CN109772783B - Steam cleaning device - Google Patents
Steam cleaning device Download PDFInfo
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- CN109772783B CN109772783B CN201810803238.6A CN201810803238A CN109772783B CN 109772783 B CN109772783 B CN 109772783B CN 201810803238 A CN201810803238 A CN 201810803238A CN 109772783 B CN109772783 B CN 109772783B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Abstract
The steam cleaning device comprises: a vapor generator for generating saturated vapor; a superheater configured to generate superheated steam by superheating the saturated steam; a first valve located between the steam generator and the superheater for regulating the amount of saturated steam injected into the superheater; a nozzle portion connected to the superheater; and a second valve, located between the steam generator and the nozzle portion, for adjusting the amount of the saturated steam supplied to the nozzle portion, the nozzle portion injecting at least one of the saturated steam and the superheated steam.
Description
Technical Field
The present invention relates to a steam cleaning device, and more particularly, to a steam cleaning device using saturated steam and superheated steam.
Background
Impurities such as particles, oil, and specks may be generated in a process for manufacturing a display substrate, a process for manufacturing a semiconductor device, and the like. To remove such impurities, a cleaning device is used.
As such a cleaning apparatus, a water jet (water-jet) method is used, which removes impurities by directly spraying deionized water (deionized water) to a cleaning object. Such a water jet system may limit the types of impurities or cleaning power that can be cleaned depending on the size of the water droplet particles by using the physical striking force of the water droplets. For example, since the water jet method has a water droplet particle size of about 15 to 20 μm, impurities such as fine slurry (slurry), organic matter, and polymer, which have a size smaller than the water droplet particle size, may not be cleaned by the water jet method.
Disclosure of Invention
The present invention provides a steam cleaning device capable of cleaning impurities such as fine slurry, organic matters, and polymers having a size smaller than the size of nano-sized water droplet particles.
The steam cleaning device according to an embodiment of the present invention includes: a vapor generator for generating saturated vapor; a superheater configured to generate superheated steam by superheating the saturated steam; a first valve located between the steam generator and the superheater for regulating the amount of saturated steam injected into the superheater; a nozzle portion connected to the superheater; and a second valve, located between the steam generator and the nozzle portion, for adjusting the amount of the saturated steam supplied to the nozzle portion, the nozzle portion injecting at least one of the saturated steam and the superheated steam.
The temperature of the superheated steam may be higher than the temperature of the saturated steam, and the pressure of the superheated steam may be the same as the pressure of the saturated steam.
The first valve may be a flow regulating valve capable of regulating the amount of the saturated vapor injected into the superheater.
The second valve may be a flow rate adjustment valve capable of adjusting the amount of the saturated vapor supplied to the nozzle portion.
The steam cleaning device of an embodiment of the present invention may further include: a first connecting line connected to the vapor generator; a first connection pipe seat connected to the first connection pipe; a second connecting pipe connected to the first connecting pipe seat and the injection port of the superheater; a third connection pipe connected to the first connection pipe holder; a fourth connecting line connected to an outflow port of the superheater; a second connection pipe holder connected to the third connection pipe and the fourth connection pipe; and a fifth connecting pipe connected between the second connection tube holder and the nozzle portion.
The first valve may be connected to the second connecting line and regulate the amount of the saturated vapor injected into the superheater via the second connecting line.
The second valve may be connected to the third connection pipe and adjust the amount of the saturated vapor supplied to the second connection pipe seat via the third connection pipe.
The nozzle portion may include: a first injection line including a vapor injection port injecting at least one of the saturated vapor and the superheated vapor and an air injection port injecting clean dry air; a nozzle head including a first water injection port into which ultrapure water is injected and an injection slit for injecting vapor; a suction hood surrounding a periphery of an outlet for ejecting the vapor in the nozzle head; and a suction line for sucking and discharging the vapor in the suction hood.
The nozzle portion may further include a second injection line for injecting the ultrapure water into the suction hood.
The spacing of the ejection slots of the nozzle head may be 0.15mm.
The velocity of the vapor ejected from the nozzle head may be a velocity in the range of 350m/s to 550 m/s.
The steam cleaning method according to another embodiment of the present invention includes the steps of: generating saturated vapor in a vapor generator; determining whether to perform saturated vapor purging in which the saturated vapor is supplied to a nozzle portion or to perform superheated vapor purging in which superheated vapor obtained by superheating the saturated vapor by a superheater is supplied to the nozzle portion; closing a first valve connected between the steam generator and the superheater and adjusting a second valve connected between the steam generator and the nozzle portion when the saturated steam purge is performed; and closing the second valve and adjusting the first valve and injecting the saturated vapor into the superheater while the superheated vapor purge is performed.
