CN109757023A - Printed wiring board and preparation method thereof - Google Patents
Printed wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN109757023A CN109757023A CN201711091388.0A CN201711091388A CN109757023A CN 109757023 A CN109757023 A CN 109757023A CN 201711091388 A CN201711091388 A CN 201711091388A CN 109757023 A CN109757023 A CN 109757023A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- copper
- clad plate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000004744 fabric Substances 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 238000000465 moulding Methods 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000007598 dipping method Methods 0.000 claims abstract description 3
- 238000005452 bending Methods 0.000 claims description 58
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- 239000000463 material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 26
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- -1 amine compound Chemical class 0.000 claims description 11
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- 239000005011 phenolic resin Substances 0.000 claims description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
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- 238000003825 pressing Methods 0.000 claims description 9
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- 239000002105 nanoparticle Substances 0.000 claims description 8
- 239000011258 core-shell material Substances 0.000 claims description 7
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- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
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- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 5
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
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- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
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- 150000003839 salts Chemical class 0.000 claims 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims 1
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- 238000009740 moulding (composite fabrication) Methods 0.000 description 33
- 230000003068 static effect Effects 0.000 description 11
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- 230000000694 effects Effects 0.000 description 6
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- 238000005476 soldering Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
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- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
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- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 241000050051 Chelone glabra Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- INKDAKMSOSCDGL-UHFFFAOYSA-N [O].OC1=CC=CC=C1 Chemical compound [O].OC1=CC=CC=C1 INKDAKMSOSCDGL-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical compound C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 description 1
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- QLURSWHJVYRJKB-UHFFFAOYSA-N formaldehyde;urea Chemical compound O=C.NC(N)=O.NC(N)=O QLURSWHJVYRJKB-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 150000002790 naphthalenes Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
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- 238000009864 tensile test Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of printed wiring board and preparation method thereof.Printed wiring board of the invention includes bent molding copper-clad plate as substrate, the copper-clad plate includes copper foil and the compositions of thermosetting resin being adhered on copper foil dipping base fabric, its flexural modulus of elasticity > 10GPa, peel strength between 60-200 DEG C is greater than 1.0N/mm, and after removing copper foil, there is the maximum stress value greater than 400MPa and the breaking strain value greater than 4%.Printed wiring board of the invention can form the printed wiring board with warp architecture by primary or punch forming for several times.
Description
Technical field
The present invention relates to technical field of electronic products, in particular to a kind of printed wiring board and preparation method thereof.
Background technique
As electronic product develops and the day of battery durable ability is aobvious to light and shortization and multifunctional integrated direction
The demand of the 3 D stereo installation of deficiency, printed wiring board (PCB) and electronic component is more and more, currently in order to realizing three-dimensional
Solid installation, mostly uses greatly rigid-flexible combination PCB technology path.The rigid-flexible combination pcb board of tradition refers on one piece of PCB printed circuit board
Comprising one or more rigid regions and one or more flexible regions, it is laminated in an orderly manner by rigid pcb board and flexible (FPCB) plate
It forms together, and is formed and be electrically connected with plated through-hole.Rigid-flexible combination PCB is existing can to provide rigid printed board due support
Effect, and have the bendability of flex plate, it can satisfy the requirement of three-dimensional assembling, demand in recent years is increasing.But it is rigid-flexible
Complicated in conjunction with PCB processing technology, difficulty is big, for example: rigid PCB needs local hollow out, then with FPCB by pipe sensitive adhesion, simultaneously
The binding material of not gummosis must be used between the rigid PCB and flexibility FPCB of local hollow out, and such material lamination window is very
It is narrow, it presses very difficult, it is easy to the defects of bubble and hickie occur；In addition, the polyimides of flexibility coat copper plate (FCCL)
(PI) film surface inertia is big, not high with the cohesive force of hardboard and most of binding materials, and the resinite of rubber and acrylic compounds
System can bond well with PI film, but the performances such as heat resistance and dimensional stability are bad, therefore there are hidden danger for product reliability, and
And yield rate is not high, causes cost very high.
Many soft or hard combination PCB are for static bending field, so-called static bending, i other words need to only bend one when installation
After a secondary or bending forming, the bending region without swing, that is, be when working it is static, unlike printer laser head that
What sample swung back and forth；But even if being exactly in these static bending fields, common rigid PCB is also unable to satisfy bending forming
And requirement.
Therefore, much the electronics fields such as PCB are installed in static bending, have one-shot is molding to add material requirements
Work ability can preferably absorb impact stress in impact forming process, not crack, is not stratified, and it be curved to go out various solids
Bent or concaveconvex shape is fixed, and is installed and used convenient for subsequent PCB.
Summary of the invention
The present invention is intended to provide a kind of PCB and preparation method thereof of static bending installation.
