CN109860420A - Encapsulate film layer and preparation method thereof, encapsulating structure, display device - Google Patents
Encapsulate film layer and preparation method thereof, encapsulating structure, display device Download PDFInfo
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Abstract
The present invention provides a kind of encapsulation film layer and preparation method thereof, encapsulating structure, and display device is related to field of display technology, the waterproof effect to electronic device is remarkably improved using the encapsulation film layer.The encapsulation film layer includes: base layer；The base layer includes: first surface, the second surface opposite with the first surface towards electronic device to be packaged；Super-hydrophobic layer on the second surface, the super-hydrophobic layer include: multiple spaced hydrophobic microprotrusions on the second surface.For encapsulating the preparation of film layer and to the encapsulation of electronic device.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of encapsulation film layer and preparation method thereof, encapsulating structure, displays
Device.
Background technique
Electronic device is very sensitive to steam and oxygen, and the steam and oxygen for penetrating into device inside can reduce device
Service life, therefore, encapsulation technology are extremely important to electronic device.
In the prior art, a kind of encapsulation technology is cover board encapsulation, i.e., in underlay substrate (such as glass for being formed with electronic device
Or metal) on add a cover board, and desiccant is attached on the inside of cover board, then will serve as a contrast by sealant (for example, epoxy resin)
Substrate is bonding with cover board, to form the confined space of a placement electronic device.However, since sealant generallys use
Organic material is made, and has porosity, and the steam and oxygen in air still can penetrate into device inside, to electronic device
Performance has an adverse effect.
Another encapsulation technology is thin-film package, i.e., by being packaged to it in electronic device surface covering film,
Weight and packaging cost of the thin film encapsulation technology compared to cover board encapsulation technology, after electron device package can be reduced.Due to list
The hydrone transmitance of one inorganic thin film or single organic film is difficult to reach encapsulation requirement, therefore, in the prior art
Thin-film package be usually as inorganic thin film and organic film stacking made of multi-layer compound film.However, multi-layer compound film
Waterproof action can only be enhanced, but be still difficult to reach preferably waterproof effect.
Summary of the invention
In consideration of it, to solve problem of the prior art, the embodiment of the present invention provides a kind of encapsulation film layer and its preparation side
Method, encapsulating structure, display device are remarkably improved the waterproof effect to electronic device using the encapsulation film layer.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
First aspect of the embodiment of the present invention provides a kind of encapsulation film layer, comprising: base layer；The base layer includes: direction
The first surface of electronic device to be packaged, the second surface opposite with the first surface；On the second surface
Super-hydrophobic layer, the super-hydrophobic layer include: multiple spaced hydrophobic microprotrusions on the second surface.
In some embodiment of the invention, the hydrophobic microprotrusion includes: microprotrusion structure, is adsorbed on the microprotrusion knot
The low-surface-energy molecule on structure surface.
In some embodiment of the invention, in the face of the second surface, the microprotrusion structure is along line direction and column
The size in direction is 25nm~500nm, and the spacing of the two neighboring microprotrusion structure is 25nm~500nm；Perpendicular to
On the direction of the second surface, the height of the microprotrusion structure is 50nm~500nm；The surface of the low-surface-energy molecule
30mJ/m can be less than2。
In some embodiment of the invention, the microprotrusion structure is made of polymer, and perpendicular to first table
On the direction in face, after being compressed, the stimulation volume by external condition can expand the microprotrusion structure.
It in some embodiment of the invention, include amido and/or carboxylic acid group in the structural formula of the polymer；It is described
External condition is hydrone.
In some embodiment of the invention, the low-surface-energy molecule is also dispersed in the microprotrusion structure and/or described
In base layer.
In some embodiment of the invention, the low-surface-energy molecule is covered by the polymer capsule with porous structure
In, the polymer capsule is dispersed in the microprotrusion structure and/or the base layer.
In some embodiment of the invention, the base layer is made of polymer；The encapsulation film layer further include: be located at institute
State the first organic film of first surface side, and/or positioned at the super-hydrophobic layer far from the inorganic of the second surface side
Film layer.
In some embodiment of the invention, the case where including the inorganic film for the encapsulation film layer, the envelope
Fill film layer further include: the second organic film between the super-hydrophobic layer and the inorganic film.
