high, so that the heat of electronic device 70-78 is distributed in first side 12
Region 20,22,24,26,28,30 or first side 12 corresponding region 20,22,24,26,28,30 whole surface in.
For generate a small amount of heat until do not generate heat and therefore not as becoming hot (being, for example, less than about 100 DEG C) electronics
For device 70-78, the low covering material of selection thermal coefficient.First thermal coefficient can be in about 0.75W/mK to about
In the range of 1.5W/mK, such as it can be about 1W/mK.Second thermal coefficient can be in about 2W/mK to about 4W/mK's
In range, such as it can be about 2.5W/mK.Third thermal coefficient can be in about 0.75W/mK to the model of about 1.5W/mK
In enclosing, such as it can be about 1W/mK.
The dam material and covering material that will be used as intermediate region material be coated in first side 12 region 20,22,
24, after in 26,28,30, harden covering material and intermediate region material ages as so-called packing material, such as logical
It crosses heat and/or UV radiation carrys out age-hardening.Now, electronic device 70-78 is with respect to ambient enviroment or the medium of surrounding, such as phase
It is arranged in oil, salt fog and/or water, and/or relatively in electronic building brick 5, for example as the electronic building brick of Transmission Control Module 5
Not normal protected well in terms of temperature change load therein, especially oil is thickly protected.Meanwhile generating many heats
The heat of electronic device 70-78 be dispersed into ambient enviroment well, the electronic device 70-78 without generating many heats
Extraly by other devices 70-78() do not heat.Therefore, electronic device 70-78 can be determined parameter independently of each other, or
The respective temperature levels or maximum running temperature of corresponding device 70-78 need only be paid close attention to respectively in design.In such case
Under, it is not necessary to consider the maximum running temperature of other electronic device 70-78, other electronic devices are in printed circuit board 10
The first of the region 20,22,24,26,28,30 or printed circuit board 10 separated by intermediate region 40-44 of first side 12
In the part of side 12.
The second side opposed with first side 12 of substrate 10 may also comprise following component part: second side it is multiple
By following intermediate region region separated from each other, the intermediate region includes the intermediate region material with the first thermal coefficient
Material, wherein at least one region in these regions of second side has covering material, the especially energy before age-hardening
The covering material of flowing, the covering material have the second thermal coefficient, wherein the covering material in the corresponding region of second side
Be covered each by a part of one or more devices in device and second side, and wherein the first thermal coefficient less than
Two thermal coefficients.This means that: second side can construct same or likely with first side: there are multiple electronic devices,
There is these electronic devices the covering material of one or more thermal coefficients to cover, and wherein these covering materials, which pass through, has such as
The intermediate region material of lower thermal coefficient is separated from each other, which is less than the thermally conductive of one or more covering materials
Coefficient.
The electronic building brick especially can be the part of gearbox control or electric driver or small-sized electric driver.It should
Electronic building brick can be rain brush, clutch adjustment mechanism, gearbox adjustment mechanism, engine radiator, motor radiating fan, vehicle
The part of window glass lifter, the actuator or gearbox or controller that pump and/or be mounted on internal combustion engine.
Finally, it is noted that: the term as " having ", " comprising " etc. is not excluded for other element or steps, and such as " one
It is a " or " one " as term be not excluded for it is multiple.Appended drawing reference in claim is not construed as limiting.
Claims (10)
1. a kind of electronic building brick (5) comprising:
Substrate (10), the substrate have the electronic device (70-78) being arranged in the first side (12) of the substrate (10),
It is characterized in that
The first side (12) it is multiple by the region separated from each other following intermediate region (40-44) (20,22,24,26,
28,30), the intermediate region includes the intermediate region material with the first thermal coefficient,
Wherein at least one region in the region (20,22,24,26,28,30) of the first side (12) has covering
Material, the especially flowable covering material before age-hardening, the covering material have the second thermal coefficient,
Wherein the covering material in the corresponding region (20,22,24,26,28,30) of the first side (12) is covered each by device
A part of one or more devices and the first side (12) in (70-78),
And wherein first thermal coefficient is less than second thermal coefficient.
2. electronic building brick (5) according to claim 1, wherein
The intermediate region (40-44) includes air-gap.
3. electronic building brick (5) according to claim 1 or 2, wherein
The intermediate region material is included in substantially not flowable intermediate region material before age-hardening, it is preferable that institute
Intermediate region material is stated to be made of intermediate region material substantially not flowable before age-hardening.
4. according to one of the claims, especially in accordance with electronic building brick as claimed in claim 3 (5), wherein
The intermediate region material is respectively around the region (20,22,24,26,28,30) of the first side (12), especially
It is the region (20,22,24,26,28,30) completely about the first side (12).
