CN101738856A - Sensible heat composition for positive thermosensitive CTP plate without preheating and plate-making method by using same - Google Patents
Sensible heat composition for positive thermosensitive CTP plate without preheating and plate-making method by using same Download PDFInfo
- Publication number
- CN101738856A CN101738856A CN200810178143A CN200810178143A CN101738856A CN 101738856 A CN101738856 A CN 101738856A CN 200810178143 A CN200810178143 A CN 200810178143A CN 200810178143 A CN200810178143 A CN 200810178143A CN 101738856 A CN101738856 A CN 101738856A
- Authority
- CN
- China
- Prior art keywords
- sensible heat
- weight
- plate
- sodium
- paracresol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Plates And Materials Therefor (AREA)
Abstract
The invention relates to a sensible heat composition for a thermosensitive CTP (Computer to Plate) plate. The thermosensitive composition comprises a perether compound of one or more low molecular phenolic compounds as a dissolution inhibitor or a solutizer, and the molecular weight of the low molecular phenolic compound is 100-400. Furthermore, the invention also relates to a method for preparing the positive thermosensitive CTP plate without preheating. The method comprises the following steps of: (1) sequentially carrying out rough treatment, anodic oxidation treatment and sealing treatment on an aluminum plate base; (2) carrying out plate coating on the aluminum plate base through the sealing treatment by using the thermosensitive CTP (Computer to Plate) plate; (3) carrying out two-section drying on the coated aluminum plate base obtained in the step (2), wherein the first section is dried by using a far infrared ray to heat, while the second section is dried by using forced hot blast, thereby obtaining the positive thermosensitive CTP plate without preheating. The plate produced in the invention has favorable appearance, higher sensitivity, favorable development latitude and higher print run and can be used in cooperation with photographic developers universally utilized at home and abroad.
Description
Technical field
The present invention relates to a kind of positive without preheating thermal CTP plate material sensible heat composition.Particularly, the present invention relates to a kind of comprise low molecule monobasic, binary or polyphenol compound vinyl C
1-C
6Alkyl ether or 2, the etherate that 3-dihydropyrane etherificate obtains is as the positive without preheating thermal CTP plate material sensible heat composition of the molten/chaotropic agent of resistance.In addition, the invention still further relates to a kind of method of using described positive without preheating thermal CTP plate material with sensible heat preparation of compositions positive without preheating thermal CTP plate material.
Background technology
PS version (Presensitized Offset Plates) is a pre-coating light sensitive plate, develops out for adapting to lithographic developing rapidly.Because PS version body has the resolving power height, dot reproduction is full, levels are rich, and ink-water balance is easily grasped, and characteristics such as pressrun height have obtained popularizing rapidly in printing industry.At present, the PS version still is current consumption maximum, also is most important planographic printing plate material, and PS version manufacturing industry has become one of extremely important mainstay industry of current printing apparatus manufacturing industry.The version base material matter of positive-type PS version is generally aluminium sheet.
Positive without preheating thermal CTP plate material do not need by in the past by laser photo-typesetting, again through the Making Film of developing, photographic fixing is made, but the graph text information that will print from computing machine directly to version (computer toplate, also claim CTP) novel plate technology, also claim digitizing direct plate-making technology.
Kodak had released the commercial preheating thermal CTP plate material that has in 1996, and positive without preheating thermal CTP plate material comes out and commercialization in Wu Yue, the 2000 De Luba exhibition, becomes the main flow in all kinds of CTP plates gradually.But this at that time commercial plate belongs to physical change stencilling materials such as the molten or resistance of associating of dyestuff resistance is molten more.Calendar year 2001 Beijing Normal University's photosensitive polymer research department begin one's study normal temperature have the resistance of efficient acid-decomposed activity molten/chaotropic agent, should hinder molten/chaotropic agent cooperates with infrared absorbing dye and photo-thermal product acid source, obtained the sensible heat composition that chemical amplification type positive without preheating thermal CTP plate material is used, and around this content application a series of Chinese patents (02117827.5,02160050.3,03143500.9,01123686.8), unite the Chinese patent (ZL03143500.9) that application has also been authorized comprising the applicant and Beijing Normal University.Owing to used the molten/chaotropic agent of normal temperature high acidolysis active type (normal temperature chemical amplification type) resistance in these patents, scan by the 830nm infrared laser, Infrared dyes absorbing light and be transformed into heat, make and be scanned regional instantaneous temperature and can reach more than 300 ℃, cause producing in the plate acid source and decompose product acid, the acid that is produced makes the molten/chaotropic agent of resistance decompose rapidly at normal temperatures, and developing with alkaline developer is easy to obtain sensitivity height, good resolution, the development tolerance is big, the blotting ink transfer is good plate.But the use of the molten/chaotropic agent of this high acidolysis active resistance has also brought some disadvantages to plate.Because employed etherificate parent was a molecular weight at 2000～4000 linear phenol-aldehyde resin in the past, when the etherificate rate of hydroxyl in the resin greater than 50% the time, though but it is not high to have the molten ability sensitivity of higher resistance, in case exposure deficiency, etherate can not thoroughly decompose, and it is dirty to be easy in the developing process keep on file; When the etherificate rate less than 20% the time, hinder molten scarce capacity, image is easy to subtract the film loss of gloss in the developing process.Because parent phenolics is thorough etherificate, residual the phenolic hydroxyl group of a great deal of in the molecule of this high acidolysis active etherate, the hydroxyl acidity of some phenolics is stronger, causes hindering molten/chaotropic agent self bin stability and descends.In addition, the molecular weight of active etherate is bigger, brings certain trouble also for coated version technology.
The technical background of in the past inventing based on used in the past technology and the inventor, the main purpose of the present invention is to solve the positive PS printing plate version base of crossing with common sealing of hole, under the condition that does not add undercoat or transition bed, be coated with make sensitivity height, good resolution, development tolerance greatly, be difficult for loss of gloss and subtract the dirty positive without preheating thermal CTP plate material of the film and the residual end.
Summary of the invention
In view of the above-mentioned problems in the prior art, the inventor finds the active etherate of specific phenolic compound is included in positive without preheating thermal CTP plate material with in the sensible heat composition, can solve above-mentioned technical matters of the prior art, the molecular weight that wherein is used to prepare the phenolic compound of described active etherate is 100-400, be preferably 150～300, the etherificate rate is near 100%, so not only guarantee the high sensitivity of the plate that high acidolysis active brought but also guaranteed the bin stability of active etherate self, also guaranteed to have bigger difference solubleness before and after the heat scan, thereby improved the development tolerance (do not subtract film when development time is longer, development time is not more kept on file) of plate.Described active etherate has high acidolysis active at normal temperatures, can be used as the molten/chaotropic agent of resistance in the sensible heat composition at positive without preheating thermal CTP plate material.