The step of injecting the saturated vapor into the superheater may comprise: the amount of saturated vapor injected into the superheater is adjusted by adjusting the first valve, thereby determining the temperature of the superheated vapor generated in the superheater.
The temperature of the superheated steam may be higher than the temperature of the saturated steam, and the pressure of the superheated steam may be the same as the pressure of the saturated steam.
The method may further comprise the steps of: and injecting clean and dry air and ultrapure water into the nozzle section, and mixing and injecting one of the saturated steam and the superheated steam supplied to the nozzle section with the clean and dry air and the ultrapure water.
The method may further comprise the steps of: judging whether or not to perform mixed vapor purging in which the saturated vapor and the superheated vapor are mixed and supplied to the nozzle unit; and when the mixed vapor purge is performed, adjusting the first valve to supply a part of the saturated vapor generated in the vapor generator into the superheater, and adjusting the second valve to supply a part of the saturated vapor generated in the vapor generator into the nozzle portion.
The present invention can perform steam cleaning using saturated steam and steam cleaning using superheated steam by using one steam cleaning device. Accordingly, it is not necessary to independently operate the vapor cleaning device using saturated vapor and the vapor cleaning device using superheated vapor, and thus the manufacturing cost of the display substrate or the semiconductor element can be reduced.
Drawings
Fig. 1 is a block diagram schematically showing a steam cleaning device according to an embodiment of the present invention.
Fig. 2 shows a nozzle part included in the steam cleaning device of fig. 1.
Fig. 3 shows the results of simulation of the velocity distribution of the steam injected from the nozzle portion of the steam cleaning device of fig. 1.
Fig. 4 is a flow chart showing a steam cleaning method according to an embodiment of the present invention.
Fig. 5 is a flow chart showing a steam cleaning method according to another embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily implement the present invention. This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
For the purpose of clarity of explanation of the present invention, parts not related to the explanation are omitted, and the same reference numerals are used for the same or similar constituent elements throughout the specification.
For convenience, the size and thickness of each structure shown in the drawings are arbitrarily shown, and therefore the present invention is not necessarily limited to the illustrations. In the drawings, the thickness is exaggerated for the purpose of clearly expressing a plurality of layers and regions. In the drawings, the thicknesses of partial layers and regions are exaggerated for convenience of explanation.
Further, when a portion of a layer, film, region, or plate, etc. is referred to as being "above" or "upper" other portions, this includes not only the case of being "directly" above "other portions, but also the case of having other portions in between. Conversely, when it is said that a certain portion is "directly" located "above" another portion, it means that there is no other portion in the middle. The term "upper" or "upper" located above or below the reference portion does not necessarily mean "above" or "upper" located in the direction opposite to the gravitational force.
In addition, throughout the specification, when a certain portion "includes" a certain structural element, this means that other structural elements are not excluded and other structural elements may be further included unless specifically stated to the contrary.
In addition, throughout the specification, the term "overlapping" means overlapping one another in a cross section or being located in the same region in whole or in part in a plane.
Next, a steam cleaning device according to an embodiment of the present invention will be described with reference to fig. 1 to 3.
Fig. 1 is a block diagram schematically showing a steam cleaning device according to an embodiment of the present invention.
Referring to fig. 1, the steam cleaning device 100 includes a steam generator 10, a superheater 20, a nozzle unit 30, a first valve 41, and a second valve 42.
The steam generator 10 may include an inner space capable of receiving deionized water DIW, and the deionized water DIW may be received in the inner space of the steam generator 10. Deionized water DIW is purified water from which dissolved ions are completely removed. The vapor generator 10 may include a heater 11 located inside the container. The heater 11 can heat the deionized water DIW contained in the vapor generator 10. The saturated vapor S1 may be generated by heating the deionized water DIW contained in the vapor generator 10 by the heater 11. The temperature of the saturated vapor S1 may be about 150 ℃. The steam generator 10 is connected to the first connection pipe 51, and the generated saturated steam S1 may be discharged to the outside of the steam generator 10 through the first connection pipe 51.
The first connection pipe 51 is connected to the first connection socket 61. The first connection socket 61 may connect the first, second and third connection pipes 51, 52 and 53 to each other. That is, the first connection pipe holder 61 may be a three-way connection pipe holder, and the saturated vapor S1 supplied via the first connection pipe 51 may be separately supplied to the second connection pipe 52 and the third connection pipe 53 through the first connection pipe holder 61.
