CN109769377A - A kind of thermally conductive shielding foam - Google Patents
A kind of thermally conductive shielding foam Download PDFInfo
- Publication number
- CN109769377A CN109769377A CN201910118255.0A CN201910118255A CN109769377A CN 109769377 A CN109769377 A CN 109769377A CN 201910118255 A CN201910118255 A CN 201910118255A CN 109769377 A CN109769377 A CN 109769377A
- Authority
- CN
- China
- Prior art keywords
- foam
- thermally conductive
- conductive shielding
- adhesive layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006260 foam Substances 0.000 title claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000010439 graphite Substances 0.000 claims abstract description 17
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 17
- 239000004831 Hot glue Substances 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002937 thermal insulation foam Substances 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000006978 adaptation Effects 0.000 abstract description 3
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A kind of thermally conductive shielding foam, is among it foam, is followed successively by hot melt adhesive layer, graphite flake layer, thermosetting glue-line, PI film silver coating and PET double-sided adhesive from the inside to the outside.The effects of using the present invention, being able to achieve protection component or IC is not damaged, capable of playing buffering, electrically conductive, shielding, heat dissipation, wide adaptation range, using effect are more preferable.
Description
Technical field
The present invention relates to a kind of thermally conductive shielding foams.
Background technique
With the development of the times, the demand in the modern times to electronic product increasingly tends to frivolous dexterity, these demands promote
It updates us ceaselessly and integrated product, constantly develops multi-functional practical material.Current most of electronics
There is heat dissipation problems for product, and graphite foam is based on the novel product of problems research and development, it can not increase electronics
It is additional in the case where product component to strengthen heat-sinking capability.
CN205052046U discloses a kind of heat conductive graphite foam, including surface layer, polyester sponge, polyurethane hot melt and people
Work graphite linings, in a rectangular parallelepiped shape, surface layer and electrographite layer form graphite thermal layer to the polyester sponge, and electrographite layer is set to
The inside on surface layer, graphite thermal layer are equipped with suture oral area around polyester sponge one week and in two ends intersection, suture the outer of oral area
Portion is equipped with polyurethane hot melt.It cannot achieve function of shielding.
CN206077927U discloses a kind of heat conductive graphite foam, from the inside to the outside successively by buffer layer, fire-retardant glue-line, artificial
Compound stone layer of ink and extexine composition, in buffer layer is coated on by fire-retardant glue-line, artificial synthesized graphite linings coat fire-retardant glue-line
Inside, artificial synthesized graphite linings are coated on interior by extexine, and extexine is conductive layer or insulating layer.It also cannot achieve shielding
Function.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of thermally conductive shielding foams.
The technical solution adopted by the present invention to solve the technical problems is: a kind of thermally conductive shielding foam, is among it foam,
It is followed successively by hot melt adhesive layer, graphite flake layer, thermosetting glue-line, PI film silver coating and PET double-sided adhesive from the inside to the outside.
Further, the foam is insulation foam or conducting foam.
Further, the hot melt adhesive layer can be conductive adhesive layer.
Further, the thermosetting glue-line can be conductive adhesive layer.
Further, the PI film silver coating is using PI as substrate (carrier), and PI sheet is insulating film, and after plating, stroke is led
It is logical, play conductive, shield effectiveness or Electro-static Driven Comb.
Single product thickness is depending on the general thickness of client, while the thickness of every money material is all to have certain office
Sex-limited, thickness is mainly adjusted or matches according further to conventional raw materials.
Mechanism of the invention is that main protection component or IC are not damaged, while carrying out auxiliary heat dissipation, shielding.
Compared with prior art, the present invention is able to achieve protection component or IC is not damaged, can play buffering, electrically conductive, screen
The effects of covering, radiating, wide adaptation range, using effect are more preferable.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiment of the present invention；
In figure: 1. foams, 2. hot melt adhesive layers, 3. graphite flake layers, 4. thermosetting glue-lines, 5. PI film silver coatings, 6.PET double-sided adhesive.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and embodiments.
Embodiment
Referring to Fig.1, a kind of thermally conductive shielding foam is among it foam 1, is followed successively by hot melt adhesive layer 2, graphite flake from the inside to the outside
Layer 3, thermosetting glue-line 4, PI film silver coating 5 and PET double-sided adhesive 6.
In the present embodiment, the foam 1 is insulation foam, primarily serves buffer function, material PU.Certainly, the bubble
Cotton 1 can also be conducting foam.
In the present embodiment, the hot melt adhesive layer 2 mainly plays fixed, connection function；It can also be conductive adhesive layer, it is main to play conduction
Shielding, connection, fixed function.
In the present embodiment, the graphite flake layer 3 is heat-conducting layer, and heat is diffused, allows hot localised points to become a face, makes
Heat dissipation area becomes larger.
In the present embodiment, the thermosetting glue-line 4 mainly plays fixed, connection function；It can also be conductive adhesive layer, it is main to play conduction
Shielding, connection, fixed function.
In the present embodiment, for the PI film silver coating 5 using PI as substrate (carrier), PI sheet is insulating film, after plating, row
Journey conducting, plays conductive, shield effectiveness or Electro-static Driven Comb.
In the present embodiment, the effect of the PET double-sided adhesive is encapsulated for graphite, prevents graphite from losing powder, while playing absolutely
Edge effect.Certainly, it is possible to use the other materials of similar effect.
Preparation process: centered on foam, hot melt adhesive is first applied in foam 1, then winds graphite flake, then apply hot-setting adhesive, so
PI film silver coating is wound afterwards, then winds PET double-sided adhesive.
