CN109776737A - The application of solvent resistant resin, the photosensitive composition containing the resin and the composition - Google Patents
The application of solvent resistant resin, the photosensitive composition containing the resin and the composition Download PDFInfo
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Abstract
The invention discloses a kind of solvent resistant resin, which is the copolymer of styrene, acrylic or methacrylic acid and polyalkylene glycol acrylate ester or methacrylic acid macrogol ester.The weight average molecular weight of the solvent resistant resin is 15000-100000.Compared with the existing technology, outstanding feature of the invention is: solvent resistant resin is used in composition, the solvent resistant of plate, pressrun, which obtained, to be significantly improved, solve the disadvantage of temperature-sensitive version solvent resistant ability present in existing temperature-sensitive platemaking technology and Nai Yin ability difference, there is the good ink of resistance to UV especially in the printing of UV ink, plate has the advantages that good film-forming property, solvent resistant, pressrun are high.
Description
Technical field
The invention belongs to printing plate technical fields, and in particular to a kind of solvent resistant resin, photosensitive group containing the resin
Close the application of object and the composition.
Background technique
Computer direct plate making (Computer to plate, abbreviation CTP) starts from the 1980s, current CTP technology
It is rapidly developed, wherein positive heat-sensitive CTP plate-making technology is plate-making technology most mature, most stable, effect is best at present.With
Various countries environmental requirement is increasingly stringenter, further increase the performance of heat-sensitive CTP plate, reduce environmental pollution, especially improve
The solvent resistance and Nai Yin ability of plate are the emphasis of thermal CTP plate material exploitation.
Plate solvent resistant refers to the corrosion of the organic solvent in the resistance to various printing chemicals of printing plate, as used in printing
Washing oil, fountain solution, baking cream, printing plate preserving agent, plate cleaners, ink especially UV ink-washing oil corrosion.
Plate wearability and solvent resistance have certain relevance, and in general, the preferable plate of solvent resistance generally has
There is a higher wearability, but not necessarily solvent resistance is all right for the good plate of wearability, the especially erosion of the plate ink of resistance to UV.
Improve heat-sensitive CTP plate plate solvent resistance and Nai Yin ability method it is very much, most important one method it
One is exactly the exploitation of the especially functional film-forming resin of plate coating organic matter, such as disclosed in Kodak patent CN101321632A
Phosphoric acid side group or adamantane side group, the chemical-resistant of Lai Tigao plate are introduced in polymer.
Phenolic resin is a kind of important temperature-sensitive version film-forming resin, can by the modification of phenolic resin, modified improve
The solvent resistance and pressrun of temperature-sensitive version.
The printing plate modification of alkali solubility phenolic resin, modification are modified generally by the distant pawl group of phenolic hydroxyl group,
Such as phenolic resin phenolic hydroxyl group and sulfonic group or carboxy moiety esterification modification disclosed in EP-A 0934822.
Agfa Corp. EP02102446.8, CN1688441A disclose one kind by the distant pawl group of phenolic hydroxyl group to phenolic aldehyde tree
Rouge carries out the method for modifying of diazonium salt grafting, for improving the chemical resistance of temperature-sensitive version.Method disclosed in Ai Kefa is pair
Phenolic resin carries out diazonium salt graft modification, is formed azo-aryl group (- N=N-Q group, Q are aromatic group), improves coating
Chemical resistance.
Fujiphoto 2004.3.11 JP2004-069478 proposes main chain with phenol skeleton and urea bond (- NHCONH-)
Temperature-sensitive version resin has solvent resistance.
Kodak proposes in WO2004/033206, and barbiturates group is introduced in macromolecule resin side chain, can be obvious
Improve the solvent resistance and wearability of plate coating.Kodak discloses a kind of phenolic hydroxyl group grafting bar ratio by phenolic resin
The method of appropriate acid groups.
Agfa Corp. DE60320436(WO2004035686 of the same clan) a kind of polymer of pyrazole group containing N- is disclosed,
The polymer can increase the chemical resistance of printing plate.
Fuji Photo Film Co., Ltd. CN201380011228.4 discloses a kind of Pioloform, polyvinyl acetal by the way that a hydroxyl is added
Resin increases chemical-resistant, the printability resistance of printing plate.