The second connection pipe 52 is connected to the injection port of the superheater 20, and a first valve 41 may be provided between the injection port of the superheater 20 and the first connection pipe seat 61. That is, the first valve 41 may be connected to the second connection pipe 52 and adjust the amount of the saturated vapor S1 supplied via the second connection pipe 52. The first valve 41 may be an automatic valve that automatically opens and closes according to an electric signal. Further, the first valve 41 may be a flow rate adjustment valve capable of adjusting the amount of the saturated vapor S1 supplied via the second connection pipe 52.
The superheater 20 superheats the saturated vapor S1 injected through the second connection pipe 52 to generate superheated vapor (superheated steam) S2. The superheater 20 may allow the saturated vapor S1 to pass directly without staying in the interior of the superheater 20, and the superheater 20 may apply heat to the passed saturated vapor S1 to generate superheated vapor S2 having the same pressure as the saturated vapor S1. That is, the superheated vapor S2 may be vapor having the same pressure as the saturated vapor S1 but a temperature higher than the saturated vapor S1. The temperature of the superheated steam S2 may be about 200 ℃. According to an embodiment, the temperature of the superheated vapor S2 may be a temperature in the range of about 200 ℃ to 400 ℃.
In addition, the superheater 20 may include an additional heating module (not shown) capable of superheating the injected saturated vapor S1, with which the saturated vapor S1 may be superheated. Such a heating module may superheat the saturated vapor S1 by a predetermined amount of heat, and may determine the temperature of the superheated vapor S2 generated in the superheater 20 according to the amount of the saturated vapor S1 supplied to the superheater 20 through the first valve 41. For example, in the case where the amount of the saturated vapor S1 supplied into the superheater 20 is reduced by the first valve 41, the temperature of the superheated vapor S2 generated in the superheater 20 can be raised. Further, in the case where the amount of the saturated vapor S1 supplied to the superheater 20 is increased by the first valve 41, the temperature of the superheated vapor S2 generated in the superheater 20 can be reduced. That is, when the heating module of the superheater 20 superheats the saturated vapor S1 by a predetermined amount of heat, the temperature of the superheated vapor S2 can be adjusted by the first valve 41.
The outflow port of the superheater 20 is connected to a fourth connection line 54, and superheated steam S2 generated in the superheater 20 can be discharged to the outside of the superheater 20 via the fourth connection line 54. Fourth connecting tube 54 may be connected to second connection tube holder 62.
The third connection pipe 53 is connected to the second connection pipe holder 62, and the second valve 42 may be connected to the third connection pipe 53 and adjust the amount of saturated vapor S1 supplied to the second connection pipe holder 62 via the third connection pipe 53. The second valve 42 may be an automatic valve that automatically opens and closes according to an electric signal. Further, the second valve 42 may be a flow rate adjustment valve capable of adjusting the amount of the saturated vapor S1 supplied via the third connection line 53.
The second connection tube holder 62 may connect the third connection tube 53, the fourth connection tube 54, and the fifth connection tube 55 connected to the nozzle portion 30 to each other. That is, the second connection tube holder 62 may be a three-way connection tube holder. The saturated vapor S1 supplied via the third connecting pipe 53 may be supplied into the fifth connecting pipe 55 through the second connecting pipe seat 62, and supplied into the nozzle portion 30 via the fifth connecting pipe 55. Further, the superheated steam S2 supplied via the fourth connection pipe 54 may be supplied into the fifth connection pipe 55 through the second connection pipe seat 62, and supplied into the nozzle portion 30 via the fifth connection pipe 55.
The nozzle portion 30 can spray the received saturated vapor S1 or superheated vapor S2 toward a cleaning target (see PL of fig. 2) such as a display substrate or a semiconductor element. When the superheated steam S2 generated in the superheater 20 by opening the first valve 41 is supplied to the nozzle portion 30, the second valve 42 may be closed. Alternatively, when the second valve 42 is opened to supply the saturated vapor S1 to the nozzle portion 30, the first valve 41 may be closed. Thereby, the nozzle unit 30 can spray the received saturated vapor S1 or superheated vapor S2 toward the cleaning target PL.
