CN109741859A - Transparent conductive film substrate and preparation method thereof - Google Patents
Transparent conductive film substrate and preparation method thereof Download PDFInfo
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- CN109741859A CN109741859A CN201910150177.2A CN201910150177A CN109741859A CN 109741859 A CN109741859 A CN 109741859A CN 201910150177 A CN201910150177 A CN 201910150177A CN 109741859 A CN109741859 A CN 109741859A
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Abstract
The present invention relates to a kind of transparent conductive film substrates and preparation method thereof, and wherein method and step includes: to print insulation glue-line on the substrate by printing technology；Circuit board is set in the side of the printing insulation glue-line, and connect the circuit board with the insulation glue-line；Optical adhesive layer is set in the other side of the insulation glue-line, and makes the thickness of the optical adhesive layer greater than the thickness of the insulation glue-line.The production method of above-mentioned transparent conductive film substrate prints insulation glue-line by printing technology on substrate, obtains the thickness of accurate control insulation glue-line, the thickness of insulation glue-line is avoided to be greater than the thickness of optical adhesive layer and cause product bad；It connect circuit board with insulation glue-line, so that the route on circuit board can be protected, even if the frame of substrate is relatively narrow, nor affects on the coating and its effect played of insulation glue-line.
Description
Technical field
The present invention relates to touch screen fields, more particularly to a kind of transparent conductive film substrate and preparation method thereof.
Background technique
Transparent conductive film substrate after FOC (Bumping process flow) processing procedure, need to coat insulating cement with into
Row line is protected, and generally insulating cement is coated by dispenser in existing substrate, coated in the insulation glue-line receptor site glue on substrate
The influence of machine various parameters, it is difficult to which it is blocked up and cause product not to be easy to appear insulation glue-line for the thickness of accurate control insulation glue-line
It is good, as phenomena such as bubble occurs in product surface；If substrate it is reserved point glue space it is narrow, may due to without enough spaces into
Row dispensing and there is the insulating cement not situation complete with wiring circuit contact, be unfavorable for protection circuit.
Summary of the invention
Based on this, in view of the above-mentioned problems, it is necessary to provide a kind of transparent conductive film substrates and preparation method thereof.
A kind of production method of transparent conductive film substrate, step include:
Print insulation glue-line on the substrate by printing technology；
Circuit board is set on the substrate, and makes the side of the adjacent insulation glue-line of the circuit board；
Optical adhesive layer is set in the other side of the insulation glue-line, and the thickness of the optical adhesive layer is made to be greater than the insulation
The thickness of glue-line.
One end of the circuit board is covered on the insulation glue-line of part in one of the embodiments, is made described
There is lap between circuit board and the insulation glue-line.
In one of the embodiments, further include: the insulation glue-line is solidified by ultra-violet curing technique.
In one of the embodiments, in ultra-violet curing technique, by solidification temperature control within 110 degree.
In one of the embodiments, on the substrate print thickness be less than 15um insulation glue-line.
In one of the embodiments, further include: anisotropic conductive adhesive paste is set between the substrate and the circuit board
Film layer bonds the circuit board by the anisotropic conductive film layer and the substrate, and realizes connection.
The anisotropic conductive adhesive paste is coated on the substrate and part the insulation glue-line in one of the embodiments,
Film layer makes have lap between the anisotropic conductive film layer and the insulation glue-line.
The insulation is printed on the substrate and part the anisotropic conductive film layer in one of the embodiments,
Glue-line makes have lap between the insulation glue-line and the anisotropic conductive film layer.
One end of the anisotropic conductive film layer is flushed with one end of the circuit board in one of the embodiments,
Setting
A kind of transparent conductive film substrate, comprising:
Insulate glue-line, on the substrate by printing technology printing；
Circuit board, is arranged in the side of the insulation glue-line, and the circuit board is connect with the insulation glue-line；
Optical adhesive layer, is arranged in the other side of the insulation glue-line, and the thickness of the optical adhesive layer is greater than the insulating cement
The thickness of layer.
Above-mentioned transparent conductive film substrate and preparation method thereof is printed insulation glue-line on substrate by printing technology, obtained
The thickness for obtaining accurately control insulation glue-line avoids the thickness of insulation glue-line from being greater than the thickness of optical adhesive layer and cause product bad；
It connect circuit board with insulation glue-line, so that the route on circuit board can be protected, even if the frame of substrate is relatively narrow, also not shadow
Ring the coating and its effect played of insulation glue-line.