According to a first aspect of the invention, provide a kind of thermal CTP plate material sensible heat composition, based on the general assembly (TW) of this sensible heat composition, it comprises following component:
A) the full ether compound of one or more low molecular phenolics compounds of 7～25 weight % is as the molten/chaotropic agent of resistance, and the molecular weight of this low molecular phenolics compound is 100～400;
B) 1～5 weight %'s has the infrared absorbing dye of absorption peak in 790～830nm optical wavelength range;
C) photo-thermal of 1～5 weight % produces acid source;
D) the conventional PS version background dye of 1～5 weight %; And
E) weight-average molecular weight of 60～90 weight % is 3000～10000 linear phenol-aldehyde resin.
According to a second aspect of the invention, provide a kind of method of using thermal CTP plate material of the present invention with sensible heat preparation of compositions positive without preheating thermal CTP plate material, this method comprises the steps:
(1) aluminum substrate being carried out successively roughening treatment, anodized and sealing of hole handles;
(2) will use thermal CTP plate material of the present invention to carry out coated version through the aluminum substrate that sealing of hole was handled with the sensible heat composition;
The aluminum substrate through applying that (3) will obtain in step (2) carries out the two-part drying, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air drying, thereby obtain positive without preheating thermal CTP plate material.
Adopted effective hole-sealing technology in the basic processing procedure of version, made conventional positive PS printing plate handle to be coated with through sealing of hole and make desirable thermal CTP plate material with the version base.In the plate drying process, first section is adopted FAR INFRARED HEATING to carry out drying; Second section is adopted the forced air drying, and the gas flow temperature of forced air dryer section is 105-115 ℃, for example about 110 ℃.First section FAR INFRARED HEATING drying can guarantee to apply the dry initial stage of plate and boil off solvent rapidly, does not produce " cloud and mist " phenomenon that heated-air drying is brought again, thereby guarantees that plate has good surface appearance; Second section forced air drying process has avoided the infrared absorbing dye in the plate to absorb the superheating phenomenon that infrared ray causes, and is unlikely to make the product acid source to decompose product acid and causes subtracting film loss of gloss even plate complete failure.Also avoided the crosslinked dirty phenomenon of keeping on file that causes of the overheated film-forming resin that causes.
Component A
Use in the sensible heat composition at thermal CTP plate material of the present invention, the full ether compound that comprises low molecular phenolics compound is as component A, and this component is used as the molten/chaotropic agent of resistance in sensible heat composition of the present invention.The component A that is used as the molten/chaotropic agent of resistance at thermal CTP plate material of the present invention in the sensible heat composition can commercially obtain, perhaps can prepare by methods known in the art, for example can be by disclosed method preparation in the Chinese patent application 200810098637.3 that is entitled as " active etherate of phenolic compound and preparation thereof ", the document is incorporated herein by reference in full.Resistance as component A is molten/and chaotropic agent is the full ether compound with low molecular phenolics compound of high acidolysis active.The molecular weight of the phenolic compound that synthetic this etherate is used is 100～400, preferably 150～300.This phenolic compound can be monohydric phenol, dihydric phenol or polyphenol compound, preferred bisphenols and polyhydric phenols.So synthetic full ether compound has high acidolysis active.
Can select 4 for use in the bisphenol compound, 4 '-dihydroxy benaophenonel, 4,4 '-dioxydiphenyl methane (bis-phenol M), 4,4 '-dihydroxy diphenyl sulphur (bisphenol S), 4,4 '-dihydroxy-diphenyl sulfone, bisphenol-A, 3,3 '-dichloro bis-phenol M, 3,3 '-dimethyl bis-phenol M, 2,2 '-dimethyl bisphenol-A, tetrabromobisphenol A or tetrabromo-bisphenol s, the perhaps combination in any of these compounds, preferred use 4,4 '-dihydroxy benaophenonel, bis-phenol M, bisphenol-A, bisphenol S, 4,4 '-dihydroxy-diphenyl sulfone, 3,3 '-dichloro bis-phenol M or 3,3 '-dimethyl bis-phenol M, the perhaps combination in any of these compounds.
Polyhydric phenols can be selected triphenolyl methane for use, 1,1,1-triphen phenolic group ethane, 2,6-dihydroxymethyl paracresol respectively with phenol, metacresol, resorcinol or biphenyl 3 phenol condensation product with one to two mol ratio.As polyhydric phenols, the present invention preferably uses 2,6-dihydroxymethyl paracresol two resorcinols that contract.
As the monohydric phenol compounds; can use 2; the 4-xylenol; 3; the 4-xylenol; p-tert-butylphenol; to chloro-tert.-butylphenol; to benzoyl phenol; 2; 6-dimethyl p-tert-butylphenol; 2; 4; the 6-trichlorophenol; 2; 4; the 6-tribromphenol; propylparaben; to acetyl phenol; the 4-dihydroxy benaophenonel; p-phenoxyphenol or to thiophenyl phenol, wherein 2, the 4-xylenol; 3; the 4-xylenol; p-tert-butylphenol; to chloro-tert.-butylphenol; to benzoyl phenol; 2,6-dimethyl p-tert-butylphenol; propylparaben or be that the present invention preferentially recommends the monohydric phenol that uses to thiophenyl phenol.
As the component A of sensible heat composition of the present invention, it is the full ether compound of low molecular phenolics compound.This etherate obtains with the etherifying reagent etherificate by hanging down the molecular phenolics compound.For the purpose of the present invention, the etherifying reagent that is used to prepare described active etherate comprises vinyl C
1-C
6Alkyl ether and 2, the 3-dihydropyrane
Described vinyl C
1-C
6The example of alkyl ether comprises EVE, vinyl propyl ether, vinyl isopropyl ether, vinyl n-butyl ether, vinyl isobutyl ether, vinyl sec-butyl ether, vinyl tertbutyl ether, vinyl amyl ether and vinyl hexyl ether.Preferred vinyl C
1-C
6Alkyl ether is vinyl C
1-C
4Alkyl ether, the example comprise EVE, vinyl propyl ether, vinyl isopropyl ether, vinyl n-butyl ether, vinyl isobutyl ether, vinyl sec-butyl ether and vinyl tertbutyl ether.Especially preferred vinyl C
1-C
4Alkyl ether is an etherifying reagent.In addition, etherifying reagent also can use dihydrofuran or vinyl benzyl ether etc. to have the compound of vinyl ether structure.Optimal ethylene benzyl ethyl ether and/or 2, the 3-dihydropyrane is as etherifying reagent.