The particle size of the saturated vapor S1 may be about 10 μm, and the particle size of the superheated vapor S2 may be about 2 to 3 μm. The saturated vapor S1 may be used in removing residual slurry, residual organic matters, photoresist, or the like in a process of manufacturing a display substrate or a semiconductor device. In addition, the superheated vapor S2 may be used in cleaning a ultrafine (submicron) pattern or etching a polymer or the like in a process for manufacturing a display substrate or a semiconductor element. Since the superheated steam S2 does not form saturated water due to its high dryness, there is no resistance caused by the saturated water during movement of the superheated steam S2, and the superheated steam S2 is not injected together with the saturated water, so that the particle size of the steam is easily controlled. Further, since the superheated steam S2 can be ejected with a high heat while maintaining the same pressure as the ejection pressure of the saturated steam S1, physical damage to the cleaning object PL can be reduced. The superheated steam S2 has a molecular motion more active than that of the saturated steam S1, and is advantageous for cleaning substances and the like which react only at a high temperature. In addition, since the superheated steam S2 is in a pure water molecular state, it is less likely to be oxidized by oxygen.
In addition, according to the embodiment, the nozzle portion 30 may spray the mixed vapor S3, in which the saturated vapor S1 and the superheated vapor S2 are mixed, toward the cleaning object PL. For example, when the first valve 41 and the second valve 42 are opened, the saturated vapor S1 and the superheated vapor S2 may be joined together in the second connection tube holder 62 to generate the mixed vapor S3 in which the saturated vapor S1 and the superheated vapor S2 are mixed, and the mixed vapor S3 may be supplied to the nozzle unit 30. At this time, the temperature of the generated superheated steam S2 may be adjusted by adjusting the amount of the saturated steam S1 supplied to the superheater 20 through the first valve 41, and the temperature of the mixed steam S3 in which the saturated steam S1 and the superheated steam S2 are mixed may be determined by adjusting the amount of the saturated steam S1 supplied through the second valve 42. The nozzle unit 30 may spray the mixed vapor S3, in which the saturated vapor S1 and the superheated vapor S2 are mixed, toward the cleaning target PL.
In this way, the steam cleaning device 100 can selectively perform saturated steam cleaning using the saturated steam S1, superheated steam cleaning using the superheated steam S2, or mixed steam cleaning using the mixed steam S3.
If the cleaning device that performs the saturated vapor cleaning and the cleaning device that performs the superheated vapor cleaning are separately manufactured, it is necessary to provide a heating device, a connection pipe, and an electric device for the cleaning device in each cleaning device, and thus there is a possibility that manufacturing costs of the cleaning devices may be increased. Further, since it is necessary to separately provide a space for each cleaning device, there is a possibility that the space occupied by the cleaning device in the workshop may be increased. Further, since it is necessary to supply power to each cleaning device independently, there is a possibility that the amount of power supply to the cleaning device increases.
However, as in the embodiment of the present invention, the saturated steam cleaning and the superheated steam cleaning can be selectively performed by one steam cleaning device 100, and thus the manufacturing cost of the cleaning device can be relatively reduced. In addition, since the saturated steam cleaning and the superheated steam cleaning can be selectively performed by one steam cleaning device 100, the space occupied by the cleaning device in the workshop can be reduced. Further, since only one steam cleaning device 100 needs to be supplied with power and additional power needs to be further supplied to the superheater 20, power consumption can be reduced as compared with the case where two cleaning devices are operated.
Next, the nozzle unit 30 will be described in more detail with reference to fig. 2 and 3.
Fig. 2 shows a nozzle part included in the steam cleaning device of fig. 1. Fig. 3 shows the results of simulation of the vapor velocity distribution of the vapor ejected from the nozzle unit of the vapor cleaning device of fig. 1.
Referring to fig. 2, the nozzle portion 30 includes a first injection line 31, a nozzle head 32, a suction hood 33, a second injection line 34, and a suction line 35.
The first injection line 31 may include: the steam injection port 31-1 connected to the fifth connection pipe 55 shown in fig. 1; and an air injection port 31-2 for injecting Clean Dry Air (CDA). Any one of the saturated vapor S1, the superheated vapor S2, and the mixed vapor S3 can be injected from the fifth connection line 55 to the first injection line 31 via the vapor injection port 31-1. The clean dry air CDA can be injected into the first injection line 31 through the air injection port 31-2. Any one of the saturated vapor S1, the superheated vapor S2, and the mixed vapor S3 and the clean dry air CDA can be mixed in the first injection line 31. The vapor mixed with the clean and dry air CDA can be supplied from the first injection line 31 to the nozzle head 32.
