CN109731622B - Electrode printing device and method for microfluidic chip - Google Patents
Electrode printing device and method for microfluidic chip Download PDFInfo
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- CN109731622B CN109731622B CN201910041309.8A CN201910041309A CN109731622B CN 109731622 B CN109731622 B CN 109731622B CN 201910041309 A CN201910041309 A CN 201910041309A CN 109731622 B CN109731622 B CN 109731622B
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Abstract
The invention discloses an electrode printing device of a microfluidic chip, wherein a microfluidic chip printing system comprises a second conveying assembly; the cutting assembly comprises a circular film cutter, a bearing roller and a traction roller, and the circular film cutter and the bearing roller are arranged correspondingly; the circular film cutter and the bearing cutting lifter are correspondingly matched on the second conveying base material to press-cut the electrode slice and the rest parts around the electrode slice; the pull roll is remote from the second head end roll. The invention is used for discharging the excess materials, and the printing principle is combined with the manufacturing process of the microfluidic chip to print the microfluidic chip.
Description
Technical Field
The invention relates to the technical field of microfluidics, in particular to an electrode printing device and an electrode printing method of a microfluidic chip.
Background
The micro-fluidic chip is a new interdisciplinary field and is an important development front in many fields of new century analytical science, micro-electro-mechanical processing, life science, chemical synthesis, analytical instruments, environmental science and the like.
The micro-fluidic analysis chip processing technology originates from the micro-processing of semiconductor and integrated circuit chips, but the processing size of chip channels is far larger than that of large-scale integrated circuits, the size of the chip is about several square centimeters, and the width and the depth of the micro-channel are in micron order. On the other hand, the selection of chip materials, the design of microchannels, the surface modification of microchannels and the manufacture of chips are the key problems of microfluidic analysis chips.
In the prior art, methods such as laser engraving, chemical etching, photoetching and the like are mainly used in the microfluidic chip processing technology, and have the main disadvantages of complicated operation, long processing period, material selection, large channel roughness, poor repeatability, difficulty in batch production and difficulty in serving as a general and effective chip processing method. With the development of modern numerical control micro-processing technology, the processing precision and the scale of the micro-control chip can meet the technical requirements of the micro-control chip, but the existing numerical control micro-processing equipment is not specially designed and processed for the micro-control chip, so that unnecessary waste and damage to materials are caused in application.
Therefore, there is still much room for development in the prior art.
Disclosure of Invention
In view of the defects of the prior art, the invention provides a microfluidic chip printing system and a use method thereof, which utilize the principle of printing technology to manufacture microfluidic chips, have unique technical characteristics and improve the flexibility of operation.
In order to realize the purpose, the invention adopts the following technical scheme: a micro-fluidic chip printing and manufacturing system can be used for printing micro-fluidic chips and makes a new breakthrough on the basis of the original technology for manufacturing the micro-fluidic chips, and an electrode printing and manufacturing device of the micro-fluidic chips comprises a second conveying assembly, a first end roller, a second conveying base material and a first conveying base material, wherein the second conveying assembly comprises a second head end roller and a second end roller, and the second conveying base material is arranged between the second head end roller and the second end roller and is used for conveying electrode raw materials; the cutting assembly comprises a circular film cutter, a bearing cutting roller and a traction roller which are arranged between the second head end roller and the second tail end roller respectively, wherein the circular film cutter is arranged corresponding to the bearing cutting roller; the second conveying substrate conveying electrode original department penetrates through the circular film cutter and the bearing cutting roller to be connected with the traction roller, and the circular film cutter and the bearing cutting roller are correspondingly matched on the second conveying substrate to press and cut the electrode slice and the rest departments around the electrode slice; the drawing roller is far away from the second head end roller, the excess materials are wound on the drawing roller corresponding to the speed of the second conveying base material, and the rest electric plates are arranged on the second conveying base material.
Preferably, the device also comprises a third conveying assembly, wherein the third conveying assembly comprises a third head end roller, a third tail end roller and a third conveying base material arranged between the third head end roller and the third tail end roller, the third conveying base material is also provided with a steering roller, one surface with a third glue layer faces the electrode plate through the steering roller, and the third conveying base material is used for conveying a second base layer;
the third gluing assembly is arranged on a third conveying substrate between the third head end roller and the steering roller and comprises a third gluing die correspondingly suspended on the upper surface of the third conveying substrate, so that viscose is extruded from the gluing die; and
a third loader abutting against the lower surface of the third conveying base material, wherein the third loader is correspondingly matched with the gluing mouth mold, so that a third glue layer is attached to the upper surface of the second base layer;
the third tail end fixing roller is tangent to a second conveying substrate between the cutting assembly and the second pressing assembly, and the third tail end fixing roller and the second conveying substrate rotate correspondingly and are used for conveying the first base layer into the second conveying substrate.
Preferably, the electrode plate pressing device further comprises a second pressing component, the second pressing component is arranged on a second conveying base material between the carrying and cutting component and the second tail end fixing roller and comprises a third pressing roller and a fourth pressing roller, the third pressing roller is tangent to the upper surface of the second conveying base material, the second pressing roller is tangent to the lower surface of the second conveying base material, and the electrode plate is attached to a third glue layer on the second base layer through corresponding matching of the first pressing roller and the second pressing roller to form a second base layer with the electrode plate.