Second aspect of the embodiment of the present invention provides a kind of preparation method for encapsulating film layer, comprising: provides base layer, the base
Body layer includes: first surface, the second surface opposite with the first surface towards electronic device to be packaged；Described
Super-hydrophobic layer is formed on two surfaces, the super-hydrophobic layer includes: multiple spaced hydrophobic on the second surface
Microprotrusion.
In some embodiment of the invention, described that super-hydrophobic layer, the super-hydrophobic layer packet are formed on the second surface
It includes: multiple spaced hydrophobic microprotrusions on the second surface, comprising: use layer-by-layer, laser
Any one of lithographic technique, electrochemical vapour deposition (EVD) technology, spraying technology form multiple intervals on the second surface and set
The microprotrusion structure set；Low-surface-energy molecule is adsorbed in the microprotrusion body structure surface.
The third aspect of the embodiment of the present invention provides a kind of encapsulating structure, comprising: underlay substrate is located on the underlay substrate
Electronic device；Further include: cover the encapsulation film layer described in any of the above embodiments of the electronic device；Wherein, the encapsulating film
The first surface in layer is towards the electronic device.
In some embodiment of the invention, the electronic device is OLED device.
Fourth aspect of the embodiment of the present invention provides a kind of display device, including encapsulating structure described in any of the above embodiments.
Based on this, the above-mentioned encapsulation film layer provided through the embodiment of the present invention, by base layer far from electricity to be packaged
Super-hydrophobic layer is arranged in the side of sub- device, using the ultra-hydrophobicity for the similar lotus leaf surface that the super-hydrophobic layer is shown, so that
Steam is difficult to soak second surface of the base layer far from electronic device to be packaged, and then effectively stops the intrusion of steam, thus
So that the encapsulation film layer has excellent waterproof effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is that a kind of encapsulation film layer provided in an embodiment of the present invention is illustrated along the cross-section structure perpendicular to its bedding angle
Figure；
Fig. 2 is the microprotrusion knot being located on the second surface of base layer in a kind of encapsulation film layer provided in an embodiment of the present invention
The schematic perspective view of structure；
Fig. 3 is a kind of selfreparing schematic illustration for encapsulating film layer provided in an embodiment of the present invention；
Fig. 4 is the selfreparing schematic illustration of another encapsulation film layer provided in an embodiment of the present invention；
Fig. 5 is that another encapsulation film layer provided in an embodiment of the present invention is illustrated along the cross-section structure perpendicular to its bedding angle
Figure；
Fig. 6 is that another encapsulation film layer provided in an embodiment of the present invention is illustrated along the cross-section structure perpendicular to its bedding angle
Figure；
Fig. 7 is that another encapsulation film layer provided in an embodiment of the present invention is illustrated along the cross-section structure perpendicular to its bedding angle
Figure；
Fig. 8 is that another encapsulation film layer provided in an embodiment of the present invention is illustrated along the cross-section structure perpendicular to its bedding angle
Figure；
Fig. 9 is that another encapsulation film layer provided in an embodiment of the present invention is illustrated along the cross-section structure perpendicular to its bedding angle
Figure；
Figure 10 is a kind of preparation method flow diagram for encapsulating film layer provided in an embodiment of the present invention；
Figure 11 is that a kind of encapsulating structure provided in an embodiment of the present invention is illustrated along the cross-section structure perpendicular to its bedding angle
Figure；
Figure 12 is that another encapsulating structure provided in an embodiment of the present invention shows along the cross-section structure perpendicular to its bedding angle
It is intended to；
Figure 13 is that another encapsulating structure provided in an embodiment of the present invention shows along the cross-section structure perpendicular to its bedding angle
It is intended to；
Figure 14 is that another display device provided in an embodiment of the present invention is shown along the cross-section structure perpendicular to its board direction
It is intended to.
Appended drawing reference:
01- encapsulates film layer；
10- base layer；10a- first surface；10b- second surface；
11- super-hydrophobic layer；The hydrophobic microprotrusion of 110-；110a- microprotrusion structure；
110b- low-surface-energy molecule；110b '-polymer capsule；
The first organic film of 12-；13- inorganic film；The second organic film of 14-；
02- encapsulating structure；20- underlay substrate；21- electronic device；
03- display device.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Hereinafter, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the embodiment of the present application, unless otherwise indicated, " multiples' " contains
Justice is two or more.