Detailed description of the invention
Fig. 1 is the production flow diagram of transparent conductive film substrate in one embodiment；
Fig. 2 is arrangement mode of several substrates 210 on big plate 220 in one embodiment；
Fig. 3 is the production flow diagram of transparent conductive film substrate in another embodiment；
Fig. 4 is the sectional view of transparent conductive film substrate in one embodiment；
Fig. 5 is the production flow diagram of transparent conductive film substrate in another embodiment；
Fig. 6 is the sectional view of transparent conductive film substrate in another embodiment；
Fig. 7 is the plane structure chart of transparent conductive film substrate in one embodiment；
Fig. 8 is the enlarged drawing in Fig. 7 at A.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
Body embodiment purpose, it is not intended that in limitation the present invention.
Fig. 1 is the production method of transparent conductive film substrate in one embodiment.As shown in Figure 1, this method includes following
Step S110 to S130.
S110, insulation glue-line is printed on substrate by printing technology, the thickness of the insulation glue-line is easily controllable, passes through print
The lesser insulation glue-line of the available thickness of dataller's skill.Optionally, the print thickness of the insulation glue-line is less than 15um, the insulating cement
The surface impedance of layer is greater than 10*10^10 Ω, and in the present embodiment, the print thickness of the insulation glue-line is 6~10um.
S120, circuit board is set in the side of printing insulation glue-line, and connect circuit board with insulation glue-line, to route
It is protected.Wherein, which is flexible circuit board.
S130, optical adhesive layer is set in the other side of insulation glue-line, and the thickness of optical adhesive layer is made to be greater than insulation glue-line
Thickness, so that the resulting finished product yield of following process is not influenced by insulation glue-line.
This method can be used for middle operation or small pieces operation, and middle operation is aligned by above-mentioned steps S110 to S130 simultaneously
It is processed in several substrates on the same big plate, Fig. 2 is several substrates 210 in one embodiment on big plate 220
Arrangement mode, in other embodiments, several substrates 210 can also be other arrangement modes on big plate 220.Small pieces are made
Industry processes single substrate by above-mentioned steps S110 to S130.
Wherein the sequence of step S110 to S130 can be interchanged, and need to only ensure that it puts in order and be followed successively by circuit board, insulation
Glue-line and optical adhesive layer.
The production method of above-mentioned transparent conductive film substrate is printed insulation glue-line on substrate by printing technology, obtained
The thickness of accurate control insulation glue-line, avoids the thickness of insulation glue-line from being greater than the thickness of optical adhesive layer and cause product bad；Make
The side of the adjacent insulation glue-line of circuit board, so that the route on circuit board can be protected, even if the frame of substrate is relatively narrow, also not
Influence the coating and its effect played of insulation glue-line.
Fig. 3 is the production method of transparent conductive film substrate in another embodiment；Fig. 4 is transparent in one embodiment leads
The sectional view of conductive film substrate.As shown in figure 3, this approach includes the following steps S310 to S350.
S310, insulation glue-line is printed on substrate by printing technology, the thickness of the insulation glue-line is easily controllable, passes through print
The lesser insulation glue-line of the available thickness of dataller's skill.Optionally, the print thickness of the insulation glue-line is less than 15um, the insulating cement
The surface impedance of layer is greater than 10*10^10 Ω.
S320, the insulation glue-line is solidified by ultra-violet curing technique.In ultra-violet curing technique, solidification temperature control is existed
Within 110 degree.
S330, anisotropic conductive film layer is set on substrate.Wherein it is possible to make the side of the anisotropic conductive film layer
Edge abuts against the side of insulation glue-line, concrete operations are as follows: coats anisotropic conductive film close to insulation glue-line on substrate
Layer；The side and insulation glue-line that can also make the anisotropic conductive film layer are crossed to form lap, concrete operations are as follows: exhausted
Anisotropic conductive film layer is coated on the edge of edge glue-line, and continues to coat anisotropy conduction close to insulation glue-line on substrate
Adhesive film makes have lap between anisotropic conductive film layer and insulation glue-line；It in other embodiments, can be with anisotropy
Conducting resinl film layer and insulation glue-line can also be other positional relationships.In the present embodiment, the one of anisotropic conductive film layer
Side and insulation glue-line are crossed to form lap, as shown in figure 4, insulation glue-line 420 is arranged on substrate 410, anisotropy is conductive
Adhesive film 430 is arranged on substrate 410 and SI semi-insulation glue-line 420.
S340, circuit board is set on anisotropic conductive film layer.Concrete operations are as follows: circuit board cover is located at anisotropy and is led
On electric adhesive film, bonded with anisotropic conductive film layer, so that circuit board be made to be adhesively fixed on substrate.Wherein, pass through different side
Property conducting resinl film layer, circuit board realize respectively with substrate and insulate glue-line connection.In the present embodiment, by anisotropy conduction
One end of one end and circuit board that adhesive film is connect with insulation glue-line flushes setting, to ensure the insulation glue-line in printing tolerance
Route can be completely attached to, to realize route protection.As shown in figure 4, one end of circuit board 440 and the one of insulation glue-line 420
End flushes, and anisotropic conductive film layer 430 is arranged on substrate 410 and SI semi-insulation glue-line 420, i.e. the lid of circuit board 440 is located at
On substrate 410 and SI semi-insulation glue-line 420, by anisotropic conductive film layer 430, the fixation of circuit board 440 is bonded in substrate 410
It is connect on SI semi-insulation glue-line 420, and respectively with substrate 410 and insulation glue-line 420.
S350, optical adhesive layer is set far from the side of circuit board in insulation glue-line, and it is exhausted to be greater than the thickness of optical adhesive layer
The thickness of edge glue-line, so that the resulting finished product yield of following process is not influenced by insulation glue-line.As shown in figure 4, optical adhesive layer
On 450 setting substrates 410, positioned at insulation side of the glue-line 420 far from circuit board 440.
Wherein step S350 can be executed between any two steps.
Fig. 5 is the production method of transparent conductive film substrate in another embodiment；Fig. 6 is transparent in one embodiment leads
The sectional view of conductive film substrate.As shown in figure 5, this approach includes the following steps S510 to S550.
S510, anisotropic conductive film layer is coated on substrate.
S520, insulation glue-line is printed on substrate and on the anisotropic conductive film layer of part by printing technology, makes different side
Property conducting resinl film layer and insulation glue-line be crossed to form lap.As shown in fig. 6, anisotropic conductive film layer 630 is arranged in base
On plate 610, insulation glue-line 620 is arranged on substrate 610 and part anisotropic conductive film layer 630.Wherein, the insulation glue-line
Thickness is easily controllable, passes through the lesser insulation glue-line of the available thickness of printing technology.Optionally, the printing of the insulation glue-line is thick
Degree is less than 15um, and the surface impedance of the insulation glue-line is greater than 10*10^10 Ω.
S530, the insulation glue-line is solidified by ultra-violet curing technique.In ultra-violet curing technique, solidification temperature control is existed
Within 110 degree.
S540, circuit board is set on anisotropic conductive film layer and SI semi-insulation glue-line.Concrete operations are as follows: by circuit board
Lid is located on anisotropic conductive film layer and SI semi-insulation glue-line, the partial circuit plate for being located at lid on anisotropic conductive film layer
It is bonded with anisotropic conductive film layer, so that circuit board be made to be adhesively fixed on substrate；Another part circuit board and insulation glue-line
It connects, to ensure that the insulation glue-line in printing tolerance can completely attach to route, to realize route protection.Wherein,
By anisotropic conductive film layer, circuit board realizes the connection with substrate.As shown in fig. 6, insulation glue-line 620 is arranged in substrate
610 and part anisotropic conductive film layer 630 on, circuit board 640 lid be located at anisotropic conductive film layer 630 and SI semi-insulation glue
It on layer 620, connects with insulation glue-line 620, and is bonded on substrate 610 by the fixation of anisotropic conductive film layer 630, together
The connection of Shi Shixian and substrate 610.
S550, optical adhesive layer is set far from the side of circuit board in insulation glue-line, and it is exhausted to be greater than the thickness of optical adhesive layer
The thickness of edge glue-line, so that the resulting finished product yield of following process is not influenced by insulation glue-line.As shown in fig. 6, optical adhesive layer
On 650 setting substrates 610, positioned at insulation side of the glue-line 620 far from circuit board 640.
Wherein step S550 can be executed between any two steps.
Substrate in above-described embodiment can be transparent conductive film substrate；Circuit board in above-described embodiment can be soft
Property circuit board.
The production method of above-mentioned transparent conductive film substrate is printed insulation glue-line on substrate by printing technology, obtained
The thickness of accurate control insulation glue-line, avoids the thickness of insulation glue-line from being greater than the thickness of optical adhesive layer and cause product bad；Make
Circuit board cover is located on substrate and SI semi-insulation glue-line, to ensure that the insulation glue-line in printing tolerance can completely attach to line
Road, even if the frame of substrate is relatively narrow, nor affects on the coating and its effect played of insulation glue-line to realize route protection
Fruit.
Fig. 7 is the plane structure chart of transparent conductive film substrate in one embodiment.As shown in fig. 7, the electrically conducting transparent is thin
Ilm substrate includes:
Insulate glue-line 720, is printed on substrate 710 by printing technology；
Circuit board 740, is arranged in the side of insulation glue-line 710, and circuit board 740 is connect with insulation glue-line 720；
Optical adhesive layer 750, is arranged in insulation side of the glue-line 720 far from circuit board 740, and the thickness of optical adhesive layer 750 is big
In the thickness of insulation glue-line 720.
It in one embodiment, further include anisotropic conductive film layer, which can be set in base
On plate and SI semi-insulation glue-line, also it can be arranged directly on substrate.
In the present embodiment, the sectional view of transparent conductive film substrate is as shown in figure 4, insulation glue-line 420 is arranged in substrate 410
On；Anisotropic conductive film layer 430 is arranged on substrate 410 and SI semi-insulation glue-line 420；The lid of circuit board 440 is located at anisotropy
It in conducting resinl film layer 430, bonds with anisotropic conductive film layer 430, is fixedly connected to realize with substrate 410；Optical cement
Layer 450 is arranged on substrate 410, positioned at insulation side of the glue-line 420 far from circuit board 440.
Wherein, anisotropic conductive film layer 430 is arranged on substrate 410 and SI semi-insulation glue-line 420, i.e. circuit board 440
Lid is located on substrate 410 and SI semi-insulation glue-line 420, and by anisotropic conductive film layer 430, the fixation of circuit board 440 is bonded in
On substrate 410 and SI semi-insulation glue-line 420, and it is connect respectively with substrate 410 and insulation glue-line 420.Optionally, circuit board 440
One end and insulation glue-line 420 one end flush, with ensure printing tolerance in insulation glue-line 420 can completely attach to line
Road, to realize route protection, as shown in figure 8, Fig. 8 is the enlarged drawing in Fig. 7 at A, insulation glue-line 820 has with circuit board 840
The region of overlapping, to ensure that the insulation glue-line 820 in printing tolerance can completely attach to route 841.
In one embodiment, the sectional view of transparent conductive film substrate is as shown in fig. 6, anisotropic conductive film layer 630
It is arranged on substrate 610；The glue-line 620 that insulate is arranged on substrate 610 and part anisotropic conductive film layer 630；Circuit board 640
Lid is located on anisotropic conductive film layer 630 and SI semi-insulation glue-line 620, is connected with insulation glue-line 620, optical adhesive layer
On 650 setting substrates 610, positioned at insulation side of the glue-line 620 far from circuit board 640.
Wherein, the lid of circuit board 640 is located on SI semi-insulation glue-line 620, is connected with insulation glue-line 620, to ensure
Insulation glue-line in printing tolerance can completely attach to route, to realize route protection.The lid of circuit board 640 is located at anisotropy and leads
It on electric adhesive film 630, is bonded on substrate 610, while realized and substrate 610 by the fixation of anisotropic conductive film layer 630
Connection.
Substrate in above-described embodiment can be transparent conductive film substrate；Circuit board in above-described embodiment can be soft
Property circuit board.
Above-mentioned transparent conductive film substrate prints insulation glue-line by printing technology on substrate, and it is exhausted to obtain accurate control
The thickness of edge glue-line avoids the thickness of insulation glue-line from being greater than the thickness of optical adhesive layer and cause product bad；Set circuit board cover
On substrate and SI semi-insulation glue-line, to ensure that the insulation glue-line in printing tolerance can completely attach to route, to realize
Route protection nor affects on the coating and its effect played of insulation glue-line even if the frame of substrate is relatively narrow.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of production method of transparent conductive film substrate, which is characterized in that step includes:
Print insulation glue-line on the substrate by printing technology；
Circuit board is set in the side of the printing insulation glue-line, and connect the circuit board with the insulation glue-line；
Optical adhesive layer is set in the other side of the insulation glue-line, and the thickness of the optical adhesive layer is made to be greater than the insulation glue-line
Thickness.