As component A, preferred one or more etherates that are selected from down in the group that use:
Dihydroxymethyl paracresol the contract full ether compound of EVE of bifocal gallic acid and the full ether compound of EVE of two poly bisphenols.
Be preferably selected from down especially the group in one or more:
The full ether compound of the EVE of bisphenol-A (V-32 derives from sky, Weihai and becomes chemical industry company limited), dihydroxymethyl paracresol contract two resorcinols the full ether compound of EVE (V-33 derives from sky, Weihai and becomes chemical industry company limited),
4, the full ether compound of the dihydropyrane of 4 '-dioxydiphenyl methane (V-34 derives from sky, Weihai and becomes chemical industry company limited),
The dihydroxymethyl paracresol contract the bifocal gallic acid the full ether compound of EVE (V-35 derives from sky, Weihai and becomes chemical industry company limited),
The full ether compound of the EVE of two poly bisphenols (V-36 derives from sky, Weihai and becomes chemical industry company limited) and
4, the full ether compound of the EVE of 4 '-dihydroxy benaophenonel (V-300 derives from sky, Weihai and becomes chemical industry company limited).
Most preferably the present invention uses V-32, V-33 and/or V-36 as component A.
As component A, it both can use single kind according to full ether compound of the present invention, also can use two or more different full ether compound, for example can use the combination of V-36 and V-32.
In the preferred embodiment of sensible heat composition of the present invention, the consumption of component A is generally 7～25 weight % based on the sensible heat composition total weight.This consumption does not then reach the molten purpose of resistance if be lower than 7 weight % before the scanning, the short dissolubility in scanning back can be also very poor, and the development tolerance significantly diminishes; If this consumption is greater than 25 weight %, and the anti-dry grinding of rete is poor, the sensitivity step-down, in case under-exposed, it is dirty to be easy to the residual end.More preferably, based on the sensible heat composition total weight, the consumption of component A is at least 8,9,10,11,12,13,14 or 15 weight %, and this consumption is at most 24,23,22,21 or 20 weight %, and the consumption of component A is preferably 10～20 weight %.
B component
Use in the sensible heat composition at thermal CTP plate material of the present invention, be included in 790～830nm optical wavelength range and have the infrared absorbing dye of absorption peak as B component.This infrared absorbing dye can be selected for use both at home and abroad, and commercially available colored cyanines are infrared absorbing dye.The absorption peak wavelength of this infrared absorbing dye is 800～830nm, and the absorption peak of measuring in alcohol solvent is 815～820nm usually, and the absorption peak in the sensible heat composition should be about 830nm.808nm optical wavelength newly developed is the heat-sensitive plate-making machine of main output on the market in order to adapt to, and advantageously uses the infrared absorbing dye that the certain absorption optical density is all arranged in 790～830nm optical wavelength range.The infrared absorbing dye that is fit to sensible heat composition of the present invention has NK-2014, NK-2268, the HCD-21 of Lin Yuan company, the PS-101 of Japanese chemical drug, PS-102, and the S0094 of FEW CHEMICALS company etc.
The consumption of infrared absorbing dye accounts for 1～5 weight % of sensible heat composition total weight usually, is preferably 2～4 weight %.When this consumption was less than 1 weight %, it is low that plate is scanned the part heating temp, is not enough to decompose produce acid source, thereby reduces the sensitivity of plate significantly; Consumption the bin stability of the master that coats is descended, and it was dirty to be easy to the residual end in the developing process greater than 5% o'clock.
Component C
Use in the sensible heat composition at thermal CTP plate material of the present invention, comprise photo-thermal and produce acid source as component C.In the context of the invention, " photo-thermal product acid source " is meant and is easy to decompose the material that produces acid or proton under the effect of infrared light and/or heat.Available product acid source has following a few class:
1. triazines is produced acid source, and as 1,3,5-three (trichloromethyl) triazine, 1-methyl-3, two (trichloromethyl) triazines of 5-, 1-phenyl-3, two (trichloromethyl) triazines of 5-, 1-be to methoxy styryl-3, two (trichloromethyl) triazines of 5-etc.Selected triazines photo-thermal produces acid source and does not preferably have absorption in the wavelength coverage of being longer than 350nm, so that safe operation under indoor daylight.
2. sulfonic acid esters produces acid source, for example applicant's carboxylate of carboxylate, polyphenol compound and the paratoluensulfonyl chloride of carboxylate (for example phthalimide p-toluenesulfonic esters), N-hydroxyl phthalimide and the naphthalene sulfonyl chloride of disclosed N-hydroxyl phthalimide and paratoluensulfonyl chloride etc. among state's patent CN1603956 therein.The heat decomposition temperature that sulfonic acid esters produces acid source should be 150-250 ℃ usually.When decomposition temperature is higher than 250 ℃, be difficult to decompose product acid in the heat scan process; When decomposition temperature is lower than 150 ℃, produce acid during coated version in the drying process easily, cause plate rotten.
3. salt produces acid source, for example triphenyl sulfosalt or replace triphenyl sulfosalt, diphenyl iodnium or substituted diphenylamine base salt compounded of iodine, alicyclic sulfosalt etc.Its compatibility ion can be tetrafluoroborate, hexafluoro-phosphate radical, trifluoromethanesulfonic acid root, perchlorate, p-toluenesulfonic acid root etc.The heat decomposition temperature that salt produces acid source also should be 150～250 ℃ usually, and near ultraviolet and visible light are not absorbed.
In sensible heat composition of the present invention, account for 1～5 weight % of sensible heat complex general assembly (TW), preferred 1.5～4 weight % as the product acid source of component C.Consumption produces acid source and is easy to separate out from glue during greater than weight 5%, and can cause the bin stability of plate to descend, and to hinder molten ability stronger because some produces acid source, and it is dirty also to be easy in the developing process keep on file; Consumption produces subacidity during less than weight 1%, and the sensitivity of plate is descended.
Component D
Use in the sensible heat composition at thermal CTP plate material of the present invention, comprise conventional PS version and use background dye as component D.It is blue dyestuff that this background dye or illuminating colour can be selected triphenylmethane for use, as commercially available alkaline bright blue, Victoria's ethereal blue, solvent blue etc., also can select green dye for use, as malachite green etc., can also select cudbear for use, as crystal violet, methyl violet etc., also select for use some yellow dyes such as dimethyl yellow, curcumin, sudan black to make auxiliary dyestuff under some situation.Conventional PS version as component D both can be a single kind of dyestuff with background dye, also can be two or more different dyes.Account for 1～5 weight % of sensible heat composition total weight as the conventional PS version of component D with the consumption of background dye, be preferably 1～2 weight %.