It in use process, as the case may be, is mounted on component or IC, plays protection, buffering, shielding, heat dissipation etc. and make
With, wide adaptation range, using effect is more preferable.
Claims (5)
1. a kind of thermally conductive shielding foam, it is characterised in that: be among it foam, be followed successively by hot melt adhesive layer, graphite flake from the inside to the outside
Layer, thermosetting glue-line, PI film silver coating and PET double-sided adhesive.
2. thermally conductive shielding foam according to claim 1, it is characterised in that: the foam is insulation foam or conductive bubble
Cotton.
3. thermally conductive shielding foam according to claim 1 or 2, it is characterised in that: the hot melt adhesive layer is conductive adhesive layer.
4. thermally conductive shielding foam according to claim 1 or 2, it is characterised in that: the thermosetting glue-line is conductive adhesive layer.
5. thermally conductive shielding foam according to claim 1 or 2, it is characterised in that: the PI film silver coating using PI as substrate,
PI sheet is insulating film, and after plating, stroke conducting plays conductive, shield effectiveness or Electro-static Driven Comb.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910118255.0A CN109769377A (en) | 2019-02-16 | 2019-02-16 | A kind of thermally conductive shielding foam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910118255.0A CN109769377A (en) | 2019-02-16 | 2019-02-16 | A kind of thermally conductive shielding foam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109769377A true CN109769377A (en) | 2019-05-17 |
Family
ID=66456719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910118255.0A Pending CN109769377A (en) | 2019-02-16 | 2019-02-16 | A kind of thermally conductive shielding foam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109769377A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494022A (en) * | 2019-09-11 | 2019-11-22 | 苏州明欲圆电子材料有限公司 | Thermally conductive compound foam |
| CN111801001A (en) * | 2020-07-07 | 2020-10-20 | 苏州康丽达精密电子有限公司 | Structure-optimized omnibearing conductive foam and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120012382A1 (en) * | 2009-05-13 | 2012-01-19 | Laird Technologies, Inc. | Conductive Films for EMI Shielding Applications |
| CN203279459U (en) * | 2013-05-24 | 2013-11-06 | 深圳市鸿富诚屏蔽材料有限公司 | Conductive foam |
| CN105111952A (en) * | 2015-09-10 | 2015-12-02 | 深圳市美信电子有限公司 | Shielding and grounding foam tape with metal foil as base material and preparing method thereof |
| CN105667041A (en) * | 2016-02-24 | 2016-06-15 | 深圳市金晖科技有限公司 | Graphite heat conducting foam and preparation process thereof |
| CN205890097U (en) * | 2016-08-12 | 2017-01-18 | 深圳市津田电子有限公司 | Conducting froth cotton |
| CN206077927U (en) * | 2016-09-15 | 2017-04-05 | 广东思泉新材料股份有限公司 | A kind of conductive graphite foam |
| JP2017183671A (en) * | 2016-03-31 | 2017-10-05 | Ｊｘ金属株式会社 | Electromagnetic wave shield material |
| KR20180129139A (en) * | 2017-05-25 | 2018-12-05 | 삼아알미늄 (주) | Outer packaging materials having non-flammability for vacuum insulation panel, Vacuum insulation panel having high temperature resistance, and Manufacturing method thereof |
| CN208425129U (en) * | 2018-08-08 | 2019-01-22 | 睿惢思工业科技（苏州）有限公司 | A kind of shielding heat dissipation film |
-
2019
- 2019-02-16 CN CN201910118255.0A patent/CN109769377A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120012382A1 (en) * | 2009-05-13 | 2012-01-19 | Laird Technologies, Inc. | Conductive Films for EMI Shielding Applications |
| CN203279459U (en) * | 2013-05-24 | 2013-11-06 | 深圳市鸿富诚屏蔽材料有限公司 | Conductive foam |
| CN105111952A (en) * | 2015-09-10 | 2015-12-02 | 深圳市美信电子有限公司 | Shielding and grounding foam tape with metal foil as base material and preparing method thereof |
| CN105667041A (en) * | 2016-02-24 | 2016-06-15 | 深圳市金晖科技有限公司 | Graphite heat conducting foam and preparation process thereof |
| JP2017183671A (en) * | 2016-03-31 | 2017-10-05 | Ｊｘ金属株式会社 | Electromagnetic wave shield material |
| CN205890097U (en) * | 2016-08-12 | 2017-01-18 | 深圳市津田电子有限公司 | Conducting froth cotton |
| CN206077927U (en) * | 2016-09-15 | 2017-04-05 | 广东思泉新材料股份有限公司 | A kind of conductive graphite foam |
| KR20180129139A (en) * | 2017-05-25 | 2018-12-05 | 삼아알미늄 (주) | Outer packaging materials having non-flammability for vacuum insulation panel, Vacuum insulation panel having high temperature resistance, and Manufacturing method thereof |
| CN208425129U (en) * | 2018-08-08 | 2019-01-22 | 睿惢思工业科技（苏州）有限公司 | A kind of shielding heat dissipation film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494022A (en) * | 2019-09-11 | 2019-11-22 | 苏州明欲圆电子材料有限公司 | Thermally conductive compound foam |
| CN111801001A (en) * | 2020-07-07 | 2020-10-20 | 苏州康丽达精密电子有限公司 | Structure-optimized omnibearing conductive foam and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190517 |
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| RJ01 | Rejection of invention patent application after publication |