CN109728192B - Packaging structure and display device - Google Patents
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- CN109728192B CN109728192B CN201811451012.0A CN201811451012A CN109728192B CN 109728192 B CN109728192 B CN 109728192B CN 201811451012 A CN201811451012 A CN 201811451012A CN 109728192 B CN109728192 B CN 109728192B
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Abstract
The application relates to the technical field of screen body display, and provides a packaging structure and a display device. The packaging structure at least comprises a first inorganic layer, an auxiliary packaging layer and a second inorganic layer which are sequentially stacked. The auxiliary packaging layer at least comprises an auxiliary substrate layer with a gap structure. And at least part of the gap structures of the auxiliary matrix layer are filled with drying agents. The shape, particle size, and position of the gap structure in the auxiliary base layer are not particularly limited. When the packaging structure is bent or broken, the drying agent in the auxiliary packaging layer can move, so that the drying agent can move to fully absorb water and oxygen in the packaging structure, and the protection function of the packaging structure is enhanced. When the packaging structure is applied to the OLED device, the service life of the OLED device can be prolonged.
Description
Technical Field
The application relates to the technical field of screen body display, in particular to a packaging structure and a display device.
Background
In recent years, with the development of society and the advancement of science and technology, the technical development of intelligent terminal devices and wearable devices is changing day by day, the requirements for flat panel display are gradually increased, and the requirements are more and more diversified. Organic Light-Emitting diodes (OLEDs) are receiving more and more attention. Compared with the traditional display screen, the OLED device is lighter and thinner in size and lower in power consumption, and the endurance of equipment is favorably improved.
The existing OLED devices are generally encapsulated by a Thin Film Encapsulation (TFE) method. The film encapsulation method generally adopts a first inorganic substance, an organic substance and a second inorganic substance for alternate encapsulation, and the film encapsulation structure can not ensure complete water and oxygen blocking, so that external water and oxygen can easily permeate through the film encapsulation layer and enter the organic light emitting layer of the OLED device, and the problem of service life reduction or failure of the OLED device caused by overhigh water and oxygen content is easily caused.
Disclosure of Invention
Therefore, it is necessary to provide an encapsulation structure and a display device for solving the problems that the conventional film encapsulation structure cannot ensure complete water and oxygen blocking, external water and oxygen can easily enter the organic light emitting layer of the OLED device through the film encapsulation layer, and the service life of the OLED device is reduced or the OLED device fails due to too high water and oxygen content.
A packaging structure at least comprises a first inorganic layer, an auxiliary packaging layer and a second inorganic layer which are sequentially stacked; the auxiliary packaging layer at least comprises an auxiliary substrate layer with a gap structure, and at least part of the gap structure of the auxiliary substrate layer is filled with a drying agent.
In one embodiment, the gap size of the gap structure is adapted to the grain size of the filling desiccant.
In one embodiment, the gap structures are arranged in a point-like discrete manner or in a hole-like manner in the auxiliary substrate layer.
In one embodiment, the auxiliary encapsulation layer further comprises an organic layer; the organic layer is disposed between the first inorganic layer and the auxiliary base layer or between the second inorganic layer and the auxiliary base layer.
In one embodiment, the modulus of elasticity of the auxiliary matrix layer is less than the modulus of elasticity of the organic layer.
In one embodiment, the material of the auxiliary substrate layer is selected from one or more of vinyl ester resin, polyvinyl chloride, or thermoplastic polyurethane.
In one embodiment, the auxiliary encapsulation layer has a thickness in a range of 8 microns to 120 microns.
In one embodiment, the material of the filling desiccant is selected from one or more of an R-oxyl epoxy aluminum desiccant, a transparent silica gel desiccant or a molecular sieve desiccant.
A display device having a basic display area and an edge display area, wherein an encapsulation structure according to any one of the preceding claims is provided.
In one embodiment, the display device further includes: a touch electrode; the touch electrode is directly arranged on the packaging structure in a contact mode.
