CN109713157B - Display panel, preparation method thereof and display device - Google Patents
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- CN109713157B CN109713157B CN201811504701.3A CN201811504701A CN109713157B CN 109713157 B CN109713157 B CN 109713157B CN 201811504701 A CN201811504701 A CN 201811504701A CN 109713157 B CN109713157 B CN 109713157B
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Abstract
The invention relates to a display panel, a preparation method thereof and a display device, wherein the display panel comprises a substrate, a light-emitting element and a packaging structure, wherein the substrate is provided with a display area and a non-display area; the light-emitting element is arranged in the display area; the packaging structure covers the light-emitting element and is in contact with the non-display area of the substrate; a first embedding part is embedded at one side of the packaging structure, which is in contact with the non-display area of the substrate; the first embedding portion is mainly formed of an associative polymer and is in contact with the non-display region of the substrate. On one hand, the associative polymer has better viscoelasticity, and on the other hand, the associative polymer in the first embedding part can be associated with molecules in a non-display area of the substrate to form a three-dimensional net structure, so that high-shear viscosity is generated between the packaging structure and the substrate, the sealing property between the packaging structure and the substrate is improved, water and oxygen invasion is effectively blocked, the packaging performance of the display panel is improved, and the service life and the yield of the display panel can be further improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
In recent years, with the technical development of intelligent terminal equipment and wearable equipment, the demand for display is more and more diversified, for example, an O L ED (organic L light-Emitting Diode, O L ED) organic light-Emitting Diode display has self-luminous performance, and a backlight module consuming more energy is omitted compared with a liquid crystal display screen, so that the display has the advantage of saving more energy.
Currently, most adopted in the industry is Thin-Film Encapsulation (TFE) which is a packaging technology suitable for narrow-bezel and flexible O L ED (organic L light-Emitting Diode) panels, and a typical Thin-Film packaging structure is formed by stacking an inorganic packaging Film and an organic packaging Film, wherein the inorganic packaging Film provides barrier properties, and the organic packaging Film provides toughness.
However, the encapsulation performance of the current thin film encapsulation structure still needs to be improved, and particularly, the defect that water and oxygen easily invade to cause unreliable encapsulation exists, so that the service life of the device is reduced. Therefore, the industry has put higher demands on the packaging performance of the display panel, especially for the display panel with larger size, such as the display panel with medium or large size.
Disclosure of Invention
Therefore, a display panel with better packaging performance, a preparation method thereof and a display device are needed to be provided.
According to an aspect of the present invention, there is provided a display panel including:
the display device comprises a substrate, a display area and a non-display area, wherein the substrate is provided with the display area and the non-display area which is positioned at the periphery of the display area;
a light emitting element provided in the display region; and
an encapsulation structure covering the light emitting element and configured to contact a non-display region of the substrate;
a first embedding part is embedded in one side of the packaging structure, which is in contact with the non-display area of the substrate; the first embedding portion includes an associative polymer and is in contact with the non-display region of the substrate.
The side of the packaging structure, which is contacted with the non-display area of the substrate, is embedded with a first embedding part. The first embedding portion includes an associative polymer and is in contact with the non-display region of the substrate. On one hand, the associative polymer has good viscoelasticity, and on the other hand, the associative polymer in the first embedding part can be associated with molecules (such as polyimide) on the surface of the substrate to form a three-dimensional net structure, so that high-shear viscosity is generated between the packaging structure and the substrate, the sealing property between the packaging structure and the substrate is improved, water and oxygen invasion is effectively blocked, the packaging performance of the display panel is improved, and the service life and the yield of the display panel can be further improved.
The packaging structure can be used for display panels of any size, and is particularly suitable for display panels with larger sizes, such as display panels with medium and large sizes, so as to improve the packaging performance of the display panels.
In one embodiment, the encapsulation structure includes an inorganic encapsulation layer, and the first embedding portion is disposed in the inorganic encapsulation layer.