Component E
Thermal CTP plate material of the present invention with the sensible heat composition in, comprise weight-average molecular weight and be 3000～10000 linear phenol-aldehyde resin as component E.This linear phenol-aldehyde resin is the component of content maximum in the sensible heat composition as film-forming resin.The selection principle of component E should make that the compatibility of it and A, B, C and four components of D is good, particularly with as the resistance of component A molten/chaotropic agent has good compatibility, and do not contain and cause hindering the impurity that molten/chaotropic agent decomposes.Weight-average molecular weight as the linear phenol-aldehyde resin of component E is generally 3000～10000, is preferably 5000～8000.This molecular weight is greater than 10000, and the sensitivity of sensible heat complex is lower, and developing powder is slow, and it is dirty to be easy to keep on file; This molecular weight hindered a little less than the molten ability less than 3000 o'clock, was easy to subtract the film loss of gloss in the developing process.They can use separately, also can compoundly use.The principle of compound use is that will to make the weight average of the weight-average molecular weight of these resins be 5000～8000, both has been not easy to subtract the film loss of gloss like this in the developing process, and it is dirty to be not easy the residual end again.Be applicable to that line style phenolic aldehyde film-forming resin of the present invention for example is BTB-25 (metacresol-paracresol-formaldehyde resin that sky, Weihai becomes chemical industry company limited to be produced, the mol ratio of metacresol and paracresol is 6: 4, weight-average molecular weight 5000-6000, Mw/Mn is 4-6), BTB-27 (paracresol-phenol-formaldehyde resin, about weight-average molecular weight 4000, Mw/Mn is 3-4), BTB-29 (metacresol-paracresol-formaldehyde resin, metacresol and paracresol mol ratio are 7: 3, about weight-average molecular weight 9000, Mw/Mn is 9-10), BTB-29 (L) (metacresol-paracresol-formaldehyde resin, metacresol and paracresol mol ratio are 7: 3, weight-average molecular weight 5000-6000, Mw/Mn is 5-6) and BTB-211 (paracresol-phenol-metacresol-formaldehyde resin, paracresol, phenol and metacresol mol ratio are 6: 3: 1, and weight-average molecular weight 3000-4000, Mw/Mn are 3-3.5).
Usually account for 60～90 weight % of sensible heat composition solid general assembly (TW) as the consumption of the line style phenolic aldehyde film-forming resin of component E, be preferably 70～80 weight %.The polydispersity index Mw/Mn of line style phenolic aldehyde film-forming resin generally should be 3～8.The resin permission polydispersity index that molecular weight is bigger can be big slightly, but also should not surpass 10.In addition, when use than the resistance of small-molecular weight molten/during chaotropic agent, the molecular weight of line style phenolic aldehyde film-forming resin should be selected higher; When the resistance of using larger molecular weight molten/during chaotropic agent, the molecular weight of line style phenolic aldehyde film-forming resin can be selected smaller.So the purpose of selecting is that sensitivity, resolving power and the pressrun that makes the sensible heat complex taken into account.
The line style phenolic aldehyde film-forming resin that the present invention uses with as the resistance of component A molten/part by weight of chaotropic agent also can be called B/P, it is more much bigger than the B/P of traditional PS version, is generally 3.5～10, be preferably 3.5-8.5, and the B/P of traditional PS version is 1.5～3.B/P is too big, for example greater than 10, the molten scarce capacity of resistance before the heat scan, behind the heat scan short dissolubility can be a little less than, be unfavorable for improving the development tolerance of plate; B/P is too little, and as less than 3.5, the sensitivity of plate obviously descends.
In another embodiment of the invention, the invention provides a kind of method of using thermal CTP plate material of the present invention with sensible heat preparation of compositions positive without preheating thermal CTP plate material, this method comprises the steps:
(1) aluminum substrate being carried out successively roughening treatment, anodized and sealing of hole handles;
(2) will use thermal CTP plate material of the present invention to carry out coated version through the aluminum substrate that sealing of hole was handled with the sensible heat composition;
The aluminum substrate through applying that (3) will obtain in step (2) carries out the two-part drying, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air drying, thereby obtain positive without preheating thermal CTP plate material.
In method for platemaking of the present invention, the version base of the positive without preheating thermal CTP plate material of employing is an aluminum substrate.Before coating thermal CTP plate material of the present invention was with the sensible heat composition, this aluminum substrate need carry out roughening treatment, anodized and sealing of hole to be handled.
For the roughening treatment in the step (1), the purpose of this processing is to enlarge the specific surface of version base, improves absorption affinity.Roughening treatment both can be mechanical roughening treatment, also can be that electrolyzing and coarsening is handled, and perhaps comprised this two kinds of roughening treatments, under one situation of back, preferably carried out mechanical roughening treatment earlier, after carry out electrolyzing and coarsening and handle.For electrolyzing and coarsening, its method commonly used is the alternating current roughening method,, two aluminium plates is put into the electrolytic solution of hydrochloric acid or nitric acid that is, connects AC power, makes the aluminium plate surface form the depth and fineness is moderate, the Grains that is evenly distributed.For the anodized in the step (1), the purpose of this processing is to make the aluminium plate surface to form the fine and closely woven aluminum oxide film of one deck.Anodized for example can be carried out anodic oxidation and carry out by aluminium plate being made anode and stereotype is put into sulfuric acid solution as negative electrode.Aluminium plate surface through anodized is the oxide film of one deck porous, because the too much too small space of a whole page that makes of pore very easily pollutes, brings difficulty for plate-making and printing, thereby in method for platemaking of the present invention, must carry out sealing of hole and handle.
Depend on the circumstances the processing of carrying out needing before the coated version except above-mentioned, aluminum substrate also comprises other conventional processing.For example when the space of a whole page of aluminum substrate has grease, need carry out ungrease treatment earlier to the version base, this is for example by using aqueous slkali, for example sodium hydrate aqueous solution soaks and realizes, also can realize, preferably earlier with soaking with acid solution after the aqueous slkali soaking by soaking with acid solution such as diluted nitric acid aqueous solution.In addition, also be included in flushing, neutralization and the optional dried of having carried out after every processing.
For example, before aluminum substrate coating sensible heat composition, typically aluminum substrate can be carried out following processing successively:
(1) makes the aluminum substrate degreasing with dilute NaOH solution, for example under 60～70 ℃, soaked 30 seconds with NaOH;
(2) water flushing;
(3) use rare HNO
3Solution (3% HNO for example
3Solution) soak the space of a whole page;
(4) water flushing;
(5) roughening treatment;
(6) water flushing;
(7) neutralize with alkali lye;
(8) water flushing;
(9) anodized;
(10) water flushing;
(11) sealing of hole is handled; And
(12) use in the phosphoric acid,diluted and remaining alkali, clean oven dry again.
