CN201142327Y

CN201142327Y - Rear panel structure

Info

Publication number: CN201142327Y
Application number: CNU2007201944275U
Authority: CN
Inventors: 曹龙国; 黄明煌
Original assignee: Cooler Master Co Ltd
Current assignee: Kaichuang Research Co Ltd
Priority date: 2007-11-29
Filing date: 2007-11-29
Publication date: 2008-10-29
Anticipated expiration: 2017-11-29

Abstract

The utility model discloses a backplane architecture which can be arranged below a main board for fixing CPU radiators of different specifications in a matching manner, the backplane architecture comprises a plane body which is provided with a through hole at the center, a plurality of ally arms are horizontally extended from the plane body, each ally arm is provided with a group of first fixing holes, the plane body is respectively extended with an outward extending plate from the two sides to form a ladder form, the outward extending plates are respectively provided with a group of second fixing holes and a group of third fixing holes; by means of the structure, the utility model achieves the purpose of fixing the CPU radiators of different specifications in the matching manner, and effectively reduces the production cost.

Description

Back board structure

Technical field

The utility model relates to a kind of cpu heat for different size and cooperates fixing back board structure.

Background technology

Will produce a large amount of heat in the process that general electronic component such as central processing unit equals to move, if there is not in time to get rid of the heat of its generation, to cause the temperature of the operational environment of electronic component to raise, and have a strong impact on the normal operation of electronic component, therefore fixedly install a radiator on described heat-generating electronic elements surface usually, to reach the effect of heat radiation.

Generally speaking, the locate mode of radiator is directly to rely on an elastic spring or cramp to be fastened on the suitable position of electronic component periphery on the motherboard, makes radiator that electronic component is produced a strength that compresses relatively.But motherboard is not to design for powerful holding capacity can be provided on structural design, and this kind fixed form will make the weight of radiator that motherboard is produced the improper application of force, and then easily motherboard be caused damage.

Therefore just develop and a kind of existing fixing structure of radiator, it is characterized by, utilize a plate body to be seated in the below of motherboard, by means of several retaining elements run through the position, hole that is positioned on the motherboard described plate body and the radiator that is positioned at the motherboard top are fixed, so motherboard just can not be subjected to the improper application of force and damage, but this kind practice still has problems: because of the described plate body cpu heat of corresponding single gauge mostly only, when assembling the cpu heat of different size, must produce corresponding plate body simultaneously, and cause increasing production cost, stock buildup cost of inventory and stock control cost etc.Therefore the utility model designer promptly carries out improvement design at this problem.

Summary of the invention

The purpose of this utility model is: a kind of back board structure is provided, relies on first fixing hole, second fixing hole on the described back board structure, the cpu heat that makes the corresponding different size of described back board structure energy is to reduce production costs.

Another purpose of the utility model is to provide a kind of back board structure, and it is to rely on the main frame plate holder is pulled between described plate body and the described radiator and interfix and combine, and it is improper stressed and damage to prevent that motherboard is subjected to.

For achieving the above object, the technical solution adopted in the utility model comprises:

A kind of back board structure, be arranged on the motherboard below, cpu heat for different size cooperates fixing, it is characterized in that: described back board structure comprises a plate body, the central authorities of described plate body offer a through hole, and horizontal-extending has several support arms on described plate body, and offer one group of first fixing hole on each described support arm, at the outside respectively stepped extension plate that is extended with in the both sides of described plate body, on described extension plate, offer one group of second fixing hole in addition.

Wherein, described extension plate to the longitudinal pitch of described motherboard greater than the longitudinal pitch of described support arm to described motherboard.

For achieving the above object, the technical solution adopted in the utility model also comprises:

A kind of back board structure, be arranged on the motherboard below, cpu heat for different size cooperates fixing, it is characterized in that: described back board structure comprises a plate body, the central authorities of described plate body offer a through hole, and horizontal-extending has several support arms on described plate body, and offer one group of first fixing hole on each described support arm, at the outside respectively stepped extension plate that is extended with in the both sides of described plate body, on described extension plate, offer one group of the 3rd fixing hole in addition.

Compared with prior art, adopt the advantage that the utlity model has of technique scheme to be:

Rely on above-mentioned structure, the cpu heat that the utility model can be reached for different size cooperates fixing purpose, and effectively reduces production costs.

Description of drawings

Fig. 1 is a stereogram of the present utility model;

Fig. 2 is that first preferred embodiment of the present utility model is applied in the fixing three-dimensional exploded view of radiator;

Fig. 3 is that first preferred embodiment of the present utility model is applied in the fixing three-dimensional combination figure of radiator;

Fig. 4 is that first preferred embodiment of the present utility model is applied in the fixing side cutaway view of radiator;

Fig. 5 is the three-dimensional exploded view of second preferred embodiment of the present utility model;

Fig. 6 is the three-dimensional exploded view of the 3rd preferred embodiment of the present utility model.

Description of reference numerals: 10-plate body; The 11-through hole; The 12-support arm; 121-first fixing hole; 13-extension plate; 131-second fixing hole; 132-the 3rd fixing hole; 14-dispersive stress hole; The 15-ribs; The 40-radiator; 4 1-fixing holes; The 50-motherboard; The 51-processor; The 52-perforation; The 53-perforation; The 54-perforation; 70-first retaining element; The 71-flexible member; 72-second retaining element.

