CN109788707B - Riveting structure and riveting method for electronic component and radiating fin - Google Patents
Riveting structure and riveting method for electronic component and radiating fin Download PDFInfo
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- CN109788707B CN109788707B CN201711129993.2A CN201711129993A CN109788707B CN 109788707 B CN109788707 B CN 109788707B CN 201711129993 A CN201711129993 A CN 201711129993A CN 109788707 B CN109788707 B CN 109788707B
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- electronic component
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- positioning column
- heat sink
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Abstract
The invention relates to a riveting structure of an electronic component and a radiating fin, which comprises the electronic component and the radiating fin, wherein the electronic component comprises a working part and a connecting part which are fixedly connected with each other, a first positioning column is arranged on the radiating fin, a positioning hole is arranged on the connecting part corresponding to the first positioning column, the positioning hole is sleeved on the first positioning column, a plurality of fixing claws are further arranged on the radiating fin, the fixing claws are positioned on two sides of the connecting part and abut against the connecting part, each fixing claw comprises a bent part arranged on the top of the fixing claw, the bent part is positioned above the connecting part and abuts against the connecting part, and the fixing claws are fixedly arranged on the radiating fin. The invention reduces the weight of the fixing structure of the electronic component and the radiating fin, saves materials and simplifies the processing technology.
Description
Technical Field
The invention relates to the field of electric appliances, in particular to a riveting structure of an electronic component and a radiating fin.
Background
Electronic components are the basis of forming electronic products, along with the continuous progress of the manufacturing process of electronic components, the integration level of the electronic components is higher and higher, and the excessive electronic components often bring overheating problems to a circuit integrated board to cause the damage of the electronic components; at present, electronic components are mostly arranged on a radiating fin so as to solve the radiating problem of the electronic components, but the fixing structure for fixing the electronic components on the radiating fin is complex, heavy and not firm enough, and the electronic components or the radiating fin is easy to fall off in the using process.
Disclosure of Invention
Based on this, the invention aims to provide a riveting structure of an electronic component and a heat sink, which comprises the electronic component and the heat sink, wherein the electronic component comprises a working part and a connecting part which are fixedly connected with each other, a first positioning column is arranged on the heat sink, a positioning hole is arranged on the connecting part corresponding to the first positioning column, the positioning hole is sleeved on the first positioning column, a plurality of fixing claws are further arranged on the heat sink, the fixing claws are positioned on two sides of the connecting part and abut against the connecting part, each fixing claw comprises a bending part arranged on the top of the fixing claw, the bending part is positioned above the connecting part and abuts against the connecting part, and the fixing claws are fixedly arranged on the heat sink.
The fixing claw is a part bent upwards on the radiating fin, the electronic component is fixed on the radiating fin through the radiating fin, the heat of the electronic component can be directly transferred to the fixing claw, namely a part of the radiating fin, and an additional fixing structure is removed, so that the fixing claw is lighter in weight, simpler in structure and better in radiating effect; according to the invention, the electronic component is positioned through the fixing claws and the first positioning column, the positioning hole is sleeved on the first positioning column, and meanwhile, two ends of the connecting part are abutted against the fixing claws positioned at two sides of the connecting part, so that the movement and swing of the electronic component in the vertical direction and the horizontal direction can be limited, the electronic component can be in close contact with the radiating fins, and a good radiating effect is achieved.
Preferably, the heat sink and the fixing claw and/or the first positioning column are integrally formed.
The integrated into one piece's structural strength is better, can avoid in the use fin and stationary dog and/or first reference column pine to take off, influences electronic components's use.
Further, the height of the first positioning column is smaller than that of the connecting plate.
The height of first locating column is less than the height of connecting plate can prevent that first locating column is located to the locating hole cover when locating first locating column, avoids first locating column outstanding connecting portion, forms other components and parts of easy fish tail and user of sharp-pointed part on the connecting portion surface.
Preferably, the device further comprises second positioning columns, wherein the second positioning columns are located on two sides of the working part and abut against the working part.
The second positioning columns are located on the left side and the right side of the working portion and used for limiting the left-right swinging and moving of the working portion of the electronic component and further fixing the electronic component, meanwhile, the second positioning columns and the radiating fins are of an integrally formed structure, the second positioning columns are in contact with the side faces of the working portion, the second positioning columns are in direct contact with the working portion, the contact area between the radiating fins and the working portion is increased, and a better radiating effect is achieved.