In one embodiment, the encapsulation structure comprises at least two inorganic encapsulation layers and an organic encapsulation layer arranged between two adjacent inorganic encapsulation layers;
the inorganic packaging layer which is directly arranged on the light-emitting element and is in contact with the non-display area of the substrate is a first inorganic packaging layer, and the first embedding part is arranged in the first inorganic packaging layer;
preferably, the organic encapsulation layer covers the first embedding portion on an orthographic projection of the substrate.
In one embodiment, the first embedded portion is disposed around the light emitting element.
In one embodiment, the display panel further includes an organic film layer between the light emitting element and the encapsulation structure; the non-display area of the substrate comprises a first non-display subarea covered with an organic film layer and a second non-display subarea positioned on the periphery of the first non-display subarea, and the packaging structure is in direct contact with the substrate in the organic film layer and the second non-display subarea respectively;
the packaging structure is embedded with at least two first embedding parts, wherein one first embedding part is embedded at one side of the packaging structure in direct contact with the organic film layer, and the other first embedding part is embedded at one side of the packaging structure in direct contact with the substrate of the second non-display partition.
In one embodiment, a second embedding portion is also embedded within the organic encapsulation layer, the second embedding portion including the associative polymer.
In one of the embodiments, the associative polymer is an associative polymer based on a polyurethane or acrylic polymer having a hydrophobic group and a hydrophilic chain.
In one embodiment, the hydrophobic group is at least one of a polyoxypropylene group, a long-chain perfluoroalkyl group, a polysiloxane group, an octadecyl group, a dodecylphenyl group, and a nonylphenol group, wherein the number of long-chain carbon atoms in the long-chain perfluoroalkyl group is 12 or more; the hydrophilic chain is a polyether chain.
According to another aspect of the present invention, there is provided a method of manufacturing a display panel, including the steps of:
providing a substrate, wherein the substrate is divided into a display area and a non-display area positioned at the periphery of the display area;
forming a light emitting element in a display region of the substrate;
depositing a first encapsulation material on the light emitting element and the non-display area of the substrate to cover the light emitting element;
forming a groove in the position, corresponding to the non-display area of the substrate, of the first packaging material;
and filling gel solution of associated polymer in the groove, solidifying to form a first embedded part, and depositing a second packaging material on the first packaging material to form a packaging structure.
According to another aspect of the present invention, there is provided a display device including the display panel of any one of the above.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention;
FIG. 2 is a schematic representation of the structure of an associative polymer according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a display panel according to yet another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a display panel according to yet another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a display panel according to yet another embodiment of the present invention;
fig. 6 is a schematic structural diagram of a display panel according to yet another embodiment of the invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the conventional film packaging structure, the internal stress of the inorganic packaging film is relatively large, the bonding force between films is poor due to different materials between the inorganic packaging film and the organic packaging film, heat generated during cutting is generated, and the like, so that the film packaging structure is easy to crack and peel, and the packaging reliability of the film packaging structure needs to be further improved. Based on the technical problems of poor applicability and packaging performance of TFE in large-sized display panels such as medium-sized and large-sized display panels, the inventor conducts a large number of research experiments, and further provides a brand-new display screen and a preparation method thereof.
It can be understood that the display panel provided in the embodiment of the present invention is mainly applied to a full-screen or frameless display panel, and may also be applied to a general display panel with a frame or a narrow frame.
FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention; FIG. 2 shows a schematic representation of the structure of an associative polymer according to an embodiment of the present invention; fig. 3 is a schematic structural diagram of a display panel according to still another embodiment of the present invention; fig. 4 is a schematic structural diagram of a display panel according to still another embodiment of the present invention; fig. 5 is a schematic structural diagram of a display panel according to still another embodiment of the present invention; fig. 6 is a schematic structural diagram of a display panel according to still another embodiment of the present invention. For the purpose of illustration, the drawings show only the structures associated with embodiments of the invention.
Referring to fig. 1, a display panel 100 according to an embodiment of the invention is provided. The display panel 100 includes a substrate 110, a light emitting device 120, and a package structure 130.
The substrate 110 has a display region (denoted as an AA region) and a non-display region (denoted as an NAA region) located at the periphery of the display region.
The light emitting element 120 is provided in a display region on the substrate 110.