Preferably, the third end fixing roller is a first pressing roller.
Preferably, the method further comprises a second thermostat, wherein the second thermostat is arranged between the third tail end fixing roller and the third gluing component and is heated at a constant temperature corresponding to the second base layer coated with the glue layer, so that the second base layer and the electrode plate are bonded stably in a pressing mode.
Preferably, a second punching assembly and a second punching assembly are further arranged between the second pressing assembly and the second tail end roller, the second punching assembly comprises a second convex roller and a second bearing roller, the second convex roller and the second bearing roller are respectively arranged above the second conveying base material and below the second conveying base material, the first die cutting roller is correspondingly matched with the first bearing roller, and through holes are formed in the second base layer through the first die cutting roller.
A method of printing an electrode printing apparatus, comprising:
connecting a second transfer substrate to be cut with the pull roll;
the electrode cutting step, namely conveying the second conveying base material to a cutting assembly, wherein the cutting assembly cuts and cuts the electrode original material to form an electrode belt and excess materials which are strung with electrode plates, and the excess materials are recovered by the traction roller;
and an assembling step, namely pressing the electrode strip into the bottom plate packaging device and the first material layer to form the microfluidic chip strip.
Preferably, the method further comprises connecting an electrode belt to the second end roller through a third transfer substrate; before the assembling step, a second gluing step is also included, wherein a third base plate is transmitted to a third gluing component by a third transmission base material; the third gluing component is used for gluing the second base layer to form a glued second base layer; the second base layer with the adhesive passes through a turning roller, the turning roller changes the moving direction of the second base layer with the adhesive and enables one surface with the adhesive to face the electric plate;
the third transfer substrate transfers the adhesive second base layer to a second transfer substrate.
Preferably, the method comprises the following steps:
and a second pressing step, namely pressing the electrode circuit on a second conveying base material and the glued second base material by a second pressing component to form a second substrate with an electrode, and conveying the second substrate with the electrode out of the second pressing component by the second conveying base material to form a second base layer with an electrode slice.
Preferably, the second gluing step further includes a constant temperature step, and the second thermostat performs constant temperature and heating on the glue layer of the second substrate with glue on the second conveying base material to prevent the glue layer from being cured.
Preferably, the second pressing step further comprises a second punching step, wherein the second base layer of the first conveying base material with the electrode plate of the second conveying base material passes through the first punching assembly, and the second punching assembly punches the second base layer with the electrode plate.
Has the advantages that: (1) for example, the roller device can effectively shorten the flow period of the whole chip manufacturing, the first curing step and the first material layer printing step are carried out simultaneously, the first material inlet die can also be filled with corresponding first materials when the first material inlet die is used for building the first glue coating, the next step is not needed after the next step is finished, the time is effectively saved, and the problems of complex operability and long processing period are solved.
(2) Each device of the whole system can be independently used, and the whole system has good repeatability in selecting specific operation steps according to different chip properties.
(3) The multi-selection operation exists in some components of the device, so that different microfluidic chips can be printed, the printing device is not only limited to one type, but also can be basically used as a universal and effective microfluidic chip processing system, and the device has great breakthrough compared with the prior art.
(4) The properties of the first pressing component can be selected, but when the number of layers of the chip is large and the thickness is large, the problem of hardness of the pressing device can be involved, so that the hardness of the first pressing component can be selected, and the first pressing component can be well suitable for various chip manufacturing processes.
(5) The whole process of printing the microfluidic chip is similar to a production line, the filling device is provided with a plurality of ink-jet heads and powder-spraying heads, the electrode imprinting, the first material layer imprinting, the bottom plate packaging and the like can be operated in batch, and the defects in the prior art are overcome.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of a microfluidic chip printing system according to example 1 of the present invention;
FIG. 2 is a schematic structural view of a first material layer printing apparatus according to embodiment 1 of the present invention;
FIG. 3 is a schematic structural view of a surface treatment apparatus according to embodiment 1 of the present invention;
FIG. 4 is a schematic structural view of a filling apparatus according to embodiment 1 of the present invention;
FIG. 5 is a schematic structural view of an electrode-printing apparatus according to embodiment 1 of the present invention;
fig. 6 is a schematic structural diagram of a backplane packaging apparatus according to embodiment 1 of the present invention;
FIG. 7 is a schematic structural diagram of a first punch assembly according to embodiment 1 of the present invention;
fig. 8 is a schematic structural diagram of a first material layer filling structure in embodiment 1 of the present invention;
fig. 9 is a flowchart of a method for printing a microfluidic chip according to example 1 of the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides a microfluidic chip printing system according to the invention shown in fig. 1. Convenient and fast's preparation micro-fluidic chip is showing the promotion in efficiency on being limited to the basis of technique, micro-fluidic chip system of making includes: the first conveying assembly 1 comprises a first head end roller 10 and a first conveying base material 12 arranged between the first head end roller 10 and a first tail end roller 11, wherein the first conveying base material 12 adopts a transparent medical PMM first gravure template 2110, PC, CBC, COC, COP, PS and other polymer coiled materials, the width of the coiled materials is different from 50mm to 360mm, and the thickness of the coiled materials is different from 0.1mm to 2 mm. The specific specification and size are determined according to the size of the product and the typesetting condition; the transfer surface of the first transfer substrate 12 is horizontal to the floor.