It should be pointed out that unless otherwise defined, all terms used in the embodiment of the present invention (including technology and section
Technics) have and identical meanings commonly understood by one of ordinary skill in the art to which the present invention belongs.It is also understood that such as existing
Term those of is defined in usual dictionary should be interpreted as having and their meaning phases one in the context of the relevant technologies
The meaning of cause is explained, unless being clearly defined herein without application idealization or the meaning of extremely formalization.
For example, term " includes " used in description of the invention and claims or "comprising" etc. are similar
Word means that the element or object that occur before the word are covered the element for appearing in the word presented hereinafter or object and its waited
Together, other elements or object are not excluded for." upper/top ", " under/lower section ", " row/line direction " and " column/column direction " etc.
The term of the orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience and purposes of illustration of this hair
Bright technical solution simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with
Specific orientation construction and operation, therefore be not considered as limiting the invention.
For example, in some cases, the embodiment for being related to " line direction " can be implemented etc. in the case where " column direction ",
Mutually vice versa.This patent right scope is also fallen within after scheme described in this patent is carried out 90 ° of rotations or mirror image.
First aspect of the embodiment of the present invention provides a kind of encapsulation film layer, as shown in Figure 1, the encapsulation film layer 01 includes: matrix
Layer 10；The base layer 10 include: towards electronic device to be packaged first surface 10a, opposite with first surface 10a
Two surface 10b；Super-hydrophobic layer (Superhydrophobic surface) 11 on second surface 10b, the super-hydrophobic layer
11 include: multiple spaced hydrophobic microprotrusions 110 on second surface 10b.
Please continue to refer to Fig. 1, it is to be understood that hydrophobic microprotrusion 110 along the size of line direction, the size of column direction,
The parameters such as the spacing between the height and contiguous hydrophobic microprotrusion 110 of protrusion are in micron (μm) order of magnitude hereinafter, be micro-nano
The order of magnitude of rice structure so that one by one hydrophobic microprotrusion 110 formd on second surface 10b one it is hydrophobic coarse
Surface shows the ultra-hydrophobicity of similar lotus leaf surface, that is, constitutes super-hydrophobic layer 11；When steam penetrates into super-hydrophobic layer 11
When surface, due to the surface tension effects of hydrone itself, shape meeting of the vapour molecule on these small coarse structure surfaces
Close to spherical shape, contact angle is up to 150 ° or more, so that steam is difficult to soak second surface 10b, to stop steam
Intrusion.
It should be pointed out that the concrete shape and quantity, distribution of the hydrophobic microprotrusion 110 illustrated in above-mentioned Fig. 1 are only
Signal, can be adjusted flexibly the concrete shape of hydrophobic microprotrusion 110 according to the size of second surface 10b, preparation method difference
And quantity, distribution.
In embodiments of the present invention, any one in multiple hydrophobic microprotrusions 110 can be direct using hydrophobic material
It is made, is also possible to be formed on conventional bulge-structure surface by modifying the substance of low-surface-energy, certainly, it is contemplated that preparation work
The simplicity of skill can choose any one in above-mentioned preparation method to form all hydrophobic microprotrusions 110.
Here, due to the substrate that base layer 10 is as hydrophobic microprotrusion 110 one by one, and hydrophobic microprotrusion one by one
110 super-hydrophobic layers 11 constituted have the ultra-hydrophobicity of similar lotus leaf surface, can effectively stop the intrusion of steam, because
This, the embodiment of the present invention is not construed as limiting the hydrophily or hydrophobicity of the base layer 10 as substrate, as long as making base layer 10
Super-hydrophobic layer 11 is formed on second surface 10b far from electronic device to be packaged.
Based on this, the above-mentioned encapsulation film layer 01 provided through the embodiment of the present invention, by base layer 10 far to be packaged
Electronic device side be arranged super-hydrophobic layer 11, utilize the super-hydrophobicity for the similar lotus leaf surface that the super-hydrophobic layer 11 is shown
Can, so that steam is difficult to soak second surface 10b, and then effectively stop the intrusion of steam, so that the encapsulation film layer 01 has
There is excellent waterproof effect, can almost completely cut off the intrusion of extraneous steam completely.
It is exemplary, it is provided in an embodiment of the present invention above-mentioned hydrophobic micro- please continue to refer to amplifier section shown in arrow in Fig. 1
Protrusion 110 specifically includes: the microprotrusion structure 110a and low-surface-energy molecule 110b for being adsorbed on the surface microprotrusion structure 110a.