Summary of the invention
It is an object of the invention to solve temperature-sensitive version solvent resistant ability and Nai Yin ability present in existing temperature-sensitive platemaking technology
The disadvantage of difference provides the application of a kind of solvent resistant resin, the photosensitive composition containing the resin and the composition.
The object of the present invention is achieved in the following manner:
Solvent resistant resin, the resin are styrene, acrylic or methacrylic acid and polyalkylene glycol acrylate ester or metering system
The copolymer of acid polyethylene glycol ester.The weight average molecular weight of the solvent resistant resin is 15000-100000.
Styrene accounts for the 1%-30% of solvent resistant resin gross mass, and acrylic or methacrylic acid accounts for solvent resistant resin gross mass
1%-40%, polyalkylene glycol acrylate ester or methacrylic acid macrogol ester account for the 58%-98% of solvent resistant resin gross mass.
The degree of polymerization of the polyalkylene glycol acrylate ester or the polyethylene glycol in methacrylic acid macrogol ester is 9-
125。
A kind of photosensitive composition containing above-mentioned solvent resistant resin, including solvent resistant resin, alkali soluble resin, dissolution suppression
Preparation, development accelerant, infrared absorbing dye and background dye.
The solvent resistant resin accounts for the 5-30% of photosensitive composition gross mass, and alkali soluble resin accounts for photosensitive composition gross mass
50-91%, dissolution inhibitor accounts for the 1-20% of photosensitive composition gross mass, and development accelerant accounts for photosensitive composition gross mass
0.1-10%, infrared absorbing dye account for the 1-5% of photosensitive composition gross mass, and background dye accounts for the 1- of photosensitive composition gross mass
5%。
The solvent resistant resin accounts for the 10-15% of photosensitive composition gross mass, and alkali soluble resin accounts for photosensitive composition gross mass
60-85%, dissolution inhibitor accounts for the 1-20% of photosensitive composition gross mass, and development accelerant accounts for photosensitive composition gross mass
0.1-10%, infrared absorbing dye account for the 2.5-3.5% of photosensitive composition gross mass, and background dye accounts for photosensitive composition gross mass
2-3.5%。
The alkali soluble resin is phenolic resin or poly(4-hydroxystyrene) resin.
Phenolic resin is metacresol-paracresol phenolic resin, phenol-paracresol phenolic resin, o-cresol-paracresol phenolic aldehyde
At least one of resin, phenolic resin.Available phenolic resin has metacresol phenolic resin, and (Mw is in 4000 ~ 8000, Mw/
Mn is 4 ~ 8), metacresol-paracresol phenolic resin (molar ratio of metacresol and paracresol be 8 ︰, 2 ~ 6 ︰ 4, Mw is 4000 ~ 10000
Between, Mw/Mn is 4 ~ 12), phenol-paracresol phenolic resin (molar ratio of phenol and paracresol is 5 ︰, 5 ~ 3 ︰ 7, Mw 4000 ~
Between 6000, Mw/Mn is 4 ~ 6), (molar ratio of phenol, o-cresol and paracresol is phenol-o-cresol-paracresol phenolic resin
2 ︰, 1 ︰ 7, Mw is between 6000 ~ 9000, and Mw/Mn is 6 ~ 9), phenol-metacresol-paracresol phenolic resin (phenol, metacresol and
The molar ratio of paracresol be 1 ︰, 6 ︰ 4, Mw is between 7000 ~ 10000, and Mw/Mn is 7 ~ 10) and phenol-formaldehyde resin modified (Mw is 12000
Between ~ 13500, Mw/Mn is 8 ~ 11) etc..Synthesize the preferred 1000- of linear phenolic resin weight average molecular weight of the present invention
100000, more preferably 2000-50000 are most preferably 2500-14000.
The dissolution inhibitor is quaternary ammonium salt nitrogenous compound, glyoxaline compound, quinoline salt compound, benzo thiophene
Azoles salt compound, aromatic carboxylic acid's ester, lactone ketone, two sulfone of aromatic hydrocarbons, poly-alkoxyl ether or polyethylene glycols.
