CN109734931A - For removing the environment-friendly type glue-dispenser and preparation method thereof of burr after semiconductor packages - Google Patents
For removing the environment-friendly type glue-dispenser and preparation method thereof of burr after semiconductor packages Download PDFInfo
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- CN109734931A CN109734931A CN201811489153.1A CN201811489153A CN109734931A CN 109734931 A CN109734931 A CN 109734931A CN 201811489153 A CN201811489153 A CN 201811489153A CN 109734931 A CN109734931 A CN 109734931A
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Abstract
The present invention relates to a kind of for removing the environment-friendly type glue-dispenser and preparation method thereof of burr after semiconductor packages, the glue-dispenser is prepared by the component of following weight percent: softening solvent 35-65%, quaternary ammonium bases organic amine 25-40%, association complex 0.5-1.6%, reducing agent 0.1-1%, ion-nonionic surfactant 0.1-3%, preservative 0.2-0.8%, stabilizer 0.1-0.5%, surplus is deionized water；When preparation, the deionized water of 1/2-2/3 amount is added in a reservoir, sequentially adds softening solvent, quaternary ammonium bases organic amine, association complex and reducing agent, stirring；Preservative, stabilizer and ion-nonionic surfactant are sequentially added, is stirred, deionized water is then filled into aequum, is uniformly mixed.Compared with prior art, glue-dispenser of the present invention has splendid deburring (flash), deoxidation compound effect, it is not damaged to plastic-sealed body (substrate), the feature of environmental protection is good, it can be recycled, it can avoid having a good application prospect the damage of the part other than burr to the maximum extent.
Description
Technical field
The present invention relates to semiconductor fabrication techniques field, more particularly, to a kind of for removing burr after semiconductor packages
Environment-friendly type glue-dispenser and its preparation.
Background technique
Semiconductor packages, which refers to, to process to obtain individual chips according to product type and functional requirement by the wafer tested
Process.Encapsulation process are as follows: the wafer from the preceding road technique of wafer is cut into small chip (Die) after passing through scribing process,
Then the chip of well cutting glue is mounted onto the island of corresponding substrate (lead frame) frame, recycles ultra-fine metal
The landing pad (BondPad) of chip is connected to the respective pins of substrate by (Jin Xitong aluminium) conducting wire or electroconductive resin
(Lead), and required circuit is constituted；Then packaging protection is subject to plastic shell to independent chip again.And actual
Burr can be inevitably generated in encapsulation process, burr is also referred to as overlap or flash, refers to semiconductor devices after plastic packaging
Remain in the epoxy-plastic packaging material flash of pin etc..It is the plastics substance overflowed from mold during plastic packaging, usually
Burr mainly include three parts: epoxy resin, release agent and the cured epoxy molding plastic not being fully cured.They can be half
It is formed at the pin of conductor device, and is wrapped up pin in the form of plastic foil of varying thickness.If without processing
If, it will affect the appearance of product, when plating leakage copper occurs and seriously affects plating weldability, to the reliable of electronic component
Property causes tremendous influence, so product generally must all carry out corresponding pre-treatment debarring process, by substrate surface and pipe
Plastic packaging flash removal on foot is clean, just can enter subsequent electroplating work procedure.
In order to remove flash removed to guarantee being normally carried out for subsequent electroplating work procedure, the current country is struck off substantially with craft or machinery
Sandblasting, electrolysis go flash either strong acid or strong alkali solution chemical immersion etc. to carry out the removal of burr, but craft and machinery
Method be easy to damage substrate surface, lead to bad order, and go the effect of flash also undesirable, edge flash is easy to
Remaining influence subsequent electroplating process；Need to be equipped with expensive electrolytic deburring device using the method for electrochemical deburring, this
Very big pressure is increased without row to medium-sized and small enterprises；In addition the method that strong acid or strong alkali solution impregnate, strong acid are easy to damage
Metal substrate and plastic-sealed body surface, and strong alkali solution is not easy to clean up, substance remained on surface, and plastic-sealed body is easy to cause to become
The problems such as color, is affected to some extent product quality.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide one kind effectively to overcome
The deficiency of burr removing method, can avoid to the maximum extent to the part other than burr in existing semiconductive resin encapsulation post-processing
Damage, so that treated element appearance and the impregnable environment-friendly type for removing burr after semiconductor packages of function are removed photoresist
Agent.
Another object of the present invention is just to provide above-mentioned for removing the environment-friendly type glue-dispenser of burr after semiconductor packages
Preparation method.