The microfluidic chip imprint system as shown in fig. 2 further includes a first material layer imprint apparatus 2, the first material layer imprint apparatus 2 including an imprint assembly 21, the imprint assembly 21 including:
a first discharge die 210 for discharging a first material from the first discharge die 210, wherein the first material is a medical grade thermoplastic or thermosetting powder resin or granular resin, and the like, and is a thermoplastic granular resin in the embodiment;
further, an infrared heater 216 is disposed at one side of the first outlet die 210 to heat the first material, so that the first material flows out more smoothly.
The printing plate roller 211 corresponding to the first discharging port die 210 is arranged, the printing plate roller 211 corresponds to the rotation direction of the first head end roller 10 and the first tail end roller 11, the printing plate roller 211 rotates perpendicular to the ground, and the surface of the printing plate roller 211 is provided with a first gravure template 2110; the first discharging die 210 is in contact with the first gravure template 2110, the first discharging die 210 also plays a role of paving the first material in the first gravure template 2110 while discharging, and the printing plate roller 211 is at least tangent to the upper surface of the first transmission belt; a first solidifying device 214 disposed under the first conveying base material 12, wherein the first solidifying device 214 is a cold air knife in the embodiment, the first solidifying device 214 corresponds to the printing plate roller 211, so that the first material filled in the first gravure plate 2110 is solidified to form a first material layer 9 with micro channels 90, and the first material layer 9 is pulled out of the first gravure plate 2110 and moved to the first end roller 11 by the first conveying base material 12.
Specifically, the printing assembly 21 further includes: at least one hot press roller 215, the hot press roller 215 is disposed between the first discharging die 210 and the first conveying base material 12, and is tangent to the first gravure plate 2110, and performs a pressing function on the first material during rolling pushing, so that the first material filled in the first gravure plate 2110 passes through the hot press roller 215, and is fully filled in the first gravure plate 2110, and simultaneously, the material of the first material is fully filled in the first gravure plate 2110 before pressing.
Specifically, a first accommodating cavity 2111 is arranged in the printing plate roller 211, a first thermostat 2112 is arranged in the first accommodating cavity 2111, the first thermostat 2112 maintains the temperature of the first material, so that the part of the first material close to the first thermostat 2112 cannot be solidified, and the first thermostat 2112 is detachably connected with the first accommodating cavity 2111.
Specifically, the functional layer gravure printing device further includes: a first gluing member 22, said first gluing member 22 being arranged before entering said printing member 21, said first gluing member 22 comprising: a first glue application die 220 suspended from the upper surface of the first transfer substrate 12, such that a first glue is extruded from the first glue application die 220; and a first loader 221 abutting against the lower surface of the first transmission base material 12, in this embodiment, the first loader 221 is a roller device, and rotates corresponding to the first transmission base material 12, and the first loader 221 and the first glue coating die 220 are correspondingly matched, so that a first glue layer is attached to the surface of the first transmission base material 12 on the first transmission base material 12, in this embodiment, the glue layer is a hot melt glue.
Specifically, the functional layer gravure printing device further includes: constant temperature component 24, constant temperature component 24 includes the heat preservation machine, constant temperature component 24 is located first rubber coating subassembly 22 with between the printing subassembly 21, to scribbling the glue film first transmission substrate 12 carries out the constant temperature, makes the glue film not solidify.
In this embodiment, since the nature of the first adhesive used is hot melt adhesive, and the nature of the first material is also thermoplastic, the corresponding thermostatic assembly 24, the hot pressing roller 215, the first thermostat 2112, and the first curing device are all configured correspondingly to their nature, and when the nature of the adhesive layer adopts UV adhesive, the nature of the first material is also selected similarly, at this time, the hot pressing roller 215 is replaced by the pressing roller 215, that is, the heating device of the hot pressing roller 215 is turned off, the first thermostat 2112 and the infrared heater 216 are both in a turned-off state, and the first curing device is a lighting machine or an LED strip, which is not limited in this invention.
Specifically, the adhesive tape further comprises a first corona machine 23 arranged corresponding to the first conveying base material 12, wherein the first corona machine 23 is arranged in front of the first gluing component 22 and is used for improving the surface tension of the first conveying base material 12 and increasing the adhesive force of the adhesive layer.
Specifically, the printing assembly 21 further includes a first embossing roller 212 and a second embossing roller 213; the first embossing roller 212, the second embossing roller 213 and the printing plate roller 211 are matched to clamp the first conveying base material 12, so that the first conveying base material 12 is fully contacted with the first material in the first gravure template 2110 to form a bonding area, in this embodiment, the shape of the bonding area corresponds to the radian of the printing plate roller 211, the first embossing roller 212 corresponds to the inlet of the bonding area, the second embossing roller 213 corresponds to the outlet of the bonding area, the first curing device 214 is correspondingly arranged in the bonding area, the first embossing roller 212 and the second embossing roller 213 are spaced from each other, in this embodiment, the arc length of the bonding area occupies about 30% to 50% of the whole circumference, and the specific spacing is adjusted according to different degrees of material curing speed.
Further, the printing assembly 21 further includes a stripper 217 disposed corresponding to the gravure roller, and a stripping liquid is stored in the stripper 217; before the first material is pre-coated on the first gravure template 2110, the stripper 217 is sprayed on the first gravure template 2110 to form a release layer between the first material and the first gravure template 2110, which may be polytetrafluoroethylene; fluororesin powder; fluororesin coating, etc., and the present invention is not particularly limited.