The development accelerant is organic acid, acid anhydrides, phenols or sulfone class.Such as sulfonic acid, phosphoric acid, alkyl benzene sulphonate, benzoic acid
It is adipic acid, lauric acid, ascorbic acid, acetic anhydride, phthalic anhydride, maleic anhydride, chloromaleic acid acid anhydride, succinic anhydride, double
Phenol A, p-nitrophenol, to ethyoxyl phenol, 2,3,4- trihydroxy benzophenone, 4- hydroxy benzophenone etc..
The infrared absorbing dye is flower cyanines system infrared absorbing dye.There is the infrared of absorption peak in 790-830nm
Dyestuff is absorbed, IR dyes are flower cyanines system infrared absorbing dye.It is general to select commercially available colored cyanines system infrared absorbing dye both at home and abroad,
Such as the LC-01 of Honywell company, NK-2014, NK-2268, HCD-21 of Lin Yuan company, PS-101, PS- of Japanese chemical drug
102, the NIRD etc. of the S 0094 of FEW CHEMICALS company and Liaoning Huahai indigo plant sail, the present invention mainly select the competing chemical industry of object
830nm IR sensitizing dye.The absorption peak wavelength of these infrared absorbing dyes is usually molten in ethyl alcohol generally in 810-830nm
The absorption peak measured in agent is 815-820nm, and the absorption peak in thermosensitive CTP coating fluid is generally in 815nm or so.It is used
Amount accounts for the 1-5%, preferably 2.5-3.5% of photosensitive composition total weight.Since IR dyes are a kind of alkali insoluble materials, itself tool
There is the molten effect of resistance, certain difficulty can be caused to development when IR dyes dosage is excessively high.Fever is too low when dosage is too low, defined
It scans under energy, is especially not thorough close to aluminum substrate punishment solution, easy development is kept on file.
The background dye is solvent blue, alkaline bright blue, Victoria pure blue, phthalocyanine blue, malachite green, blackish green, phthalocyanine
Green, crystal violet, crystal violet, ethyl violet, dimethyl yellow or fluorescein.
Such as weigh application of the above-mentioned photosensitive composition in positive-printing heat-sensitive CTP plate material.
It is 7-20% that photosensitive composition, which is configured to positive heat-sensitive CTP coating fluid solid content,.
Photosensitive composition is configured to thermosensitive CTP coating fluid and selects, evaporation rate good to said components dissolubility moderate and boiling
Point is in 70-150 DEG C of dicyandiamide solution, and wherein the boiling point of bulk solvent is preferably at 100-140 DEG C.Available solvent is just like second two
The only ether of alcohol, ethylene glycol monoemethyl ether, the only methyl ether of propylene glycol, the only ether of propylene glycol, cyclohexanone, butanone, ethylene glycol monomethyl ether acetic acid
At least one of ester, propylene-glycol ethyl ether acetate, gamma-butyrolacton, dioxane etc..Solvent usage regards coating needed for coating machine
Depending on the viscosity of liquid, the solid content of general photosensitive composition solution is between 10-15%, and viscosity is in 3-5 mm2·s-1Between.Certain
Coating fluid viscosity needed for a little high-speed production lines is lower than 3mm2·s-1, so solid content also has the case where being lower than 10%.
Several components should dissolve in the following order when configuring thermosensitive CTP coating fluid, usually first dissolve more insoluble infrared
Dyestuff adds film-forming resin, dissolution inhibitor and development accelerant after IR dyes are completely dissolved, and is eventually adding background dye
Material.
It is mainly made of alkaline aqueous solution for developer of the invention.
Alkaline-based developer is a kind of alkaline solution, is mainly made of developer, protective agent, wetting agent etc..Developer is used for
The photosensitive layer that dissolution positive picture CTP plate has exposed, commonly uses strong alkaline substance, can choose: sodium hydroxide, potassium hydroxide, sodium carbonate,
Potassium carbonate, sodium metasilicate, potassium silicate, disodium hydrogen phosphate or tertiary sodium phosphate, the concentration of strong alkaline substance are preferably 0.5-30%
(wt).Protective agent, wetting agent are anionic surfactant, nonionic surface active agent in developer solution.