The substrate 110 may be formed of one or more organic materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or Polyimide (PI). Preferably, the substrate 110 is formed using polyimide.
It is understood that the light emitting element 120 may be an O L ED organic light emitting diode, and the substrate 110 and the light emitting element 120 may be collectively referred to as an organic electroluminescent device.
Specifically, the light emitting device 120 may include a tft (thin Film transistor) array 121 and an organic light emitting structure 122, and the display panel 100 may further include a pixel defining layer (not shown). The organic light emitting structure 122 includes at least an organic light emitting material layer. In some embodiments, the organic light emitting structure 122 may have a multi-layered structure, for example, may include an electron transport layer and a hole transport layer balancing electrons and holes, and an electron injection layer and a hole injection layer for enhancing injection of electrons and holes, in addition to the organic light emitting material layer.
The encapsulation structure 130 covers the light emitting element 120 and contacts the non-display region of the substrate 110.
It is understood that the package structure 130 may be one or more layers, and may be an organic film layer or an inorganic film layer, or a stacked structure of an organic film layer and an inorganic film layer. For example, in some embodiments, the package structure 130 may also include two inorganic layers and an organic layer disposed between the two inorganic layers.
The structure schematic diagram of the associative polymer is shown in fig. 2, the associative polymer refers to that the hydrophobic groups of an amphiphilic polymer with a small amount of hydrophobic groups on a hydrophilic macromolecular chain are mutually associated in an aqueous solution, and the electrostatic repulsion and attraction of the charged ionic groups compete with each other and cooperate with each other, so that the macromolecular chain generates intramolecular or intermolecular association (a substrate PI material) to form various micellar structures with different forms, namely supramolecular network structures.
Further, the associative polymer is an associative polymer formed of a polyurethane or acrylic polymer having a hydrophobic group and a hydrophilic chain. Specifically, the hydrophobic group is at least one of polyoxypropylene, long-chain perfluoroalkyl, polysiloxane, octadecyl, dodecylphenyl and nonylphenol, wherein the number of long-chain carbon atoms in the long-chain perfluoroalkyl is more than 12; the hydrophilic chain is a polyether chain. The hydrophobic end of the associated polymer can be associated with the hydrophobic structure of the organic molecules (e.g., polyimide) on the non-display area of the substrate 110 to form a three-dimensional network structure, thereby generating high viscosity between the encapsulation structure 130 and the substrate 110. In addition, the hydrophilic chain can be bonded with oxygen atoms and hydrogen atoms in the package structure 130, so that the adhesive force between the interiors of the package structures 130 is improved, the density of the package structure 130 is improved, and the performance of the package structure 130 in blocking water and oxygen is improved.
For example, in one example, the associative polymer is an associative polymer formed from a hydrophobically modified ethoxylated urethane having the formula wherein the molecular chain has a plurality of hydrophilic and hydrophobic groups R1、R2And can be used for association. Hydrophobic radical R1、R2Independently selected from at least one of polyoxypropylene group, long-chain perfluoroalkyl group, polysiloxane group, octadecyl group, dodecylphenyl group and nonylphenol group, and the ethoxy group forms polyether in the molecular chain as a hydrophilic group.
The first embedding portion 131 is embedded at a side of the package structure 130 contacting the non-display region of the substrate 110. The first embedding portion 131 includes an associative polymer and is in contact with the non-display region of the substrate 110. The structure schematic diagram of the associative polymer is shown in fig. 2, on one hand, the associative polymer itself has better viscoelasticity, and on the other hand, the associative polymer in the first embedding portion 131 can associate with molecules (such as polyimide) on the surface of the substrate 110 to form a three-dimensional network structure, so that high viscosity is generated between the encapsulation structure 130 and the substrate 110, the sealing property between the encapsulation structure 130 and the substrate 110 is improved, water and oxygen intrusion is effectively blocked, the encapsulation performance of the display panel 100 is improved, and the service life and yield of the display panel 100 can be further improved.
The package structure 130 can be used for any size of display panel, and is particularly suitable for a display panel with a larger size, such as a middle or large size display panel, to improve the packaging performance of the display panel 100.