The purpose of the present invention can be achieved through the following technical solutions:
It is a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, the environment-friendly type glue-dispenser is by following weight hundred
The component of score is prepared: softening solvent 35-65%, quaternary ammonium bases organic amine 25-40%, association complex 0.5-1.6%,
Reducing agent 0.1-1%, ion-nonionic surfactant 0.1-3%, preservative 0.2-0.8%, stabilizer 0.1-0.5%, it is remaining
Amount is deionized water.
The softening solvent is mixed by alcohols solvent, amide solvent and esters solvent.
The alcohols solvent includes glycerol, methanol, ethyl alcohol, isopropanol, ethylene glycol, three contracting triethylene glycols, n-butanol, different
One of butanol or benzyl alcohol are a variety of, and the amide solvent includes formamide, acetamide, N, N- dimethyl formyl
One of amine, n,N-dimethylacetamide, succimide or urea are a variety of, and the esters solvent includes propylene glycol first
Ether acetic acid ester, propylene-glycol ethyl ether acetic acid esters, diethyl carbonate, glyceryl triacetate, ethyl acetoacetate or Sorbitan alcohol ester
One of fat acid esters is a variety of.
The quaternary ammonium bases organic amine includes tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, trimethyl benzyl hydrogen-oxygen
Change one of ammonium, tetraethyl ammonium hydroxide and triethylbenzyl ammonium hydroxide or a variety of.
The association complex be disodium ethylene diamine tetraacetate, sodium alginate and modified sodium lignosulfonate in mass ratio
It is mixed for 1:1:2-5.
The preparation method of the modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, and the water that mass concentration is 30-40% is made in stirring and dissolving
Hydroquinone is added in solution, and regulation system pH value is 8-10, is placed in variable frequency microwave reactor, regulation power 300-
1200W is warming up to 90-100 DEG C, reacts 0.5-1h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 70-80 DEG C, is stirred to react 1-2h；
Step (C): it is cooled to 30-40 DEG C of addition phosphorous acid crystal, is uniformly mixed；
Step (D): after being cooled to 30-40 DEG C, being added dropwise formalin, react 2-4h after being then warming up to 80-100 DEG C, to
Modified sodium lignosulfonate is obtained after reaction.
The mass ratio of the sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:2-4:1-2:
1-1.5；
The mass ratio of the sodium lignin sulfonate and phosphorous acid crystal, formalin is 10:1.5-3:3-4；
The mass concentration of the formalin is 32-37%, and the formalin drips in 0.5h.
The reducing agent includes hydroxylamine, hydroxyl sulfate, hydroxylamine hydrochloride, hydrogen peroxide, sodium sulfite, sodium hypophosphite, boron
One or more of sodium hydride or potassium borohydride, the ion-nonionic surfactant are Anionic surfactants
The mixture of agent and nonionic surfactant, the preservative include one in triethanolamine oleate or benzotriazole
Kind or two kinds, the stabilizer include mercapto benzothiazole sodium salt, lignosulfonate, xylitol, D-sorbite, sodium lactate,
One or more of soybean protein.
The anionic surfactant is perfluoro alkyl sulfonic acid potassium, and the nonionic surfactant is rouge
Fatty acid methyl esters ethoxylate and/or alkyl polyglycoside.
It is a kind of for removing the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, this method includes following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 35-65%, quaternary ammonium bases organic amine 25-40%, association complex 0.5-1.6%, reducing agent 0.1-
1%, ion-nonionic surfactant 0.1-3%, preservative 0.2-0.8%, stabilizer 0.1-0.5%, surplus are deionization
Water；
Step (2): the deionized water of 1/2-2/3 amount is added in a reservoir, sequentially adds according to the ratio under agitation soft
Change solvent, quaternary ammonium bases organic amine, association complex and reducing agent, after adding, continues to stir 5-10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 5-10min, then fills into deionized water to aequum, stirs.
The pH value that the present invention is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages is 7.5-9.It is actually using
When, it by the environment-friendly type glue-dispenser, is added in stainless steel sink, is warming up to 70-85 DEG C, substrate to be processed is impregnated into 20-
40min is rinsed well after gently being brushed with brush, dry.