Specifically, as shown in fig. 7, a first punching assembly 3 is further included between the printing assembly 21 and the end fixing roller, and the first punching assembly 3 includes: a first die-cutting roller 30 and a first carrier-cutting roller 31 respectively disposed above the first transfer base material 12 and below the first transfer base material 12; so that the first die-cutting roller 30 is correspondingly matched with the first bearing-cutting roller 31, through the first die-cutting roller 30, a through hole is arranged on the first material layer 9, the first die-cutting roller 30 is corresponding to the first bearing-cutting roller 31, and the first punching component 3 punches coding holes on the near sides of the two sides of the first base material so as to determine the position of the chip micro-channel 90 and match the subsequent lamination and the alignment of the packaging reagent. The method comprises the following steps: each code hole represents a signal corresponding to the corresponding micro channel 90 region, and a position signal is obtained through photoelectric recognition and read, and is transmitted to an external control system, and the external control system gives a corresponding action instruction, such as an injection tester.
Specifically, as shown in fig. 3, the microfluidic chip printing system further includes a surface treatment device 4, where the surface treatment device 4 includes a surface liquid sprayer 41 disposed corresponding to the microchannel 90 to spray a first liquid to perform surface treatment on the microchannel 90 to obtain a second material layer 92, and the second material layer 92 is attached to the surface of the microchannel 90.
Further, the surface treatment apparatus 4 further includes a second corona machine 40, a dryer 42, or a refrigerator 43, the second corona machine 40, the surface liquid sprayer 41, the dryer 42, or the refrigerator 43 are arranged away from the first head end roller 10 in sequence, the dryer and the refrigerator select whether both are needed or not according to the characteristics of the characteristic layer, and the second corona machine 40 is used for performing corona treatment on the surface of the first material layer 9, so that the dyne value of the first material layer 9 is increased.
The surface treatment material can adopt a liquid material for improving the hydrophobicity, the hydrophilicity or the biocompatibility of the surface of the flow channel of the microfluidic chip, such as protein and the like.
Specifically, as shown in fig. 4, a filling device 5 is further disposed between the surface treatment device 4 and the first end roller 11, and the filling device 5 includes: corresponding to the nozzle disposed above the micro flow channel 90, so as to fill the second liquid material stored in the nozzle into the reaction region of the second material layer 92, thereby obtaining a third material layer 93, as shown in fig. 9.
Further, the filling device 5 further comprises a powder spraying component 50, and corresponds to the first material layer 9; the dry powder spraying component 50 comprises a powder spraying head 500, and the powder spraying head 500 corresponds to the reaction area of the micro channel 90;
further, the device also comprises a photoelectric probe 54, wherein the photoelectric probe 54 is arranged between the surface treatment device 4 and the dry powder spraying component 50 and is used for positioning a reaction area on the micro-channel 90; the photoelectric probe 54 and the powder spraying head 500 are respectively connected through an external control system, and the external control system controls the positioning and filling of the dry powder spraying component 50.
Further, the device further comprises a droplet ejection assembly 51, the droplet ejection assembly 51 is disposed between the photoelectric probe 54 and the first end roller 11, the droplet ejection assembly 51 comprises a plurality of inkjet heads 510, the positions of the inkjet heads 510 correspond to the reaction regions of the micro channels 90, and similar to an inkjet printing mechanism, the inkjet heads 510 can inject various types of reagents.
Further, the method also comprises the following steps: the digital electrostatic printing component 52 is arranged between the photoelectric probe 54 and the first tail end roller 11, the digital electrostatic printing component 52 corresponds to the reaction area of the micro-channel 90, and the digital electrostatic printing component 52 is similar to a Schle electrostatic digital printer and is transferred into the reaction acupoint of the chip in a relief plate salient point electrostatic adsorption mode corresponding to the size of the reaction acupoint.
Further, the method also comprises the following steps: the digital electrostatic printing component 52, the dripping and spraying component 51 and the dry powder spraying component 50 are installed on the slideway component 53, the digital electrostatic printing component 52, the dripping and spraying component 51 and the dry powder spraying component 50 are connected with the external control system through a servo motor 530, and the servo motor 530 drives the digital electrostatic printing component 52, the dripping and spraying component 51 and the dry powder spraying component 50 to move or switch.
In the present invention, the digital electrostatic printing component 52, the droplet spraying component 51, and the dry powder spraying component 50 are optional components, and a filling manner is selected according to the properties of the chip, and one device may be selected to be filled, or both devices may be selected, and the present embodiment is not limited thereto.
Specifically, the chute assembly 53 further includes a height adjuster 531, the digital electrostatic printing assembly 52, the droplet spraying assembly 51, and the dry powder spraying assembly are connected to the servo motor 530 through the height adjuster 531, and the digital electrostatic printing assembly 52, the droplet spraying assembly 51, and the dry powder spraying assembly 50 are driven by the servo motor 530 to move up and down under the control of the external control system.