5. electronic building brick (5) according to one of the above claims, wherein
At least one region in the region (20,22,24,26,28,30) of the first side (12) has following covering
Material, the covering material have third thermal coefficient, wherein the third thermal coefficient is less than second thermal coefficient.
6. according to one of the claims, especially in accordance with the electronic building brick (5) described in claim 5, wherein
The third thermal coefficient is less than second thermal coefficient and is less than or equal to first thermal coefficient, especially base
It is equal to first thermal coefficient in sheet.
7. electronic building brick (5) according to one of the above claims, wherein
First thermal coefficient be second thermal coefficient at least 20%, especially 40%, preferably 60%, particularly preferably
Ground 80%.
8. method of the one kind for manufacturing electronic building brick (5), described method includes following steps:
It provides substrate (10), the substrate has the electronic device (70- being arranged in the first side (12) of the substrate (10)
78)；
By intermediate region material, especially before age-hardening, substantially not flowable intermediate region material is coated to described
In first side (12), be used to form the first side (12) multiple regions separated from each other (20,22,24,26,28,
30), wherein the intermediate region material has the first thermal coefficient；
The region separated from each other (20,22,24,26,28,30) of the first side (12) is filled with covering material respectively,
So that at least one region in the region (20,22,24,26,28,30) of the first side (12) has following covering
Material, the covering material have the second thermal coefficient, wherein first thermal coefficient is less than second thermal coefficient.
9. the method according to claim 8 for manufacturing electronic building brick (5), wherein
The region separated from each other (20,22,24,26,28,30) of the first side (12) is filled with covering material respectively,
So that at least one region in the region (20,22,24,26,28,30) of the first side (12) has following covering
Material, the covering material have third thermal coefficient, wherein the third thermal coefficient is less than second thermal coefficient.
10. the method according to claim 9 for manufacturing electronic building brick (5), wherein
The third thermal coefficient is less than second thermal coefficient and is less than or equal to first thermal coefficient, especially base
It is equal to first thermal coefficient in sheet.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016219995.1 | 2016-10-13 | ||
| DE102016219995.1A DE102016219995A1 (en) | 2016-10-13 | 2016-10-13 | Electronic assembly and method of manufacturing an electronic assembly |
| PCT/EP2017/071569 WO2018068939A1 (en) | 2016-10-13 | 2017-08-28 | Electronic assembly and method for producing an electronic assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109791917A true CN109791917A (en) | 2019-05-21 |
Family
ID=59714028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780063259.2A Pending CN109791917A (en) | 2016-10-13 | 2017-08-28 | Electronic building brick and method for manufacturing electronic building brick |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3526813A1 (en) |
| CN (1) | CN109791917A (en) |
| DE (1) | DE102016219995A1 (en) |
| WO (1) | WO2018068939A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09326454A (en) * | 1996-04-05 | 1997-12-16 | Koito Mfg Co Ltd | Electronic device and manufacture thereof |
| JP2003332500A (en) * | 2002-05-13 | 2003-11-21 | Denso Corp | Electronic circuit device |
| US20120097997A1 (en) * | 2010-10-22 | 2012-04-26 | Chia-Tin Chung | Multichip package structure using a constant voltage power supply |
| CN104638098A (en) * | 2013-11-12 | 2015-05-20 | 罗伯特·博世有限公司 | Thermoelectric module and method for manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4408176A1 (en) | 1994-03-11 | 1995-09-14 | Sel Alcatel Ag | Component encapsulation esp. integrated circuits |
| DE29510335U1 (en) * | 1995-06-26 | 1995-08-24 | Siemens Ag | Electronic combined logic power module |
| JP3764687B2 (en) * | 2002-02-18 | 2006-04-12 | 三菱電機株式会社 | Power semiconductor device and manufacturing method thereof |
-
2016
- 2016-10-13 DE DE102016219995.1A patent/DE102016219995A1/en not_active Withdrawn
-
2017
- 2017-08-28 CN CN201780063259.2A patent/CN109791917A/en active Pending
- 2017-08-28 WO PCT/EP2017/071569 patent/WO2018068939A1/en unknown
- 2017-08-28 EP EP17758156.8A patent/EP3526813A1/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09326454A (en) * | 1996-04-05 | 1997-12-16 | Koito Mfg Co Ltd | Electronic device and manufacture thereof |
| JP2003332500A (en) * | 2002-05-13 | 2003-11-21 | Denso Corp | Electronic circuit device |
| US20120097997A1 (en) * | 2010-10-22 | 2012-04-26 | Chia-Tin Chung | Multichip package structure using a constant voltage power supply |
| CN104638098A (en) * | 2013-11-12 | 2015-05-20 | 罗伯特·博世有限公司 | Thermoelectric module and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102016219995A1 (en) | 2018-04-19 |
| EP3526813A1 (en) | 2019-08-21 |
| WO2018068939A1 (en) | 2018-04-19 |
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