The application relates to the technical field of screen body display, and provides a packaging structure and a display device. The packaging structure at least comprises a first inorganic layer, an auxiliary packaging layer and a second inorganic layer which are sequentially stacked. The auxiliary packaging layer at least comprises an auxiliary substrate layer with a gap structure. And at least part of the gap structures of the auxiliary matrix layer are filled with drying agents. The shape, particle size, and position of the gap structure in the auxiliary base layer are not particularly limited. And filling a drying agent in the gap structure. When the packaging structure is bent or broken, the drying agent in the auxiliary packaging layer can move, and the drying agent can more fully absorb water and oxygen in the packaging structure after moving, so that the protection function of the packaging structure is enhanced. When the packaging structure is applied to the OLED device, the service life of the OLED device can be prolonged.
Drawings
Fig. 1 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a package structure provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a display device provided in an embodiment of the present application.
The reference numbers illustrate:
First inorganic layer 110
Second inorganic layer 130
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clearly apparent, the package structure and the display device of the present application are further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 1, in one embodiment, a package structure 100 is provided, which at least includes a first inorganic layer 110, an auxiliary encapsulation layer 120, and a second inorganic layer 130 stacked in sequence.
The auxiliary packaging layer 120 at least includes an auxiliary substrate layer 21 having a gap structure 22, and at least a portion of the gap structure 22 of the auxiliary substrate layer 21 is filled with a desiccant.
Specifically, the first inorganic layer 110 and the second inorganic layer 130 need to have excellent barrier properties against moisture and oxygen. Generally, the first inorganic layer 110 and the second inorganic layer 130 may be selected from transparent oxides, fluorides, and silicon nitrides. The auxiliary encapsulating layer 120 is generally made of a polymer film, and has good film forming property and compact surface. The auxiliary substrate layer 21 has a gap structure 22. Specifically, the auxiliary base layer 21 may be made of an organic material having an interstitial structure. It is also possible that the material of the auxiliary base layer 21 itself has no gap structure, and the gap structure 22 is formed during the deposition process of forming the auxiliary base layer 21. The shape, the size of the grain size, and the position in the auxiliary encapsulating layer 120 of the gap structure 22 are not particularly limited. For example, the gap structure 22 may be provided as a lattice sandwich, a porous structure, or a fillable structure of any shape arranged in an array. The gap structure 22 is filled with a desiccant wrapped with a plastic material. The gap structure 22 may be filled with a desiccant wrapped in a plastic material. The plastic material is an organic material with a large plastic coefficient. For example, metals, plastics, etc. all have varying degrees of plastic deformability. There are many types of desiccants, such as liquid desiccants, solid desiccants, or any substance capable of performing a drying function. In one embodiment, a liquid desiccant is selected in the gap structure 22.
In this embodiment, the package structure 100 includes the first inorganic layer 110, the auxiliary encapsulation layer 120, and the second inorganic layer 130. The auxiliary encapsulation layer 120 includes the auxiliary base layer 21. The auxiliary substrate layer 21 has a gap structure 22. The gap structure 22 is filled with a desiccant. The gap structure 22 may be provided as a lattice sandwich, a porous structure or a fillable structure of any shape arranged in an array. The gap structure 22 is filled with a desiccant. When the package structure 100 is bent or broken, the desiccant in the auxiliary package layer 120 may flow. The desiccant may absorb water and oxygen in the package structure 100 after flowing, enhancing the protection function of the package structure 100. When the encapsulation structure 100 is applied to an OLED device, the service life of the OLED device can be prolonged.
In one embodiment, the gap size of the gap structure 22 is adapted to the grain size of the filled desiccant.
In this embodiment, the gap size of the gap structure 22 may be uniform, stepwise, or randomly varied. The particle size of the filled desiccant may be from 2 microns to 100 microns. The gap size of the gap structure 22 may be slightly larger than the desiccant particle size. For example, the gap structure 22 may have a diameter of 20 microns. The particle size of the filled desiccant may be 22 microns.
In this embodiment, the auxiliary encapsulating layer 120 and the gap structure 22 are set within a reasonable range of diameters, which is beneficial to forming the encapsulating structure 100 with stronger film toughness, smaller stress between films, and better water and oxygen blocking performance.