Specifically, as shown in fig. 5, the microfluidic chip printing system further includes an electrode printing device 6, where the electrode printing device 6 includes: a second conveying assembly 60, wherein the second conveying assembly 60 includes a second head end roller 600, a second tail end roller 601, and a second conveying substrate 602 disposed between the second head end roller 600 and the second tail end roller 601, and is used for conveying electrode raw materials, in this embodiment, the electrode raw materials may be a copper foil or an aluminum foil suitable for biochemical detection, or may be a film material roll such as a metal coating suitable for an electrode, and the like, and the invention is not particularly limited;
still include cutting assembly 61, cutting assembly 61 includes: the circular film cutting knife 610, the second bearing and cutting roller 611 and the traction roller are respectively arranged between the second head end roller 600 and the second tail end roller 601, and the circular film cutting knife 610 and the second bearing and cutting roller 611 are correspondingly arranged; the second conveying substrate 602 conveys electrode raw materials to pass through the circular film cutter 610 and the bearing and cutting roller to be connected with the traction roller, and the circular film cutter 610 and the bearing and cutting roller are correspondingly matched on the second conveying substrate 602 to press and cut out an electrode plate and excess materials around the electrode plate; in this embodiment, the pulling roll is connected to the electrode material, the pulling roll is far away from the second head end roll 600, the pulling roll winds the surplus material on the pulling roll corresponding to the speed of the second conveying substrate 602, the surplus electrode sheet is on the second conveying substrate 602, and the second conveying substrate 602 is provided with a turning roll 623.
Specifically, the electrode printing apparatus further includes: a third conveying assembly 62, where the third conveying assembly 62 includes a third head roller 620, a third tail roller 621, and a third conveying base 622 disposed between the third head roller 620 and the third tail roller 621, a turning roller 623 is further disposed on the third conveying base 622, the side with the third glue layer faces the electrode sheet through the turning roller 623, and the third conveying base 622 is used for conveying a second base layer;
a third gluing assembly 63, wherein the third gluing assembly 63 is disposed on a third transfer substrate 622 between the third head roller 620 and the turning roller 623, and the third gluing assembly 63 includes a third gluing die 630 correspondingly suspended on the upper surface of the third transfer substrate 622, so that the glue is extruded from the third gluing die 630; and
a third carrier 631 abutting against the lower surface of the third transfer substrate 622, wherein the third carrier 631 is correspondingly matched with the third glue coating die 630, so that a third glue layer is attached to the upper surface of the second base layer; in this embodiment, the properties of the third glue layer are the same as the second glue layer 94. In this embodiment, the first carrier, the second carrier, and the third carrier are all roller devices.
The third end roller 621 is tangential to the second transfer substrate 602 between the cutting assembly 61 and the second pressing assembly 64, and the third end roller 621 rotates corresponding to the second transfer substrate 602, so as to transfer the second base layer into the second transfer substrate 602.
Specifically, the electrode printing apparatus 6 further includes: second pressing components 64, second pressing components 64 locates cutting components 61 with on the second conveying substrate 602 between the second terminal roller 601, second pressing components 64 includes third pressing rollers 640, fourth pressing rollers 641, third pressing rollers 640 with the upper surface of second conveying substrate 602 is tangent, fourth pressing rollers 641 with the lower surface of second conveying substrate 602 is tangent, through third pressing rollers 640, fourth pressing rollers 641 correspond the cooperation, will the electrode slice paste in on the glue film of second basic level, form the second basic level that has the electrode slice, in this embodiment the electrode slice impression with in the third glue film, make the electrode slice with third glue film parallel and level.
Specifically, the third end fixing roller is a first pressing roller 710.
Specifically, still include second thermostat 65, second thermostat 65 set up in third end fixed roll with between the third rubber coating subassembly 63, corresponding to scribble the second basic unit of glue film and carry out the constant temperature heating, in order to right the second basic unit with the electrode slice does benefit to the bonding stability when carrying out the pressfitting.
Specifically, a second punching assembly 66 is further disposed between the second pressing assembly 64 and the second end roller 601, and the second punching assembly 66 includes: a second convex roller 660 and a second carrier roller 661, which are respectively disposed above the second transfer substrate 602 and below the second transfer substrate 602; so that the first die-cutting roller 30 is correspondingly matched with the first bearing-cutting roller 31, and through holes are arranged on the second base layer through the first die-cutting roller 30.
Specifically, as shown in fig. 6, the microfluidic chip printing system further includes:
an electrode belt 73; and
a backplane packaging apparatus 7, the backplane packaging apparatus 7 comprising: a second gluing assembly 72 and a first stitching assembly 71,
the second glue applying assembly 72 includes a second glue applying die 722 correspondingly suspended on the upper surface of the first material layer 9, so that a second glue is extruded from the second glue applying die 722, in this embodiment, the second glue is a photosensitive glue or an ultraviolet curing glue (UV glue); and a second carrier abutting against the lower surface of the first transfer base material 12, the second carrier being correspondingly matched with the second glue coating die, so that the second glue layer 94 is attached to the bonding area on the surface of the first material layer 9; the first pressing component 71 is arranged between the second gluing component 72 and the first end roller 11, the first pressing component 71 comprises a first pressing roller 710 and a second pressing cylinder 711 which correspond to each other, the first conveying base material 12 with the first material layer 9 and the electrode belt 73 synchronously pass through the space between the first pressing roller 710 and the second pressing roller, and the electrode belt 73 and the first material layer 9 are pressed through the first pressing roller 710 and the second pressing roller to form the chip microfluidic belt.