The purpose of the present invention can be achieved through the following technical solutions.
One aspect of the present invention provides a kind of printed wiring board comprising can static bending copper-clad plate as substrate,
The copper-clad plate includes copper foil and the compositions of thermosetting resin being adhered on copper foil dipping base fabric, the bullet of the copper-clad plate
Property bending modulus > 10GPa (preferably > 12GPa), peel strength between 60-200 DEG C is greater than 1.0N/mm, and is removing copper foil
Afterwards, there is the maximum stress value greater than 400Mpa and the breaking strain value greater than 4%.
In some embodiments, the compositions of thermosetting resin includes: thermosetting resin；Curing agent；Toughening material；
And solvent, wherein by thermosetting resin be 100 parts by weight in terms of, curing agent be 1-50 parts by weight, toughening material be 20-60 weight
Part, solvent is 5-50 parts by weight.
In some embodiments, the thermosetting resin includes epoxy resin, preferably polyfunctional epoxy resin；And/or
The curing agent include phenolic resin, amine compound, acid anhydrides, imidazole compound, sulfonium salt, dicyandiamide, in active ester extremely
Few one kind；And/or the toughening material includes rubber (the preferably rubber of core-shell structure), phenoxy resin, polyvinyl butyral
(PVB), nylon, nanoparticle (preferably SiO2, TiO2Or CaCO3Nanoparticle), ethylenic block copolymers (preferably poly- first propylene
At least one of the block copolymer of acid, butadiene and styrene)；And/or the solvent includes dimethylformamide
(DMF), ethylene glycol monomethyl ether (MC), propylene glycol monomethyl ether (PM), propylene glycol methyl ether acetate (PMA), cyclohexanone, methyl ethyl ketone (MEK),
Toluene, at least one of dimethylbenzene.
In some embodiments, the base fabric includes glass fabric or non-woven fabrics.
In some embodiments, the printed wiring board is that high density interconnects (HDI) printed wiring board.
Another aspect of the present invention provides a kind of printed wiring board bending and molding method, which comprises will be above-mentioned
Printed wiring board is put into mold, carries out punch forming, it is 10~90 ° that the mold design, which is used to form bending angle, bending
Radius is the warp architecture of 1mm~25mm.
In some embodiments, before being put into mold, printed wiring board is heated to 60-200 DEG C of temperature, preferably
It is heated to the temperature of glass transition temperature ± 50 DEG C of compositions of thermosetting resin in copper-clad plate.
In some embodiments, stamping forming condition includes:
1) stamping pressure: 100N-20000N；
2) pressing and forming is held time: >=2sec；
3) mold temperature: room temperature (20~35 DEG C), or it is heated to 100 DEG C or less.
In some embodiments, the number of plies for carrying out copper-clad plate in stamping forming printed wiring board is 4-14 layers, thickness
For 0.2mm -1mm.
Another aspect of the invention also provides a kind of high density interconnection (HDI) printed wiring board with warp architecture,
It is characterized in that, the HDI printed wiring board with warp architecture is using side described in any one of claim 6-9
Method is made by primary or punch forming for several times, and bending angle is 10~90 °, and bending radius is 1mm~25mm, excellent
Selection of land, the printed wiring board need the region of bending forming there was only simple route, are not turned on hole.
The present invention can have at least one of following advantages:
1, copper-clad plate of the invention and using the copper-clad plate printed wiring board within the scope of certain temperature and mechanical force
It can be plastically deformed under effect, when discharging mechanical force and being restored to room temperature, original shape, which sells of one's property raw shape, to change, and be capable of fixing
Molding, that is, have certain rigidity with the effect that meets with stresses generates deformation and it is not broken, and with deformation dependent variable.
2, the technological process of production of printed wiring board is simple, without the printed wiring board manufacture craft of soft or hard combination, improves
Efficiency, save the cost.
3, printed wiring board has primary or brake forming for several times working ability, can be preferable during brake forming
Stress is absorbed impact, does not crack, is not stratified, and goes out various three-dimensional bendings or concaveconvex shape is fixed, it is curved convenient for subsequent static state
Song is installed and used, and HDI printed wiring board is particularly suitable for.
Detailed description of the invention
Fig. 1 shows the load-deformation curve of five seed types.
Fig. 2 shows that one of the copper-clad plate of the present invention according to tensile strength and the acquisition of stretch modulus test method is typical
Stress (F)-strains (L) curve.
Fig. 3 shows the bending radius of the PCB of bending forming in the embodiment of the present application 1.
Fig. 4 shows the bending angle of the PCB of bending forming in the embodiment of the present application 1.