2. the production method of transparent conductive film substrate according to claim 1, which is characterized in that by the circuit board
One end is covered on the insulation glue-line of part, makes have lap between the circuit board and the insulation glue-line.
3. the production method of transparent conductive film substrate according to claim 1, which is characterized in that further include: pass through purple
Outer curing process solidifies the insulation glue-line.
4. the production method of transparent conductive film substrate according to claim 3, which is characterized in that in ultra-violet curing technique
In, by solidification temperature control within 110 degree.
5. the production method of transparent conductive film substrate according to claim 1, which is characterized in that print on the substrate
Brush thickness is less than the insulation glue-line of 15um.
6. the production method of transparent conductive film substrate according to claim 2, which is characterized in that further include: described
Anisotropic conductive film layer is set between substrate and the circuit board, the circuit board is made to pass through the anisotropic conductive film layer
It is bonded with the substrate, and realizes connection.
7. the production method of transparent conductive film substrate according to claim 6, which is characterized in that in the substrate and portion
Divide on the insulation glue-line and coat the anisotropic conductive film layer, makes the anisotropic conductive film layer and the insulation glue-line
Between have lap.
8. the production method of transparent conductive film substrate according to claim 6, which is characterized in that in the substrate and portion
Divide on the anisotropic conductive film layer and print the insulation glue-line, makes the insulation glue-line and the anisotropic conductive film layer
Between have lap.
9. the production method of transparent conductive film substrate according to claim 6, which is characterized in that lead the anisotropy
One end of electric adhesive film flushes setting with one end of the circuit board.
10. a kind of transparent conductive film substrate characterized by comprising
Insulate glue-line, on the substrate by printing technology printing；
Circuit board, is arranged in the side of the insulation glue-line, and the circuit board is connect with the insulation glue-line；
Optical adhesive layer, is arranged in the other side of the insulation glue-line, and the thickness of the optical adhesive layer is greater than the insulation glue-line
Thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910150177.2A CN109741859B (en) | 2019-02-28 | 2019-02-28 | Transparent conductive film substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910150177.2A CN109741859B (en) | 2019-02-28 | 2019-02-28 | Transparent conductive film substrate and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN109741859A true CN109741859A (en) | 2019-05-10 |
| CN109741859B CN109741859B (en) | 2020-10-16 |
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| JP2011124075A (en) * | 2009-12-10 | 2011-06-23 | Sekisui Chem Co Ltd | Insulating sheet, laminated structure, and manufacturing method of laminated structure |
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| CN103593089A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch screen of GG structure |
| CN103716980A (en) * | 2013-12-30 | 2014-04-09 | 重庆博耐特实业（集团）有限公司 | Positive electrode oxidation film printing substrate used for power module |
| CN104238825A (en) * | 2014-09-30 | 2014-12-24 | 江西省平波电子有限公司 | Manufacturing technology of touch screen of improved PG structure |
| CN107168588A (en) * | 2017-07-14 | 2017-09-15 | 业成科技（成都）有限公司 | Touch module structure and its manufacture method |
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2019
- 2019-02-28 CN CN201910150177.2A patent/CN109741859B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011124075A (en) * | 2009-12-10 | 2011-06-23 | Sekisui Chem Co Ltd | Insulating sheet, laminated structure, and manufacturing method of laminated structure |
| KR20130039119A (en) * | 2011-10-11 | 2013-04-19 | 연세대학교 산학협력단 | Complex of graphene and polymer, device having complex of graphene and polymer and manufacturing method thereof |
| CN103593089A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch screen of GG structure |
| CN103716980A (en) * | 2013-12-30 | 2014-04-09 | 重庆博耐特实业（集团）有限公司 | Positive electrode oxidation film printing substrate used for power module |
| CN104238825A (en) * | 2014-09-30 | 2014-12-24 | 江西省平波电子有限公司 | Manufacturing technology of touch screen of improved PG structure |
| CN107168588A (en) * | 2017-07-14 | 2017-09-15 | 业成科技（成都）有限公司 | Touch module structure and its manufacture method |
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| CN109741859B (en) | 2020-10-16 |
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