Innovative point of the invention is: 1, solvent resistant resin contains outer pendant carboxy group and polyethers hydrophilic radical, and polymeric chain is hydrophobic
Group, the feature of the surfactant with polar group and non-polar group in structure, improves the surface tension of solution, increases
It is coated with adaptability；2, it is designed as polymer electrolyte solvent resistant resin, improves being blended for the resin and compositions other in heat-sensitive composition
Property, mitigate and generate phenomenon of phase separation, improves the overall mechanical properties of high polymer；3, the present invention is to provide a kind of use solvent resistant tree
Rouge photosensitive composition and its application in positive-printing heat-sensitive CTP plate material are used for thermosensitive CTP using solvent resistant resin photosensitive composition
Version has the advantages that good film-forming property, solvent resistant, pressrun are high.
Compared with the existing technology, outstanding feature of the invention is: in composition use solvent resistant resin, plate it is resistance to molten
Agent, pressrun, which obtained, to be significantly improved, and temperature-sensitive version solvent resistant ability and Nai Yin ability present in existing temperature-sensitive platemaking technology are solved
The disadvantage of difference, especially for having the good ink of resistance to UV in the printing of UV ink, plate has good film-forming property, resistance to molten
The high advantage of agent, pressrun.
Specific embodiment
Here is the specific example of invention, but the contents of the present invention do not limit so.In embodiment, styrene comes from
Yanshan Petrochemical；(methyl) acrylic acid is all from the beautiful sun of Mitsubishi；Methyl) polyalkylene glycol acrylate ester is all from British-
Sigma；Benzoyl peroxide, azodiisobutyronitrile come from the gloomy chemistry of good fortune；N,N-Dimethylformamide, N, N- dimethylacetamide
Amine is from connection carbon geochemistry；Tetrahydrofuran comes from Exxon Mobil (China)；Acetone, butanone come from one factory of Tianjin chemical reagent.
Solvent resistant resin, the resin are styrene, acrylic or methacrylic acid and polyalkylene glycol acrylate ester or methyl
The copolymer of polyalkylene glycol acrylate ester.
Styrene accounts for the 1%-30% of solvent resistant resin gross mass, and acrylic or methacrylic acid accounts for solvent resistant resin gross mass
1%-40%, polyalkylene glycol acrylate ester or methacrylic acid macrogol ester account for the 58%-98% of solvent resistant resin gross mass.
The degree of polymerization of the polyalkylene glycol acrylate ester or the polyethylene glycol in methacrylic acid macrogol ester is 9-
125。
A kind of photosensitive composition containing above-mentioned solvent resistant resin, including solvent resistant resin, alkali soluble resin, dissolution suppression
Preparation, development accelerant, infrared absorbing dye and background dye.
The solvent resistant resin accounts for the 5-30% of photosensitive composition gross mass, and alkali soluble resin accounts for photosensitive composition gross mass
50-91%, dissolution inhibitor accounts for the 1-20% of photosensitive composition gross mass, and development accelerant accounts for photosensitive composition gross mass
0.1-10%, infrared absorbing dye account for the 1-5% of photosensitive composition gross mass, and background dye accounts for the 1- of photosensitive composition gross mass
5%。
The solvent resistant resin accounts for the 10-15% of photosensitive composition gross mass, and alkali soluble resin accounts for photosensitive composition gross mass
60-85%, dissolution inhibitor accounts for the 1-20% of photosensitive composition gross mass, and development accelerant accounts for photosensitive composition gross mass
0.1-10%, infrared absorbing dye account for the 2.5-3.5% of photosensitive composition gross mass, and background dye accounts for photosensitive composition gross mass
2-3.5%。
The alkali soluble resin is phenolic resin or poly(4-hydroxystyrene) resin.
The dissolution inhibitor is quaternary ammonium salt nitrogenous compound, glyoxaline compound, quinoline salt compound, benzo thiophene
Azoles salt compound, aromatic carboxylic acid's ester, lactone ketone, two sulfone of aromatic hydrocarbons, poly-alkoxyl ether or polyethylene glycols.
The development accelerant is organic acid, acid anhydrides, phenols or sulfone class.
The infrared absorbing dye is flower cyanines system infrared absorbing dye.
The background dye is solvent blue, alkaline bright blue, Victoria pure blue, phthalocyanine blue, malachite green, blackish green, phthalocyanine
Green, crystal violet, crystal violet, ethyl violet, dimethyl yellow or fluorescein.