In the preferred embodiment of method for platemaking of the present invention, aluminum substrate obtains R after roughening treatment and anodic oxidation
aValue is 0.4～0.6 μ m, R
h(R
z) value is that the amount of 2～3 μ m and oxide film is 2.5～3.0g/m
2Processing version base.
Handle for the aluminum substrate that will obtain after the anodized carries out sealing of hole, the version base of this processing can be delivered in the sealing of hole groove that pore-sealing liquid is housed and be carried out sealing of hole.Usually, the temperature of sealing of hole groove remains under 50～80 ℃ usually, and the speed of a motor vehicle of sealing of hole time during on coating decided, and may be selected to be 20～40 seconds.For the present invention, being used for the pore-sealing liquid of sealing of hole can be based on following hole sealing agent: potassium dihydrogen phosphate-potassium fluoride, potassium dihydrogen phosphate-tartrate list sodium salt-potassium fluoride, potassium dihydrogen phosphate-sodium silicate-potassium fluoride, sodium dihydrogen phosphate-sodium fluoride, sodium metaaluminate-sodium fluoride, sodium dihydrogen phosphate-β-I is peaceful, sodium silicate-sodium fluoride, sodium metaaluminate, sodium potassium tartrate tetrahydrate-tartrate and/or sodium silicate-tartrate etc.The present invention more preferably selects for use potassium dihydrogen phosphate-potassium fluoride or sodium dihydrogen phosphate-sodium fluoride as hole sealing agent.Pore-sealing liquid is generally by preparing aforementioned sealing of hole system can obtain with deionized water and/or distilled water.Based on the general assembly (TW) of whole pore-sealing liquid, the hole sealing agent concentration of the pore-sealing liquid of being prepared is generally 5～15 weight %, preferred 8～10 weight %.
Hole-sealing technology of the present invention is the process procedure an of necessity for method for platemaking of the present invention, removes this hole-sealing technology unlike conventional positive PS printing plate, otherwise that the plate that is coated with is easy to the residual end is dirty.More external thermal CTP plate material manufacturers except that adopting hole-sealing technology, add undercoat or transition bed toward contact, and the present invention only need sealing of hole to get final product for addressing this problem.
After the aluminum substrate sealing of hole is handled, if necessary after the remaining alkalescence that neutralized, will carry out coated version with sensible heat composition of the present invention after the aluminum substrate clean dry.For this reason, for example can send it to and can control coated version in the airtight extrusion coated device of coating weight by volume pump and spraying nozzle slit, control solid rete coating weight (in solid content) is at 1.6～2.0g/m
2Between.
For coated version, sensible heat composition of the present invention need use solvent to be mixed with the form of coating fluid usually.Preferably, sensible heat composition of the present invention is mixed with the coating fluid that solid content is generally 10～15 weight % and carries out coated version.Certainly, according to concrete coated version technology, also sensible heat composition of the present invention can be mixed with the coating fluid of other concentration to carry out coated version.Solvent for use is the used solvent of conventional positive PS printing plate, and as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, cyclohexanone, γ-Ding lactones, butanone and/or dioxane etc., these solvents can use separately, also can compoundly use.What preferably can use separately is ethylene glycol monoethyl ether, propylene glycol monomethyl ether or cyclohexanone.Butanone, dioxane and γ-Ding lactones uses as secondary solvent usually, its objective is the viscosity that reduces coating fluid, is convenient to after the coating levelling as early as possible.The weight ratio of the consumption of secondary solvent and main body solvent load is generally 1/3～1/10, is preferably 1/4～1/6.Because the boiling point of secondary solvent is lower, when use amount was too big, velocity of evaporation was too fast, and the spraying nozzle place is easy to skinning, causes appearance of coat bad.Secondary solvent is very little the time, and diluting effect reduces, and does not fit into the needs of quick coating.If but the speed of a motor vehicle of coating machine is lower than 10m/min, and control coating fluid solid content is 10～15%, then also can be coated with smoothly with single solvent.Coating method, the coating speed of a motor vehicle on coating machine are decided, and coating fluid generally will pass through three-stage filtration: 10～20 μ m filter membranes are the first order, and 3～5 μ m filter membranes are the second level, and 0.5～1 μ m filter membrane is the third level.
To in step (2), behind levelling section levelling, carry out drying by the aluminum substrate through applying.This drying is carried out with the two-part drying according to the present invention, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air drying, thereby obtain positive without preheating thermal CTP plate material.Preferably, this two-part drying is carried out in the dry road of two-part, and first section of this drying road is adopted the FAR INFRARED HEATING heating, and second section is adopted forced air to carry out drying; Usually, the dry road length of first section FAR INFRARED HEATING drying is generally about 10 meters.This FAR INFRARED HEATING can utilize far-infrared heating tube to produce.The far infrared illumination of first section far infrared drying is the same with conventional PS version production line, and far infrared drying efficient is higher, is difficult for producing " cloud and mist " phenomenon that the forced air drying is brought.Although the one section hot air flow in back is bigger, because through first section far infrared drying, most solvents boil off, good apparently form can not caused " cloud and mist " phenomenon or other apparent bad phenomenon yet.And, the solvent of space of a whole page coating is reduced to after two sections dryings below the 5 weight %, even 3 below the weight %, problem such as can not produce also that the overheated heat sensing layer that causes of the space of a whole page decomposes or crosslinked, thus guaranteed not only to be not easy to subtract the film loss of gloss but also to be not easy to keep on file in the developing process.This two-part drying process provides very favorable condition for being coated with out good thermal CTP plate material with common PS version sealing of hole version base.The length ratio of far infrared drying section and forced air dryer section is 2: 1～1: 1.Should make space of a whole page temperature be no more than 120 ℃ when the far infrared drying section is dry, the gas flow temperature of forced air dryer section should be 105-115 ℃, preferably about 110 ℃.
After the coated board backbone was dry, the cooling back cut according to plate given size specification, cuts scale error and preferably is controlled in the 0.3mm, obtains positive without preheating thermal CTP plate material.
Embodiment
The following embodiment that introduces not is the whole of embodiment, but the representative embodiment of a part.