Here, low-surface-energy molecule 110b refers to that the surface of the substance can be less than 30mJ/m2, low-surface-energy molecule 110b
Include: HDI (i.e. hexamethylene diisocyanate, hexamethylene diisocyanate), octadecylamine (i.e.
Octadecylamine), PDMS (i.e. Polydimethylsiloxane, dimethyl silicone polymer), FAS be (i.e.
Fluoroalkylsioxane, silicon fluoride) one of or it is a variety of.
Wherein, microprotrusion structure 110a can be structure as a whole with base layer 10, and it is possible to using with preparation microprotrusion
The material of structure 110a, which reacts, the modes such as combines and/or sprays, and forms a large amount of low of absorption on the microprotrusion surface structure 110a
The quantity and chain of the low-surface-energy molecule 110b illustrated in surface energy molecule 110b, Fig. 1 is only to illustrate, the embodiment of the present invention
This is not construed as limiting.
Arrangement mode of the above-mentioned hydrophobic microprotrusion 110 on the second surface 10b of base layer 10 is as shown in Fig. 2, need to refer to
Out, the microprotrusion structure 110a in hydrophobic microprotrusion 110 as main body is only illustrated for the sake of for convenience of description, in Fig. 2, not
Illustrate the low-surface-energy molecule 110b for being adsorbed on the surface microprotrusion structure 110a.
Please continue to refer to Fig. 2, in the face of second surface 10b, microprotrusion structure 110a is along line direction X-X ' and column direction
The size of Y-Y ' is 25nm~500nm, and the space D of two neighboring microprotrusion structure is 25nm~500nm；Perpendicular to second
On the direction on surface (hereinafter referred to as vertical direction Z-Z '), the height of microprotrusion structure 110a is 50nm~500nm, thus shape
At microprotrusion array.
It should be pointed out that the microprotrusion structure 110a as main body, can be after having prepared base layer 10, second
What is formed on the 10b of surface is raised one by one；Second surface 10b is handled alternatively, can also be, to form it into bumps not
Flat structure, to form raised one by one, the shape of the microprotrusion structure 110a illustrated in Fig. 2 only signal, specifically not
It limits.
Further, when above-mentioned encapsulation film layer 01 is because of extraneous factor, for example, when the encapsulation film layer 01 is used as flexible package knot
Structure is applied to flexible display apparatus, is frequently bent；Alternatively, when the encapsulation film layer 01 is placed under the high temperature conditions, thus
Hydrophobic microprotrusion 110 is damaged or damaged, thus when losing ultra-hydrophobicity, in order to enable above-mentioned super-hydrophobic layer 11 into one
Step can have the ability of self-regeneration (i.e. Self-healing, hereinafter referred to as selfreparing), even if being destroyed by extraneous factor
Also selfreparing can be carried out within a short period of time, re-form super-hydrophobic layer, so as to it is long-term, be effectively reduced steam intrusion quilt
The probability of the electronic device of encapsulation is advantageously implemented the Curved screen and narrow side of the display device using the encapsulation of above-mentioned encapsulation film layer 01
Frame design, above-mentioned encapsulation film layer 01 provided in an embodiment of the present invention is further selfreparing film layer, according to the difference of damage type,
Two ways is provided below reviews one's lessons by oneself complex structure.
Mode one
In above-mentioned super-hydrophobic layer 11, the microprotrusion structure 110a as hydrophobic 110 main body of microprotrusion is made of polymer,
And on the direction (the vertical direction Z-Z ' in referring to fig. 2) perpendicular to first surface, microprotrusion structure 110a after being compressed,
Stimulation volume by external condition can expand.
In this way, being driven plain it, so as to cause base when damage type is the projective structure for destroying hydrophobic microprotrusion 110
When can not form scabrid hydrophobic structure above the second surface 10b of body layer 10,110a is by external condition for microprotrusion structure
Stimulation volume can expand, to restore its pattern.
Here, the polymer that microprotrusion structure 110a is made for example can be shape-memory polymer (i.e. Shape
Memory Polymers, referred to as SMP), after being compressed, stimulated by external condition (such as heat, electricity, light, chemical co-ordination)
It can restore (or restoring to close) its original shape again.
Further, it is contemplated that when super-hydrophobic layer 11 is destroyed, steam can directly penetrate into damage field, therefore, this
Inventive embodiments restore the external condition of pattern using the steam of infiltration as microprotrusion structure 110a, include in selection structural formula
Have the polymer of amido and/or carboxylic acid group microprotrusion structure 110a is made, in this way, using amido and/or carboxylic acid group with
The protonation reaction occurred between hydrone enables to the damage field being driven plain slowly to expand, so that damage field
Restore pattern.