Furthermore, the number of the second positioning columns is two, the two second positioning columns are respectively located on two sides of the working portion, and the two second positioning columns are located at the same horizontal height.
The two second positioning columns are respectively positioned at the same height of two sides of the working part, so that the weight of the radiating fins can be reduced as much as possible while the balance of the stress received by the left side and the right side of the working part in work is ensured, and the lightness and miniaturization of the electric appliance are ensured.
Furthermore, the height of the second positioning column is smaller than that of the working part.
Preferably, the connecting part is of a flat plate-shaped structure.
The flat plate-shaped structure can enable the electronic component to have larger contact area with the radiating fin under the condition of the same mass and volume, so that the radiating effect of the electronic component is better.
Another object is to provide a method for riveting an electronic component and a heat sink, comprising the following steps:
s1, folding the fixed claws upwards to form an included angle of 90 degrees with the radiating fins;
and S2, sleeving the positioning hole on the electronic component on the first positioning column, and enabling the connecting part to abut against the fixing claws on the two sides of the connecting part, so that the working part abuts against the second positioning columns on the two sides of the connecting part.
And S3, bending the bending part at the top of the positioning claw towards the connecting plate, so that the bending part is positioned above the connecting plate and is abutted against the connecting plate.
The principle and effect of the present invention will be further explained by combining the above technical solutions:
the fixing claws are arranged on the radiating fins, and the electronic components are fixed on the radiating fins by the fixing claws, so that the fixing structure is firm, an additional fixing device is omitted, the weight of the fixing structure of the electronic components and the radiating fins is reduced, the material is saved, and the processing technology is simplified.
Drawings
Fig. 1 is a first structural schematic diagram of a riveting structure of an electronic component and a heat sink according to an embodiment of the invention;
fig. 2 is a second schematic structural diagram of a riveting structure of an electronic component and a heat sink according to an embodiment of the invention;
description of reference numerals:
the electronic component 1, the working part 11, the connecting part 12, the positioning hole 121, the heat sink 2, the fixing claw 21, the bending part 211, the first positioning column 22, and the second positioning column 23.
Detailed Description
For the convenience of understanding of those skilled in the art, the present invention will be described in further detail below with reference to the accompanying drawings and examples:
as shown in fig. 1, a riveting structure of an electronic component 1 and a heat sink includes the electronic component 1 and the heat sink 2, the electronic component 1 includes a working portion 11 and a connecting portion 12 that are fixedly connected to each other, the heat sink 2 is provided with a first positioning column 22, the connecting portion 12 is provided with a positioning hole 121 corresponding to the first positioning column 22, the positioning hole 121 is sleeved on the first positioning column 22, the heat sink 2 is further provided with a plurality of fixing claws 21, the fixing claws 21 are located on two sides of the connecting portion 12 and abut against the connecting portion 12, the fixing claws 21 include a bending portion 211 arranged on the top of the fixing claws, the bending portion 211 is located above the connecting portion 12 and abuts against the connecting portion 12, and the fixing claws 21 are fixedly arranged on the heat sink 2.
In one embodiment, the heat sink 2 is integrally formed with the fixing claw 21 and/or the first positioning column 22.
In one embodiment, the device further includes a second positioning column 23, and the second positioning column 23 is located at two sides of the working portion 11 and abuts against the working portion 11.
In one embodiment, the number of the second positioning columns 23 is two, two of the second positioning columns 23 are respectively located at two sides of the working portion 11, and the two second positioning columns 23 are located at the same horizontal height.
In one embodiment, the height of the second positioning column 23 is smaller than the height of the working portion 11.
In one embodiment, the connecting portion 12 is a flat plate-like structure.
In one embodiment, a method for riveting an electronic component 1 and a heat sink is characterized by comprising the following steps:
s1, folding the fixed claw 21 upwards to form an included angle of 90 degrees with the radiating fin 2;
s2, the positioning hole 121 of the electronic component 1 is fitted over the first positioning post 22, and the connecting portion 12 abuts against the fixing claws 21 on both sides thereof, so that the working portion 11 abuts against the second positioning posts 23 on both sides thereof.