Embodiment 1～6
1～6 used edition base of embodiment is to utilize the positive PS printing plate production line, and the aluminium plate of 0.3mm is resulting via mechanical alligatoring → electrolyzing and coarsening → anodic oxidation → sealing of hole processing → washing and drying, its R
aValue is 0.58 μ m, R
h(R
z) value is 2.8 μ m, the amount of oxide film is 3.0g/m
2Used pore-sealing liquid is dissolved in 1 cubic metre of deionized water with 100 kilograms of potassium dihydrogen phosphates and 1.4 kilograms of potassium fluorides and makes.The sealing of hole slot length is 3 meters, and the pore-sealing liquid temperature is 60 ℃.The version base of handling well is directly delivered to extrusion coated section coating, and dispense tip adopts closed extrusion coated head.By the flow of control volume pump and the gap width of dispense tip nozzle, make coating weight (in solid content) be controlled at 1.6～1.8g/m
2Enter dry road drying behind levelling section levelling, dry road total length is 20 meters, and preceding 10 meters are adopted the heating of far infrared drying pipe, and this type of heating makes space of a whole page temperature be no more than 120 ℃, back 10 meters forced air dryings that adopt about 110 ℃.The solvent of sensible heat coating finally is controlled at below 5% after two sections dryings.The prescription of the sensible heat composition that embodiment 1～6 uses is listed in the table 1, and the corresponding without preheating positive-printing heat-sensitive CTP plate material that uses these sensible heat compositions to obtain is respectively WLTP-1, WLTP-2, WLTP-3, WLTP-4, WLTP-5 and WLTP-6.
Embodiment 7
Change 50% potassium dihydrogen phosphate in embodiment 1～5 pore-sealing liquid tartrate list sodium salt of identical weight into, and 50% potassium dihydrogen phosphate and whole potassium fluorides keep; Sensible heat composition composition and the basic processing of version, coated version, drying process are with embodiment 1.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-7.
Embodiment 8
The sodium silicate of 50% potassium dihydrogen phosphate in embodiment 1～5 pore-sealing liquid with equivalent replaced, and 50% potassium dihydrogen phosphate and whole potassium fluorides keep; Sensible heat composition composition and the basic processing of version, coated version, drying process are with embodiment 2.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-8.
Embodiment 9
Potassium dihydrogen phosphate in embodiment 1～5 pore-sealing liquid and potassium fluoride are replaced with the sodium dihydrogen phosphate and the sodium fluoride of identical weight respectively; Sensible heat composition composition and the basic processing of version, coated version, drying process are with embodiment 3.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-9.
Embodiment 10
The sodium metaaluminate of sodium dihydrogen phosphate among the embodiment 9 with equivalent replaced, and sodium fluoride is constant; Sensible heat composition composition and the basic processing of version, coated version, drying process are with embodiment 4.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-10.
Embodiment 11
With the sodium fluoride among the embodiment 9 with equivalent β-I rather replaces, and sodium dihydrogen phosphate is constant; Sensible heat composition composition and the basic processing of version, coated version, drying process are with embodiment 5.Obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-11.
Comparative Examples 1
In the mode identical with embodiment 1, preparation without preheating positive-printing heat-sensitive CTP plate material WLTP-CP1, difference is that the sensible heat composition that adopts is different from the sensible heat complex that adopts among the embodiment 1, the composition of this sensible heat composition is illustrated in the table 1, wherein as active etherate, what adopt is that (the used etherificate parent of active etherate V-26 is the BTB-26 resin to V-26, and etherifying reagent is an EVE, etherificate rate about 40%; Described BTB-26 resin is the film forming linear phenol-aldehyde resin that Weihai Economic and Technological Development Zone Tiancheng Chemical Co., Ltd. produces, be phenol, paracresol, metacresol terpolymer resin, weight-average molecular weight about 3400, number-average molecular weight 1100, repetitive is about 10, molecular weight distributing index 3.1).
Comparative Examples 2
With the PS version version base disposal route among the embodiment 1, but only handle till the anodic oxidation, not carrying out sealing of hole handles, obtain handling the version base, sensible heat composition among the embodiment 2 is applied on the above-mentioned processing version base, coated version and drying process obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-CP2 fully with embodiment 1.
Comparative Examples 3
With PS version version base disposal route and the sealing of hole disposal route among the embodiment 1, obtain the version base, sensible heat composition among the embodiment 2 is applied on the above-mentioned version base, behind levelling, directly enters into the dry road of forced air and carry out drying, obtain without preheating positive-printing heat-sensitive CTP plate material WLTP-CP3.
Comparative Examples 4
With PS version version base disposal route and the sealing of hole disposal route among the embodiment 1, obtain the version base, sensible heat composition among the embodiment 2 is applied on the above-mentioned version base, and whole process using traditional PS version is carried out drying with the far infrared drying mode behind levelling, obtains without preheating positive-printing heat-sensitive CTP plate material WLTP-CP4.
Embodiment 1～11 and Comparative Examples 1～4 coat without preheating positive-printing heat-sensitive CTP plate material WLTP-1～11 that obtain and coated version, the imaging performance of WLTP-CP1～4 listed in the table 2.The preparation of the full ether compound of EVE (V-36) of 12: two poly bisphenols of embodiment
Get sky, Weihai, Shandong and become chemical industry that BTB-36 resin (bisphenol-A and formaldehyde are with the condensed polymer of 2: the 1 mol ratios) 23.4g (0.05mol) of limited production is arranged, be dissolved in 30.0g 1, in the double solvents of 4-dioxane and 90.0g methylene chloride.Add the anhydrous p-toluenesulfonic acid of 0.015g, after the stirring and dissolving, under 20 ℃, in 30 minutes, drip EVE 20.16g (0.28mol), stir and at room temperature leave standstill reaction after 2 hours.Per 2 hours sampling and measuring infrared spectrums, reduce to original 1/10th when following to 3300～3400cm-1 place phenolic hydroxyl group absorption peak absorbing light density (calculating) with base-line method, in 10 minutes, add Powdered natrium carbonicum calcinatum 1.5g gradually, stirred 2 hours, left standstill then 8 hours, and removed lixiviating neutralizing agent and paratoluenesulfonic acid sodium salt solid with the suction funnel suction filtration.Filtrate changes in the cucurbit, and 60～70 ℃ of control bath temperatures boil off unreacted etherifying reagent and low boiling point solvent methylene chloride and the overwhelming majority 1, the 4-dioxane under higher vacuum.Obtain the full ether compound of two poly bisphenols-EVE, it is yellow thick liquid, and purity is 93%.
The invention effect
1. can find out clearly that from coated version, the imaging performance of table 2 it is apparent that the present invention is easy to obtain good plate, and sensitivity is higher, the development tolerance is good, pressrun is higher, can be used with the developer solution that generally uses both at home and abroad. The patent that in the past proposed compared with the present invention first inventor (Comparative Examples 1 be wherein a typical example), outstanding advantages be the coating apparent be improved significantly, sensitivity is able to obvious raising, the development tolerance can compare favourably with the plate of domestic and international well-known producer, is the invention that a utmost point has application prospect.
2. the present invention is with sensible heat composition of the present invention, as long as the version base is processed through sealing of hole, can obtain available positive image without preheating temperature-sensitive CTP plate, need not used bilayer coating or the multi-layer coated technology of some manufacturers both at home and abroad, but be difficult to obtain plate with practical value without the version base of sealing of hole.