In this, the selfreparing of super-hydrophobic layer 11 can be completed using the induction of steam.
Mode two
In above-mentioned encapsulation film layer 01, low-surface-energy molecule 110b is also dispersed in microprotrusion structure 110a and/or base layer
In 10.
In this way, when damage type is the low-surface-energy molecule 110b for destroying hydrophobic 110 adsorption of microprotrusion, to lead
When causing that scabrid hydrophobic structure can not be formed above the second surface 10b of base layer 10, second surface 10b is damaged on surface
Hydrophobic microprotrusion 110 can become hydrophilic, the energy difference between at this moment hydrophobic air and hydrophilic material is very big, meanwhile, parent
Energy between the material of water and the hydrophobic low-surface-energy molecule 110b being dispersed in microprotrusion structure 110a and/or base layer 10
Amount difference is also very big, so that the low-surface-energy molecule 110b being dispersed in microprotrusion structure 110a and/or base layer 10 can
By the active force of free energy, it is easier to which the Air Interface of Xiang Shushui migrates, and then moves to the microprotrusion structure of damage field
The surface 110a, so that damage field restores super-hydrophobicity.
In this, the selfreparing of super-hydrophobic layer 11 can be completed using the induction of humidity.
Here, embedding techniques can be used, are covered by with porous please continue to refer to Fig. 1, low-surface-energy molecule 110b
To be dispersed in microprotrusion structure 110a and/or base layer 10 in the polymer capsule 110b ' of structure, and then can be in humidity
Induction under, the polymer capsule that is ruptured by the porous structure on the capsule wall of polymer capsule 110b ' and/or after being damaged
It is migrated in 110b ' to the surface microprotrusion structure 110a of damage field, so that damage field restores super-hydrophobicity.
It should be noted that due in actual use, the reason of super-hydrophobic layer 11 is destroyed may be microprotrusion
The pattern of structure 110a is destroyed and/or the low-surface-energy molecule 110b of adsorption is destroyed, therefore, as hydrophobic microprotrusion
The microprotrusion structure 110a of 110 main bodys is made of polymer, and on the direction perpendicular to first surface, microprotrusion structure 110a
After being compressed, the stimulation volume by external condition can be expanded；Meanwhile low-surface-energy molecule 110b is also dispersed in dimpling
It rises in structure 110a and/or base layer 10, so that above-mentioned encapsulation film layer 01 can cope with possible one or two kinds of combinations
The damage of situation improves the degree of intelligence of its selfreparing.
Below for above two reparation mode, a specific embodiment is provided respectively, for its reparation to be described in detail
Process.
Embodiment 1: the selfreparing after being damaged for microprotrusion structure
As shown in figure 3, using PEI (i.e. Polyetherimide, polyetherimide) and PVDMA (i.e. poly-2-vinyl-
It is 4,4-dimethylazlactone, poly- (2- vinyl -4,4- dimethyl azlactone)) carry out LBL self-assembly, by PEI and
Both polymer of PVDMA crosslink reaction, and the base layer 10 and its surface irregularity for forming integral structure are one by one
Microprotrusion structure 110a is reacted with low-surface-energy molecule 110b (for example, decyl amine molecule) by PVDMA, it is made to be adsorbed on dimpling
The surface structure 110a is played, to form super-hydrophobic layer 11.
When not being damaged, vapour molecule the surface microprotrusion structure 110a shape can close to spherical shape so that
Steam is difficult to soak second surface 10b, to stop the intrusion of steam；At this point, the status indication of super-hydrophobic layer 11 is S1.
After compression of the microprotrusion structure 110a by vertical direction Z-Z ', the pattern that dimpling goes out is destroyed, and causes to surpass
Hydrophobic layer 11 loses ultra-hydrophobicity, and vapour molecule is able to enter the gap location between microprotrusion structure 110a, and soaks and arrive
The second surface 10b of base layer 10, to be difficult to stop the intrusion of steam.At this point, the state for the super-hydrophobic layer 11 destroyed
Labeled as S2.
After steam penetrates into damage field, Partial protons occur for amido and vapour molecule in the PEI of damage location, make
The microprotrusion structure 110a of damage location vertically Z-Z ' slowly expands so that the super-hydrophobic layer being driven plain
11 are slowly restored to original micro-nano compound pattern, that is, are restored to state S1, to realize that selfreparing restores superhydrophobic characteristic.