Using the softening solvent mixed by alcohols solvent, amide solvent and esters solvent in inventive formulation, it is
The bulk composition of deburring liquid, for semiconductor-sealing-purpose resin softening, dissolution, under alkaline atmosphere by with other auxiliary agents
Synergistic effect remove workpiece surface burr；And used quaternary ammonium bases organic amine can promote corresponding pH value, and then guarantee
Deburring effect, and it can occur saponification with the fatty glyceride in greasy dirt and form nascent soap, become greasy dirt
Water-soluble and dissolved removal；Have in used association complex, in modified sodium lignosulfonate chelator molecule big
Also there are lone pair electrons pair on N, P atom of amount hydroxyl and carboxyl, introduced amino and phosphonic acid base, there is stronger chelating energy
Power is used in compounding with disodium ethylene diamine tetraacetate, sodium alginate, can effectively prevent the generation of sediment in solution, and reduction is gone
The unnecessary consumption of jelly, guaranteed efficiency form protective film in metal surface by chelatropic reaction, can effectively reduce glue-dispenser pair
Corrosion of metal；Used reducing agent and preservative play the role of inhibiting oxidation on metal surface corrosion；And ion-it is non-from
On the one hand sub- surfactant promotes the dissolubility of organic matter, enhance the wetting effect to workpiece of glue-dispenser, promotes reaction, separately
On the one hand it acts synergistically with alkali, promotes cleaning effect；The use of stabilizer can then improve compatible steady between system each component
It is qualitative, while glue-dispenser also can be improved to the wetting effect of workpiece.
Compared with prior art, the invention has the characteristics that:
1) there is splendid deburring (flash), deoxidation compound effect, not damaged to plastic-sealed body (substrate), formula material is complete
It is more convenient to meet the waste processing that environmental requirement, product be stable, generates in use process entirely；
2) it can effectively overcome the shortcomings of burr removing method in existing semiconductive resin encapsulation post-processing, deburring efficiency is more
Height is readily cleaned, and can be recycled, and can prevent plastic-sealed body surface discolouration, and can avoid to the maximum extent to other than burr
Partial damage, so that treated element appearance and function are unaffected.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.
Embodiment 1:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
Be prepared: softening solvent 42%, quaternary ammonium bases organic amine 30%, association complex 1.2%, reducing agent 0.8%, ion-are non-
Ionic surface active agent 1%, preservative 0.5%, stabilizer 0.4%, surplus are deionized water.
Wherein, softening solvent by glycerol, succimide and propylene glycol methyl ether acetate be in mass ratio 1:1:3 mixing and
At；Quaternary ammonium bases organic amine is tetramethylammonium hydroxide；Association complex is disodium ethylene diamine tetraacetate, sodium alginate and modification
Sodium lignin sulfonate mixes in mass ratio for 1:1:2.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 32% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 9, is placed in variable frequency microwave reactor, regulation power 800W is warming up to 95
DEG C, react 0.5h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 72 DEG C, is stirred to react 2h；
Step (C): 35 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 35 DEG C, formalin is added dropwise, 3h is reacted after being then warming up to 90 DEG C, to after reaction
Obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:3:1:1；It is wooden
The mass ratio of plain sodium sulfonate and phosphorous acid crystal, formalin is 10:3:3；The mass concentration of formalin is 35%, and first
Aldehyde solution drips in 0.5h.
In the present embodiment, reducing agent is hydroxylamine；Ion-nonionic surfactant be anionic surfactant with
The mixture of nonionic surfactant, anionic surfactant are perfluoro alkyl sulfonic acid potassium, and non-ionic surface is living
Property agent be fatty acid methyl ester ethoxylate；Preservative is triethanolamine oleate；Stabilizer is sodium lactate.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 42%, quaternary ammonium bases organic amine 30%, association complex 1.2%, reducing agent 0.8%, ion-it is non-from
Sub- surfactant 1%, preservative 0.5%, stabilizer 0.4%, surplus are deionized water；
Step (2): being added the deionized water of 1/2 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 8min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 8min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 8.In actual use, by environment-friendly type glue-dispenser, stainless steel is added
In slot, 75 DEG C are warming up to, substrate to be processed is impregnated into 30min, is rinsed well after gently being brushed with brush, it is dry.
Embodiment 2:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
Be prepared: softening solvent 51%, quaternary ammonium bases organic amine 34%, association complex 1%, reducing agent 0.6%, ion-it is non-from
Sub- surfactant 0.4%, preservative 0.6%, stabilizer 0.3%, surplus are deionized water.
Wherein, softening solvent presses quality by three contracting triethylene glycols, n,N-dimethylacetamide and propylene-glycol ethyl ether acetic acid esters
Than being mixed for 2:1:1；Quaternary ammonium bases organic amine is tetraethyl ammonium hydroxide；Association complex is ethylenediamine tetra-acetic acid two
Sodium, sodium alginate and modified sodium lignosulfonate mix in mass ratio for 1:1:3.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 35% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 8, is placed in variable frequency microwave reactor, regulation power 1000W is warming up to
100 DEG C, react 0.5h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 76 DEG C, is stirred to react 1.5h；
Step (C): 34 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 34 DEG C, formalin is added dropwise, 2h is reacted after being then warming up to 100 DEG C, to the end of reacting
After obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:2:1:1.2；Wood
The mass ratio of quality sodium sulfonate and phosphorous acid crystal, formalin is 10:2:3.5；The mass concentration of formalin is 32%, and
And formalin drips in 0.5h.