The nozzle head 32 may include a first water injection port 32-1 and a spray slit 32-2. Ultrapure water (UPW) can be injected into the nozzle head 32 via the first water injection port 32-1. The ultra-pure water UPW can be used for removing H 2 Deionized water DIW in which no inorganic or mineral plasma component is present other than the O component. The vapor mixed with the clean dry air CDA and the ultrapure water UPW may be mixed in the nozzle head 32 and sprayed through the spray slit 32-2. The interval GP between the outlet of the finally ejected vapor in the ejection head 32 and the cleaning object PL such as a display substrate or a semiconductor element may be determined by considering the ejected vapor speed, the characteristics of the cleaning object PL, the kind of impurities, and the like. In addition, the nozzle head 32 may be fabricated with a vapor-resistant material at predetermined intervalsThe ejection slit 32-2 enables vapor ejected from the outlet of the nozzle head 32 to have prescribed ejection characteristics. For example, the ejection slots 32-2 may be made of titanium having high hardness and low thermal conductivity and thermal expansion coefficient at intervals of about 0.15mm.
As shown in fig. 3, in the case where the interval of the ejection slits 32-2 is 0.15mm and the interval GP between the outlet of the nozzle head 32 and the cleaning object PL is 6mm, the vapor velocity distribution ejected from the nozzle head 32 was simulated. The vapor velocity of the ejection from the nozzle head 32 is about 450m/s, and the vapor velocity is about 100-200m/s on the surface of the cleaning object PL 6mm from the outlet of the nozzle head 32. According to the embodiment, the vapor velocity ejected from the ejection head 32 can be adjusted. For example, the vapor velocity ejected from the ejection head 32 may be a velocity in the range of about 350m/s to 550 m/s. Alternatively, the vapor velocity ejected from the nozzle head 32 may be a velocity in the range of about 400m/s to 500 m/s.
The vapor sprayed from the nozzle head 32 after mixing with deionized water DIW may vibrate at a frequency of about 10KHz to 1MHz as bubbles of nanoparticles through heat exchange and phase change. By vibration of such frequency, H 2 O can be decomposed into hydrogen ions (H + ) And hydroxide ion (OH) - ). Can be prepared from hydroxyl ions (OH - ) The peeling (lift off) effect by the electrostatic force separates the foreign matter of the cleaning object PL from the cleaning object PL. In addition, when the bubbles of the nanoparticles impact the surface of the cleaning object PL, impurities inside the structure in the form of holes (holes) of the cleaning object PL, for example, can be removed by shock wave (wave) or cavitation (cavitation).
Referring again to fig. 2, a suction hood 33 may be attached to the nozzle head 32 in a manner surrounding the outlet periphery of the nozzle head 32. That is, the nozzle head 32 may be located within the suction hood 33. Also, a second injection line 34 and a suction line 35 may be connected to the edge of the suction hood 33.
At the edge of the suction hood 33, two or more second injection lines 34 may be provided, and ultrapure water UPW may be injected into the suction hood 33 via the second injection lines 34. The second injection line 34 may supply ultrapure water UPW into the suction hood 33, thereby preventing vapor injected from the nozzle head 32 from diffusing out of the suction hood 33.
More than two suction lines 35 may be provided at the edge of the suction hood 33, and the suction lines 35 may be connected to the external exhaust line EX. The external exhaust line EX may provide the suction line 35 with a suction force generated by exhaust. The suction line 35 sucks the vapor, ultrapure water UPW, impurities separated by the vapor, and the like in the suction hood 33, and discharges the vapor into the exhaust line EX.
In addition, the cleaning object PL is supported by the driving member DR. The cleaning object PL can be moved by the driving member DR while maintaining a predetermined gap GP from the outlet of the nozzle head 32. The kind or function of the driving part DR is not limited.
An embodiment of a steam cleaning method using the steam cleaning device 100 shown in fig. 1 will be described below with reference to fig. 4.
Fig. 4 is a flow chart showing a steam cleaning method according to an embodiment of the present invention.
Referring to fig. 4, deionized water DIW may be stored in the steam generator 10, and the heater 11 may heat the deionized water DIW to generate saturated steam S1 (S110). The temperature of the saturated vapor S1 may be about 150 ℃.
When the saturated vapor S1 is generated in the vapor generator 10, the first valve 41 and the second valve 42 may be closed, and the closed state of the first valve 41 and the second valve 42 may be maintained until the temperature and the pressure of the saturated vapor S1 become predetermined temperatures and pressures (S120).
It is determined whether to perform saturated vapor cleaning using the saturated vapor S1 or to perform superheated vapor cleaning using the superheated vapor S2 (S130). That is, it is determined whether to perform the saturated steam purge in which the saturated steam S1 is supplied to the nozzle portion 30 or the superheated steam purge in which the superheated steam S2 in which the saturated steam S1 is superheated by the superheater 20 is supplied to the nozzle portion 30. The saturated vapor cleaning or the superheated vapor cleaning may be determined according to the kind of the cleaning object PL or the kind of the impurity to be removed.