Further, the second end roller 601 is connected to the electrode belt 73, and transfers the second base layer with an electrode onto the first transfer base 12.
Further, the second gluing component 72 further comprises a glue spreader 720, wherein a second gravure template 7200 is arranged on the glue spreader 720, bumps coated with an encapsulation adhesive layer are arranged on the second gravure template 7200, a mesh roller 721 is arranged on the mesh roller 721 in a tangent manner, and adhesive leakage patterns of the mesh roller 721 correspond to the bumps; the second glue coating die 722 corresponds to the screen roller 721, the packaging glue layer is coated on the screen roller 721 in a blade mode, and the packaging glue layer is transferred to the salient points of the second gravure template 7200 through the screen roller 721; in this embodiment, the second carrier is a rubber bearing roller 723, the glue coating roller 720 and the rubber bearing roller 723 are arranged oppositely, and the glue coating roller 720 and the rubber bearing roller 723 rotate reversely, so that the packaging adhesive layer in the second gravure template 7200 is transferred to the first material layer 9 to form a second adhesive layer 94.
In the present invention, the second gluing component 72 can also be a silk screen offset plate and a second gluing die 722 corresponding to the silk screen offset plate, the glue leakage pattern of the silk screen offset plate corresponds to the non-micro flow channel 91 region of the first material layer 9, the second gluing die 722 is arranged above the silk screen, the second gluing die 722 is driven by a servo motor 530 to circularly slide on the silk screen to leak and print the glue layer on the non-micro flow layer, and the servo motor 530 is connected with an external control system; alternatively, the second glue applying assembly 72 is a screen roller 721 and a glue applying opening mold disposed in the screen roller 721, the glue leakage pattern of the screen roller 721 corresponds to the non-microchannel 91 region of the first material layer 9, and the package glue layer is transferred to the non-microchannel 91 region through the glue applying opening mold.
Specifically, a second accommodating cavity 7100 is arranged in the first pressing roller 710 of the first pressing assembly 71, and a second curing device 7101 is arranged in the second accommodating cavity 7100 and is used for curing the packaging adhesive layer.
Further, since the encapsulation adhesive layer used in this embodiment is an ultraviolet curing adhesive, the second curing device 7101 is an ultraviolet irradiation machine, and the ultraviolet irradiation machine is an LED strip and is disposed in the second receiving cavity 7100 closest to the first transfer substrate 12; the first stitching roller 710 is made of a transparent material to ensure good light transmittance.
Specifically, the hardness of the second pressing cylinder 711 is 20-40; the hardness of the first pressing roller 710 is 80-100; when the first pressing roller 710 and the second pressing cylinder 711 are pressed against each other, the second pressing cylinder 711 is deformed by pressing, so that the electrode belt 73, the first material layer 9 and the first pressing roller 710 are forced to have belt-like contact.
Further, the first combiner assembly further comprises: and the third pressing cylinder 712 is a transparent third pressing cylinder 712 with a hardness of 20-40, and the third pressing cylinder 712 is sleeved outside the first pressing roller 710 and corresponds to the second pressing cylinder 711.
Further, the first pressing roller 710 is made of quartz; the second pressing cylinder 711 and the third pressing cylinder 712 are made of silica gel.
Since the number of embossed layers is variable in the present invention, when the number of laminated layers is large or when the semi-finished product of the chip to be laminated has a certain rigidity, the suitable hardness of the first laminating roller 710, the second laminating cylinder 711 and the third laminating cylinder 712 can be adjusted accordingly so as to make the lamination more sufficient and not damage the chip.
Further, an external transmission assembly (not shown) is disposed between the second gluing assembly 72 and the first pressing assembly 71: the outer transport assembly comprises a leading roller and a trailing roller, and an outer first transport substrate 12 disposed between the leading roller and the trailing roller; the tail roller is tangent to the first conveying base material 12, and the external conveying assembly conveys the packaged product to the first conveying base material 12 to cover the glue layer of the belt plate surface.
Further, the microfluidic chip printing and manufacturing system further comprises a packaging device, wherein the package is arranged between the first pressing component 71 and the first tail end roller 11 so as to realize the cutting and packaging of the microfluidic chip strip in the embodiment, and the packaging device is a vacuum plastic uptake machine.
The first packaging device further comprises a printing assembly, and the printing device comprises a digital ink-jet printing unit and is used for printing chip two-dimensional codes, codes and the like.
Specifically, the microfluidic chip printing and manufacturing system further comprises a detection device, the detection device is arranged on the first transmission base material 12 between the printing assembly and the first end roller 11, the detection device comprises an artificial intelligence vision scanner, and in this embodiment, the vision scanner is a microfluidic chip detection machine.
Specifically, the conveying assembly further comprises a plurality of deviation rectifying limiters 8, and each deviation rectifying limiter 8 comprises: a limiting hole arranged on the first conveying base material 12, and a rectification roller arranged corresponding to the limiting hole; the first conveying base material 12 continuously passes through the deviation rectification roller and the limiting hole to be matched with each other to avoid deviating from the conveying route during displacement.
A method for printing a microfluidic chip, as shown in fig. 9, includes the following steps: a first transmission substrate 12 and a printing plate roller 211 are provided, wherein the printing plate roller 211 is driven by the first transmission substrate 12 to rotate.