In the present embodiment, reducing agent is hydroxyl sulfate；Ion-nonionic surfactant is anionic surfactant
With the mixture of nonionic surfactant, anionic surfactant is perfluoro alkyl sulfonic acid potassium, non-ionic surface
Activating agent is alkyl polyglycoside；Preservative is benzotriazole；Stabilizer is lignosulfonate.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 51%, quaternary ammonium bases organic amine 34%, association complex 1%, reducing agent 0.6%, ion-nonionic
Surfactant 0.4%, preservative 0.6%, stabilizer 0.3%, surplus are deionized water；
Step (2): being added the deionized water of 2/3 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 6min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 6min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 9.In actual use, by environment-friendly type glue-dispenser, stainless steel is added
In slot, 80 DEG C are warming up to, substrate to be processed is impregnated into 35min, is rinsed well after gently being brushed with brush, it is dry.
Embodiment 3:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
Be prepared: softening solvent 54%, quaternary ammonium bases organic amine 28%, association complex 1.5%, reducing agent 0.8%, ion-are non-
Ionic surface active agent 2%, preservative 0.2%, stabilizer 0.4%, surplus are deionized water.
Wherein, softening solvent is 1:2:4 mixing by isopropanol, n,N-Dimethylformamide and diethyl carbonate in mass ratio
It forms；Quaternary ammonium bases organic amine is trimethyl benzyl ammonium hydroxide；Association complex is disodium ethylene diamine tetraacetate, sodium alginate
It is mixed in mass ratio for 1:1:4 with modified sodium lignosulfonate.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 35% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 10, is placed in variable frequency microwave reactor, regulation power 600W is warming up to 90
DEG C, react 1h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 76 DEG C, is stirred to react 1.5h；
Step (C): 32 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 32 DEG C, formalin is added dropwise, 4h is reacted after being then warming up to 80 DEG C, to after reaction
Obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:4:2:1.5；Wood
The mass ratio of quality sodium sulfonate and phosphorous acid crystal, formalin is 10:3:4；The mass concentration of formalin is 37%, and
Formalin drips in 0.5h.
In the present embodiment, reducing agent is hydroxylamine hydrochloride；Ion-nonionic surfactant is anionic surfactant
With the mixture of nonionic surfactant, anionic surfactant is perfluoro alkyl sulfonic acid potassium, non-ionic surface
Activating agent is alkyl polyglycoside；Preservative is benzotriazole；Stabilizer is xylitol.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 54%, quaternary ammonium bases organic amine 28%, association complex 1.5%, reducing agent 0.8%, ion-it is non-from
Sub- surfactant 2%, preservative 0.2%, stabilizer 0.4%, surplus are deionized water；
Step (2): being added the deionized water of 2/3 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 10min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 8.5.In actual use, it by environment-friendly type glue-dispenser, is added stainless
In steel tank, 82 DEG C are warming up to, substrate to be processed is impregnated into 25min, is rinsed well after gently being brushed with brush, it is dry.
Embodiment 4:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
Be prepared: softening solvent 35%, quaternary ammonium bases organic amine 30%, association complex 1.6%, reducing agent 1%, ion-it is non-from
Sub- surfactant 3%, preservative 0.7%, stabilizer 0.3%, surplus are deionized water.
Wherein, softening solvent by methanol, ethyl alcohol, formamide and glyceryl triacetate be in mass ratio 1:1:2:1 mixing and
At；Quaternary ammonium bases organic amine is tetraethyl ammonium hydroxide；Association complex is disodium ethylene diamine tetraacetate, sodium alginate and modification
Sodium lignin sulfonate mixes in mass ratio for 1:1:5.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 30% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 8, is placed in variable frequency microwave reactor, regulation power 300W is warming up to 94
DEG C, react 1h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 70 DEG C, is stirred to react 2h；
Step (C): 30 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 30 DEG C, formalin is added dropwise, 3h is reacted after being then warming up to 88 DEG C, to after reaction
Obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:2:1:1.2；Wood
The mass ratio of quality sodium sulfonate and phosphorous acid crystal, formalin is 10:1.5:3；The mass concentration of formalin is 37%, and
And formalin drips in 0.5h.