Such as weigh application of the above-mentioned photosensitive composition in positive-printing heat-sensitive CTP plate material.
Embodiment 1
The preparation of sensitive lithographic plate
(1) preparation of aluminum substrate:
With a thickness of the aluminium sheet of 0.28mm, 55 DEG C at a temperature of, ungrease treatment 40 is carried out in the sodium hydrate aqueous solution of 7wt%
Second, the formation electrolysis method of Grains uses sine wave alternating current in the aqueous hydrochloric acid solution that concentration is 10wt% at a temperature of 25 DEG C
Carry out electrolysis processing, 50HZ alternating current, electric current 50A/dm2, electrolysis time 60 seconds, Ra=0.3-0.6um is controlled, preferably in 0.4-
0.6μm.Then at a temperature of 60 DEG C, Slag treatment is removed in the sodium hydrate aqueous solution of 50wt% concentration 10 seconds, then in 25 DEG C of temperature
Spending lower current density is 5A/dm2, concentration is handles 40 seconds in the sulfuric acid solution of 20wt%, control oxidation film=2.5-3.5g/m2.Most
Afterwards, NaH is used at 60 DEG C2PO4- NaF solution carries out sealing pores 30 seconds, and the aluminum substrate suitable for sensitive lithographic plate can be obtained.
(2) photosensitive composition is configured to the thermosensitive CTP coating fluid that solid content is 10%, is coated in by stick coating method with above-mentioned
It is 2 minutes dry at 130 DEG C on the aluminum plate foundation of method preparation, then the version is placed in an oven, is cured 24 hours at 50 DEG C
To a temperature-sensitive sensitive lithographic plate, the film thickness of photosensitive layer is 1.5g/m2。
(3) optimum exposure laser quantity measuring method:
On SCREEN8600E laminator, with included test-strips, screening 175lpi is imaged, exports resolution 2400dpi, according to
Following exposure condition (see Table 1) and development conditions (see Table 2) carry out the scanning plate-making of different laser energy, then on example edition
Determining exposed laser amount, as its sensitivity using the following method.
50% plain net value under different exposure energies is surveyed with the density reflectometer IC-Plate2 of X-rite, until finding out step-wedge
Show value of the 50% plain net region within the scope of 49.5%-50.4% in item, the value are both the sensitivity of plate.
Record the sensitivity of plate.
(4) development latitude detects:
It in SCREEN8600E platemaking machine, is exposed according to 1.1 times of light exposure of sensitivity value obtained above, with included
Test-strips are scanned plate-making on sample, under the conditions of different developing time, (selecting 20s, 30s, 40s here), to sample
Version carries out development working process, and plate can be made to reach requirement, and (blank space is not kept on file, value < 0.29 density OD；Coating is on the spot
Do not subtract film, density loss≤4%；Site reductase 12-99%) the peak of developing time and the difference of minimum be the plate
Development latitude.
Photosensitive composition such as table 3:
I synthetic method of solvent resistant resin in table: styrene 30g, methacrylic acid 10.0g, methyl are added into 500ml flask bottle
Polyalkylene glycol acrylate ester (n=25) 60.0g, azodiisobutyronitrile 1.0g, acetone 240g, nitrogen protection open stirring 200r/
Min after being warming up to 70 DEG C, reaction 7 hours, is added 1.0g hydroquinone and terminates reaction, decompression removal solvent, then vacuum is dry
It is dry.Weight average molecular weight 15000.
Embodiment 2
The preparation method is the same as that of Example 1 for example edition
Photosensitive composition such as table 4:
II synthetic method of solvent resistant resin in table: it is poly- that styrene 5g, acrylic acid 10.0g, acrylic acid are added into 500ml flask bottle
Glycol ester (n=9) 85.0g, azodiisobutyronitrile 1.0g, tetrahydrofuran 250g, nitrogen protection open stirring 200r/min, heating
To 80 DEG C, after reaction 7 hours, 1g hydroquinone is added and terminates reaction, then decompression removal solvent is dried in vacuo.Weight-average molecular
Amount 48000.