Embodiment 2: the selfreparing after being damaged for low-surface-energy molecule
As shown in figure 4, low-surface-energy molecule 110b (for example, HDI molecule) is adsorbed on the surface microprotrusion structure 110a,
To form super-hydrophobic layer 11；And HDI molecule is coated in polymer capsule 110b ', be distributed to microprotrusion structure 110a and
In base layer 10.
Wherein, polymer capsule 110b ' for example can be uramit microcapsules (poly (urea-formaldehyde)
Microcapsule, referred to as PUF MCs).
When not being damaged, vapour molecule the surface microprotrusion structure 110a shape can close to spherical shape so that
Steam is difficult to soak second surface 10b, to stop the intrusion of steam；At this point, the status indication of super-hydrophobic layer 11 is S1.
After the HDI molecule of microprotrusion structure 110a adsorption is destroyed, super-hydrophobic layer 11 is caused to lose super-hydrophobicity
Can, vapour molecule is able to enter the gap location between microprotrusion structure 110a, and soaks the second surface for arriving base layer 10
10b, to be difficult to stop the intrusion of steam.At this point, the status indication for the super-hydrophobic layer 11 destroyed is S2 '.
After steam penetrates into damage field, the HDI molecule coated in polymer capsule 110b ' can be in the induction of humidity
Under, the polymer capsule 110b ' that is ruptured by the porous structure on the capsule wall of polymer capsule 110b ' and/or after being damaged
It is middle to migrate to the surface microprotrusion structure 110a of damage field, so that damage field restores super-hydrophobicity.It is restored to shape
State S1, to realize that selfreparing restores superhydrophobic characteristic.
On the basis of the above, above-mentioned encapsulation film layer 01 further includes such as flowering structure:
As shown in figure 5, above-mentioned encapsulation film layer 01 further include: first positioned at the side first surface 10a of base layer 10 has
Machine film layer 12.
First organic film 12 can use PET (i.e. polyethylene terephthalate, poly terephthalic acid second
Diester), PEN (i.e. polyethylene naphthalate two formic acid glycol ester, poly- naphthalenedicarboxylic acid
Glycol ester), PI (i.e. polyimide, polyimides), PVC (polyvinyl chloride, polyvinyl chloride) and PTFE
The one or more of (i.e. polytetrafluoroethylene, polytetrafluoroethylene (PTFE)) are made.
Here, since usually (as polymeric matrix) is made by polymer in base layer 10, the first organic film 12
The adhesiveness between the base layer 10 of top can be improved；Simultaneously as the first organic film 12 has good ductility
And flatness, can preferably cover electronic device to be packaged, and for the base layer 10 of top provide one it is relatively flat
Substrate, in favor of the preparation of the hydrophobic microprotrusion 110 on base layer 10.
As shown in fig. 6, above-mentioned encapsulation film layer 01 further include: the nothing positioned at super-hydrophobic layer 11 far from the side second surface 10b
Machine film layer 13.
Inorganic film 13 using one of silicon nitride, silica, silicon oxynitride, aluminium oxide or a variety of can be made.
Inorganic film 13 to lower section due to that can constitute dredging for super-hydrophobic layer 11 with good compactness and mechanical strength
Water microprotrusion 110 plays preferable protective effect.
As shown in fig. 7, above-mentioned encapsulation film layer 01 further include: first positioned at the side first surface 10a of base layer 10 has
Machine film layer 12, and the inorganic film 13 positioned at super-hydrophobic layer 11 far from the side second surface 10b, the first organic film 12 and nothing
The concrete composition of machine film layer 13 refers to above description, and details are not described herein again.
It should be noted that in above-mentioned Fig. 5 into Fig. 7, only showing super-hydrophobic layer for the sake of for convenience of description with simple layer body surface
11, multiple spaced hydrophobic microprotrusions 110 on second surface 10b are not drawn actually, hydrophobic microprotrusion 110
Specific structure please refers to preceding description, and details are not described herein again.
In addition, in embodiments of the present invention, when a component is referred to as " being located at ... side ", it can refer to the component
It is set up directly in other assemblies, is also possible to there are other assemblies to be present among the two.