In the present embodiment, reducing agent is hydrogen peroxide；Ion-nonionic surfactant be anionic surfactant with
The mixture of nonionic surfactant, anionic surfactant are perfluoro alkyl sulfonic acid potassium, and non-ionic surface is living
Property agent be fatty acid methyl ester ethoxylate；Preservative is triethanolamine oleate；Stabilizer is D-sorbite.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 35%, quaternary ammonium bases organic amine 30%, association complex 1.6%, reducing agent 1%, ion-nonionic
Surfactant 3%, preservative 0.7%, stabilizer 0.3%, surplus are deionized water；
Step (2): being added the deionized water of 2/3 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 10min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 7.5.In actual use, it by environment-friendly type glue-dispenser, is added stainless
In steel tank, 70 DEG C are warming up to, substrate to be processed is impregnated into 40min, is rinsed well after gently being brushed with brush, it is dry.
Embodiment 5:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
Be prepared: softening solvent 60%, quaternary ammonium bases organic amine 32%, association complex 0.8%, reducing agent 0.4%, ion-are non-
Ionic surface active agent 2%, preservative 0.4%, stabilizer 0.2%, surplus are deionized water.
Wherein, softening solvent is 1:2:2 by ethylene glycol, acetamide, urea and sorbitan fatty acid ester in mass ratio:
3 mix；Quaternary ammonium bases organic amine is triethylbenzyl ammonium hydroxide；Association complex is disodium ethylene diamine tetraacetate, sea
Mosanom mixes in mass ratio for 1:1:3 with modified sodium lignosulfonate.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 30% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 9.5, is placed in variable frequency microwave reactor, regulation power 900W is warming up to
98 DEG C, react 1h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 78 DEG C, is stirred to react 2h；
Step (C): 40 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 40 DEG C, formalin is added dropwise, 2.5h is reacted after being then warming up to 95 DEG C, to the end of reacting
After obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:3:1.2:1；Wood
The mass ratio of quality sodium sulfonate and phosphorous acid crystal, formalin is 10:2:3.5；The mass concentration of formalin is 32%, and
And formalin drips in 0.5h.
In the present embodiment, reducing agent is sodium sulfite；Ion-nonionic surfactant is anionic surfactant
With the mixture of nonionic surfactant, anionic surfactant is perfluoro alkyl sulfonic acid potassium, non-ionic surface
Activating agent is fatty acid methyl ester ethoxylate and alkyl polyglycoside, perfluoro alkyl sulfonic acid potassium and fatty acid methyl ester ethoxylate,
The mass ratio of alkyl polyglycoside is 2:1:3；Preservative be triethanolamine oleate with benzotriazole be in mass ratio 1:1 mix and
At；Stabilizer is soybean protein.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 60%, quaternary ammonium bases organic amine 32%, association complex 0.8%, reducing agent 0.4%, ion-it is non-from
Sub- surfactant 2%, preservative 0.4%, stabilizer 0.2%, surplus are deionized water；
Step (2): being added the deionized water of 2/3 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 10min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 8.In actual use, by environment-friendly type glue-dispenser, stainless steel is added
In slot, 78 DEG C are warming up to, substrate to be processed is impregnated into 35min, is rinsed well after gently being brushed with brush, it is dry.
Embodiment 6:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
Be prepared: softening solvent 58%, quaternary ammonium bases organic amine 32%, association complex 1.2%, reducing agent 0.8%, ion-are non-
Ionic surface active agent 1.5%, preservative 0.5%, stabilizer 0.5%, surplus are deionized water.
Wherein, softening solvent is 1:2:1 by isobutanol, benzyl alcohol, succimide and ethyl acetoacetate in mass ratio:
3 mix；It with tetramethylammonium hydroxide is that 2:1 is mixed that quaternary ammonium bases organic amine is triethylbenzyl ammonium hydroxide in mass ratio
It forms；Association complex is that disodium ethylene diamine tetraacetate, sodium alginate and modified sodium lignosulfonate are 1:1:2 mixed in mass ratio
It closes.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 30% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 9.5, is placed in variable frequency microwave reactor, regulation power 1000W is warming up to
98 DEG C, react 1h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 78 DEG C, is stirred to react 2h；
Step (C): 40 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 40 DEG C, formalin is added dropwise, 2.5h is reacted after being then warming up to 95 DEG C, to the end of reacting
After obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:3:1.2:1；Wood
The mass ratio of quality sodium sulfonate and phosphorous acid crystal, formalin is 10:2:3.5；The mass concentration of formalin is 32%, and
And formalin drips in 0.5h.