Embodiment

Relevant detailed description of the present utility model and technology contents cooperate graphic being described as follows, yet appended graphic reference and the explanation usefulness of only providing not is to be used for the utility model is limited.

Please refer to Fig. 1 to shown in Figure 4, it is respectively three-dimensional exploded view of the present utility model, the first preferred embodiment three-dimensional exploded view, the first preferred embodiment three-dimensional combination figure and the first preferred embodiment side cutaway view, the utility model provides a kind of back board structure, be arranged on motherboard 50 belows, cpu heat 40 for different size cooperates fixing, described back board structure comprises a plate body 10, the central authorities of described plate body 10 offer a through hole 11, described through hole 11 correspondences are formed under the processor (CPU) 51, to avoid the plate body 10 and the stitch of processor 51 to produce interference, horizontal-extending has several support arms 12 on the described plate body 10, and on each described support arm 12, offer one group of first fixing hole 121, described first fixing hole 121 is corresponding with the cpu heat 40 of INTEL-775 series specification, wears and fixes in the bottom surface and 72 mutual bindings of second retaining element of support arm 12 for first retaining element 70.

In addition at the outside respectively stepped extension plate 13 that is extended with in the both sides of described plate body 10, on described extension plate 13, offer one group of second fixing hole 131 and one group of the 3rd fixing hole 132, the both sides of through hole 11 offer a dispersive stress hole 14 respectively, it can disperse the stress in the described back board structure, the both sides in addition of through hole 11 are arranged with downwards respectively and form a ribs 15, described ribs 15 is to extend to described support arm 12, and ribs 15 is in order to strengthen the intensity of described back board structure.

Described back board structure is the below that plate body 10 is placed on motherboard 50 when using, to be positioned at the perforation 52 that first fixing hole 121 on the support arm 12 is aimed on the motherboard 50, again radiator 40 is placed on the top of motherboard 50, with the perforation 52 on the fixing hole 41 aligning motherboards 50 of radiator 40, at last flexible member 71 is set in first retaining element 70, again first retaining element 70 is passed fixing hole 41, perforation 52 and first fixing hole 121, and fixing in the bottom surface and the 72 mutual bindings of second retaining element of support arm 12, described flexible member 71 is to can be a compression spring.

Please refer to Fig. 5 and shown in Figure 6, be to be respectively second preferred embodiment of the present utility model to implement aspect figure and the 3rd preferred embodiment enforcement aspect figure, described second fixing hole 131 is the cpu heat (figure do not express) corresponding to the AMD-AM2 series specification and the perforation 53 of motherboard 50 thereof, wear and fix for first retaining element 70 in the bottom surface and 72 mutual bindings of second retaining element of extension plate 13, described the 3rd fixing hole 132 is perforation 54 of the cpu heat and the motherboard 50 thereof of corresponding A MD-K8 series specification, wears and fixes in the bottom surface and 72 mutual bindings of second retaining element of extension plate 13 for first retaining element 70.

In sum, when knowing the back board structure that is used in radiator of the present utility model, had industry applications, novelty and progressive, structure of the present utility model had not again been seen in like product and public use yet, meeting novel patent application important document fully, files an application according to Patent Law in the whence.

Claims

1. back board structure, be arranged on the motherboard below, cpu heat for different size cooperates fixing, it is characterized in that: described back board structure comprises a plate body, the central authorities of described plate body offer a through hole, and horizontal-extending has several support arms on described plate body, and offer one group of first fixing hole on each described support arm, at the outside respectively stepped extension plate that is extended with in the both sides of described plate body, on described extension plate, offer one group of second fixing hole in addition.

2. back board structure according to claim 1 is characterized in that: the both sides of described through hole offer a dispersive stress hole respectively.

3. back board structure according to claim 2 is characterized in that: be arranged with downwards respectively on the described plate body of the both sides in addition of described through hole and form a ribs, described ribs is to extend on the described support arm.

4. back board structure according to claim 1 is characterized in that: described extension plate to the longitudinal pitch of described motherboard greater than the longitudinal pitch of described support arm to described motherboard.

5. back board structure according to claim 1 is characterized in that: described first fixing hole is to cooperate with the cpu heat of INTEL-775 series specification to fix.

6. back board structure according to claim 1 is characterized in that: described second fixing hole is to cooperate with the cpu heat of AMD-AM2 series specification to fix.

7. back board structure according to claim 1 is characterized in that: be to offer one group of the 3rd fixing hole on the described extension plate.

8. back board structure according to claim 7 is characterized in that: described the 3rd fixing hole is to cooperate with the cpu heat of AMD-K8 series specification to fix.

9. back board structure, be arranged on the motherboard below, cpu heat for different size cooperates fixing, it is characterized in that: described back board structure comprises a plate body, the central authorities of described plate body offer a through hole, and horizontal-extending has several support arms on described plate body, and offer one group of first fixing hole on each described support arm, at the outside respectively stepped extension plate that is extended with in the both sides of described plate body, on described extension plate, offer one group of the 3rd fixing hole in addition.

10. back board structure according to claim 9 is characterized in that: described the 3rd fixing hole is to cooperate with the cpu heat of AMD-K8 series specification to fix.