Referring to fig. 1-3, in one embodiment, the gap structures 22 are arranged in a dot-like discrete manner or in a hole-like manner in the auxiliary substrate layer 21.
In particular, the arrangement of the gap structures 22 may be a discrete irregular arrangement. For example, the gap structure 22 is configured as a lattice sandwich, a porous structure, or a fillable structure with any shape arranged in an array. The gap structures 22 may be arranged in a hole-like manner. The shape of the gap structure 22 may be circular, triangular, polygonal or other irregular shape.
In this embodiment, the gap structure 22 may be a lattice sandwich, a porous structure, or a fillable structure with any shape arranged in an array. In this embodiment, the gap structure 22 may be filled with a liquid desiccant wrapped with a plastic material. When the package structure 100 is bent or broken, the plastic material wrapped desiccant in the auxiliary package layer 120 may flow to form a protection layer with a flat surface. The desiccant can absorb water and oxygen in the package structure 100 after flowing to form a flat surface, thereby enhancing the protection function of the package structure 100. When the package structure 100 is applied to a display device, the service life of the display device can be prolonged.
Referring to fig. 4 and 5, in one embodiment, the auxiliary encapsulation layer 120 further includes an organic layer 23. The organic layer 23 is disposed between the first inorganic layer 110 and the auxiliary base layer 21 or between the second inorganic layer 130 and the auxiliary base layer 21.
Specifically, the organic layer 23 may be a polymer thin film, and the organic layer 23 has good film forming property and a dense surface and is not easy to form pinholes. The organic layer 23 may be directly in contact with the first inorganic layer 110, and the organic layer 23 may also be directly in contact with the second inorganic layer 130. The gap structure 22 filled with the liquid desiccant wrapped in the plastic material is provided in the auxiliary substrate layer 21 when deformation, such as bending, occurs in the package structure 100. The liquid desiccant can flow along with the deformation of the auxiliary substrate layer 21, so as to avoid the fracture of the package structure 100.
In this embodiment, providing the organic layer 23 with a flat and dense surface can increase the stability of the package structure 100. In addition, the organic layer 23 is disposed at different positions, so that the package structure 100 can be bent in different directions. The auxiliary substrate layer 21 has the gap structure 22, a desiccant can be filled in the gap structure 22, and when the package structure 100 is bent or under a strong pressure, the auxiliary substrate layer 21 is deformed first, which corresponds to the deformation of the package structure 100.
In one embodiment, the modulus of elasticity of the auxiliary matrix layer 21 is less than the modulus of elasticity of the organic layer 23.
In this embodiment, both the organic layer 23 and the auxiliary substrate layer 21 may be made of organic polymers. The organic layer 23 and the auxiliary matrix layer 21 generally have different elastic moduli. The auxiliary substrate layer 21 assists the bending ability of the substrate layer 21 to be better than the bending ability of the organic layer 23.
In one embodiment, the material of the auxiliary substrate layer 21 is selected from one or more of vinyl ester resin, polyvinyl chloride, or thermoplastic polyurethane.
The auxiliary matrix layer 21 may be a vinyl ester resin. Vinyl ester resins are a modified class of epoxy resins obtained by reacting bisphenol-type or novolac-type epoxy resins with methacrylic acid, commonly known as vinyl ester resins (VE), also known as epoxy acrylic resins, which are thermosetting resins.
The auxiliary substrate layer 21 may be polyvinyl chloride (pvc), which is abbreviated as pvc (polyvinyl chloride), and is an initiator of Vinyl Chloride Monomer (VCM) in peroxide, azo compound, and the like; or a polymer polymerized by a free radical polymerization mechanism under the action of light and heat. Vinyl chloride homopolymers and vinyl chloride copolymers are collectively referred to as vinyl chloride resins.