When the saturated vapor purging is performed, the saturated vapor S1 may be supplied to the nozzle portion 30 by adjusting the second valve 42 (S131). At this time, the first valve 41 remains in the closed state. The second valve 42 can adjust the amount of the saturated vapor S1 supplied to the nozzle unit 30. Thereby, the saturated vapor S1 having a predetermined pressure can be supplied to the nozzle unit 30.
The saturated vapor S1 supplied to the nozzle portion 30 is injected through the nozzle portion 30 (S132). In the nozzle unit 30, the cleaning and drying air CDA, the ultrapure water UPA, and the saturated vapor S1 may be mixed and sprayed, so that the impurities of the cleaning object PL may be removed. Such saturated vapor cleaning is useful in removing residual slurry, residual organic matter, photoresist, or the like in a process for manufacturing a display substrate or a semiconductor device.
After removing the foreign matter of the cleaning object PL, the second valve 42 may be closed to end the saturated vapor cleaning (S133). At this time, the power supply to the heater 11 may be turned off.
In addition, when the superheated steam purge is performed, the saturated steam S1 may be injected into the superheater 20 by adjusting the first valve 41 (S141). At this time, the second valve 42 remains in the closed state.
The superheater 20 superheats the saturated steam S1 to generate superheated steam S2 (S142). The superheater 20 can cause the generated superheated steam S2 to have the same pressure as the saturated steam S1 by avoiding the saturated steam S1 to stay inside the superheater 20. The temperature of the superheated steam S2 generated in the superheater 20 can be determined by adjusting the amount of saturated steam S1 supplied into the superheater 20 by the first valve 41. The temperature of the superheated steam S2 may be about 200 ℃. According to an embodiment, the temperature of the superheated vapor S2 may be a temperature in the range of about 200 ℃ to 400 ℃.
The superheated steam S2 generated in the superheater 20 is supplied to the nozzle unit 30, and the superheated steam S2 supplied to the nozzle unit 30 is injected through the nozzle unit 30 (S143). In the nozzle portion 30, the cleaning and drying air CDA, the ultrapure water UPW, and the superheated steam S2 may be mixed and sprayed, so that the foreign substances of the cleaning object PL may be removed. Such superheated steam may be used for cleaning ultrafine patterns or ultrafine etching polymers in a process for manufacturing a display substrate or a semiconductor device.
After removing the foreign matter of the cleaning object PL, the first valve 41 may be closed to end the superheated steam cleaning (S144). At this time, the power supply to the heater 11 may be turned off.
The saturated steam purge and the superheated steam purge may be continuously performed. In this case, the next superheated steam cleaning process may be performed after the saturated steam cleaning is finished without turning off the power of the heater 11. Further, the next saturated vapor cleaning process may be performed after the end of the superheated vapor cleaning without turning off the power of the heater 11.
Next, another embodiment of a steam cleaning method using the steam cleaning device 100 shown in fig. 1 will be described with reference to fig. 5.
Fig. 5 is a flow chart showing a steam cleaning method according to another embodiment of the present invention.
Referring to fig. 5, deionized water DIW may be stored in the steam generator 10, and the heater 11 heats the deionized water DIW to generate saturated steam S1 (S210).
When the saturated vapor S1 is generated in the vapor generator 10, the first valve 41 and the second valve 42 may be closed, and the closed state of the first valve 41 and the second valve 42 may be maintained until the temperature and the pressure of the saturated vapor S1 become predetermined temperatures and pressures (S220).
It is determined whether to perform saturated vapor cleaning using the saturated vapor S1 or to perform superheated vapor cleaning using the superheated vapor S2 (S230).
In the case where the saturated vapor cleaning is not performed, it is determined whether the superheated vapor cleaning is to be performed or the mixed vapor cleaning using the mixed vapor S3 in which the saturated vapor S1 and the superheated vapor S2 are mixed is to be performed (S240).
When the mixed vapor purge is performed, a part of the saturated vapor S1 generated in the vapor generator 10 may be supplied into the superheater 20 by adjusting the first valve 41, and a part of the saturated vapor S1 generated in the vapor generator 10 may be supplied into the nozzle portion 30 by adjusting the second valve 42 (S251).