S1, a first corona step: the surface dyne value of the first transfer substrate 12 is increased by the first corona 23 to 30 to 60 dynes.
S2, a first gluing step: a first adhesive layer is arranged on the first conveying base material 12 on one side corresponding to the printing plate roller 211, and the thickness of the first adhesive layer is 1.5 micrometers to 10 micrometers.
S3, constant temperature step: the first adhesive layer is subjected to constant temperature through the constant temperature component 24, so that the first adhesive layer is not solidified.
S4, pre-demoulding step: before the first material is coated on the first gravure template 2110, a release solution is sprayed on the first gravure template 2110 through the stripper 217, so that a separation layer is formed between the first material layer 9 and the first gravure template 2110.
S5, gravure printing: the first material flows out from the first discharge die 210 and is filled into the printing plate roller 211 on the surface of which the first gravure plate 2110 is provided.
S6: a perforating step, said first perforating assembly 3 perforating said first transfer substrate 12 with said first material layer 9 and/or said first material layer 9.
S71: the surface dyne value of the first material layer 9 is enlarged by the second corona machine 40 to increase the dyne value to 30 to 60 dynes. Transferring the first and second liquids stored in the surface treatment device 4 and/or the nozzle to the micro flow channel 90; the hydrophilic layer or the hydrophobic layer is obtained by a dryer and/or a refrigerator.
S8, specifically, the filling step further comprises the following steps: dry powder transfer machine constructs, dry powder transfer machine constructs and includes: a powder outlet nozzle, a powder rotating roller respectively arranged above the first material layer 9, and a printing roller arranged below the first conveying base material 12; under the cooperation of the printing roller, the powder material delivered from the powder outlet nozzle is filled in the micro flow channel 90 through the powder rotating roller.
S9, glue printing: coating a second adhesive layer 94 on the surface of the bonding area of the first material layer 9 by using a screen printing method or a rotary screen printing method or a flexographic printing method, avoiding the micro flow channel 90;
S1A electrode cutting step
Connecting a second transfer substrate to be cut with the pull roll; the second conveying base material is conveyed to a cutting assembly, the cutting assembly cuts and cuts the electrode original material to form an electrode belt and excess materials which are strung with electrode plates, and the excess materials are recovered by the traction roller;
and an assembling step, namely pressing the electrode strip into the bottom plate packaging device and the first material layer to form the microfluidic chip strip.
S2A, a second gluing step:
connecting an electrode belt to the second end roller via a third transport substrate;
the third conveying substrate conveys the second substrate to a third gluing component; the third gluing component is used for gluing the second base layer to form a glued second base layer;
the second base layer with the adhesive passes through a turning roller, the turning roller changes the moving direction of the second base layer with the adhesive and enables one surface with the adhesive to face the electric plate;
the third transfer substrate transfers the adhesive second base layer to a second transfer substrate.
And S2a, keeping the temperature, namely keeping the temperature of the adhesive layer of the second substrate with the adhesive on the second transmission substrate constant by a second thermostat, and heating to ensure that the adhesive layer is not cured.
And S3A, a second pressing step, in which the second pressing assembly presses the electrode circuit on the second conveying substrate and the glued second substrate to form a second substrate with an electrode, and the second conveying substrate conveys the second substrate with the electrode out of the second pressing assembly to form a second base layer with an electrode sheet.
And S4A, a second punching step, namely, the second base layer of the first conveying base material with the electrode plate of the second conveying base material passes through the first punching assembly, and the second punching assembly punches the second base layer with the electrode plate.
S10, pressing: synchronously feeding the second base layer of the electrode plate between the first pressing roller 710 and the second pressing roller by the electrode belt 73 and the first material layer 9 with the second adhesive, so that the electrode plate 73 is correspondingly attached to the bonding area;
s11, a second curing step: and a second curing device is arranged in the first pressing roller 710 and/or the second pressing roller, and the second curing device corresponds to the second adhesive, so that the second adhesive is cured while the electrode belt 73 is pressed on the first material layer 9.
Specifically, the second curing step includes a belt-shaped ultraviolet curing device disposed in the first pressing roller 710, the second adhesive layer 94 is an ultraviolet curing adhesive, the second pressing roller is a flexible second pressing roller, and when the flexible second pressing roller is pressed by the first pressing roller 710 in a matching manner, the electrode belt 73, the first transport substrate 12 and the first pressing roller 710 have a planar curing area.
Specifically, the gravure printing step, the first curing step, the filling step, the glue printing step, the pressing step and the second curing step are repeated in sequence at least once.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention, which are made by using the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An electrode printing apparatus of a microfluidic chip, comprising:
a second transfer assembly including a second leading roller, a second trailing roller, and a second transfer substrate disposed between the second leading roller and the second trailing roller for transferring the electrode raw material;
a cutting assembly, the cutting assembly comprising:
the circular film cutter, the bearing cutting roller and the traction roller are respectively arranged between the second head end roller and the second tail end roller, and the circular film cutter is arranged corresponding to the bearing cutting roller; the second conveying base material conveying electrode passes through the circular film cutter and the bearing cutting roller to be connected with the traction roller, and is correspondingly matched with the circular film cutter and the bearing cutting roller to press and cut the electrode plate and excess materials around the electrode plate on the second conveying base material; the drawing roller is far away from the second head end roller, the excess materials are wound on the drawing roller corresponding to the speed of the second conveying base material by the drawing roller, and the rest electric plates are arranged on the second conveying base material;
the first conveying assembly comprises a first head end roller and a first conveying base material arranged between the first head end roller and the first tail end roller,
still include surface treatment device, surface treatment device with still be provided with filling device between the first end roller, filling device includes: and correspondingly arranging the nozzle above the micro flow channel to fill the second feed liquid stored in the nozzle into the reaction area of the second material layer to obtain a third material layer.