In the present embodiment, it with potassium borohydride is that 1:1 is mixed that reducing agent is sodium hypophosphite in mass ratio；Ion-it is non-from
Sub- surfactant is the mixture of anionic surfactant and nonionic surfactant, Anionic surfactants
Agent is perfluoro alkyl sulfonic acid potassium, and nonionic surfactant is fatty acid methyl ester ethoxylate and alkyl polyglycoside, perfluor alkane
The mass ratio of base potassium sulfonate and fatty acid methyl ester ethoxylate, alkyl polyglycoside is 1:1:1；Preservative be triethanolamine oleate with
Benzotriazole mixes in mass ratio for 2:1；Stabilizer is mercapto benzothiazole sodium salt.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 58%, quaternary ammonium bases organic amine 32%, association complex 1.2%, reducing agent 0.8%, ion-it is non-from
Sub- surfactant 1.5%, preservative 0.5%, stabilizer 0.5%, surplus are deionized water；
Step (2): being added the deionized water of 1/2 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 10min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 8.5.In actual use, it by environment-friendly type glue-dispenser, is added stainless
In steel tank, 80 DEG C are warming up to, substrate to be processed is impregnated into 25min, is rinsed well after gently being brushed with brush, it is dry.
Embodiment 7:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
It is prepared: softening solvent 36%, quaternary ammonium bases organic amine 25%, association complex 1%, reducing agent 1%, ion-nonionic
Surfactant 3%, preservative 0.8%, stabilizer 0.4%, surplus are deionized water.
Wherein, softening solvent is by three contracting triethylene glycols, acetamide, n,N-Dimethylformamide, succimide and acetyl
Ethyl acetate, sorbitan fatty acid ester mix in mass ratio for 1:1:2:3:2:1；Quaternary ammonium bases organic amine is three second
Base benzyl ammonium hydroxide mixes in mass ratio for 1:1 with tetramethylammonium hydroxide；Association complex is ethylenediamine tetra-acetic acid
Disodium, sodium alginate and modified sodium lignosulfonate mix in mass ratio for 1:1:4.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 40% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 10, is placed in variable frequency microwave reactor, regulation power 1200W is warming up to
100 DEG C, react 1h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 70 DEG C, is stirred to react 2h；
Step (C): 38 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 38 DEG C, formalin is added dropwise, 3.5h is reacted after being then warming up to 87 DEG C, to the end of reacting
After obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:3:2:1；It is wooden
The mass ratio of plain sodium sulfonate and phosphorous acid crystal, formalin is 10:2:3；The mass concentration of formalin is 36%, and first
Aldehyde solution drips in 0.5h.
In the present embodiment, reducing agent be hydroxyl sulfate, sodium sulfite with sodium borohydride be in mass ratio 1:1:2 mix and
At；Ion-nonionic surfactant be anionic surfactant and nonionic surfactant mixture, yin from
Sub- property surfactant is perfluoro alkyl sulfonic acid potassium, and nonionic surfactant is fatty acid methyl ester ethoxylate and alkyl
The mass ratio of more glycosides, perfluoro alkyl sulfonic acid potassium and fatty acid methyl ester ethoxylate, alkyl polyglycoside is 2:1:2；Preservative is oil
Triethylenetetraminehexaacetic acid hydramine mixes in mass ratio for 2:3 with benzotriazole；Stabilizer is mercapto benzothiazole sodium salt and sorbose
Alcohol, sodium lactate mix in mass ratio for 1:1:2.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 36%, quaternary ammonium bases organic amine 25%, association complex 1%, reducing agent 1%, ion-nonionic table
Face activating agent 3%, preservative 0.8%, stabilizer 0.4%, surplus are deionized water；
Step (2): being added the deionized water of 1/2 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 10min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 9.In actual use, by environment-friendly type glue-dispenser, stainless steel is added
In slot, 82 DEG C are warming up to, substrate to be processed is impregnated into 20min, is rinsed well after gently being brushed with brush, it is dry.
Embodiment 8:
The present embodiment is used to remove the environment-friendly type glue-dispenser of burr after semiconductor packages, by the component of following weight percent
Be prepared: softening solvent 65%, quaternary ammonium bases organic amine 30%, association complex 1.2%, reducing agent 0.8%, ion-are non-
Ionic surface active agent 2.4%, preservative 0.6%, stabilizer 0.5%, surplus are deionized water.
Wherein, softening solvent is by glycerol, acetamide, n,N-Dimethylformamide, urea and propylene-glycol ethyl ether acetic acid esters, carbon
Diethyl phthalate mixes in mass ratio for 2:1:1:1:2:1；Quaternary ammonium bases organic amine is trimethyl benzyl ammonium hydroxide, tetrem
Base ammonium hydroxide and tetramethylammonium hydroxide mix in mass ratio for 3:1:1；Association complex is ethylenediamine tetra-acetic acid two
Sodium, sodium alginate and modified sodium lignosulfonate mix in mass ratio for 1:1:4.