Embodiment 3
The preparation method is the same as that of Example 1 for example edition
Photosensitive composition such as table 5:
Solvent resistant resin III synthetic method in table: styrene 1g, methacrylic acid 40.0g, methyl are added into 500ml flask bottle
Polyalkylene glycol acrylate ester (n=42) 59.0g, benzoyl peroxide 1.0g, n,N-Dimethylformamide 250g, nitrogen protection,
Stirring 200r/min is opened, after being warming up to 85 DEG C, reaction 7 hours, 1g hydroquinone is added and terminates and reacts, decompression removal solvent, so
After be dried in vacuo.Weight average molecular weight 100000.
Embodiment 4
The preparation method is the same as that of Example 1 for example edition
Photosensitive composition such as table 6:
IV synthetic method of solvent resistant resin in table: styrene 10g, acrylic acid 20.0g, methyl-prop are added into 500ml flask bottle
Olefin(e) acid macrogol ester (n=75) 70.0g, azodiisobutyronitrile 1.0g, butanone 280g, nitrogen protection open stirring 200r/min,
After being warming up to 80 DEG C, reaction 7 hours, 1g hydroquinone is added and terminates reaction, then decompression removal solvent is dried in vacuo.Weight is equal
Molecular weight 30000
Embodiment 5
The preparation method is the same as that of Example 1 for example edition
Photosensitive composition such as table 7:
V synthetic method of solvent resistant resin in table: styrene 20g, methacrylic acid 1.0g, methyl are added into 500ml flask bottle
Polyalkylene glycol acrylate ester (n=125) 79.0g, benzoyl peroxide 1.0g, n,N-dimethylacetamide 200g, nitrogen protection,
Stirring 200r/min is opened, after being warming up to 90 DEG C, reaction 8 hours, 1g hydroquinone is added and terminates and reacts, decompression removal solvent, so
After be dried in vacuo.Weight average molecular weight 72000.
Embodiment 6
The preparation method is the same as that of Example 1 for example edition
Photosensitive composition such as table 8:
VI synthetic method of solvent resistant resin in table: styrene 1g, acrylic acid 1.0g, metering system are added into 500ml flask bottle
Acid polyethylene glycol ester (n=100) 98.0g, azodiisobutyronitrile 1.0g, n,N-Dimethylformamide 250g, nitrogen protection are opened and are stirred
200r/min is mixed, after being warming up to 70 DEG C, reaction 7 hours, 1g hydroquinone is added and terminates reaction, depressurize removal solvent, then very
Sky is dry.Weight average molecular weight 60000.
Embodiment 7
The preparation method is the same as that of Example 1 for example edition.
Photosensitive composition such as table 9:
VII synthetic method of solvent resistant resin in table: styrene 30g, acrylic acid 12g, metering system are added into 500ml flask bottle
Acid polyethylene glycol ester (n=9) 58.0g, azodiisobutyronitrile 1.0g, n,N-Dimethylformamide 250g, nitrogen protection open stirring
200r/min is added 1g hydroquinone and terminates reaction after being warming up to 70 DEG C, reaction 7 hours, depressurizes removal solvent, then vacuum
It is dry.
Embodiment 8
The preparation method is the same as that of Example 1 for example edition.
Photosensitive composition such as table 10:
VIII synthetic method of solvent resistant resin in table: styrene 25g, acrylic acid 5g, methacrylic acid are added into 500ml flask bottle
Macrogol ester (n=40) 70.0g, azodiisobutyronitrile 1.0g, n,N-Dimethylformamide 250g, nitrogen protection open stirring
200r/min is added 1g hydroquinone and terminates reaction after being warming up to 70 DEG C, reaction 7 hours, depressurizes removal solvent, then vacuum
It is dry.
Embodiment 9
The preparation method is the same as that of Example 1 for example edition.
Photosensitive composition such as table 11:
Ⅸ synthetic method of solvent resistant resin in table: styrene 5g, acrylic acid 30g, methacrylic acid are added into 500ml flask bottle
Macrogol ester (n=60) 65.0g, azodiisobutyronitrile 1.0g, n,N-Dimethylformamide 250g, nitrogen protection open stirring
200r/min is added 1g hydroquinone and terminates reaction after being warming up to 70 DEG C, reaction 7 hours, depressurizes removal solvent, then vacuum
It is dry.
Embodiment 10
The preparation method is the same as that of Example 1 for example edition.
Photosensitive composition such as table 12:
Ⅹ synthetic method of solvent resistant resin in table: styrene 15g, acrylic acid 15g, metering system are added into 500ml flask bottle
Acid polyethylene glycol ester (n=80) 70.0g, azodiisobutyronitrile 1.0g, n,N-Dimethylformamide 250g, nitrogen protection are opened and are stirred
200r/min is mixed, after being warming up to 70 DEG C, reaction 7 hours, 1g hydroquinone is added and terminates reaction, depressurize removal solvent, then very
Sky is dry.
Embodiment 11
The preparation method is the same as that of Example 1 for example edition.
Photosensitive composition such as table 13:
Ⅺ synthetic method of solvent resistant resin in table: styrene 5g, acrylic acid 5g, methacrylic acid are added into 500ml flask bottle
Macrogol ester (n=100) 90.0g, azodiisobutyronitrile 1.0g, n,N-Dimethylformamide 250g, nitrogen protection open stirring
200r/min is added 1g hydroquinone and terminates reaction after being warming up to 70 DEG C, reaction 7 hours, depressurizes removal solvent, then vacuum
It is dry.
Embodiment 12
The preparation method is the same as that of Example 1 for example edition.
Photosensitive composition such as table 14:
Ⅻ synthetic method of solvent resistant resin in table: styrene 10g, acrylic acid 10g, metering system are added into 500ml flask bottle
Acid polyethylene glycol ester (n=125) 80.0g, azodiisobutyronitrile 1.0g, n,N-Dimethylformamide 250g, nitrogen protection are opened and are stirred
200r/min is mixed, after being warming up to 70 DEG C, reaction 7 hours, 1g hydroquinone is added and terminates reaction, depressurize removal solvent, then very
Sky is dry.
Comparative example 1-12
Equally, the alkali soluble resin in solvent resistant resin formula is replaced according to the method in the various embodiments described above, production sun
Figure temperature-sensitive sensitive lithographic plate.
Solvent resistance is investigated: above-mentioned plate sample is immersed in 30 in 23 DEG C of isopropyl alcohol and water (mass ratio 1:1) solution
Minute, it is rinsed with deionized water, measures plate coating loss.
Pressrun is investigated: machine on above-mentioned plate sample normally being printed (four color four of Beiren opens high speed rotary press), is examined
Examine its pressrun.
Plate performance is seen attached list shown in 15.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those skilled in the art,
Without depart from that overall concept of the invention, several changes and improvements can also be made, these also should be considered as of the invention
Protection scope.
Claims (12)
1. solvent resistant resin, it is characterised in that: the resin is styrene, acrylic or methacrylic acid and polyalkylene glycol acrylate
The copolymer of ester or methacrylic acid macrogol ester.
2. solvent resistant resin according to claim 1, it is characterised in that: styrene accounts for the 1%- of solvent resistant resin gross mass
30%, acrylic or methacrylic acid accounts for the 1%-40% of solvent resistant resin gross mass, polyalkylene glycol acrylate ester or methacrylic acid
Macrogol ester accounts for the 58%-98% of solvent resistant resin gross mass.
3. solvent resistant resin according to claim 1, it is characterised in that: the polyalkylene glycol acrylate ester or metering system
The degree of polymerization of polyethylene glycol in acid polyethylene glycol ester is 9-125.
4. a kind of photosensitive composition containing solvent resistant resin described in claim 1, it is characterised in that: including solvent resistant tree
Rouge, alkali soluble resin, dissolution inhibitor, development accelerant, infrared absorbing dye and background dye.
5. photosensitive composition according to claim 4, it is characterised in that: the solvent resistant resin accounts for the total matter of photosensitive composition
The 5-30% of amount, alkali soluble resin account for the 50-91% of photosensitive composition gross mass, and dissolution inhibitor accounts for photosensitive composition gross mass
1-20%, development accelerant account for the 0.1-10% of photosensitive composition gross mass, and infrared absorbing dye accounts for photosensitive composition gross mass
1-5%, background dye account for the 1-5% of photosensitive composition gross mass.
6. photosensitive composition according to claim 5, it is characterised in that: the solvent resistant resin accounts for the total matter of photosensitive composition
The 10-15% of amount, alkali soluble resin account for the 60-85% of photosensitive composition gross mass, and dissolution inhibitor accounts for photosensitive composition gross mass
1-20%, development accelerant accounts for the 0.1-10% of photosensitive composition gross mass, and infrared absorbing dye accounts for photosensitive composition gross mass
2.5-3.5%%, background dye accounts for the 2-3.5% of photosensitive composition gross mass.
7. photosensitive composition according to claim 4, it is characterised in that: the alkali soluble resin is phenolic resin or gathers
4-Vinyl phenol resin.
8. photosensitive composition according to claim 4, it is characterised in that: the dissolution inhibitor is quaternary ammonium salt nitrogen
Close object, glyoxaline compound, quinoline salt compound, benzothiazole salt compound, aromatic carboxylic acid's ester, lactone ketone, aromatic hydrocarbons two
Sulfone, poly-alkoxyl ether or polyethylene glycols.
9. photosensitive composition according to claim 4, it is characterised in that: the development accelerant is organic acid, acid anhydrides, phenol
Class or sulfone class.
10. photosensitive composition according to claim 4, it is characterised in that: the infrared absorbing dye is that flower cyanines system is infrared
Absorb dyestuff.
11. photosensitive composition according to claim 4, it is characterised in that: the background dye is solvent blue, alkalinity is gorgeous
Indigo plant, Victoria pure blue, phthalocyanine blue, malachite green, blackish green, phthalocyanine green, crystal violet, crystal violet, ethyl violet, dimethyl yellow or glimmering
Light is yellow.
12. application of the photosensitive composition as claimed in claim 4 in positive-printing heat-sensitive CTP plate material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711109098.4A CN109776737B (en) | 2017-11-11 | 2017-11-11 | Solvent-resistant resin, photosensitive composition containing resin and application of composition |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711109098.4A CN109776737B (en) | 2017-11-11 | 2017-11-11 | Solvent-resistant resin, photosensitive composition containing resin and application of composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109776737A true CN109776737A (en) | 2019-05-21 |
| CN109776737B CN109776737B (en) | 2023-01-06 |
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| CN201711109098.4A Active CN109776737B (en) | 2017-11-11 | 2017-11-11 | Solvent-resistant resin, photosensitive composition containing resin and application of composition |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11212263A (en) * | 1997-10-02 | 1999-08-06 | Dainippon Printing Co Ltd | Photosensitive resin composition |
| US6184268B1 (en) * | 1999-08-30 | 2001-02-06 | Xerox Corporation | Ink jet ink compositions and processes thereof |
| CN1445608A (en) * | 2002-03-20 | 2003-10-01 | 富士胶片株式会社 | Photosensitive composition of infrared sensitive |
| US20050003285A1 (en) * | 2001-04-04 | 2005-01-06 | Kouji Hayashi | Imageable element with solvent-resistant polymeric binder |
| US20070059638A1 (en) * | 2005-09-14 | 2007-03-15 | Osamu Namba | Photosensitive resin composition |
-
2017
- 2017-11-11 CN CN201711109098.4A patent/CN109776737B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11212263A (en) * | 1997-10-02 | 1999-08-06 | Dainippon Printing Co Ltd | Photosensitive resin composition |
| US6184268B1 (en) * | 1999-08-30 | 2001-02-06 | Xerox Corporation | Ink jet ink compositions and processes thereof |
| US20050003285A1 (en) * | 2001-04-04 | 2005-01-06 | Kouji Hayashi | Imageable element with solvent-resistant polymeric binder |
| CN1445608A (en) * | 2002-03-20 | 2003-10-01 | 富士胶片株式会社 | Photosensitive composition of infrared sensitive |
| US20070059638A1 (en) * | 2005-09-14 | 2007-03-15 | Osamu Namba | Photosensitive resin composition |
Non-Patent Citations (1)
| Title |
|---|
| 岳德茂等: "《实用感光材料及版材技术指南》", 31 March 2007, 印刷工业出版社 * |
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| CN109776737B (en) | 2023-01-06 |
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