It is understood that the first embedding portion 131 may be formed in the package structure 130 having a single-layer structure, or may be disposed in the package structure 130 having a multi-layer structure, as long as the first embedding portion 131 is disposed on a side of the package structure 130 contacting the non-display region of the substrate 110.
Further, in the specific example shown in fig. 3, when the encapsulation structure 130 includes at least two inorganic encapsulation layers 132 stacked on the light emitting element 120 and an organic encapsulation layer 134 disposed between the two adjacent inorganic encapsulation layers 132, the inorganic encapsulation layer 132 directly disposed on the light emitting element 120 and in contact with the non-display region of the substrate 110 is used as the first inorganic encapsulation layer, and the first embedding portion 131 is disposed in the first inorganic encapsulation layer. Specifically, the non-display regions of two adjacent inorganic encapsulation layers 132 are attached to cover the organic encapsulation layer 134.
Common inorganic encapsulating layer 132 materials include silicon nitride, silicon oxide, aluminum nitride, and other inorganic materials with certain barrier properties, and it is understood that the inorganic encapsulating layer 132 may be a single layer or a stacked layer formed by one or more of the above materials.
It is understood that the first embedding portion 131 may not penetrate through a side of the first inorganic encapsulation layer away from the substrate 110. Thus, the first embedded portion 131 is wrapped in the first inorganic encapsulation layer, and the first inorganic encapsulation layer can prevent water and oxygen from invading into the first embedded portion 131, so as to improve the stability of the package structure 130.
In other examples, the first embedding portion 131 may also penetrate through a side of the first inorganic encapsulation layer away from the substrate 110, because another inorganic encapsulation layer 132 (i.e., a second inorganic encapsulation layer) is further formed on the first inorganic encapsulation layer, so that the two inorganic encapsulation layers 132 are tightly combined in the non-display region of the substrate 110 to cover the first embedding portion 131, thereby preventing water and oxygen from invading into the first embedding portion 131 to reduce the stability of the encapsulation structure 130.
It is understood that the first insertion portion 131 may be one or a plurality (including two); the cross-section of the first embedding portion 131 may be triangular, circular, square, polygonal, or annular in the orthographic projection of the substrate 110, and is not limited herein. Specifically, when the first insertion portion 131 has a ring shape, it may be disposed around the light emitting element 120; when the first embedding portions 131 are triangular, circular, square or polygonal, the package structure 130 may be provided with a plurality of first embedding portions 131 arranged around the light emitting element 120, and in this case, the distance between two adjacent first embedding portions 131 is preferably 3 μm to 5 μm. When the first insertion part 131 has a ring shape, the width of the first insertion part 131 (the difference between the outer radius and the inner radius) is 3 to 5 μm, so that the first insertion part 131 can have good mechanical strength and adhesive force.
Further, referring to fig. 4, in the present specific example, on the orthographic projection of the substrate 110, the organic encapsulation layer 134 covers the first embedding portion 131. Thus, the organic encapsulation layer 134 covers the position of the inorganic encapsulation layer 132 where the first embedding portion 131 is formed, and the planarization and toughness of the organic encapsulation layer 134 can avoid the problem that the inorganic encapsulation layer 132 is uneven due to the arrangement position of the first embedding portion 131, thereby facilitating the subsequent formation of the smooth inorganic encapsulation layer 132 and ensuring the encapsulation performance of the encapsulation structure 130.
Referring to fig. 1 to 4, it can be understood that at least a partial region of the non-display region of the substrate 110 is in direct contact with the package structure 130, so that the light emitting device 120 is effectively packaged. The first embedding portion 131 may be disposed on a side of the package structure 130 directly contacting the substrate 110, so that the hydrophobic end of the associated polymer may be directly associated with the hydrophobic structure of organic molecules such as polyimide on the surface of the substrate 110 to form a three-dimensional network structure, thereby generating high viscosity between the package structure 130 and the substrate 110.
Referring to fig. 5, in another embodiment, the non-display region of the substrate 110 includes a first non-display partition 101 covered with an organic film (not shown) and a second non-display partition 102 located at the periphery of the first non-display partition 101.
The encapsulation structure 130 is in direct contact with the organic film layer and the substrate 110 within the second non-display partition 102.
At least two (group) first embedding parts are embedded in the packaging structure, wherein one (group) first embedding part 131 is embedded in one side of the packaging structure 130, which is in direct contact with the organic film layer, and the other (group) first embedding part 131 is embedded in one side of the packaging structure 130, which is in direct contact with the substrate 110 of the second non-display partition.
Specifically, when the light emitting element 120 is formed, the insulating layer, the passivation layer, and even the planarization layer in the TFT array 121 may extend to the non-display region of the substrate 110 in the display region of the substrate 110, so that an organic film layer formed by one or more of the insulating layer, the passivation layer, and the planarization layer is formed on the side of the non-display region of the substrate 110 close to the display region. At this time, when the light emitting element 120 is packaged by the package structure 130, the package structure 130 is simultaneously in direct contact with the organic film layer in the first non-display region and the substrate 110 of the second non-display region in the non-display region of the substrate 110. The insulating layer, the passivation layer and the planarization layer are generally made of organic materials, and therefore, the first embedding portion 131 can also be associated with hydrophobic molecules in an organic film formed by these materials to form a three-dimensional network structure, thereby enhancing the water and oxygen barrier performance of the package structure 130.
To sum up, the first embedding portion 131 may be embedded in one side of the package structure 130 directly contacting the organic film, may also be embedded in one side of the package structure 130 directly contacting the substrate 110 of the second non-display region, and may also be provided with the first embedding portions 131 at two locations (as shown in fig. 5), so as to jointly enhance the adhesion between the substrate 110 and the package structure 130 and improve the water and oxygen blocking performance of the package structure 130.
Referring to fig. 6, in another example, a second embedding portion 133 is also embedded in the organic encapsulation layer 134, and the second embedding portion 133 is also mainly formed by the associative polymer. In general, the material of the organic encapsulation layer 134 is organic polymer such as polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, polyacrylate, and organosiloxane; the organic encapsulation layer 134 may be a single layer or a stacked layer formed of at least one of these materials. Preferably, the material of the organic encapsulation layer 134 is polymethyl methacrylate, commonly known as acrylic, which has better light transmittance and haze.
Preferably, the viscosity of the associative polymer is 100CPS or more to further improve the adhesion between the associative polymer and the interface having the hydrophobic group. Further, associative polymers having a light transmittance of more than 85% are preferred.
The second embedding part 133 formed by the associative polymer is embedded in the traditional organic packaging layer 134, and the associative polymer can be combined with the material of the traditional organic packaging layer 134 through hydrogen bonds, so that the advantages of the two materials are fully utilized, the density of the organic packaging layer 134 can be improved, the water and oxygen blocking capability is improved, and the packaging performance of the packaging structure 130 is effectively improved.
It is understood that the second embedding portion 133 may be exposed to one surface or both surfaces of the organic encapsulation layer 134. Preferably, the second embedding portion 133 is located inside the organic encapsulation layer 134.
In addition, the second embedding portion 133 may be provided in plurality. Preferably, the plurality of second embedding parts 133 are distributed on the same plane of the organic encapsulation layer 134.
It is understood that all of the organic encapsulation layers 134 in the encapsulation structure 130 may be embedded with the second embedding portion 133, or a part of the organic encapsulation layers 134 may be embedded with the second embedding portion 133. Preferably, the second embedding portion 133 is embedded in the outermost organic encapsulation layer 134, so that the water and oxygen barrier performance of the outermost organic encapsulation layer 134 is enhanced, and further water and oxygen are prevented from entering the inside.
An embodiment of the present invention further provides a manufacturing method of the display panel 100. The first embedded portion 131 of the encapsulation structure 130 and the manufacturing process thereof will be described in further detail below with reference to the manufacturing method of the display panel 100.
The preparation method specifically comprises the following steps:
step S1: a substrate 110 is provided, the substrate 110 is divided into a display region and a non-display region, and a light emitting element 120 is formed on the display region on the substrate 110. This step will not be described in detail.
Step S2: a first encapsulation material is deposited on the light emitting element 120 and the non-display area of the substrate 110 to cover the light emitting element 120.
Step S3: a groove is formed in a position of the first encapsulant corresponding to the non-display region of the substrate 110 to expose the substrate 110.
Step S4: the groove is filled with a gel solution of an associated polymer and cured to form a first embedding portion 131, and then a second encapsulating material is deposited on the first encapsulating material to form the encapsulation structure 130.
It is understood that the first encapsulant and the second encapsulant may be the same material or different materials. It is understood that the first encapsulating material and the second encapsulating material may be deposited at one time or in multiple times, and that the first encapsulating material and the second encapsulating material may comprise one or more materials.
Specifically, if the package structure 130 including at least two inorganic encapsulating layers 132 and the organic encapsulating layer 134 disposed between two adjacent inorganic encapsulating layers 132 is formed, the first encapsulating material may be an inorganic encapsulating material, the second encapsulating material at least includes an inorganic encapsulating material and an organic encapsulating material, the first encapsulating material is deposited on the light emitting element 120 and the non-display region of the substrate 110, and then the cured first encapsulating material is provided with the groove. The groove is filled with a gel solution of an associated polymer and cured to form a first embedding part 131, an organic encapsulating material in a second encapsulating material is deposited on the first encapsulating material, and another layer of an inorganic encapsulating material which coats the organic encapsulating material is further deposited on the organic encapsulating material.
The associative polymer has certain rheological property, and the associative polymer is added in the form of gel solution, so that the operability is improved, and the associative polymer can be smoothly filled into the groove. In one embodiment, the gel solution of the associative polymer comprises a gel solute, a gelling agent and a solvent, wherein the gel solute is the associative polymer, the gelling agent is at least one of polysiloxane polymer, aryl alkoxy silane, phenolic resin and acrylic thickener, and the solvent is at least one of propylene glycol methyl ether acetate and ethyl lactate. It will be appreciated that, accordingly, at this time, the first insert portion and the second insert portion are also formed by curing mainly the gel solute, the gelling agent, and the solvent.
Preferably, the mass content of the associative polymer in the gel solution of the associative polymer is 5% to 10%. For cost and process capability considerations, a gel solution with an associative polymer mass content of 5% may be chosen and may also suffice.
Furthermore, in the gel solution of the associative polymer, the mass content of the associative polymer is 5-10%, the mass content of the gel is about 35-40%, and the mass content of the solvent is 55%.
Preferably, the gelling agent is a combination of a polysiloxane polymer, an arylalkoxysilane, a phenolic resin and an acrylic thickener, and the solvent is a combination of propylene glycol methyl ether acetate and ethyl lactate.
Specifically, in one example, the solvents are propylene glycol methyl ether acetate 50% and ethyl lactate 5% by mass in the gel solution of the associative polymer; the gel agent is 20-25% of polysiloxane polymer, 5% of aryl alkoxy silane, 5% of phenolic resin and 5% of acrylic thickener (ASE-60). The gel solution of the associative polymer may be purchased directly, such as from toray. Among them, the polysiloxane polymer may be a phenylmethylsiloxane polymer.
Further, the gel solution of the associative polymer is cured by heating at 80 to 150 ℃ for 15 to 30 min. Too high a curing temperature and too long a curing time will result in too large a stress after curing of the associative polymer, thereby reducing its viscoelasticity and stability, and further affecting the encapsulation performance.
It is worth noting that the shape of the groove determines the annular shape of the first embedding portion 131 formed. The ring shape of the groove may be arranged as a triangle, a circle or a ring, etc.
In addition, when the second embedding portion 133 is disposed in the organic encapsulation layer 134, the organic encapsulation layer 134 may be patterned by etching or the like to form a corresponding groove, and then the groove is filled with the gel solution of the associated polymer and cured. It can be understood that when the second embedding portion 133 is located inside the organic encapsulation layer 134, the groove formed in the organic encapsulation layer 134 cannot penetrate, i.e., the inorganic encapsulation layer 132 underneath cannot be exposed, and the organic encapsulation material needs to be deposited once after the curing process.
An embodiment of the present invention further provides a display device, including any one of the display panels 100 described above.
In some embodiments, the display device may be a tablet computer, a mobile phone, a television, a computer, or the like.
In some embodiments, the display device includes a display panel 100 and a control unit for transmitting a display signal to the display panel 100.
The display device adopts any one of the display panels 100, so that the packaging performance is improved, and the service life and the yield are further improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A display panel, comprising:
the display device comprises a substrate, a display area and a non-display area, wherein the substrate is provided with the display area and the non-display area which is positioned at the periphery of the display area;
a light emitting element provided in the display region; and
an encapsulation structure covering the light emitting element and configured to contact a non-display region of the substrate;
a first embedding part is embedded in one side of the packaging structure, which is in contact with the non-display area of the substrate; the first embedding portion includes an associative polymer and is in contact with the non-display region of the substrate.
2. The display panel of claim 1, wherein the encapsulation structure comprises an inorganic encapsulation layer, and the first embedded portion is disposed in the inorganic encapsulation layer.
3. The display panel according to claim 1, wherein the encapsulation structure comprises at least two inorganic encapsulation layers, and an organic encapsulation layer disposed between two adjacent inorganic encapsulation layers;
the inorganic packaging layer which is directly arranged on the light-emitting element and is in contact with the non-display area of the substrate is a first inorganic packaging layer, and the first embedding part is arranged in the first inorganic packaging layer.
4. The display panel of claim 3, wherein an orthographic projection of the organic encapsulation layer on the substrate covers an orthographic projection of the first embedded portion on the substrate.
5. The display panel according to claim 1, wherein the first embedding portion is provided around the light emitting element.
6. The display panel according to any one of claims 1 to 5, further comprising an organic film layer between the light-emitting element and the substrate; the non-display area of the substrate comprises a first non-display subarea and a second non-display subarea positioned on the periphery of the first non-display subarea, the organic film layer is covered on the first non-display subarea, and the packaging structure is respectively in direct contact with the substrate in the organic film layer and the second non-display subarea;
the packaging structure is embedded with at least two first embedding parts, wherein one first embedding part is embedded at one side of the packaging structure in direct contact with the organic film layer, and the other first embedding part is embedded at one side of the packaging structure in direct contact with the substrate of the second non-display partition.
7. The display panel of claim 3, wherein a second embedding portion is embedded within the organic encapsulation layer, the second embedding portion comprising the associative polymer.
8. The display panel according to claim 1 or 7, wherein the associative polymer is an associative polymer based on a polyurethane having a hydrophobic group and a hydrophilic chain or an acrylic polymer having a hydrophobic group and a hydrophilic chain.
9. The display panel according to claim 8, wherein the hydrophobic group is at least one of a polyoxypropylene group, a long-chain perfluoroalkyl group, a polysiloxane group, an octadecyl group, a dodecylphenyl group, and a nonylphenol group, wherein the number of long-chain carbon atoms in the long-chain perfluoroalkyl group is 12 or more; the hydrophilic chain is a polyether chain.
10. A preparation method of a display panel is characterized by comprising the following steps:
providing a substrate, wherein the substrate is divided into a display area and a non-display area positioned at the periphery of the display area;
forming a light emitting element in a display region of the substrate;
depositing a first encapsulation material on the light emitting element and the non-display area of the substrate to cover the light emitting element;
forming a groove in the position, corresponding to the non-display area of the substrate, of the first packaging material;
and filling gel solution of associated polymer in the groove, solidifying to form a first embedded part, and depositing a second packaging material on the first packaging material to form a packaging structure.
11. A display device comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811504701.3A CN109713157B (en) | 2018-12-10 | 2018-12-10 | Display panel, preparation method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811504701.3A CN109713157B (en) | 2018-12-10 | 2018-12-10 | Display panel, preparation method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109713157A CN109713157A (en) | 2019-05-03 |
| CN109713157B true CN109713157B (en) | 2020-07-24 |
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