Specific embodiment
The present invention has surprisingly found that with the compositions of thermosetting resin impregnated glass fiber cloth etc. containing toughening material
Prepreg is made in base fabric, by this prepreg and copper foil lamination it is compound, can be obtained after being fully cured with it is rigid and tough (or
It is hard and tough) copper-clad plate of characteristic, using this copper-clad plate can make can static bending installation printed wiring board (PCB).
The load-deformation curve of material with hard and tough characteristic is as shown in figure 1 shown in curve 2.In Fig. 1, each curve generation
The material property of table is as follows: 1, hard and crisp；2, hard and tough；3, hard and strong；4, soft and tough；5, soft and weak.
Based on above-mentioned discovery, the present invention provides the bent molding copper-clad plate of one kind, printed wiring board and preparation method thereof.
Various aspects of the invention are described below in detail.
Copper-clad plate
One aspect of the present invention provides a kind of bent molding copper-clad plate, and the copper-clad plate includes copper foil and is adhered to
The base fabric impregnated by above-mentioned compositions of thermosetting resin on the copper foil.
Compositions of thermosetting resin-
In the present invention, the compositions of thermosetting resin for impregnating base fabric be may include: thermosetting resin；Curing agent；Increase
Tough material；And solvent.
In certain embodiments, thermosetting resin may include epoxy resin, phenolic resin, polyimide resin, urea
Urea formaldehyde, melamine resin, unsaturated polyester (UP), polyurethane resin etc., wherein preferred epoxy.
The specific example of epoxy resin may include: bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol S type ring
Oxygen resin, aralkyl base epoxy, phenol novolak type epoxy resin (phenol novolactype epoxy resin),
Alkyl phenolic type epoxy resin (alkylphenol novolac type epoxyresin), bisphenol-type epoxy resin, naphthalene
Type epoxy resin, dicyclopentadiene type epoxy resin, phenolic compounds and epoxidation made of the aromatic aldehyde condensation with phenolic hydroxyl group
Object, isocyanuric acid three-glycidyl ester, alicyclic epoxy resin etc..According to circumstances, can by these epoxy resin individually or
It combines two or more and uses.
Preferably, epoxy resin is in a molecule comprising more than two epoxy groups (preferably three or more epoxy groups)
Polyfunctional epoxy resin.The epoxy resin of market sale can be used in this epoxy resin, for example, (Mitsubishi Chemical is public by JER1003
Department manufacture, methyl be 7 to 8, difunctionality, molecular weight 1300), EXA-4816 (DIC company manufacture, molecular weight 824,
Most methyl, difunctionality), YP50 (chemical company, Sumitomo Metal Industries, Nippon Steel manufacture, molecular weight be 60000 to 80000, Duo Shuojia
Base, difunctionality), DER593 (DOW Chemical manufacture, polyfunctional epoxy resin), (the Resolution corporation of EPIKOTE 157
Make, polyfunctional epoxy resin) etc..
In certain embodiments, the curing agent in compositions of thermosetting resin can according to the type of thermosetting resin and
It is fixed.For epoxy resin, curing agent may include phenolic resin, amine compound, acid anhydrides, imidazole compound, sulfonium salt,
At least one of dicyandiamide, active ester.
The active ester curing agent is by a kind of phenolic compound connected by aliphatic acyclic hydrocarbon structure, two degree of functionality carboxylic acids
Aromatic compound or acid halide and a kind of monohydroxy compound are reacted and are obtained.The two degrees of functionality carboxylic acid aromatic compound
Object or acid halide dosage are 1mol, are 0.05~0.75mol by the phenolic compound dosage that aliphatic acyclic hydrocarbon structure connects,
Monohydroxy compound dosage is 0.25~0.95mol.Active ester curing agent may include the active ester of following structural formula:
Wherein X is phenyl ring or naphthalene nucleus in formula, and j is 0 or 1, and k is 0 or 1, and n indicates that average repeat unit is 0.25-1.25.
In certain embodiments, the preferred phenolic resin of curing agent, amine compound, imidazole compound and dicyandiamide.
Can be two or more alone or in combination by these curing agent and use.Specific curing agent may include: phenolic resin (such as
Phenol resol resins, cresol novolac resin etc.)；Diaminodiphenylsulfone (DDS)；Dicyandiamide (DICY)；Dimethyl miaow
Azoles (2-MI) etc..
Relative to the thermosetting resin of 100 parts by weight, the dosage of curing agent is usually 1-50 parts by weight, such as can be 1-
40 or 1-30 parts by weight.For epoxy resin, the dosage of curing agent can control, so that the epoxy of epoxy resin is worked as
The hydroxyl equivalent ratio of amount and phenolic resin is 1:1~0.95；Or epoxy resin and amino equivalent ratio are 1:0.6~0.4.