The auxiliary substrate layer 21 may be Thermoplastic Urethane, the english name Thermoplastic Urethane, TPU for short. The TPU is a high molecular material formed by the joint reaction and polymerization of diphenylmethane diisocyanate (MDI), Toluene Diisocyanate (TDI), macromolecular polyol and a chain extender. The molecular structure of the polyurethane elastomer is formed by alternately reacting a rigid block obtained by reacting diphenylmethane diisocyanate (MDI), Toluene Diisocyanate (TDI) and a chain extender and a flexible chain segment obtained by reacting the diphenylmethane diisocyanate (MDI), the Toluene Diisocyanate (TDI) and macromolecular polyol. Thermoplastic polyurethane has high water repellency and moisture permeability, and is suitable as the auxiliary base layer 21.
The auxiliary substrate layer 21 may also comprise a mixture of any two or more of vinyl ester resin, polyvinyl chloride, or thermoplastic polyurethane. It is understood that the materials for forming the auxiliary substrate layer 21 with the gap structure 122 on the auxiliary packaging layer 120 are not limited to the materials mentioned in this application, but may be other materials considered by those skilled in the art.
In one embodiment, the material of the filling desiccant is selected from one or more of an R-oxyl epoxy aluminum desiccant, a transparent silica gel desiccant or a molecular sieve desiccant.
In this embodiment, the gap structure 22 is filled with a liquid desiccant wrapped by a plastic material, so that the package structure 100 has better barrier properties against water vapor and oxygen. The plastic material includes metal or plastic, and can be plastically deformed when a certain pressure is applied, so that the desiccant can flow out and be spread on the surface of the first inorganic layer 110, thereby tightly blocking water and oxygen from corroding the organic materials in the package structure 100. In the selection process of the drying agent, a liquid flowable drying agent can be selected. For example, the desiccant can be selected from R-oxyl epoxy aluminum desiccant, transparent silica gel desiccant or molecular sieve desiccant.
In one embodiment, the auxiliary encapsulation layer 120 has a thickness in a range of 8 microns to 120 microns.
In this embodiment, the thickness of the auxiliary encapsulating layer 120 is set to be in a range of 8 micrometers to 120 micrometers. Specifically, the auxiliary encapsulation layer 120 may include only the auxiliary substrate layer 21, and the gap structure 22 is provided in the auxiliary substrate layer 21. For example, the thickness of the auxiliary encapsulating layer 120 is 100 micrometers, and the gap size of the gap structure 22 may be set to 10 micrometers. The auxiliary encapsulation layer 120 may also include the auxiliary base layer 21 and the organic layer 23, and the gap structure 22 is provided in the auxiliary base layer 21. For example, the thickness of the auxiliary encapsulating layer 120 is 100 micrometers, and the thickness of the organic layer 23 may be in a range of 10 micrometers to 30 micrometers. The size of the gap structure 22 may also be set to 10 microns.
In this embodiment, the auxiliary encapsulating layer 120 has a suitable thickness range, the organic layer 23 has a suitable thickness range, and the gap size of the gap structure 22 has a suitable range, which is beneficial to forming the encapsulating structure 100 with stronger film toughness, smaller stress between films, and better water and oxygen blocking performance.
Referring to fig. 6, the present application provides a display device 200. The display device 200 has a basic display area 201 and an edge display area 202, and the package structure 100 is disposed in the edge display area 202.
In this embodiment, the possibility that the center of the screen of the display device 200 is damaged is low in combination with a specific phenomenon in an actual use process. Therefore, the package structure 100 mentioned in any of the above embodiments is only disposed in the edge display area 202, which can substantially save the cost and enhance the effect.
In another embodiment, the entire display device 200 may be provided with the package structure 100 as described in any one of the above embodiments. The package structure 100 is disposed in the entire display device 200 to protect the display device 200 in all directions.
In one embodiment, the display device 200 may be a display terminal, such as a tablet computer. In other embodiments, the display device 200 may also be a mobile communication terminal, such as a mobile phone terminal. The display device may also be any form of display screen, such as a billboard or other place where OLED devices are applied. In the display device 200, the auxiliary packaging layer 120 is provided with a plastic material-wrapped desiccant, and when the packaging structure 100 is bent or broken, the plastic material-wrapped desiccant in the auxiliary packaging layer 120 can flow to form a protection layer with a flat surface. The desiccant can absorb water and oxygen in the package structure 100 after flowing to form a flat surface, thereby enhancing the protection function of the package structure 100. The encapsulation structure 100 can sufficiently protect the thin film transistor and the organic light emitting diode unit from water and oxygen, and finally can prolong the service life of the display device 200.