And S3, bending the bending part 211 at the top of the positioning claw towards the connecting plate, so that the bending part 211 is positioned above the connecting plate and is abutted against the connecting plate.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. A riveting structure of an electronic component and a radiating fin is characterized by comprising the electronic component and the radiating fin, the electronic component comprises a working part and a connecting part which are fixedly connected with each other, a first positioning column and a second positioning column are arranged on the heat dissipation sheet, the connecting part is provided with a positioning hole corresponding to the first positioning column, the positioning hole is sleeved on the first positioning column, the second positioning columns are positioned at two sides of the working part and are abutted against the working part, a plurality of fixed claws are further arranged on the heat radiating fins and are positioned at two sides of the connecting part, and is abutted against the connecting part, the fixed claw comprises a bending part arranged at the top of the fixed claw, the bending part is positioned above the connecting part and is abutted against the connecting part, the bending portion is bent toward the connecting portion, and the fixing claws are fixedly arranged on the heat radiating fins.
2. A riveted structure of an electronic component and a heat sink according to claim 1, characterized in that the heat sink and the fixing claw and/or the first positioning column are integrally formed.
3. A riveted structure of an electronic component and a heat sink according to claim 1 or 2, wherein the height of the first positioning column is smaller than that of the connecting portion.
4. The electronic component and heat sink riveting structure of claim 1, wherein the number of the second positioning columns is two, the two second positioning columns are respectively located at two sides of the working portion, and the two second positioning columns are located at the same horizontal height.
5. The electronic component and heat sink riveting structure of claim 4, wherein the height of the second positioning column is smaller than the height of the working part.
6. A riveted structure of an electronic component and a heat sink according to claim 1, characterized in that the connecting portion is of a flat plate-like structure.
7. A riveting method of a riveting structure of an electronic component and a heat sink as claimed in any one of the preceding claims 1 to 6, characterized by comprising the following steps:
s1, folding the fixed claws upwards to form an included angle of 90 degrees with the radiating fins;
s2, sleeving a positioning hole on the electronic component on the first positioning column, and enabling the connecting part to abut against the fixing claws on the two sides of the connecting part so as to enable the working part to abut against the second positioning columns on the two sides of the connecting part;
and S3, bending the bending part at the top of the positioning claw towards the connecting part, so that the bending part is positioned above the connecting part and is abutted against the connecting part.
Priority Applications (1)
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CN201711129993.2A CN109788707B (en) | 2017-11-15 | 2017-11-15 | Riveting structure and riveting method for electronic component and radiating fin |
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CN201711129993.2A CN109788707B (en) | 2017-11-15 | 2017-11-15 | Riveting structure and riveting method for electronic component and radiating fin |
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CN109788707A CN109788707A (en) | 2019-05-21 |
CN109788707B true CN109788707B (en) | 2020-06-26 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101123228A (en) * | 2007-05-18 | 2008-02-13 | 康舒科技股份有限公司 | Fixing location for chip and heat radiating slice |
CN201623949U (en) * | 2010-01-28 | 2010-11-03 | 深圳市同洲电子股份有限公司 | Radiator for electronic component |
CN105470190A (en) * | 2014-09-05 | 2016-04-06 | 台达电子工业股份有限公司 | Clamp for clamping electronic component |
CN206225506U (en) * | 2016-08-16 | 2017-06-06 | 广东博纬通信科技有限公司 | A kind of lamination device and communicator |
CN206283769U (en) * | 2016-12-13 | 2017-06-27 | 厦门著赫电子科技有限公司 | A kind of radiator of electronic component |
-
2017
- 2017-11-15 CN CN201711129993.2A patent/CN109788707B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101123228A (en) * | 2007-05-18 | 2008-02-13 | 康舒科技股份有限公司 | Fixing location for chip and heat radiating slice |
CN201623949U (en) * | 2010-01-28 | 2010-11-03 | 深圳市同洲电子股份有限公司 | Radiator for electronic component |
CN105470190A (en) * | 2014-09-05 | 2016-04-06 | 台达电子工业股份有限公司 | Clamp for clamping electronic component |
CN206225506U (en) * | 2016-08-16 | 2017-06-06 | 广东博纬通信科技有限公司 | A kind of lamination device and communicator |
CN206283769U (en) * | 2016-12-13 | 2017-06-27 | 厦门著赫电子科技有限公司 | A kind of radiator of electronic component |
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CN109788707A (en) | 2019-05-21 |
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