In certain embodiments, toughening material include rubber, phenoxy resin, polyvinyl butyral (PVB), nylon,
At least one of nanoparticle, ethylenic block copolymers.These toughening materials are the thermosetting resins such as basis and epoxy resin
Compatibility, toughening effect (reach corresponding ess-strain required value (see subsequent descriptions)) etc. and select.Wherein, rubber
Preferably there is the rubber of core-shell structure, such as methyl methacrylate-butadiene-styrene (MBS) hud typed copolymer resins,
Rubber-epoxy type core shell resin etc., representative commercially available M-521, MX-395 etc. including Zhong Yuan company, Japan.Nanoparticle
Including SiO2, TiO2Or CaCO3Nanoparticle etc., partial size is generally 10-500nm.Ethylenic block copolymers are variety classes
The block copolymer that is formed of olefin-copolymerization, such as the block copolymer of poly- first acrylic acid, butadiene and styrene.
Toughening material can two or more uses alone or in combination.For example, can be by nanoparticle and another toughening material
Expect (such as core shell rubbers, phenoxy resin, PVB, nylon, ethylenic block copolymers or their mixture) with 1:10 to 2:1's
Weight ratio is applied in combination.
To reach good toughening effect, relative to the thermosetting resin of 100 parts by weight, the total dosage of toughening material is general
For 20-60 parts by weight, for example, can be 20-50 parts by weight or 30-60 parts by weight.
In certain embodiments, solvent may include dimethylformamide (DMF), ethylene glycol monomethyl ether (MC), propylene glycol
Methyl ether (PM), propylene glycol methyl ether acetate (PMA), cyclohexanone, methyl ethyl ketone (MEK), toluene, at least one of dimethylbenzene.Phase
For the thermosetting resin of 100 parts by weight, the dosage of solvent is generally 5-50 parts by weight, such as 10-50,20-50 parts by weight etc.,
To form viscosity as the glue of 300-600cPas.
In certain embodiments, in the range of not losing effect of the invention, compositions of thermosetting resin can be with
Include filler or auxiliary agent etc., such as fire retardant, levelling agent, colorant, dispersing agent, coupling agent, foaming agent etc..Wherein fire retardant can
Think organic fire-retardant, such as tetrabromobisphenol A, DOPO, one of phosphate or a variety of.
Base fabric-
In certain embodiments, base fabric includes glass fabric or non-woven fabrics.Glass fabric can select 7628,
2116, the various specifications such as 1080,106,1037,1027,1017.
Copper foil-
In certain embodiments, copper foil can select the different sizes such as 1OZ, 1/2OZ, 1/3OZ.
It can the static copper-clad plate-bent
It is of the invention can the copper-clad plate of static bending can be become within the scope of certain temperature and under mechanical force with plasticity
Shape, when discharging mechanical force and being restored to room temperature, original shape, which sells of one's property raw shape, to change, and be capable of fixing molding.
In certain embodiments, flexural modulus of elasticity > 10GPa of copper-clad plate, the peel strength between 60-200 DEG C
Greater than 1.0N/mm, and after removing copper foil, there is the maximum stress value greater than 400Mpa and the breaking strain value greater than 4%.
Above-mentioned ess-strain value passes through with Tensile strength and the measurement of stretch modulus test method.
Tensile strength of material and stretch modulus test method:
A, experimental rig/or material
Material Testing Machine
The Compression and Expansion testing machine of one ISO3384 standard, the device stretching clamp can be run with stable rate.Load
The error of measuring system is no more than ± 1%.
The etch system of clad with metal foil can be completely removed.
Vernier caliper (being accurate to 0.02mm) or micrometer (being accurate to 0.002mm)
Sample
(1) size and shape
Size 250mm × 25mm of sample, sample thickness are recommended to use 0.4mm, and sample edge answers flawless, layering etc. to lack
It falls into, otherwise with sand paper or equivalent tool polishing (edge does not form fillet).
(2) quantity and sampling
When coefficient of dispersion is less than 5%, ten pieces of samples of every batch of, longitudinal five pieces, laterally five pieces (in one-piece sample plate or small
It is cut on plate).When coefficient of dispersion is greater than 5%, the sample quantities in each direction cannot be less than 10, and guarantee to have 10 effectively
Sample.
(3) all metal claddings are removed with engraving method etching.
B, Tensile Test procedures
Measure specimen size
Specimen width and thickness are measured and recorded, width is accurate to 0.02mm, and thickness is accurate to 0.002mm.
Measurement
(1) sample is clamped, keeps the center line of sample consistent with the centring line of upper and lower fixture.
(2) fixture spacing up and down is adjusted, its 125mm ± 0.5mm is made.
(3) loading velocity is 12.5mm/min.
(4) when setting tensile modulus of elasticity calculates, part between 0.05% to the 0.25% of strain is taken.
(5) it is tested, draws load-deformation curve.