2. The electrode printing apparatus of claim 1, further comprising:
the third conveying assembly comprises a third head end roller, a third tail end roller and a third conveying base material arranged between the third head end roller and the third tail end roller, the third conveying base material is also provided with a steering roller, one surface with a third glue layer faces the electrode plate through the steering roller, and the third conveying base material is used for conveying a second base layer;
the third gluing assembly is arranged on a third conveying substrate between the third head end roller and the steering roller and comprises a third gluing die correspondingly suspended on the upper surface of the third conveying substrate, so that viscose is extruded from the gluing die; and
a third loader abutting against the lower surface of the third conveying base material, wherein the third loader is correspondingly matched with the gluing mouth mold, so that a third glue layer is attached to the upper surface of the second base layer;
the third end roller is tangent to the second transmission substrate between the cutting assembly and the second pressing assembly, and the third end roller and the second transmission substrate rotate correspondingly and are used for transferring the first base layer into the second transmission substrate.
3. The electrode printing apparatus of claim 2, further comprising:
the second press-fit assembly is arranged on the cutting assembly and the second conveying base material between the second end rollers, the second press-fit assembly comprises a third press-fit roller and a fourth press-fit roller, the third press-fit roller is tangent to the upper surface of the second conveying base material, the lower surface of the second conveying base material is tangent to the lower surface of the second conveying base material, and the electrode plates are pasted on a third glue layer on the second base layer through corresponding matching of the first press-fit roller and the second press-fit roller to form a second base layer with the electrode plates.
4. The apparatus of claim 2, wherein the third end roller is a first pressing roller.
5. The apparatus of claim 2, further comprising a second thermostat, wherein the second thermostat is disposed between the third end roller and the third glue spreading assembly, and is configured to heat the second substrate coated with the glue layer at a constant temperature, so as to facilitate stable adhesion when the second substrate and the electrode sheet are pressed together.
6. The apparatus of claim 1, wherein a second punch assembly is disposed between the second pressing assembly and the second end roller, the second punch assembly comprising:
the second convex roller and the second bearing roller are respectively arranged above the second transmission substrate and below the second transmission substrate, so that the first die-cutting roller and the first bearing roller are correspondingly matched, and through holes are arranged on the second base layer through the first die-cutting roller.
7. A method of printing the electrode printing apparatus of claim 1, comprising:
connecting a second transfer substrate to be cut with the pull roll;
the electrode cutting step, namely conveying the second conveying base material to a cutting assembly, wherein the cutting assembly cuts and cuts the electrode raw material to form an electrode belt and excess materials which are strung with electrode plates, and the excess materials are recovered by the traction roller;
the assembly step, the electrode belt enters a bottom plate packaging device and is pressed with the first material layer to form the microfluidic chip belt;
also comprises a pre-demoulding step: before the first material layer is coated on the first gravure template, spraying a stripping liquid on the first gravure template through a stripper, so that an isolation layer is formed between the first material layer and the first gravure template;
gravure printing step layer: and the first material flows out of the first discharging port die and is filled into the printing plate roller with the first gravure template arranged on the surface.
8. A method of printing on an electrode printing apparatus according to claim 7, comprising:
connecting an electrode belt to the second end roller via a third transport substrate;
before the assembling step, the method further comprises the following steps:
a second gluing step, wherein a third base plate is transmitted to a third gluing assembly by a third transmission base material; the third gluing component is used for gluing the second substrate to form a glued second base layer;
the second base layer with the adhesive passes through a steering roller, the steering roller changes the moving direction of the second base layer with the adhesive and enables one surface with the adhesive to face the electrode plate;
the third transfer substrate transfers the adhesive second base layer to a second transfer substrate.
9. A method of printing on an electrode printing apparatus according to claim 7, comprising:
and a second pressing step, namely pressing the electrode circuit on a second conveying base material and the second base layer with the adhesive by a second pressing component to form a second substrate with an electrode, and conveying the second substrate with the electrode out of the second pressing component by the second conveying base material to form the second base layer with an electrode slice.
10. A method of manufacturing an electrode manufacturing apparatus according to claim 8, further comprising a step of keeping the temperature of the adhesive layer constant after the second adhesive coating step, wherein the second thermostat keeps the temperature of the adhesive layer constant and heats the adhesive-coated second base layer on the second transfer substrate so that the adhesive layer is not cured.
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| CN110575940A (en) * | 2019-08-29 | 2019-12-17 | 安徽志诚机电零部件有限公司 | Gluing equipment for production of car roof interior trim |
| CN113414073A (en) * | 2021-06-25 | 2021-09-21 | 四川通妙科技有限公司 | Whole-disc chip counting device |
| CN113666332B (en) * | 2021-08-27 | 2023-09-29 | 辽宁分子流科技有限公司 | Preparation method of core unit of microfluidic chip |
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