In one embodiment, the display device 200 further includes a touch electrode (not shown). The touch electrode is disposed on the package structure 100 in direct contact.
In this embodiment, the touch electrode is disposed on the surface of the package structure 100, which is stable and flat and is not easily corroded by water and oxygen, to form the display device 200. In this embodiment, the display device 200 has a higher display effect and higher touch sensitivity.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The packaging structure is characterized by at least comprising a first inorganic layer, an auxiliary packaging layer and a second inorganic layer which are sequentially stacked; the auxiliary packaging layer at least comprises an auxiliary substrate layer with a gap structure, and a liquid desiccant is filled in at least part of the gap structure of the auxiliary substrate layer; the auxiliary substrate layer is made of organic materials with a gap structure; the gap structure is a porous fillable structure, and the liquid desiccant is a plastic material-wrapped liquid desiccant.
2. The encapsulation structure of claim 1, wherein the material of the first inorganic layer and the second inorganic layer is a transparent oxide, fluoride, or silicon nitride.
3. The package structure of claim 1, wherein the gap structures are in a point-like discrete arrangement or a hole-like arrangement in the auxiliary substrate layer.
4. The encapsulation structure of claim 1, wherein the auxiliary encapsulation layer further comprises an organic layer; the organic layer is disposed between the first inorganic layer and the auxiliary base layer or between the second inorganic layer and the auxiliary base layer.
5. The package structure of claim 4, wherein the auxiliary substrate layer has a modulus of elasticity less than the modulus of elasticity of the organic layer.
6. The package structure of claim 4, wherein the material of the auxiliary substrate layer is selected from one or more of vinyl ester resin, polyvinyl chloride, or thermoplastic polyurethane.
7. The package structure of claim 1, wherein the auxiliary encapsulation layer has a thickness in a range from 8 microns to 120 microns.
8. The package structure of claim 1, wherein the plastic material is plastic.
9. A display device, characterized in that the display device has a basic display area and an edge display area, in which edge display area the encapsulation structure according to any one of claims 1 to 8 is arranged.
10. The display device according to claim 9, wherein the display device further comprises: a touch electrode; the touch electrode is directly arranged on the packaging structure in a contact mode.
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| CN110635014B (en) * | 2019-09-25 | 2022-01-25 | 昆山工研院新型平板显示技术中心有限公司 | Flexible cover plate and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107425134A (en) * | 2017-05-03 | 2017-12-01 | 京东方科技集团股份有限公司 | A kind of organic EL display panel, its preparation method and display device |
| CN108321172A (en) * | 2018-04-12 | 2018-07-24 | 云谷（固安）科技有限公司 | Organic light emitting display panel, display device |
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| JP3349488B2 (en) * | 2000-02-01 | 2002-11-25 | トヨタ自動車株式会社 | Manufacturing method of organic EL element |
| TW576125B (en) * | 2002-10-25 | 2004-02-11 | Ritek Display Technology Corp | OLED device and a method for fabricating the same |
| US20040189195A1 (en) * | 2003-03-24 | 2004-09-30 | Osram Opto Semiconductors Gmbh | Devices including, methods using, and compositions of reflowable getters |
| KR101234229B1 (en) * | 2010-06-11 | 2013-02-18 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method of manufacturing thereof |
| CN105098091A (en) * | 2015-06-15 | 2015-11-25 | 深圳市华星光电技术有限公司 | Package structure and package method of organic light-emitting diode (OLED) device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107425134A (en) * | 2017-05-03 | 2017-12-01 | 京东方科技集团股份有限公司 | A kind of organic EL display panel, its preparation method and display device |
| CN108321172A (en) * | 2018-04-12 | 2018-07-24 | 云谷（固安）科技有限公司 | Organic light emitting display panel, display device |
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