(6) there is the sample of obvious internal flaw, should cancel.
(7) sample destroy in fixture or at sample fracture at clamping with a distance from be less than 10mm, should cancel.
C, it calculates
The tensile strength of each sample is calculated as follows
In formula:
τT: tensile strength, MPa
F: breaking load or maximum load, N
B: specimen width, mm
D: sample thickness, mm
The tensile modulus of elasticity of each sample is calculated as follows
In formula:
Et: tensile modulus of elasticity, MPa
The tensile stress values measured when σ ": strain stress "=0.25% ε, MPa
σ ': the tensile stress values measured when strain stress '=0.05% ε, MPa
Average tensile strength and tensile modulus of elasticity are calculated, as unit of MPa.
Fig. 2 shows that one of the copper-clad plate according to above-mentioned tensile strength and the acquisition of stretch modulus test method typically answers
Force-strain curve.As shown in Fig. 2, copper-clad plate (after etching removes metal cladding) of the invention has greater than 400Mpa's
Maximum stress value and breaking strain value greater than 4%.
Make the method-of copper-clad plate
In certain embodiments, copper-clad plate of the invention can make in accordance with the following methods:
Make prepreg-
It is impregnated or coated base fabric with the compositions of thermosetting resin of glue pattern of the invention, is then added at 100-200 DEG C
1-10 minutes hot (such as 3-10 minutes) obtain prepreg (the B scalariform state of semi-solid preparation).The resin content of prepreg can be with
Between 40-70 weight %, the resin flow of prepreg be can control between 10-30% for control.
Make copper-clad plate-
The prepreg cut is laminated on copper foil, hot pressing is carried out with the heating rate of 1-3 DEG C/min, pressure is maximum
300-500PSI, and in 180-200 DEG C of maximum temperature holding 30-120 minutes (such as 60-120 minutes), obtain copper-clad plate.
It in certain embodiments, can the punch forming in punch die by copper-clad plate of the invention.Preferably, the temperature of punching press
It spends in the range of ± 50 DEG C, preferably ± 30 DEG C of the Tg value for being chosen at copper-clad plate (compositions of thermosetting resin).
Printed wiring board (PCB)
Another aspect of the present invention provides a kind of flexible molding PCB, and the PCB includes above-mentioned copper-clad plate conduct
Substrate.
In certain embodiments, the PCB is HDI-PCB (high density interconnection printed wiring board).
In certain embodiments, the PCB is to make in above-mentioned copper-clad plate according to traditional PCB manufacture craft.
In certain embodiments, the PCB needs the region of bending forming there was only simple route, is not turned on hole.
Printed wiring board bending and molding method
Another aspect of the present invention provides a kind of printed wiring board bending and molding method, which comprises will be aforementioned
Printed wiring board be put into mold, carry out punch forming, generate required step, be suitable for 3 D stereo install.
In certain embodiments, mold is to set in advance by different crooked process radius (2-50mm) and bending angle (10-90 °)
Meter.
In certain embodiments, before being put into mold, the printed wiring board is heated to 60-200 DEG C of temperature.
In certain embodiments, stamping forming forming temperature is the vitrifying of compositions of thermosetting resin in copper-clad plate
Transition temperature ± 50 DEG C (preferably ± 30 DEG C), setting time >=2sec.
In certain embodiments, stamping forming condition includes:
1) stamping pressure: 100N-20000N；
2) pressing and forming is held time: >=2sec；
3) mold temperature: room temperature (20~35 DEG C), or it is heated to 100 DEG C or less.
In certain embodiments, it is 0~2000mm/min and molding that other molding parameters, which may include: molding rate,
The pressure value upper limit is 100~20000N.
In certain embodiments, the number of plies for carrying out copper-clad plate in stamping forming printed wiring board can be 4-14 layers,
Thickness can be 0.2mm -1mm.
In certain embodiments, it can carry out once or punch forming for several times, to realize various brake formings.
High density with warp architecture interconnects (HDI) printed wiring board
Another aspect of the invention provides a kind of high density interconnection (HDI) printed wiring board with warp architecture,
It can be made by above-mentioned bending and molding method.
In certain embodiments, the HDI printed wiring board is with 10~90 ° of bending angle and 1mm~25mm
Bending radius.
In certain embodiments, the HDI printed wiring board only has simple route in the region for needing bending forming,
It is not turned on hole.
In certain embodiments, the HDI printed wiring board can be made by forming once or for several times.
Below in conjunction with specific embodiment, further details of the technical solution of the present invention.These embodiments are
Illustratively, it rather than limits the scope of the invention.