The superheated steam S2 may be generated by superheating a portion of the saturated steam S1 supplied to the superheater 20 by the superheater 20 (S252). The superheater 20 can cause the generated superheated steam S2 to have the same pressure as the saturated steam S1 by avoiding the saturated steam S1 to stay inside the superheater 20. The temperature of the superheated steam S2 generated in the superheater 20 can be determined by adjusting the amount of saturated steam S1 supplied into the superheater 20 by the first valve 41. The superheated steam S2 generated in the superheater 20 may be supplied into the nozzle portion 30.
The saturated vapor S1 and the superheated vapor S2 may be combined in the second connection tube holder 62 to generate the mixed vapor S3, and the mixed vapor S3 is injected through the nozzle part 30 (S253). The nozzle unit 30 may spray the cleaning and drying air CDA, the ultrapure water UPW, and the mixed vapor S3 in a mixed manner.
After removing the impurity of the cleaning target PL by the mixed vapor S3, the first valve 41 and the second valve 42 may be closed to end the mixed vapor cleaning (S254). At this time, the power supply to the heater 11 may be turned off.
In addition, when the saturated vapor purging is performed, the saturated vapor S1 may be supplied into the nozzle portion 30 by adjusting the second valve 42 (S231). At this time, the first valve 41 remains in the closed state. The second valve 42 can adjust the amount of the saturated vapor S1 supplied to the nozzle unit 30. Thereby, the saturated vapor S1 having a predetermined pressure can be supplied to the nozzle unit 30.
The saturated vapor S1 supplied to the nozzle unit 30 is injected through the nozzle unit 30 (S232). In the nozzle portion 3, the cleaning and drying air CDA, the ultrapure water UPW, and the saturated vapor S1 may be mixed and sprayed, so that the impurities of the cleaning object PL may be removed.
After removing the foreign matter of the cleaning object PL, the second valve 42 may be closed to end the saturated vapor cleaning (S233). At this time, the power supply to the heater 11 may be turned off.
In addition, when the superheated steam purge is performed, the saturated steam S1 may be injected into the superheater 20 by adjusting the first valve 41 (S241). At this time, the second valve 42 remains in the closed state.
The superheated steam S2 generated in the superheater 20 is supplied to the nozzle portion 30, and the superheated steam S2 supplied to the nozzle portion 30 is injected through the nozzle portion 30 (S243). In the nozzle portion 30, the cleaning and drying air CDA, the ultrapure water UPW, and the superheated steam S2 may be mixed and sprayed, so that the foreign substances of the cleaning object PL may be removed.
After removing the foreign matter of the cleaning object PL, the first valve 41 may be closed to end the superheated steam cleaning (S244). At this time, the power supply to the heater 11 may be turned off.
The saturated vapor purge, the superheated vapor purge, and the mixed vapor purge may be continuously performed. In this case, after the saturated steam cleaning is finished, the next superheated steam cleaning process or the mixed steam cleaning process may be performed without turning off the power of the heater 11. Further, after the end of the superheated steam cleaning, the next saturated steam cleaning process or the mixed steam cleaning process may be performed without turning off the power of the heater 11. Further, after the end of the mixed vapor cleaning, the next saturated vapor cleaning process or the superheated vapor cleaning process may be performed without turning off the power of the heater 11.
The drawings referred to so far and the detailed description of the invention described are merely examples of the present invention, which are used merely for the purpose of illustrating the invention and are not used for the purpose of limiting the meaning or limiting the scope of the invention described in the claims. Therefore, it will be appreciated by those skilled in the art that many modifications may be made and other equivalent embodiments may be made based on the above embodiments. Therefore, the true technical scope of the present invention should be determined by the technical ideas of the appended claims.
Description of the reference numerals
10: steam generator
20: superheater with a heat exchanger
30: nozzle part
41: first valve
42: second valve
Claims (9)
1. A steam cleaning device, comprising:
a vapor generator for generating saturated vapor;
a superheater configured to generate superheated steam by superheating the saturated steam;
a first valve located between the steam generator and the superheater for regulating the amount of saturated steam injected into the superheater;
a nozzle portion connected to the superheater; and
a second valve, located between the steam generator and the nozzle portion, for adjusting the amount of the saturated steam supplied to the nozzle portion,
the nozzle portion sprays at least one vapor of the saturated vapor and the superheated vapor,
the steam cleaning device is capable of selectively performing saturated steam cleaning using the saturated steam, superheated steam cleaning using the superheated steam, or mixed steam cleaning using a mixed steam of the saturated steam and the superheated steam,
the nozzle portion includes:
a first injection line including a vapor injection port that injects at least one of the saturated vapor and the superheated vapor;
a nozzle head including an injection slit for injecting vapor;
a suction hood surrounding a periphery of an outlet for ejecting the vapor in the nozzle head; and
a suction pipe for sucking and discharging the vapor in the suction hood,
at least two second injection lines are provided at the edge of the suction hood, the second injection lines being for supplying ultrapure water into the suction hood for preventing diffusion of the vapor ejected from the nozzle head to the outside of the suction hood.