In the present embodiment, the preparation method of modified sodium lignosulfonate the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, stirring and dissolving be made mass concentration be 40% it is water-soluble
Hydroquinone is added in liquid, and regulation system pH value is 10, is placed in variable frequency microwave reactor, regulation power 1200W is warming up to
100 DEG C, react 1h；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure
Heating water bath adjusts temperature to 70 DEG C, is stirred to react 2h；
Step (C): 38 DEG C of addition phosphorous acid crystals are cooled to, are uniformly mixed；
Step (D): after being cooled to 38 DEG C, formalin is added dropwise, 3.5h is reacted after being then warming up to 87 DEG C, to the end of reacting
After obtain modified sodium lignosulfonate.
Wherein, the mass ratio of sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:3:2:1；It is wooden
The mass ratio of plain sodium sulfonate and phosphorous acid crystal, formalin is 10:2:3；The mass concentration of formalin is 36%, and first
Aldehyde solution drips in 0.5h.
In the present embodiment, reducing agent is hydroxyl sulfate；Ion-nonionic surfactant is anionic surfactant
With the mixture of nonionic surfactant, anionic surfactant is perfluoro alkyl sulfonic acid potassium, non-ionic surface
Activating agent is fatty acid methyl ester ethoxylate and alkyl polyglycoside, perfluoro alkyl sulfonic acid potassium and fatty acid methyl ester ethoxylate,
The mass ratio of alkyl polyglycoside is 2:1:2；Preservative be triethanolamine oleate with benzotriazole be in mass ratio 2:3 mix and
At；It with D-sorbite, lignosulfonate is that 3:1:2 is mixed that stabilizer is soybean protein in mass ratio.
The present embodiment is used to remove the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages, including following step
It is rapid:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 65%, quaternary ammonium bases organic amine 30%, association complex 1.2%, reducing agent 0.8%, ion-it is non-from
Sub- surfactant 2.4%, preservative 0.6%, stabilizer 0.5%, surplus are deionized water；
Step (2): being added the deionized water of 1/2 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, after
Continuous stirring 10min, then fills into deionized water to aequum, stirs.
The pH value of the present embodiment environment-friendly type glue-dispenser is 8.In actual use, by environment-friendly type glue-dispenser, stainless steel is added
In slot, 85 DEG C are warming up to, substrate to be processed is impregnated into 25min, is rinsed well after gently being brushed with brush, it is dry.
Comparative example 1:
Certain commercially available deburring solution is formulated following (%)
Ethylene glycol phenyl ether 35%
Dibutyl ethylene glycol ether 20%
Caprolactam 15%
Glycerol 10%
Isophorone 20%
Embodiment 1-8 and comparative example 1 carry out deburring under the same conditions, and using effect is as shown in table 1.
1 using effect of table
| Project | Deburring ability | To encapsulation bulk diffusion | Substrate is damaged | Burr residual condition | The feature of environmental protection |
| Embodiment 1 | 3 | 4 | 4 | 4 | 4 |
| Embodiment 2 | 4 | 4 | 3 | 3 | 5 |
| Embodiment 3 | 4 | 3 | 4 | 4 | 5 |
| Embodiment 4 | 4 | 4 | 4 | 4 | 5 |
| Embodiment 5 | 5 | 5 | 5 | 5 | 5 |
| Embodiment 6 | 5 | 5 | 5 | 5 | 5 |
| Embodiment 7 | 5 | 5 | 5 | 5 | 5 |
| Embodiment 8 | 5 | 5 | 5 | 5 | 5 |
| Comparative example 1 | 2 | 2 | 1 | 2 | 2 |
Note: digital " 5 " represent effect or effect is best in table 1, and " 4 ", " 3 ", " 2 ", " 1 " then indicate effect or effect according to
Secondary to successively decrease, " 1 " is poor.
By above-mentioned table 1 it is found that compared to existing commercially available deburring solution, environment-friendly type glue-dispenser of the present invention has splendid
Deburring (flash) effect, substantially not damaged to plastic-sealed body (substrate), formula material complies fully with environmental requirement, product is stablized,
It can effectively overcome the shortcomings of burr removing method in existing semiconductive resin encapsulation post-processing, and can avoid to the maximum extent to burr
The damage of part in addition, so that treated element appearance and function are unaffected.
The above description of the embodiments is intended to facilitate ordinary skill in the art to understand and use the invention.
Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein general
Principle is applied in other embodiments without having to go through creative labor.Therefore, the present invention is not limited to the above embodiments, ability
Field technique personnel announcement according to the present invention, improvement and modification made without departing from the scope of the present invention all should be of the invention
Within protection scope.
Claims (10)
1. a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, which is characterized in that the environment-friendly type glue-dispenser by
The component of following weight percent is prepared: softening solvent 35-65%, quaternary ammonium bases organic amine 25-40%, association complex
0.5-1.6%, reducing agent 0.1-1%, ion-nonionic surfactant 0.1-3%, preservative 0.2-0.8%, stabilizer
0.1-0.5%, surplus are deionized water.