3. alone pressure hot-air drying technology, the dried space of a whole page produces the cloud decorative pattern easily, but is not too big to other performance impact of plate.
4. the drying plate that goes out in alone far infrared drying road although the space of a whole page is smooth smooth, is easy to take place overheated, the roasting phenomenon of sticking with paste, particularly when control solvent content is lower than 3%, and the easier generation of this phenomenon. So the prescription of two-part drying process of the present invention and pore-sealing liquid and hole-sealing technology also are important component parts of the present invention.
Claims (13)
1. thermal CTP plate material sensible heat composition, based on the general assembly (TW) of this sensible heat composition, it comprises following component:
A) the full ether compound of one or more low molecular phenolics compounds of 7～25 weight % is as the molten/chaotropic agent of resistance, and the molecular weight of this low molecular phenolics compound is 100～400, is preferably 150～300;
B) 1～5 weight %'s has the infrared absorbing dye of absorption peak in 790～830nm optical wavelength range;
C) photo-thermal of 1～5 weight % produces acid source;
D) the conventional PS version background dye of 1～5 weight %; And
E) weight-average molecular weight of 60～90 weight % is 3000～10000 linear phenol-aldehyde resin.
2. according to the sensible heat composition of claim 1, wherein based on the general assembly (TW) of this sensible heat composition, it comprises following component:
A) the full ether compound of one or more low molecular phenolics compounds of 10～20 weight % is as the molten/chaotropic agent of resistance, and the molecular weight of this low molecular phenolics compound is 100～400:
B) 2～4 weight %'s has the infrared absorbing dye of absorption peak in 790～830nm optical wavelength range;
C) photo-thermal of 1.5～4 weight % produces acid source;
D) the conventional PS version background dye of 1～2 weight %; And
E) weight-average molecular weight of 70～80 weight % is 3000～10000, preferred 5000～8000 linear phenol-aldehyde resin.
3. according to the sensible heat composition of claim 1 or 2, wherein component A is selected from down in the group one or more:
Dihydroxymethyl paracresol the contract full ether compound of EVE (V-35) of bifocal gallic acid and the full ether compound of EVE (V-36) of two poly bisphenols;
Preferred ingredient A is selected from down in the group one or more: the contract full ether compound of EVE (V-33), 4 of two resorcinols of the full ether compound of the EVE of bisphenol-A (V-32), dihydroxymethyl paracresol, the full ether compound of the dihydropyrane of 4 '-dioxydiphenyl methane (V-34), dihydroxymethyl paracresol the contract full ether compound of EVE (V-35) of bifocal gallic acid, the full ether compound of EVE (V-36) and 4 of two poly bisphenols, the full ether compound of the EVE of 4 '-dihydroxy benaophenonel (V-300);
Special preferred ingredient A is V-32, V-33 and/or V-36.
4. according to each sensible heat composition among the claim 1-3, wherein component E is one or more linear phenolic resins that are selected from down in the group: metacresol-paracresol-formaldehyde resin, paracresol-phenol-formaldehyde resin, orthoresol-phenol-formaldehyde resin, orthoresol-paracresol-phenol-formaldehyde resin and metacresol-paracresol-phenol-formaldehyde resin are preferably metacresol-paracresol-formaldehyde resin and/or paracresol-phenol-formaldehyde resin.
5. according to each sensible heat composition among the claim 1-4, wherein the infrared absorbing dye that has an absorption peak in 790～830nm optical wavelength range as B component is an infrared absorbing dye for the flower cyanines.
6. according to each sensible heat composition among the claim 1-5, wherein producing acid source as the photo-thermal of component C be the product acid source that does not have absorption near ultraviolet and short-wavelength visible light scope, its be selected from down the group in one or more: 1,3,5-three (trichloromethyl) triazine, 1-methyl-3, two (trichloromethyl) triazines of 5-, 1-phenyl-3, two (trichloromethyl) triazines of 5-, 1-is to methoxy styryl-3, two (trichloromethyl) triazines of 5-, the carboxylate of N-hydroxyl phthalimide and paratoluensulfonyl chloride (for example phthalimide p-toluenesulfonic esters), the carboxylate of N-hydroxyl phthalimide and naphthalene sulfonyl chloride, the carboxylate of polyphenol compound and paratoluensulfonyl chloride, the triphenyl sulfosalt, diphenyl iodnium and alicyclic sulfosalt.
7. according to each sensible heat composition among the claim 1-6, wherein comprise and be selected from down in the group one or more as main dyestuff: alkaline bright blue, Victoria's ethereal blue, solvent blue, malachite green, crystal violet and methyl violet as the coloring background dye of component D.
8. according to the sensible heat composition of claim 7, wherein the coloring background dye as component D also comprises the auxiliary dyestuff of one or more conducts that is selected from down in the group: dimethyl yellow, curcumin and sudan black.
9. with the method for sensible heat preparation of compositions positive without preheating thermal CTP plate material, this method comprises the steps: according to each thermal CTP plate material among the claim 1-8 for a use
(1) aluminum substrate is carried out successively roughening treatment, anodized and sealing of hole and handles,
(2) each thermal CTP plate material carries out coated version with the sensible heat composition in will using according to claim 1-8 through the aluminum substrate that sealing of hole was handled;
The aluminum substrate through applying that (3) will obtain in step (2) carries out the two-part drying, and wherein first section is adopted FAR INFRARED HEATING to carry out drying, and second section employing forced air drying, thereby obtain positive without preheating thermal CTP plate material.
10. according to the method for claim 9, wherein the roughening treatment in the step (1) realizes by carrying out carrying out electrolyzing and coarsening after the mechanical alligatoring earlier.
11. method according to claim 9 or 10, wherein the pore-sealing liquid of sealing of hole processing use is for being selected from down the pore-sealing liquid of one or more hole sealing agents acquisitions of organizing with deionized water and/or distilled water diluting: potassium dihydrogen phosphate-potassium fluoride, potassium dihydrogen phosphate-tartrate list sodium salt-potassium fluoride, potassium dihydrogen phosphate-sodium silicate-potassium fluoride, sodium dihydrogen phosphate-sodium fluoride, sodium metaaluminate-sodium fluoride, sodium dihydrogen phosphate-β-I is peaceful, sodium silicate-sodium fluoride, sodium metaaluminate, sodium potassium tartrate tetrahydrate-tartrate and sodium silicate-tartrate, preferred hole sealing agent is potassium dihydrogen phosphate-potassium fluoride or sodium dihydrogen phosphate-sodium fluoride.