2. The steam cleaning device of claim 1, wherein,
the temperature of the superheated steam is higher than the temperature of the saturated steam, and the pressure of the superheated steam is the same as the pressure of the saturated steam.
3. The steam cleaning device of claim 1, wherein,
the first valve is a flow rate adjustment valve capable of adjusting the amount of the saturated vapor injected into the superheater.
4. The steam cleaning device of claim 1, wherein,
the second valve is a flow rate adjustment valve capable of adjusting the amount of the saturated vapor supplied to the nozzle unit.
5. The steam cleaning device of claim 1, further comprising:
a first connecting line connected to the vapor generator;
a first connection pipe seat connected to the first connection pipe;
a second connecting pipe connected to the first connecting pipe seat and the injection port of the superheater;
a third connection pipe connected to the first connection pipe holder;
a fourth connecting line connected to an outflow port of the superheater;
a second connection pipe holder connected to the third connection pipe and the fourth connection pipe; and
and a fifth connecting pipe connected between the second connection tube holder and the nozzle portion.
6. The steam cleaning device of claim 5, wherein,
the first valve is connected to the second connecting line and regulates the amount of the saturated vapor injected into the superheater via the second connecting line.
7. The steam cleaning device of claim 5, wherein,
the second valve is connected to the third connecting line and adjusts the amount of the saturated vapor supplied to the second connection header via the third connecting line.
8. The steam cleaning device of claim 1, wherein,
the first injection pipeline further comprises an air injection port, and clean and dry air is injected into the air injection port;
the nozzle head further includes a first water filling port into which ultrapure water is filled.
9. The steam cleaning device of claim 1, wherein,
the interval of the ejection slits of the nozzle head was 0.15mm, and the velocity of the vapor ejected from the nozzle head was in the range of 350m/s to 550 m/s.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170152425A KR102428347B1 (en) | 2017-11-15 | 2017-11-15 | Steam washing device and method thereof |
| KR10-2017-0152425 | 2017-11-15 |
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| Publication Number | Publication Date |
|---|---|
| CN109772783A CN109772783A (en) | 2019-05-21 |
| CN109772783B true CN109772783B (en) | 2023-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810803238.6A Active CN109772783B (en) | 2017-11-15 | 2018-07-20 | Steam cleaning device |
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| CN (1) | CN109772783B (en) |
Families Citing this family (3)
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| TW202110575A (en) * | 2019-05-29 | 2021-03-16 | 美商應用材料股份有限公司 | Steam treatment stations for chemical mechanical polishing system |
| CN110882980A (en) * | 2019-11-20 | 2020-03-17 | 蚌埠中光电科技有限公司 | Method for cleaning liquid crystal glass substrate |
| CN113685859A (en) * | 2020-05-18 | 2021-11-23 | 佛山市顺德区美的洗涤电器制造有限公司 | Fan cleaning system, range hood and control method of fan cleaning system |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3190261B2 (en) * | 1996-08-01 | 2001-07-23 | ポップリベット・ファスナー株式会社 | Method and apparatus for degreasing and cleaning small machine parts |
| JP4917651B2 (en) * | 1999-08-12 | 2012-04-18 | アクアサイエンス株式会社 | Resist film removing apparatus and resist film removing method |
| JP2004022673A (en) | 2002-06-13 | 2004-01-22 | Hitachi Kokusai Electric Inc | Oxidation treatment equipment and method of oxidation treatment |
| JP5478469B2 (en) | 2010-11-29 | 2014-04-23 | オメガセミコン電子株式会社 | Superheated steam supply apparatus and substrate processing apparatus |
| JP2013243335A (en) * | 2012-04-25 | 2013-12-05 | Aqua Science Kk | Object cleaning system and object cleaning method |
| KR101381634B1 (en) * | 2012-09-21 | 2014-04-04 | 청진테크 주식회사 | Apparatus for injecting multi-phase fluid |
| KR102100757B1 (en) * | 2016-04-01 | 2020-04-14 | 주식회사 뉴파워 프라즈마 | Steam generation apparatus using induction heating, steam cleaning system |
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| Publication number | Publication date |
|---|---|
| KR102428347B1 (en) | 2022-08-02 |
| CN109772783A (en) | 2019-05-21 |
| KR20190055866A (en) | 2019-05-24 |
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