Embodiment 1:
1, glue configures: selecting the rubber (Japanese clock deep pool M-521) of 5 parts by weight, core shell rubbers (the Japanese clock of 10 parts by weight
Deep MX-395) and 20 parts by weight Nano-meter SiO_22(winning wound Nanopol A 710) is used as toughening material, more with 100 parts by weight
Functional epoxy resins' (DER593 resin of DOW chemistry) mixing, and phenolic resin (the XZ92741 resin of DOW chemistry) is added, make
It obtains epoxide equivalent and hydroxyl equivalent ratio is 1:1, and appropriate MEK organic solvent, be configured to glue, control glue viscosity in 300-
Between 600cPaS.
2, prepreg makes: first gluing above-mentioned glue impregnated glass fiber cloth (2116 glass fabric), then puts
Entering to dry case 100-200 DEG C heated baking 3-10 minutes, so that above-mentioned resin combination is reached semi-solid preparation B scalariform state.
3, copper-clad plate makes: selecting 1OZ copper foil, combines with above-mentioned prepreg, put laminating machine, heating rate 1-3 into
DEG C/min, platen pressure maximum 300-500PSI, holding 60-120 minutes of 180-200 DEG C of material maximum temperature.
4, PCB makes: above-mentioned copper-clad plate being produced pcb board by traditional PCB manufacture craft, pcb board locally needs to be bent into
The region of type, only simple route.
5, PCB bending forming: (1) first above-mentioned pcb board is heated to 60 DEG C；(2) after heating PCB temperature is stablized, punching is put into
In mould machine, with 10000N pressure pressing 5 seconds, then it is opened again, takes out pcb board.The bending radius and bending angle of gained PCB is such as
Shown in Fig. 3, Fig. 4.
6, by above-mentioned PCB test apparent, elasticity modulus, thermal shock (288 DEG C/10S), Reflow Soldering (280 DEG C of maximum stable),
The correlation properties such as resistance to Ion transfer (CAF), and to specifications described in tensile strength and stretch modulus test method survey
Determine ess-strain value.
Embodiment 2:
Other than the configuration of following glue, copper-clad plate and PCB are made in the same manner as example 1.
Glue configuration: the core shell rubbers of phenol oxygen (53BH35 of HEXION company) and 10 parts by weight of 20 parts by weight are selected
CSR (Japanese clock deep pool MX-395) is used as toughening material, with the polyfunctional epoxy resins of 100 parts by weight (Resolution company
157 resin of EPIKOTE) mixing, and the dicyandiamide of 2.5 parts by weight is added, and appropriate DMF organic solvent, it is configured to glue,
Glue viscosity is controlled between 300-600cPaS.
PCB bending forming: (1) first above-mentioned pcb board is heated to 120 DEG C；(2) after heating PCB temperature is stablized, punch die is put into
In machine, with 100N pressure pressing 100 seconds, then it is opened again, takes out pcb board.The bending radius and bending angle of gained PCB is the same as real
Apply example 1.
Apparent, elasticity modulus, ess-strain value, thermal shock, Reflow Soldering, CAF etc. according to method described in embodiment 1 test
Correlation properties.
Embodiment 3:
Other than the configuration of following glue, copper-clad plate and PCB are made in the same manner as example 1.
Glue configuration: the PVB (U.S. head promise B90) of 20 parts by weight, the Nano-meter SiO_2 of 8 parts by weight are selected2(win wound
Nanopolo A710) and 5 parts by weight block copolymer make (A Ke horse Nanostrength) it is toughening material,
It is mixed with the polyfunctional epoxy resin (the DER593 resin of DOW chemical company) of 100 parts by weight, and adds double cyanogen of 3 parts by weight
Amine, and appropriate DMF or PM organic solvent, are configured to glue, control glue viscosity between 300-600cPaS.
PCB bending forming: (1) first above-mentioned pcb board is heated to 200 DEG C；(2) after heating PCB temperature is stablized, punch die is put into
In machine, with 20000N pressure pressing 2 seconds, then it is opened again, takes out pcb board.The bending radius and bending angle of gained PCB is the same as real
Apply example 1.
Apparent, elasticity modulus, ess-strain value, thermal shock, Reflow Soldering, CAF etc. according to method described in embodiment 1 test
Correlation properties.
Embodiment 4:
Other than the configuration of following glue, copper-clad plate and PCB are made in the same manner as example 1.
Glue configuration: the nylon (Dupont ST801A) of 20 parts by weight and the Nano-meter SiO_2 of 8 parts by weight are selected2(win wound
Nanopol A710), it is mixed with the polyfunctional epoxy resin (DOW chemistry DER593 resin) of 100 parts by weight, and press epoxide equivalent
Phenolic resin (the EPIKURE YLH129B65 of Resolution company) is added with hydroxyl equivalent 1:1, and appropriate MEK organic
Solvent is configured to glue, controls glue viscosity between 300-600cPaS.
PCB bending forming: (1) first above-mentioned pcb board is heated to 100 DEG C；(2) after heating PCB temperature is stablized, punch die is put into
In machine, with 10000N pressure pressing 10 seconds, then it is opened again, takes out pcb board.The bending radius and bending angle of gained PCB is same
Embodiment 1.
Apparent, elasticity modulus, ess-strain value, thermal shock, Reflow Soldering, CAF etc. according to method described in embodiment 1 test
Correlation properties.
Embodiment 5:
Other than the configuration of following glue, copper-clad plate and PCB are made in the same manner as example 1.
Glue configuration: block copolymer (the A Kema Nanostrength of 25 parts by weight is selected) and 8 weight
The Nano-meter SiO_2 of part2(winning wound Nanopol A710) is used as toughening material, cyanate resin (the Hui Feng company HF- with 100 parts by weight
10) rouge mixes, and adds the phenolic resin (the EPIKURE YLH129B65 of RESOLUTION company) of 20 parts by weight, Yi Jishi
MEK organic solvent is measured, glue is configured to, controls glue viscosity between 300-600cPaS.
PCB bending forming: (1) first above-mentioned pcb board is heated to 200 DEG C；(2) after heating PCB temperature is stablized, punch die is put into
In machine, with 10000N pressure pressing 20 seconds, then it is opened again, takes out pcb board.The bending radius and bending angle of gained PCB is same
Embodiment 1.
Apparent, elasticity modulus, ess-strain value, thermal shock, Reflow Soldering, CAF etc. according to method described in embodiment 1 test
Correlation properties.
Embodiment 6:
Other than the configuration of following glue, copper-clad plate and PCB are made in the same manner as example 1.
Glue configuration: the phenoxy resin (Nippon Steel chemistry ERF-001) of 20 the parts by weight, (U.S. PVB of 10 parts by weight are selected
First promise B90) and 5 parts by weight Nano-meter SiO_22(winning wound Nanopolo A710) is used as toughening material, the PPO tree with 50 parts by weight
Epoxy resin (the DOW chemistry DER593 resin) mixing of rouge (such as: the MX90 of the husky basic company of uncle) and 100 parts by weight, and add
20 parts by weight of phenolic resin (the EPIKURE YLH129B65 of RESOLUTION company), and appropriate MEK organic solvent, configuration
At glue, glue viscosity is controlled between 300-600cPaS.
PCB bending forming: (1) first above-mentioned pcb board is heated to 180 DEG C；(2) after heating PCB temperature is stablized, punch die is put into
In machine, with 10000N pressure pressing 30 seconds, then it is opened again, takes out pcb board.The bending radius and bending angle of gained PCB is same
Embodiment 1.
Apparent, elasticity modulus, ess-strain value, thermal shock, Reflow Soldering, CAF etc. according to method described in embodiment 1 test
Correlation properties.
Comparative example 1:
Other than the configuration of following glue, PCB and bending forming are made in the same manner as example 1, and are tested corresponding
Performance.
Glue configuration: selecting the polyfunctional epoxy resin (DOW chemistry DER593 resin) of 100 parts by weight, adds 2-3 weight
The dicyandiamide of part, and appropriate DMF organic solvent, are configured to glue, control glue viscosity between 300-600cPaS.
Comparative example 2:
Other than the configuration of following glue, PCB and bending forming are made in the same manner as example 1, and are tested corresponding
Performance.
Glue configuration: it selects the nitrile rubber (such as: Japanese clock deep pool M-521) of 10 parts by weight and 100 parts by weight is multifunctional
Epoxy resin (DOW chemistry DER593 resin) mixing is added the dicyandiamide of 2-3 parts by weight, and appropriate DMF organic solvent, is matched
It is set to glue, controls glue viscosity between 300-600cPaS.
Test result comparison is as follows:
More than, section Example only of the invention for those of ordinary skill in the art can be according to this hair
Bright technical solution and technical concept makes other various corresponding changes and modifications, and all these change and modification should all belong to
In the range of the claims in the present invention.
Method detailed of the invention that the present invention is explained by the above embodiments, but the invention is not limited to it is above-mentioned in detail
Method, that is, do not mean that the invention must rely on the above detailed methods to implement.Person of ordinary skill in the field should
It is illustrated, any improvement in the present invention, addition, the concrete mode of equivalence replacement and auxiliary element to each raw material of product of the present invention
Selection etc., all of which fall within the scope of protection and disclosure of the present invention.
Claims (10)
1. a kind of printed wiring board, which is characterized in that the printed wiring board includes bent molding copper-clad plate as substrate,
The copper-clad plate includes copper foil and the compositions of thermosetting resin being adhered on copper foil dipping base fabric, the bullet of the copper-clad plate
Property bending modulus > 10GPa, peel strength between 60~200 DEG C is greater than 1.0N/mm, and after removing copper foil, with being greater than
The maximum stress value of 400MPa and breaking strain value greater than 4%.
2. printed wiring board according to claim 1, which is characterized in that the compositions of thermosetting resin includes: thermosetting
Property resin；Curing agent；Toughening material；And solvent, wherein by thermosetting resin be 100 parts by weight in terms of, curing agent be 1~50 weight
Part, toughening material is 20~60 parts by weight, and solvent is 5~50 parts by weight.
3. printed wiring board according to claim 2, which is characterized in that the thermosetting resin includes epoxy resin, excellent
Select polyfunctional epoxy resin；And/or the curing agent includes phenolic resin, amine compound, acid anhydrides, imidazole compound, sulfonium
At least one of salt, dicyandiamide, active ester；And/or the toughening material include rubber (the preferably rubber of core-shell structure),
Phenoxy resin, polyvinyl butyral (PVB), nylon, nanoparticle (preferably SiO2, TiO2Or CaCO3Nanoparticle), olefinic
At least one of block copolymer (block copolymer of preferably poly- first acrylic acid, butadiene and styrene)；And/or it is described
Solvent includes dimethylformamide (DMF), ethylene glycol monomethyl ether (MC), propylene glycol monomethyl ether (PM), propylene glycol methyl ether acetate
(PMA), cyclohexanone, methyl ethyl ketone (MEK), toluene, at least one of dimethylbenzene.
4. printed wiring board according to claim 1, which is characterized in that the base fabric includes glass fabric or nonwoven
Cloth.
5. printed wiring board according to claim 1, which is characterized in that the printed wiring board is high density interconnection
(HDI) printed wiring board.
6. a kind of printed wiring board bending and molding method, which is characterized in that the described method includes: by any in Claims 1 to 5
Described in printed wiring board be put into mold, carry out punch forming, the mold design be used to form bending angle be 10~
90 °, bending radius is the warp architecture of 1mm~25mm.
7. according to the method described in claim 6, it is characterized in that, the printed wiring board is heated before being put into mold
To 60~200 DEG C of temperature, it is preferably heated to glass transition temperature ± 50 DEG C of compositions of thermosetting resin in copper-clad plate
Temperature.
8. the method according to the description of claim 7 is characterized in that the stamping forming condition includes:
1) stamping pressure: 100~20000N；
2) pressing and forming is held time: >=2sec；
3) mold temperature: room temperature (20~35 DEG C), or it is heated to 100 DEG C or less.
9. according to the method described in claim 6, it is characterized in that, carrying out the layer of copper-clad plate in stamping forming printed wiring board
Number is 4~14 layers, with a thickness of 0.2~1mm.
10. a kind of high density with warp architecture interconnects (HDI) printed wiring board, which is characterized in that described that there is bending knot
The HDI printed wiring board of structure is to pass through primary or punch forming for several times using method described in any one of claim 6~9
And make, bending angle is 10~90 °, and bending radius is 1~25mm, it is preferable that the printed wiring board needs to bend
Molding region only has simple route, is not turned on hole.
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| CN201711091388.0A CN109757023B (en) | 2017-11-08 | 2017-11-08 | Printed circuit board and manufacturing method thereof |
| PCT/CN2017/117501 WO2019090918A1 (en) | 2017-11-08 | 2017-12-20 | Printed circuit board and manufacturing method therefor |
| KR1020207010583A KR102522754B1 (en) | 2017-11-08 | 2017-12-20 | Printed circuit board and its manufacturing method |
| TW107106258A TWI711354B (en) | 2017-11-08 | 2018-02-23 | Printed circuit board and manufacturing method thereof |
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| CN201711091388.0A CN109757023B (en) | 2017-11-08 | 2017-11-08 | Printed circuit board and manufacturing method thereof |
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| CN109757023B CN109757023B (en) | 2022-04-26 |
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| KR (1) | KR102522754B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112662132A (en) * | 2020-12-22 | 2021-04-16 | 广东盈骅新材料科技有限公司 | Modified resin composition and preparation method and application thereof |
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| CN112662132A (en) * | 2020-12-22 | 2021-04-16 | 广东盈骅新材料科技有限公司 | Modified resin composition and preparation method and application thereof |
| CN112662132B (en) * | 2020-12-22 | 2023-08-22 | 广东盈骅新材料科技有限公司 | Modified resin composition and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019090918A1 (en) | 2019-05-16 |
| KR20200053566A (en) | 2020-05-18 |
| KR102522754B1 (en) | 2023-04-17 |
| CN109757023B (en) | 2022-04-26 |
| TWI711354B (en) | 2020-11-21 |
| TW201919451A (en) | 2019-05-16 |
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