12. according to each method among the claim 9-11, it wherein is the heat-sensitive plate-making machine of main output for 800nm, select the Infrared dyes that absorption peak is arranged in 790～800nm optical wavelength range for use, and, select the infrared absorbing dye that absorption peak is arranged in 810～830nm optical wavelength range for use for the heat-sensitive plate-making machine that 830nm is main output.
13. according to each method among the claim 9-12, wherein the drying in the step (3) is carried out in the dry road of two-part, first section of this drying road is adopted the FAR INFRARED HEATING drying, and second section is adopted the forced air drying; The length ratio in the dry road of FAR INFRARED HEATING dryer section and forced air dryer section is 2: 1～1: 1, and in the FAR INFRARED HEATING dryer section, space of a whole page temperature is no more than 120 ℃, and the gas flow temperature of forced air dryer section is 105-115 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101781436A CN101738856B (en) | 2008-11-24 | 2008-11-24 | Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101781436A CN101738856B (en) | 2008-11-24 | 2008-11-24 | Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101738856A true CN101738856A (en) | 2010-06-16 |
| CN101738856B CN101738856B (en) | 2012-11-07 |
Family
ID=42462493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101781436A Expired - Fee Related CN101738856B (en) | 2008-11-24 | 2008-11-24 | Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101738856B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881928A (en) * | 2010-06-22 | 2010-11-10 | 刘华礼 | Method for preparing film-free positive image PS plate |
| CN102314090A (en) * | 2011-05-10 | 2012-01-11 | 刘华礼 | Preparation method of CTCP (Client-to-Client Protocol) version |
| CN103660665A (en) * | 2013-12-05 | 2014-03-26 | 泰州市东方印刷版材有限公司 | Hole sealing technology for printing plate making |
| CN104391428A (en) * | 2014-11-20 | 2015-03-04 | 京东方科技集团股份有限公司 | Photosensitizer containing diazo group, photoresist composition and preparation methods of photosensitizer and photoresist composition |
| CN106634143A (en) * | 2016-12-26 | 2017-05-10 | 泰兴市印刷版材有限公司 | Preparation method of hole sealing solution for printing plate material |
| CN106997157A (en) * | 2017-06-06 | 2017-08-01 | 长葛市汇达感光材料有限公司 | A kind of method for sealing of photosensitive material plate |
| CN116493228A (en) * | 2023-04-14 | 2023-07-28 | 福建宝士嘉印刷器材有限公司 | Oven device of CTP edition material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1209679C (en) * | 2002-10-17 | 2005-07-06 | 北京师范大学 | Thermal sensitive imaging composition for direct platemaking by positive thermal sensitive computer |
| CN1297853C (en) * | 2003-09-30 | 2007-01-31 | 北京师范大学 | Image-forming composition for heat-sensitive CTP image base, acid generating source for the composition and preparation thereof |
-
2008
- 2008-11-24 CN CN2008101781436A patent/CN101738856B/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881928A (en) * | 2010-06-22 | 2010-11-10 | 刘华礼 | Method for preparing film-free positive image PS plate |
| CN102314090A (en) * | 2011-05-10 | 2012-01-11 | 刘华礼 | Preparation method of CTCP (Client-to-Client Protocol) version |
| CN103660665A (en) * | 2013-12-05 | 2014-03-26 | 泰州市东方印刷版材有限公司 | Hole sealing technology for printing plate making |
| CN104391428A (en) * | 2014-11-20 | 2015-03-04 | 京东方科技集团股份有限公司 | Photosensitizer containing diazo group, photoresist composition and preparation methods of photosensitizer and photoresist composition |
| CN104391428B (en) * | 2014-11-20 | 2018-06-19 | 京东方科技集团股份有限公司 | Emulsion, photoetching compositions and preparation method containing diazonium groups |
| CN106634143A (en) * | 2016-12-26 | 2017-05-10 | 泰兴市印刷版材有限公司 | Preparation method of hole sealing solution for printing plate material |
| CN106997157A (en) * | 2017-06-06 | 2017-08-01 | 长葛市汇达感光材料有限公司 | A kind of method for sealing of photosensitive material plate |
| CN116493228A (en) * | 2023-04-14 | 2023-07-28 | 福建宝士嘉印刷器材有限公司 | Oven device of CTP edition material |
| CN116493228B (en) * | 2023-04-14 | 2024-03-29 | 福建宝士嘉印刷器材有限公司 | Oven device of CTP edition material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101738856B (en) | 2012-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101738856B (en) | Heat-sensible composition for positive thermosensitive CTP plate without preheating and plate-making method by using same | |
| CN1954007B (en) | Thermally reactive infrared absorption polymers and their use in a heat sensitive lithographic printing plate | |
| CN102540730B (en) | Positive image ultraviolet-computer-to-plate ((UV-CTP) planographic printing plate | |
| EP1074887B1 (en) | Radiation-sensitive compositions for printing plates for improving their chemical and developer resistance and printing plates comprising said compositions | |
| CN101454159A (en) | Method for making a lithographic printing plate | |
| CN102159399B (en) | Lithographic printing plate precursor | |
| CN101828148A (en) | Positive lithographic printing plate precursor and method for producing the same | |
| CN101770169B (en) | Positive lithograph plate photosensitive composition with high resolution and high sensitivity | |
| CN103154817B (en) | Direct description type waterless lithographic plate | |
| CN101770167B (en) | Positive type infrared light sensitive composition and positive heat-sensitive lithographic plate | |
| CN103885286B (en) | A kind of positive heat-sensitive photosensitive composition and its application | |
| CN100589976C (en) | Method for manufacturing printing plate | |
| CN104742492A (en) | Double-coating positive thermosensitive CTP plate | |
| CN1248006A (en) | Imaging material capable of eliminating picture | |
| CN1297853C (en) | Image-forming composition for heat-sensitive CTP image base, acid generating source for the composition and preparation thereof | |
| DE69916162T2 (en) | IR and UV radiation sensitive composition and offset printing plate | |
| DE60122408T2 (en) | Thermosensitive lithographic printing plate, support for the plate and method of making the same | |
| CN108181786A (en) | A kind of IR-sensitive composition and its printing plate precursor as made from the composition | |
| CN101762972B (en) | Infrared positive thermal-sensitive imaging composition | |
| JPS6389864A (en) | Photosensitive lithographic printing plate | |
| CN101762982B (en) | Infrared positive thermal-sensitive offset plate | |
| CN101959685A (en) | A method for making a lithographic printing plate | |
| JPH0339301B2 (en) | ||
| CN100510959C (en) | Photosensitive composition and lithograph plate made of same | |
| CN103885287B (en) | Photosensitive composition with sulfonyl hydrazone-modified phenolic resin as acid-producing agent and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20151124 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |