CN101738856B - Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same - Google Patents
Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same Download PDFInfo
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- CN101738856B CN101738856B CN2008101781436A CN200810178143A CN101738856B CN 101738856 B CN101738856 B CN 101738856B CN 2008101781436 A CN2008101781436 A CN 2008101781436A CN 200810178143 A CN200810178143 A CN 200810178143A CN 101738856 B CN101738856 B CN 101738856B
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Abstract
The invention relates to a sensible heat composition for a thermosensitive CTP (Computer to Plate) plate. The thermosensitive composition comprises a perether compound of one or more low molecular phenolic compounds as a dissolution inhibitor or a solutizer, and the molecular weight of the low molecular phenolic compound is 100-400. Furthermore, the invention also relates to a method for preparing the positive thermosensitive CTP plate without preheating. The method comprises the following steps of: (1) sequentially carrying out rough treatment, anodic oxidation treatment and sealing treatment on an aluminum plate base; (2) carrying out plate coating on the aluminum plate base through the sealing treatment by using the thermosensitive CTP (Computer to Plate) plate; (3) carrying out two-section drying on the coated aluminum plate base obtained in the step (2), wherein the first section is dried by using a far infrared ray to heat, while the second section is dried by using forced hot blast, thereby obtaining the positive thermosensitive CTP plate without preheating. The plate produced in the invention has favorable appearance, higher sensitivity, favorable development latitude and higher print run and can be used in cooperation with photographic developers universally utilized at home and abroad.
Description
Technical field
The present invention relates to a kind of positive without preheating thermal CTP plate material and use the sensible heat composition.Particularly, the present invention relates to a kind of low molecule monobasic, binary or polyphenol compound of comprising and use vinyl C
1-C
6Alkyl ether or 2, the etherate that 3-dihydropyrane etherificate obtains is used the sensible heat composition as the positive without preheating thermal CTP plate material that hinders molten/chaotropic agent.In addition, the invention still further relates to a kind of method of using said positive without preheating thermal CTP plate material with sensible heat preparation of compositions positive without preheating thermal CTP plate material.
Background technology
PS version (Presensitized Offset Plates) is a pre-coating light sensitive plate, develops out for adapting to lithographic developing rapidly.Because PS version body has the resolving power height, dot reproduction is full, and levels are rich, ink-water balance are prone to grasp, and characteristics such as pressrun height have obtained popularizing rapidly in printing industry.At present, the PS version still is that current consumption is maximum, also is most important planographic printing plate material, and PS version manufacturing industry has become one of extremely important mainstay industry of current printing apparatus manufacturing industry.The version base material matter of positive-type PS version is generally aluminium sheet.
Positive without preheating thermal CTP plate material do not need by in the past by laser photo-typesetting, again through the Making Film of developing, photographic fixing was made; But the graph text information that will print from computing machine directly to version (computer toplate; Also claim CTP) novel plate technology, also claim digitizing direct plate-making technology.
Kodak had released the commercial preheating thermal CTP plate material that has in 1996, and positive without preheating thermal CTP plate material comes out and commercialization in Wu Yue, the 2000 De Luba exhibition, becomes the main flow in all kinds of CTP plates gradually.But this at that time commercial plate belongs to that dyestuff resistance is dissolved more or the resistance of associating such as dissolves at physical change stencilling material.Calendar year 2001 Beijing Normal University's photosensitive polymer research department resistance that normal temperature has an efficient acid-decomposed activity that begins one's study is dissolved/chaotropic agent; Should hinder molten/chaotropic agent cooperates with infrared absorbing dye and photo-thermal product acid source; Obtained the sensible heat composition that chemical amplification type positive without preheating thermal CTP plate material is used; And around this content application a series of Chinese patents (02117827.5,02160050.3,03143500.9; 01123686.8), unite the Chinese patent (ZL03143500.9) that application has also been authorized comprising the applicant and Beijing Normal University.Because having used normal temperature high acidolysis active type (normal temperature chemical amplification type) resistance in these patents dissolves/chaotropic agent; Scan through the 830nm infrared laser; IR dyes absorbing light and be transformed into heat makes by the scanning area instantaneous temperature can reach more than 300 ℃, causes producing in the plate acid source and decomposes and produce acid; The acid that is produced make at normal temperatures resistance dissolve/chaotropic agent decomposes rapidly, developing with alkaline developer is easy to obtain sensitivity height, good resolution, big, the good plate of blotting ink transfer property of development tolerance.But this high acidolysis active hinders the use of molten/chaotropic agent has also brought some disadvantages to plate.Because employed etherificate parent was a molecular weight at 2000～4000 linear phenol-aldehyde resin in the past; When the etherificate rate of hydroxyl in the resin greater than 50% the time; Though but it is not high to have the molten ability sensitivity of higher resistance; In case exposure is not enough, etherate can not thoroughly decompose, and it is dirty to be easy in the developing process keep on file; When the etherificate rate less than 20% the time, scarce capacity is dissolved in resistance, image is easy to subtract the film loss of gloss in the developing process.Because parent phenolics is thorough etherificate, residual the phenolic hydroxyl group of a great deal of in the molecule of this high acidolysis active etherate, the hydroxyl acidity of some phenolics is stronger, cause resistance dissolve/chaotropic agent self bin stability descends.In addition, the molecular weight of active etherate is bigger, also brings certain trouble to being coated with edition technology.
The technical background of in the past inventing based on used in the past technology and the inventor; The main purpose of the present invention is to solve the positive PS printing plate version base of crossing with common sealing of hole, under the condition that does not add undercoat or transition bed, be coated with make sensitivity height, good resolution, development tolerance greatly, be difficult for loss of gloss and subtract the dirty positive without preheating thermal CTP plate material of the film and the residual end.
Summary of the invention
In view of the problems referred to above that exist in the prior art; The inventor finds the active etherate of specific phenolic compound is included in positive without preheating thermal CTP plate material with in the sensible heat composition; Can solve above-mentioned technical matters of the prior art; The molecular weight that wherein is used to prepare the phenolic compound of said active etherate is 100-400, is preferably 150～300, and the etherificate rate is near 100%; So not only guarantee the high sensitivity of the plate that high acidolysis active brought but also guaranteed the bin stability of active etherate self; Also guaranteed to have bigger difference solubleness before and after the heat scan, thereby improved the development tolerance (do not subtract film when development time is longer, development time is not more kept on file) of plate.Said active etherate has high acidolysis active at normal temperatures, can be used as resistance in the sensible heat composition at positive without preheating thermal CTP plate material and dissolve/chaotropic agent.
According to a first aspect of the invention, provide a kind of thermal CTP plate material to use the sensible heat composition, based on the general assembly (TW) of this sensible heat composition, it comprises following component:
A) the full ether compound of one or more low molecular phenolics compounds of 7～25 weight % dissolves/chaotropic agent as resistance, and the molecular weight of this low molecular phenolics compound is 100～400;
B) 1～5 weight %'s has the infrared absorbing dye of absorption peak in 790～830nm optical wavelength range;
C) photo-thermal of 1～5 weight % produces acid source;
D) the conventional PS version of 1～5 weight % is used background dye; And
E) weight-average molecular weight of 60～90 weight % is 3000～10000 linear phenol-aldehyde resin.
According to a second aspect of the invention, a kind of method of using thermal CTP plate material of the present invention with sensible heat preparation of compositions positive without preheating thermal CTP plate material is provided, this method comprises the steps:
(1) aluminum substrate being carried out roughening treatment, anodized and sealing of hole successively handles;
(2) will use thermal CTP plate material of the present invention to be coated with version through the aluminum substrate that sealing of hole was handled with the sensible heat composition;
The aluminum substrate through applying that (3) will in step (2), obtain carries out the two-part drying, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air is dry, thereby obtains positive without preheating thermal CTP plate material.
Adopted effective hole-sealing technology in the basic processing procedure of version, made conventional positive PS printing plate handle to be coated with through sealing of hole and make desirable thermal CTP plate material with the version base.In the plate drying process, first section is adopted FAR INFRARED HEATING to carry out drying; Second section is adopted forced air dry, and the gas flow temperature of forced air dryer section is 105-115 ℃, for example about 110 ℃.First section FAR INFRARED HEATING drying can guarantee to apply the dry initial stage of plate and boil off solvent rapidly, does not produce " cloud and mist " phenomenon that heated-air drying is brought again, thereby guarantees that plate has good surface appearance; Second section forced air drying process has avoided the infrared absorbing dye in the plate to absorb the superheating phenomenon that infrared ray causes, and is unlikely to make the product acid source to decompose product acid and causes subtracting film loss of gloss even plate complete failure.Also avoided the crosslinked dirty phenomenon of keeping on file that causes of the overheated film-forming resin that causes.
Component A
Thermal CTP plate material of the present invention with the sensible heat composition in, the full ether compound that comprises low molecular phenolics compound is as component A, this component is used as resistance and dissolves/chaotropic agent in sensible heat composition of the present invention.Being used as resistance in the sensible heat composition at thermal CTP plate material of the present invention dissolves/and the component A of chaotropic agent can commercially obtain; Perhaps can be through the methods known in the art preparation; For example can be through disclosed method preparation in the one Chinese patent application 200810098637.3 that is entitled as " active etherate of phenolic compound and preparation thereof ", the document is introduced this paper as a reference in full.As the resistance of component A dissolve/chaotropic agent is the full ether compound with low molecular phenolics compound of high acidolysis active.The molecular weight of the phenolic compound that synthetic this etherate is used is 100～400, preferably 150～300.This phenolic compound can be monohydric phenol, dihydric phenol or polyphenol compound, preferred bisphenols and polyhydric phenols.So synthetic full ether compound has high acidolysis active.
Can select 4 for use in the bisphenol compound, 4 '-dihydroxy benaophenonel, 4,4 '-dioxydiphenyl methane (bis-phenol M), 4; 4 '-dihydroxy diphenyl sulphur (bisphenol S), 4,4 '-dihydroxy-diphenyl sulfone, bisphenol-A, 3,3 '-dichloro bis-phenol M, 3; 3 '-dimethyl bis-phenol M, 2,2 '-dimethyl bisphenol-A, tetrabromobisphenol A or tetrabromo-bisphenol s, the perhaps combination in any of these compounds; Preferred use 4,4 '-dihydroxy benaophenonel, bis-phenol M, bisphenol-A, bisphenol S, 4,4 '-dihydroxy-diphenyl sulfone, 3; 3 '-dichloro bis-phenol M or 3,3 '-dimethyl bis-phenol M, the perhaps combination in any of these compounds.
Polyhydric phenols can be selected triphenolyl methane for use, 1,1,1-triphen phenolic group ethane, 2,6-dihydroxymethyl paracresol respectively with phenol, metacresol, resorcinol or biphenyl 3 phenol condensation product with one to two mol ratio.As polyhydric phenols, the present invention preferably uses 2,6-dihydroxymethyl paracresol two resorcinols that contract.
As the monohydric phenol compounds, can use 2,4-xylenol, 3; 4-xylenol, p-tert-butylphenol, to chloro-tert.-butylphenol, to benzoyl phenol, 2,6-dimethyl p-tert-butylphenol, 2,4; 6-trichlorophenol, 2,4,6-tribromphenol, propylparaben, to acetyl phenol, 4-dihydroxy benaophenonel, p-phenoxyphenol or to thiophenyl phenol; Wherein 2; 4-xylenol, 3,4-xylenol, p-tert-butylphenol, to chloro-tert.-butylphenol, to benzoyl phenol, 2,6-dimethyl p-tert-butylphenol, propylparaben or be that the present invention preferentially recommends the monohydric phenol that uses to thiophenyl phenol.
As the component A of sensible heat composition of the present invention, it is the full ether compound of low molecular phenolics compound.This etherate obtains with the etherifying reagent etherificate through hanging down the molecular phenolics compound.For the purpose of the present invention, the etherifying reagent that is used to prepare said active etherate comprises vinyl C
1-C
6Alkyl ether and 2, the 3-dihydropyrane (
).Said vinyl C
1-C
6The instance of alkyl ether comprises EVE, vinyl propyl ether, vinyl isopropyl ether, vinyl n-butyl ether, vinyl isobutyl ether, vinyl sec-butyl ether, vinyl tertbutyl ether, vinyl amyl ether and vinyl hexyl ether.Preferred vinyl C
1-C
6Alkyl ether is vinyl C
1-C
4Alkyl ether, the example comprise EVE, vinyl propyl ether, vinyl isopropyl ether, vinyl n-butyl ether, vinyl isobutyl ether, vinyl sec-butyl ether and vinyl tertbutyl ether.Especially preferred vinyl C
1-C
4Alkyl ether is an etherifying reagent.In addition, etherifying reagent also can use dihydrofuran or vinyl benzyl ether etc. to have the compound of vinyl ether structure.Optimal ethylene benzyl ethyl ether and/or 2, the 3-dihydropyrane is as etherifying reagent.
As component A, preferred one or more etherates that are selected from down in the group that use:
Dihydroxymethyl paracresol the contract full ether compound of EVE of bifocal property gallic acid and the full ether compound of EVE of two poly bisphenols.
Be preferably selected from down especially the group in one or more:
The full ether compound of the EVE of bisphenol-A (V-32 derives from sky, Weihai and becomes chemical industry company limited), dihydroxymethyl paracresol contract two resorcinols the full ether compound of EVE (V-33 derives from sky, Weihai and becomes chemical industry company limited),
4, the full ether compound of the dihydropyrane of 4 '-dioxydiphenyl methane (V-34 derives from sky, Weihai and becomes chemical industry company limited),
The dihydroxymethyl paracresol contract bifocal property gallic acid the full ether compound of EVE (V-35 derives from sky, Weihai and becomes chemical industry company limited),
The full ether compound of the EVE of two poly bisphenols (V-36 derives from sky, Weihai and becomes chemical industry company limited) and
4, the full ether compound of the EVE of 4 '-dihydroxy benaophenonel (V-300 derives from sky, Weihai and becomes chemical industry company limited).
Most preferably the present invention uses V-32, V-33 and/or V-36 as component A.
As component A, it both can use single kind according to full ether compound of the present invention, also can use two or more different full ether compound, for example can use the combination of V-36 and V-32.
In the preferred embodiment of sensible heat composition of the present invention, the consumption of component A is generally 7～25 weight % based on the sensible heat composition total weight.This consumption does not then reach resistance and dissolves purpose if be lower than 7 weight % before the scanning, the short dissolubility in scanning back can be also very poor, and the development tolerance significantly diminishes; If this consumption is greater than 25 weight %, and the anti-dry grinding property of rete is poor, the sensitivity step-down, in case under-exposed, it is dirty to be easy to the residual end.More preferably, based on the sensible heat composition total weight, the consumption of component A is at least 8,9,10,11,12,13,14 or 15 weight %, and this consumption is at most 24,23,22,21 or 20 weight %, and the consumption of component A is preferably 10～20 weight %.
B component
Thermal CTP plate material of the present invention with the sensible heat composition in, be included in infrared absorbing dye that 790～830nm optical wavelength range has absorption peak as B component.This infrared absorbing dye can be selected for use both at home and abroad, and commercially available colored cyanines are infrared absorbing dye.The absorption peak wavelength of this infrared absorbing dye is 800～830nm, and the absorption peak of in alcohol solvent, measuring usually is 815～820nm, and the absorption peak in the sensible heat composition should be about 830nm.808nm optical wavelength newly developed is the heat-sensitive plate-making machine of main output on the market in order to adapt to, and advantageously uses the infrared absorbing dye that the certain absorption optical density is all arranged in 790～830nm optical wavelength range.The infrared absorbing dye that is fit to sensible heat composition of the present invention has NK-2014, NK-2268, the HCD-21 of Lin Yuan company, the PS-101 of Japanese chemical drug, PS-102, and the S0094 of FEW CHEMICALS company etc.
The consumption of infrared absorbing dye accounts for 1～5 weight % of sensible heat composition total weight usually, is preferably 2～4 weight %.When this consumption was less than 1 weight %, plate was low by the sweep test heating temp, was not enough to decompose produce acid source, thereby reduced the sensitivity of plate significantly; Consumption the bin stability of the master that coats is descended, and it was dirty to be easy to the residual end in the developing process greater than 5% o'clock.
Component C
Thermal CTP plate material of the present invention with the sensible heat composition in, comprise photo-thermal and produce acid source as component C.In context of the present invention, " photo-thermal product acid source " is meant and under the effect of infrared light and/or heat, is easy to decompose the material that produces acid or proton.Available product acid source has following several types:
1. triazines is produced acid source, and as 1,3,5-three (trichloromethyl) triazine, 1-methyl-3, two (trichloromethyl) triazines of 5-, 1-phenyl-3, two (trichloromethyl) triazines of 5-, 1-be to methoxy styryl-3, two (trichloromethyl) triazines of 5-etc.Selected triazines photo-thermal produces acid source and does not preferably have absorption in the wavelength coverage of being longer than 350nm, so that safe operation under indoor daylight.
2. sulfonic acid esters produces acid source, for example applicant's carboxylate of carboxylate, polyphenol compound and the paratoluensulfonyl chloride of carboxylate (for example phthalimide p-toluenesulfonic esters), N-hydroxyl phthalimide and the naphthalene sulfonyl chloride of disclosed N-hydroxyl phthalimide and paratoluensulfonyl chloride etc. among state's patent CN1603956 therein.The heat decomposition temperature that sulfonic acid esters produces acid source should be 150-250 ℃ usually.When decomposition temperature is higher than 250 ℃, be difficult to decompose product acid in the heat scan process; When decomposition temperature is lower than 150 ℃, produce acid when being coated with edition in the drying process easily, cause plate rotten.
3. salt produces acid source, for example triphenyl sulfosalt or replace triphenyl sulfosalt, diphenyl iodnium or substituted diphenylamine base salt compounded of iodine, alicyclic sulfosalt etc.Its compatibility ion can be tetrafluoroborate, hexafluoro-phosphate radical, TFMS root, perchlorate, p-toluenesulfonic acid root etc.The heat decomposition temperature that salt produces acid source also should be 150～250 ℃ usually, and near ultraviolet and visible light are not absorbed.
In sensible heat composition of the present invention, account for 1～5 weight % of sensible heat complex general assembly (TW), preferred 1.5～4 weight % as the product acid source of component C.Consumption produces acid source and is easy to from glue, separate out during greater than weight 5%, and can cause the bin stability of plate to descend, and to dissolve ability stronger because some produces acid source resistance, and it is dirty also to be easy in the developing process keep on file; Consumption produces subacidity during less than weight 1%, and the sensitivity of plate is descended.
Component D
Thermal CTP plate material of the present invention with the sensible heat composition in, comprise conventional PS version with background dye as component D.It is blue dyestuff that this background dye or illuminating colour can be selected triphenylmethane for use; Like commercially available alkaline bright blue, Victoria's ethereal blue, solvent blue etc.; Also green dye can be selected for use,, cudbear can also be selected for use like malachite green etc.; Like crystal violet, methyl violet etc., also select for use some yellow dyes such as dimethyl yellow, curcumin, sudan black to make auxiliary dyestuff under some situation.Conventional PS version as component D both can be a single kind of dyestuff with background dye, also can be two kinds or more kinds of different dyes.Account for 1～5 weight % of sensible heat composition total weight as the conventional PS version of component D with the consumption of background dye, be preferably 1～2 weight %.
Component E
Thermal CTP plate material of the present invention with the sensible heat composition in, comprise weight-average molecular weight and be 3000～10000 linear phenol-aldehyde resin as component E.This linear phenol-aldehyde resin is the maximum component of content in the sensible heat composition as film-forming resin.The selection principle of component E should make that the compatibility of it and A, B, C and four components of D is good, particularly dissolves with the resistance as component A/chaotropic agent has good compatibility, and does not contain and cause hindering the impurity that molten/chaotropic agent decomposes.Weight-average molecular weight as the linear phenol-aldehyde resin of component E is generally 3000～10000, is preferably 5000～8000.This molecular weight is greater than 10000, and the sensitivity of sensible heat complex is lower, and developing powder is slow, and it is dirty to be easy to keep on file; This molecular weight was less than 3000 o'clock, and resistance is dissolved a little less than the ability, is easy to subtract the film loss of gloss in the developing process.They can use separately, also can compoundly use.The principle of compound use is that will to make the weight average of the weight-average molecular weight of these resins be 5000～8000, both has been not easy to subtract the film loss of gloss like this in the developing process, and it is dirty to be not easy the residual end again.Be applicable to that line style phenolic aldehyde film-forming resin of the present invention for example is that (metacresol-paracresol-formaldehyde resin, the mol ratio of metacresol and paracresol are 6: 4 to sky, Weihai BTB-25 that becomes chemical industry company limited and produced, weight-average molecular weight 5000-6000; Mw/Mn is 4-6), BTB-27 (Mw/Mn is 3-4 for paracresol-phenol-formaldehyde resin, weight-average molecular weight about 4000), BTB-29 (metacresol-paracresol-formaldehyde resin; Metacresol and paracresol mol ratio are 7:3; About weight-average molecular weight 9000, Mw/Mn is 9-10), BTB-29 (L) (metacresol-paracresol-formaldehyde resin; Metacresol and paracresol mol ratio are 7:3; Weight-average molecular weight 5000-6000, Mw/Mn are 5-6) and BTB-211 (paracresol-phenol-metacresol-formaldehyde resin, paracresol, phenol and metacresol mol ratio are 6: 3: 1; Weight-average molecular weight 3000-4000, Mw/Mn are 3-3.5).
Usually account for 60～90 weight % of sensible heat composition solid general assembly (TW) as the consumption of the line style phenolic aldehyde film-forming resin of component E, be preferably 70～80 weight %.The polydispersity index Mw/Mn of line style phenolic aldehyde film-forming resin generally should be 3～8.The resin permission polydispersity index that molecular weight is bigger can be big slightly, but also should not surpass 10.In addition, when use than the resistance of small-molecular weight dissolve/during chaotropic agent, the molecular weight of line style phenolic aldehyde film-forming resin should be selected higher; When the resistance of using larger molecular weight dissolve/during chaotropic agent, the molecular weight of line style phenolic aldehyde film-forming resin can be selected smaller.The purpose of so selecting is that sensitivity, resolving power and the pressrun that makes the sensible heat complex is able to take into account.
The line style phenolic aldehyde film-forming resin that the present invention uses dissolves with the resistance as component A/and the part by weight of chaotropic agent also can be called B/P, and it is more much bigger than the B/P of traditional PS version, is generally 3.5～10, be preferably 3.5-8.5, and the B/P of traditional PS version is 1.5～3.B/P is too big, and for example greater than 10, scarce capacity is dissolved in resistance before the heat scan, behind the heat scan short dissolubility can be a little less than, be unfavorable for improving the development tolerance of plate; B/P is too little, and as less than 3.5, the sensitivity of plate obviously descends.
In another embodiment of the invention, the present invention provides a kind of method of using thermal CTP plate material of the present invention with sensible heat preparation of compositions positive without preheating thermal CTP plate material, and this method comprises the steps:
(1) aluminum substrate being carried out roughening treatment, anodized and sealing of hole successively handles;
(2) will use thermal CTP plate material of the present invention to be coated with version through the aluminum substrate that sealing of hole was handled with the sensible heat composition;
The aluminum substrate through applying that (3) will in step (2), obtain carries out the two-part drying, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air is dry, thereby obtains positive without preheating thermal CTP plate material.
In method for platemaking of the present invention, the version base of the positive without preheating thermal CTP plate material of employing is an aluminum substrate.Before coating thermal CTP plate material of the present invention was with the sensible heat composition, this aluminum substrate need carry out roughening treatment, anodized and sealing of hole to be handled.
For the roughening treatment in the step (1), the purpose of this processing is to enlarge the specific surface of version base, improves absorption affinity.Roughening treatment both can be mechanical roughening treatment, also can be that electrolyzing and coarsening is handled, and perhaps comprised this two kinds of roughening treatments, under one situation of back, preferably carried out mechanical roughening treatment earlier, after carry out electrolyzing and coarsening and handle.For electrolyzing and coarsening, its method commonly used is the alternating current roughening method,, two aluminium plates is put into the electrolytic solution of hydrochloric acid or nitric acid that is, connects AC power, makes the aluminium plate surface form the depth and fineness is moderate, the Grains that is evenly distributed.For the anodized in the step (1), the purpose of this processing is to make the aluminium plate surface to form the fine and closely woven aluminum oxide film of one deck.Anodized for example can be carried out anodic oxidation and carry out through aluminium plate being made anode and stereotype is put into sulfuric acid solution as negative electrode.Aluminium plate surface through anodized is the oxide film of one deck porous, because the too much too small space of a whole page that makes of pore very easily pollutes, brings difficulty for plate-making and printing, thereby in method for platemaking of the present invention, must carry out sealing of hole and handle.
Depend on the circumstances being coated with the processing that need carry out before the version except above-mentioned, aluminum substrate also comprises other conventional processing.For example when the space of a whole page of aluminum substrate has grease; Need carry out ungrease treatment earlier to the version base; This is for example through using aqueous slkali; For example sodium hydrate aqueous solution soaks and realizes, also can realize through soaking with acid solution such as diluted nitric acid aqueous solution, preferably earlier with soaking with acid solution after the aqueous slkali soaking.In addition, also be included in and carried out flushing, neutralization and the optional dried of each item after handling.
For example, before aluminum substrate coating sensible heat composition, typically can aluminum substrate be handled successively as follows:
(1) makes the aluminum substrate degreasing with dilute NaOH solution, for example under 60～70 ℃, soaked 30 seconds with NaOH;
(2) water flushing;
(3) use rare HNO
3Solution (3% HNO for example
3Solution) soak the space of a whole page;
(4) water flushing;
(5) roughening treatment;
(6) water flushing;
(7) neutralize with alkali lye;
(8) water flushing;
(9) anodized;
(10) water flushing;
(11) sealing of hole is handled; And
(12) with in the phosphoric acid,diluted with remaining alkali, clean oven dry again.
In the preferred embodiment of method for platemaking of the present invention, aluminum substrate obtains R after roughening treatment and anodic oxidation
aValue is 0.4～0.6 μ m, R
h(R
z) value is that the amount of 2～3 μ m and oxide film is 2.5～3.0g/m
2Processing version base.
Handle for the aluminum substrate that obtains after the anodized is carried out sealing of hole, can the version base of this processing be delivered in the sealing of hole groove that pore-sealing liquid is housed and carry out sealing of hole.Usually, the temperature of sealing of hole groove remains under 50～80 ℃ usually, and the sealing of hole time looks the speed of a motor vehicle when being coated with and decides, and may be selected to be 20～40 seconds.For the present invention, being used for the pore-sealing liquid of sealing of hole can be based on following hole sealing agent: potassium dihydrogen phosphate-potassium fluoride, potassium dihydrogen phosphate-tartrate list sodium salt-potassium fluoride, potassium dihydrogen phosphate-sodium silicate-potassium fluoride, sodium dihydrogen phosphate-sodium fluoride, sodium metaaluminate-sodium fluoride, sodium dihydrogen phosphate-β-I is peaceful, sodium silicate-sodium fluoride, sodium metaaluminate, sodium potassium tartrate tetrahydrate-tartrate and/or sodium silicate-tartrate etc.The present invention more preferably selects for use potassium dihydrogen phosphate-potassium fluoride or sodium dihydrogen phosphate-sodium fluoride as hole sealing agent.Pore-sealing liquid is generally through preparing aforementioned sealing of hole system can obtain with deionized water and/or distilled water.Based on the general assembly (TW) of whole pore-sealing liquid, the hole sealing agent concentration of the pore-sealing liquid of being prepared is generally 5～15 weight %, preferred 8～10 weight %.
Hole-sealing technology of the present invention is the process procedure an of necessity for method for platemaking of the present invention, removes this hole-sealing technology unlike conventional positive PS printing plate that kind, otherwise that the plate that is coated with is easy to the residual end is dirty.More external thermal CTP plate material manufacturers except that adopting hole-sealing technology, add undercoat or transition bed toward contact, and the present invention only need sealing of hole to get final product for addressing this problem.
After the aluminum substrate sealing of hole is handled, if necessary after the remaining alkalescence that neutralized, with being coated with version with sensible heat composition of the present invention after the aluminum substrate clean dry.For this reason, for example can send it to be controlled in the airtight extrusion coated device of coating weight by volume pump and spraying nozzle slit and be coated with version, control solid rete coating weight (in solid content) is at 1.6～2.0g/m
2Between.
In order to be coated with version, sensible heat composition of the present invention need use solvent to be mixed with the form of coating fluid usually.Preferably, sensible heat composition of the present invention is mixed with the coating fluid that solid content is generally 10～15 weight % and is coated with version.Certainly, according to specifically being coated with edition technology, the coating fluid that also can sensible heat composition of the present invention be mixed with other concentration is to be coated with version.Solvent for use is the used solvent of conventional positive PS printing plate, and like ethylene glycol monoethyl ether, propylene glycol monomethyl ether, cyclohexanone, γ-Ding lactones, butanone and/or dioxane etc., these solvents can use separately, also can compoundly use.What preferably can use separately is ethylene glycol monoethyl ether, propylene glycol monomethyl ether or cyclohexanone.Butanone, dioxane and γ-Ding lactones uses as secondary solvent usually, its objective is the viscosity that reduces coating fluid, is convenient to after the coating levelling as early as possible.The weight ratio of the consumption of secondary solvent and main body solvent load is generally 1/3～1/10, is preferably 1/4～1/6.Because the boiling point of secondary solvent is lower, when use amount was too big, velocity of evaporation was too fast, and the spraying nozzle place is easy to skinning, causes appearance of coat bad.Secondary solvent is very little the time, and diluting effect reduces, and does not fit into the needs of quick coating.If but the speed of a motor vehicle of coating machine is lower than 10m/min, and control coating fluid solid content is 10～15%, then also can be coated with smoothly with single solvent.Look coating method, the coating speed of a motor vehicle and deciding of coating machine, coating fluid generally will pass through three-stage filtration: 10～20 μ m filter membranes are the first order, and 3～5 μ m filter membranes are the second level, and 0.5～1 μ m filter membrane is the third level.
To in step (2), behind levelling section levelling, carry out drying through the aluminum substrate that applies.This drying is carried out with the two-part drying according to the present invention, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air is dry, thereby obtains positive without preheating thermal CTP plate material.Preferably, this two-part drying is carried out in the dry road of two-part, and first section of this drying road is adopted the FAR INFRARED HEATING heating, and second section is adopted forced air to carry out drying; Usually, first section dry dry road length of FAR INFRARED HEATING is generally about 10 meters.This FAR INFRARED HEATING far-infrared heating tube capable of using produces.The far infrared illumination of first section far infrared drying is the same with conventional PS version production line, and far infrared drying efficient is higher, is difficult for producing " cloud and mist " phenomenon that the forced air drying is brought.Although the one section hot air flow in back is bigger, because through first section far infrared drying, most solvents boil off, good apparently form can not caused " cloud and mist " phenomenon or other apparent bad phenomenon yet.And; The solvent of space of a whole page coating is reduced to after two sections dryings below the 5 weight %; Even 3 below the weight %, problem such as can not produce also that the overheated heat sensing layer that causes of the space of a whole page decomposes or crosslinked, thus guaranteed not only to be not easy to subtract the film loss of gloss but also to be not easy to keep on file in the developing process.This two-part drying process provides very favorable condition for being coated with out good thermal CTP plate material with common PS version sealing of hole version base.The length ratio of far infrared drying section and forced air dryer section is 2: 1～1: 1.When the far infrared drying section is dry, should make space of a whole page temperature be no more than 120 ℃, the gas flow temperature of forced air dryer section should be 105-115 ℃, preferably about 110 ℃.
After the coated board backbone was dry, the cooling back cut according to plate given size specification, cuts scale error and preferably is controlled in the 0.3mm, obtains positive without preheating thermal CTP plate material.
Embodiment
The following embodiment that introduces not is the whole of embodiment, but the representative embodiment of a part.
Embodiment 1～6
1～6 used edition base of embodiment is to utilize the positive PS printing plate production line, and the aluminium plate of 0.3mm is resulting via mechanical alligatoring → electrolyzing and coarsening → anodic oxidation → sealing of hole processing → washing and drying, its R
aValue is 0.58 μ m, R
h(R
z) value is 2.8 μ m, the amount of oxide film is 3.0g/m
2Used pore-sealing liquid is dissolved in 1 cubic metre of deionized water with 100 kilograms of potassium dihydrogen phosphates and 1.4 kilograms of potassium fluorides and makes.The sealing of hole slot length is 3 meters, and the pore-sealing liquid temperature is 60 ℃.The version base of handling well is directly delivered to extrusion coated section coating, and dispense tip adopts closed extrusion coated head.Through the flow of control volume pump and the gap width of dispense tip nozzle, make coating weight (in solid content) be controlled at 1.6～1.8g/m
2It is dry behind levelling section levelling, to get into dry road, and dry road total length is 20 meters, and preceding 10 meters are adopted the heating of far infrared drying pipe, and this type of heating makes space of a whole page temperature be no more than 120 ℃, and back 10 meters are adopted about 110 ℃ forced air dry.The solvent of sensible heat coating finally is controlled at below 5% after two sections dryings.The prescription of the sensible heat composition that embodiment 1～6 uses is listed in the table 1, and the corresponding without preheating positive-printing heat-sensitive CTP plate material that uses these sensible heat compositions to obtain is respectively WLTP-1, WLTP-2, WLTP-3, WLTP-4, WLTP-5 and WLTP-6.
Embodiment 7
Change 50% potassium dihydrogen phosphate in embodiment 1～5 pore-sealing liquid tartrate list sodium salt of identical weight into, and 50% potassium dihydrogen phosphate and whole potassium fluorides keep; The sensible heat composition is formed and version, drying process are handled, are coated with to the version base with embodiment 1.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-7.
Embodiment 8
The sodium silicate of 50% potassium dihydrogen phosphate in embodiment 1～5 pore-sealing liquid with equivalent replaced, and 50% potassium dihydrogen phosphate and whole potassium fluorides keep; The sensible heat composition is formed and version, drying process are handled, are coated with to the version base with embodiment 2.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-8.
Embodiment 9
Potassium dihydrogen phosphate in embodiment 1～5 pore-sealing liquid and potassium fluoride are replaced with the sodium dihydrogen phosphate and the sodium fluoride of identical weight respectively; The sensible heat composition is formed and version, drying process are handled, are coated with to the version base with embodiment 3.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-9.
Embodiment 10
The sodium metaaluminate of sodium dihydrogen phosphate among the embodiment 9 with equivalent replaced, and sodium fluoride is constant; The sensible heat composition is formed and version, drying process are handled, are coated with to the version base with embodiment 4.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-10.
Embodiment 11
With the sodium fluoride among the embodiment 9 with equivalent β-I rather replaces, and sodium dihydrogen phosphate is constant; The sensible heat composition is formed and version, drying process are handled, are coated with to the version base with embodiment 5.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-11.
Comparative Examples 1
With the mode identical with embodiment 1; Preparation without preheating positive-printing heat-sensitive CTP plate material WLTP-CP1, difference is that the sensible heat composition that adopts is different from the sensible heat complex that adopts among the embodiment 1, the composition of this sensible heat composition is illustrated in the table 1; Wherein as active etherate; What adopt is that (the used etherificate parent of active etherate V-26 is the BTB-26 resin to V-26, and etherifying reagent is an EVE, etherificate rate about 40%; Said BTB-26 resin is the film forming linear phenol-aldehyde resin that Weihai Economic and Technological Development Zone Tiancheng Chemical Co., Ltd. produces; Be phenol, paracresol, metacresol terpolymer resin, weight-average molecular weight about 3400, number-average molecular weight 1100; Repetitive is about 10, molecular weight distributing index 3.1).
Comparative Examples 2
With the PS version version base disposal route among the embodiment 1; But only handle till the anodic oxidation; Do not carry out sealing of hole and handle, obtain handling the version base, the sensible heat composition among the embodiment 2 is applied on the above-mentioned processing version base; Be coated with version and drying process fully with embodiment 1, obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-CP2.
Comparative Examples 3
With PS version version base disposal route and the sealing of hole disposal route among the embodiment 1; Obtain the version base; Sensible heat composition among the embodiment 2 is applied on the above-mentioned version base, behind levelling, directly enters into the dry road of forced air and carry out drying, obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-CP3.
Comparative Examples 4
With PS version version base disposal route and the sealing of hole disposal route among the embodiment 1; Obtain the version base; Sensible heat composition among the embodiment 2 is applied on the above-mentioned version base, and whole process using traditional PS version is carried out drying with the far infrared drying mode behind levelling, obtains without preheating positive-printing heat-sensitive CTP plate material WLTP-CP4.
Embodiment 1～11 and Comparative Examples 1～4 coat without preheating positive-printing heat-sensitive CTP plate material WLTP-1～11 that obtain and WLTP-CP1～4 be coated with version, imaging performance is listed in the table 2.
The preparation of the full ether compound of EVE (V-36) of 12: two poly bisphenols of embodiment is got sky, Weihai, Shandong and is become chemical industry that BTB-36 resin (bisphenol-A and formaldehyde are with the condensed polymer of the 2:1 mol ratio) 23.4g (0.05mol) of limited production is arranged; Be dissolved in 30.0g1, in the double solvents of 4-dioxane and 90.0g methylene chloride.Add the anhydrous p-toluenesulfonic acid of 0.015g, after the stirring and dissolving, under 20 ℃, in 30 minutes, drip EVE 20.16g (0.28mol), stir after 2 hours standing and reacting at room temperature.Per 2 hours sampling and measuring infrared spectrums are to 3300～3400cm
-1Place's phenolic hydroxyl group absorption peak absorbing light density (calculating with base-line method) reduces to original 1/10th when following; In 10 minutes, add Powdered natrium carbonicum calcinatum 1.5g gradually; Stirred 2 hours, left standstill then 8 hours, remove lixiviating neutralizing agent and paratoluenesulfonic acid sodium salt solid with the suction funnel suction filtration.Filtrating changes in the cucurbit, and 60～70 ℃ of control bath temperatures boil off unreacted etherifying reagent and low boiling point solvent methylene chloride and the overwhelming majority 1, the 4-dioxane under higher vacuum.Obtain the full ether compound of two poly bisphenols-EVE, it is yellow thick liquid, and purity is 93%.
The invention effect
From table 2 be coated with version, imaging performance can find out clearly that it is apparent that the present invention is easy to obtain good plate, and sensitivity is higher, the development tolerance is good, pressrun is higher, can be used with the developer solution that generally uses both at home and abroad.The patent (Comparative Examples 1 is a wherein typical example) that in the past proposed compared with the present invention first inventor; Outstanding advantage be the coating apparent be improved significantly; Sensitivity is able to obvious raising, and the development tolerance can compare favourably with the plate of domestic and international well-known producer, is the invention that a utmost point has application prospect.
2. the present invention is with sensible heat composition of the present invention; As long as the version base is handled through sealing of hole; Can obtain available positive without preheating thermal CTP plate material; Need not used bilayer coating or the multi-layer coated technology of some manufacturers both at home and abroad, but be difficult to obtain plate with practical value without the version base of sealing of hole.
3. single use the forced air drying process, the dried space of a whole page is easy to generate the cloud decorative pattern, but is not too big to other performance impact of plate.
4. single plate that goes out with far infrared drying road drying though the space of a whole page is smooth smooth, is easy to take place overheated, the roasting phenomenon of sticking with paste, and particularly is lower than at 3% o'clock at the control solvent, and this phenomenon takes place more easily.So the prescription of two-part drying process of the present invention and pore-sealing liquid and hole-sealing technology also are important component parts of the present invention.
Claims (28)
1. a thermal CTP plate material is used the sensible heat composition, and based on the general assembly (TW) of this sensible heat composition, it comprises following component:
A) the full ether compound of one or more low molecular phenolics compounds of 7～25 weight % dissolves/chaotropic agent as resistance, and the molecular weight of this low molecular phenolics compound is 100～400;
B) 1～5 weight %'s has the infrared absorbing dye of absorption peak in 790～830nm optical wavelength range;
C) photo-thermal of 1～5 weight % produces acid source;
D) the conventional PS version of 1～5 weight % is used background dye; And
E) weight-average molecular weight of 60～90 weight % is 3000～10000 linear phenol-aldehyde resin,
Wherein component A be selected from down the group in one or more:
Dihydroxymethyl paracresol the contract full ether compound of EVE of bifocal property gallic acid and the full ether compound of EVE of two poly bisphenols.
2. according to the sensible heat composition of claim 1, wherein based on the general assembly (TW) of this sensible heat composition, it comprises following component:
A) the full ether compound of one or more low molecular phenolics compounds of 10～20 weight % dissolves/chaotropic agent as resistance, and the molecular weight of this low molecular phenolics compound is 100～400:
B) 2～4 weight %'s has the infrared absorbing dye of absorption peak in 790～830nm optical wavelength range;
C) photo-thermal of 1.5～4 weight % produces acid source;
D) the conventional PS version of 1～2 weight % is used background dye; And
E) weight-average molecular weight of 70～80 weight % is 3000～10000 linear phenol-aldehyde resin.
3. according to the sensible heat composition of claim 1; Wherein component A is selected from down in the group one or more: the contract full ether compound of EVE, 4 of two resorcinols of the full ether compound of the EVE of bisphenol-A, dihydroxymethyl paracresol; The full ether compound of the dihydropyrane of 4 '-dioxydiphenyl methane, dihydroxymethyl paracresol the contract full ether compound of EVE of bifocal property gallic acid, the full ether compound of EVE and 4 of two poly bisphenols, the full ether compound of the EVE of 4 '-dihydroxy benaophenonel.
4. according to the sensible heat composition of claim 3, wherein component A is the contract full ether compound of EVE of two resorcinols and/or the full ether compound of EVE of two poly bisphenols of the full ether compound of EVE, the dihydroxymethyl paracresol of bisphenol-A.
5. according to the sensible heat composition of claim 1, wherein the molecular weight of low molecular phenolics compound is 150～300.
6. according to the sensible heat composition of claim 2, the weight-average molecular weight of wherein said linear phenol-aldehyde resin is 5000～8000.
7. according to the sensible heat composition of claim 1, wherein component E is one or more linear phenolic resins that are selected from down in the group: metacresol-paracresol-formaldehyde resin, paracresol-phenol-formaldehyde resin, orthoresol-phenol-formaldehyde resin, orthoresol-paracresol-phenol-formaldehyde resin and metacresol-paracresol-phenol-formaldehyde resin.
8. according to the sensible heat composition of claim 2, wherein component E is one or more linear phenolic resins that are selected from down in the group: metacresol-paracresol-formaldehyde resin, paracresol-phenol-formaldehyde resin, orthoresol-phenol-formaldehyde resin, orthoresol-paracresol-phenol-formaldehyde resin and metacresol-paracresol-phenol-formaldehyde resin.
9. according to the sensible heat composition of claim 5, wherein component E is one or more linear phenolic resins that are selected from down in the group: metacresol-paracresol-formaldehyde resin, paracresol-phenol-formaldehyde resin, orthoresol-phenol-formaldehyde resin, orthoresol-paracresol-phenol-formaldehyde resin and metacresol-paracresol-phenol-formaldehyde resin.
10. according to the sensible heat composition of claim 6, wherein component E is one or more linear phenolic resins that are selected from down in the group: metacresol-paracresol-formaldehyde resin, paracresol-phenol-formaldehyde resin, orthoresol-phenol-formaldehyde resin, orthoresol-paracresol-phenol-formaldehyde resin and metacresol-paracresol-phenol-formaldehyde resin.
11. according to the sensible heat composition of claim 1, wherein the infrared absorbing dye that has an absorption peak in 790～830nm optical wavelength range as B component is an infrared absorbing dye for the flower cyanines.
12. according to the sensible heat composition of claim 2, wherein the infrared absorbing dye that has an absorption peak in 790～830nm optical wavelength range as B component is an infrared absorbing dye for the flower cyanines.
13. according to the sensible heat composition of claim 5, wherein the infrared absorbing dye that has an absorption peak in 790～830nm optical wavelength range as B component is an infrared absorbing dye for the flower cyanines.
14. according to the sensible heat composition of claim 6, wherein the infrared absorbing dye that has an absorption peak in 790～830nm optical wavelength range as B component is an infrared absorbing dye for the flower cyanines.
15. according to the sensible heat composition of claim 7, wherein the infrared absorbing dye that has an absorption peak in 790～830nm optical wavelength range as B component is an infrared absorbing dye for the flower cyanines.
16. according to each sensible heat composition among the claim 1-15; Wherein producing acid source as the photo-thermal of component C be the product acid source that does not have absorption near ultraviolet and short-wavelength visible light scope; It is selected from down the group in one or more: 1; 3; 5-three (trichloromethyl) triazine, 1-methyl-3; Two (trichloromethyl) triazines of 5-, 1-phenyl-3; Two (trichloromethyl) triazines of 5-, 1-be to methoxy styryl-3, carboxylate, triphenyl sulphur
salt, diphenyl iodine
salt and alicyclic sulphur
salt of carboxylate, polyphenol compound and the paratoluensulfonyl chloride of carboxylate, N-hydroxyl phthalimide and the naphthalene sulfonyl chloride of two (trichloromethyl) triazines of 5-, N-hydroxyl phthalimide and paratoluensulfonyl chloride.
17. according to the sensible heat composition of claim 16, wherein the carboxylate of N-hydroxyl phthalimide and paratoluensulfonyl chloride is the phthalimide p-toluenesulfonic esters.
18. according to each sensible heat composition among the claim 1-15, wherein comprise and be selected from down in the group one or more as main dyestuff: alkaline bright blue, Victoria's ethereal blue, solvent blue, malachite green, crystal violet and methyl violet as the coloring background dye of component D.
19. according to the sensible heat composition of claim 16, wherein comprise and be selected from down in the group one or more as main dyestuff: alkaline bright blue, Victoria's ethereal blue, solvent blue, malachite green, crystal violet and methyl violet as the coloring background dye of component D.
20. according to the sensible heat composition of claim 18, wherein the coloring background dye as component D also comprises the auxiliary dyestuff of one or more conducts that is selected from down in the group: dimethyl yellow, curcumin and sudan black.
21. according to the sensible heat composition of claim 19, wherein the coloring background dye as component D also comprises the auxiliary dyestuff of one or more conducts that is selected from down in the group: dimethyl yellow, curcumin and sudan black.
22. with the method for sensible heat preparation of compositions positive without preheating thermal CTP plate material, this method comprises the steps: according to each thermal CTP plate material among the claim 1-21 for a use
(1) aluminum substrate is carried out roughening treatment, anodized and sealing of hole successively and handles,
(2) each thermal CTP plate material is coated with version with the sensible heat composition in will using according to claim 1-21 through the aluminum substrate that sealing of hole was handled;
The aluminum substrate through applying that (3) will in step (2), obtain carries out the two-part drying, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air is dry, thereby obtains positive without preheating thermal CTP plate material.
23. according to the method for claim 22, wherein the roughening treatment in the step (1) realizes through carrying out carrying out electrolyzing and coarsening after the mechanical alligatoring earlier.
24. according to the method for claim 22, wherein the pore-sealing liquid that handle to use of sealing of hole is the pore-sealing liquid of one or more hole sealing agents acquisitions of being selected from down group with deionized water and/or distilled water diluting: potassium dihydrogen phosphate-potassium fluoride, potassium dihydrogen phosphate-tartrate list sodium salt-potassium fluoride, potassium dihydrogen phosphate-sodium silicate-potassium fluoride, sodium dihydrogen phosphate-sodium fluoride, sodium metaaluminate-sodium fluoride, sodium dihydrogen phosphate-β-I rather, sodium silicate-sodium fluoride, sodium metaaluminate, sodium potassium tartrate tetrahydrate-tartrate and sodium silicate-tartrate.
25. according to the method for claim 23, wherein the pore-sealing liquid that handle to use of sealing of hole is the pore-sealing liquid of one or more hole sealing agents acquisitions of being selected from down group with deionized water and/or distilled water diluting: potassium dihydrogen phosphate-potassium fluoride, potassium dihydrogen phosphate-tartrate list sodium salt-potassium fluoride, potassium dihydrogen phosphate-sodium silicate-potassium fluoride, sodium dihydrogen phosphate-sodium fluoride, sodium metaaluminate-sodium fluoride, sodium dihydrogen phosphate-β-I rather, sodium silicate-sodium fluoride, sodium metaaluminate, sodium potassium tartrate tetrahydrate-tartrate and sodium silicate-tartrate.
26. according to each method among the claim 21-25; It wherein is the heat-sensitive plate-making machine of main output for 800nm; Select the IR dyes that absorption peak is arranged in 790～800nm optical wavelength range for use; And, select the infrared absorbing dye that absorption peak is arranged in 810～830nm optical wavelength range for use for the heat-sensitive plate-making machine that 830nm is main output.
27. according to each method among the claim 21-25, wherein the drying in the step (3) is carried out in the dry road of two-part, first section of this drying road is adopted FAR INFRARED HEATING dry, and second section is adopted forced air dry; The length ratio in the dry road of FAR INFRARED HEATING dryer section and forced air dryer section is 2: 1～1: 1, and in the FAR INFRARED HEATING dryer section, space of a whole page temperature is no more than 120 ℃, and the gas flow temperature of forced air dryer section is 105-115 ℃.
28. according to the method for claim 26, wherein the drying in the step (3) is carried out in the dry road of two-part, first section of this drying road is adopted FAR INFRARED HEATING dry, and second section is adopted forced air dry; The length ratio in the dry road of FAR INFRARED HEATING dryer section and forced air dryer section is 2: 1～1: 1, and in the FAR INFRARED HEATING dryer section, space of a whole page temperature is no more than 120 ℃, and the gas flow temperature of forced air dryer section is 105-115 ℃.
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| CN101881928A (en) * | 2010-06-22 | 2010-11-10 | 刘华礼 | Method for preparing film-free positive image PS plate |
| CN102314090A (en) * | 2011-05-10 | 2012-01-11 | 刘华礼 | Preparation method of CTCP (Client-to-Client Protocol) version |
| CN103660665A (en) * | 2013-12-05 | 2014-03-26 | 泰州市东方印刷版材有限公司 | Hole sealing technology for printing plate making |
| CN104391428B (en) * | 2014-11-20 | 2018-06-19 | 京东方科技集团股份有限公司 | Emulsion, photoetching compositions and preparation method containing diazonium groups |
| CN106634143B (en) * | 2016-12-26 | 2019-01-01 | 泰兴市印刷版材有限公司 | A kind of printing plate sealing of hole liquid and preparation method thereof |
| CN106997157A (en) * | 2017-06-06 | 2017-08-01 | 长葛市汇达感光材料有限公司 | A kind of method for sealing of photosensitive material plate |
| CN116493228B (en) * | 2023-04-14 | 2024-03-29 | 福建宝士嘉印刷器材有限公司 | Oven device of CTP edition material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1490667A (en) * | 2002-10-17 | 2004-04-21 | 北京师范大学 | Thermal sensitive imaging composition for direct platemaking by positive thermal sensitive computer |
| CN1603956A (en) * | 2003-09-30 | 2005-04-06 | 北京师范大学 | Image-forming composition for heat-sensitive CTP image base, acid generating source for the composition and preparation thereof |
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| CN1490667A (en) * | 2002-10-17 | 2004-04-21 | 北京师范大学 | Thermal sensitive imaging composition for direct platemaking by positive thermal sensitive computer |
| CN1603956A (en) * | 2003-09-30 | 2005-04-06 | 北京师范大学 | Image-forming composition for heat-sensitive CTP image base, acid generating source for the composition and preparation thereof |
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