2. according to claim 1 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In the softening solvent is mixed by alcohols solvent, amide solvent and esters solvent.
3. according to claim 2 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In the alcohols solvent includes glycerol, methanol, ethyl alcohol, isopropanol, ethylene glycol, three contracting triethylene glycols, n-butanol, isobutanol
Or one of benzyl alcohol or a variety of, the amide solvent include formamide, acetamide, n,N-Dimethylformamide, N,
One of N- dimethyl acetamide, succimide or urea are a variety of, and the esters solvent includes propylene glycol monomethyl ether second
Acid esters, propylene-glycol ethyl ether acetic acid esters, diethyl carbonate, glyceryl triacetate, ethyl acetoacetate or sorbitan fatty acid
One of ester is a variety of.
4. according to claim 1 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In, the quaternary ammonium bases organic amine include tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, trimethyl benzyl ammonium hydroxide,
One of tetraethyl ammonium hydroxide and triethylbenzyl ammonium hydroxide are a variety of.
5. according to claim 1 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In the association complex is that disodium ethylene diamine tetraacetate, sodium alginate and modified sodium lignosulfonate are 1 in mass ratio:
1:2-5 is mixed.
6. according to claim 5 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In, the modified sodium lignosulfonate preparation method the following steps are included:
Step (A): sodium lignin sulfonate powder is added to the water, and the aqueous solution that mass concentration is 30-40% is made in stirring and dissolving,
Hydroquinone is added, regulation system pH value is 8-10, is placed in variable frequency microwave reactor, regulation power 300-1200W, is heated up
To 90-100 DEG C, 0.5-1h is reacted；
Step (B): above-mentioned reaction solution is taken out from microwave reactor, epoxychloropropane and ethylenediamine is added, using normal pressure water-bath
Heating adjusts temperature to 70-80 DEG C, is stirred to react 1-2h；
Step (C): it is cooled to 30-40 DEG C of addition phosphorous acid crystal, is uniformly mixed；
Step (D): after being cooled to 30-40 DEG C, formalin is added dropwise, 2-4h is reacted after being then warming up to 80-100 DEG C, wait react
After obtain modified sodium lignosulfonate.
7. according to claim 6 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In the mass ratio of the sodium lignin sulfonate and hydroquinone, epoxychloropropane and ethylenediamine is 10:2-4:1-2:1-1.5；
The mass ratio of the sodium lignin sulfonate and phosphorous acid crystal, formalin is 10:1.5-3:3-4；
The mass concentration of the formalin is 32-37%, and the formalin drips in 0.5h.
8. according to claim 1 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In the reducing agent includes hydroxylamine, hydroxyl sulfate, hydroxylamine hydrochloride, hydrogen peroxide, sodium sulfite, sodium hypophosphite, sodium borohydride
Or one or more of potassium borohydride, the ion-nonionic surfactant be anionic surfactant with it is non-
The mixture of ionic surfactant, the preservative include one of triethanolamine oleate or benzotriazole or two
Kind, the stabilizer includes mercapto benzothiazole sodium salt, lignosulfonate, xylitol, D-sorbite, sodium lactate, soybean egg
It is one or more of white.
9. according to claim 8 a kind of for removing the environment-friendly type glue-dispenser of burr after semiconductor packages, feature exists
In the anionic surfactant is perfluoro alkyl sulfonic acid potassium, and the nonionic surfactant is fatty acid
Methyl ester ethoxylates and/or alkyl polyglycoside.
10. it is a kind of as described in claim 1 for removing the preparation method of the environment-friendly type glue-dispenser of burr after semiconductor packages,
It is characterized in that, method includes the following steps:
Step (1): it stocks up by the component of following weight percent:
Soften solvent 35-65%, quaternary ammonium bases organic amine 25-40%, association complex 0.5-1.6%, reducing agent 0.1-1%,
Ion-nonionic surfactant 0.1-3%, preservative 0.2-0.8%, stabilizer 0.1-0.5%, surplus are deionized water；
Step (2): being added the deionized water of 1/2-2/3 amount in a reservoir, and it is molten to sequentially add softening according to the ratio under agitation
Agent, quaternary ammonium bases organic amine, association complex and reducing agent after adding, continue to stir 5-10min；
Step (3): sequentially adding preservative, stabilizer and ion-nonionic surfactant according to the ratio, after adding, continues to stir
5-10min is mixed, deionized water is then filled into aequum, stirs.
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| CN118421413A (en) * | 2024-04-25 | 2024-08-02 | 达高工业技术研究院(广州)有限公司 | Deburring composition and preparation method and application thereof |
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