That is, above-mentioned first organic film 12 can be with reference to Fig. 5 or shown in Fig. 7, it is set up directly on the of base layer 10
The one surface side 10a, alternatively, being required according to specific encapsulation, between the first organic film 12 and the first surface 10a of base layer 10
It is also provided with other film layers；Likewise, above-mentioned inorganic film 13 can be with reference to Fig. 6 or shown in Fig. 7, it is set up directly on super
Hydrophobic layer 11 is far from the side second surface 10b, alternatively, being required according to specific encapsulation, between inorganic film 13 and super-hydrophobic layer 11
It is also provided with other film layers.
On the basis of the above, when above-mentioned encapsulation film layer 01 includes inorganic film 13, due to super-hydrophobic layer 11 be by
To after damage, the low-surface-energy point of microprotrusion structure 110a and/or adsorption is realized under steam and/or humidity inducing action
The selfreparing of sub- 110b, to avoid the occurrence of inorganic film 13 and lower section that top occurs in self-repair procedure because of steam effect
11 phase of super-hydrophobic layer removing the phenomenon that, above-mentioned encapsulation film layer 01 further comprises such as flowering structure:
As shown in Fig. 8 or Fig. 9, above-mentioned encapsulation film layer 01 further include: between super-hydrophobic layer 11 and inorganic film 13
Second organic film 14.Second organic film 14 is used as transition zone, can be improved between super-hydrophobic layer 11 and inorganic film 13
Adhesiveness, the whole adhesion strength of enhancing encapsulation film layer 01 can also reduce internal stress when encapsulation film layer 01 is bent, more suitable
Encapsulation for the electronic device in flexible apparatus.
Second organic film 14 can use PET (i.e. polyethylene terephthalate, poly terephthalic acid second
Diester), PEN (i.e. polyethylene naphthalate two formic acid glycol ester, poly- naphthalenedicarboxylic acid
Glycol ester), PI (i.e. polyimide, polyimides), PVC (polyvinyl chloride, polyvinyl chloride) and PTFE
The one or more of (i.e. polytetrafluoroethylene, polytetrafluoroethylene (PTFE)) are made.
Certainly, one layer of organic film can also be further added by between the first organic film 12 and base layer 10, to further enhance
The whole adhesion strength of film layer 01 is encapsulated, details are not described herein again.
Second aspect of the embodiment of the present invention provides a kind of preparation method of above-mentioned encapsulation film layer 01, as shown in Figure 10, including
Following steps S11-S12:
S11: provide base layer 10, the base layer 10 include: towards electronic device to be packaged first surface 10a, with
First surface 10a opposite second surface 10b；
S12: super-hydrophobic layer 11 is formed on second surface 10b, which includes: on second surface 10b
Multiple spaced hydrophobic microprotrusions 110.
Exemplary, above-mentioned S12 includes: using layer-by-layer, laser etching techniques, electrochemical vapour deposition (EVD) skill
Any one of art, spraying technology form multiple spaced microprotrusion structure 110a on second surface 10b；In dimpling
Play structure 110a adsorption low-surface-energy molecule 110b.
Here, microprotrusion structure 110a can individually be formed in the structure on second surface 10b, be also possible to second
Surface 10b is handled, so that is formed is raised one by one, the embodiment of the present invention is not construed as limiting this.
Film layer is encapsulated provided by beneficial effect achieved by above-mentioned preparation method and first aspect of the embodiment of the present invention
Beneficial effect achieved by 01 is identical, and details are not described herein again.
Further, in embodiments of the present invention, the encapsulation film layer 01 that preparation is completed can be covered on electricity to be packaged
On sub- device, to complete the encapsulation to electronic device.
Alternatively, the preparation of electronic device and the process of packaging technology can also be integrated in the preparation process for encapsulating film layer 01
In, it include that above-mentioned the first organic film 12, base layer 10, super-hydrophobic layer 11 and inorganic film 13 are to encapsulate film layer 01
Example, specifically comprises the following steps S21-S24:
S21: electronic device is formed on underlay substrate；
S22: on the above-mentioned underlay substrate for being formed with electronic device, the first organic film of overlay electronic device is formed
12；
S23: formed on the first organic film 12 base layer 10 and on base layer 10 with self-repair function
Super-hydrophobic layer 11；
S24: forming inorganic film 13 in super-hydrophobic layer 11, to complete the encapsulation to electronic device.
The third aspect of the embodiment of the present invention provides a kind of encapsulating structure, should as shown in any one width of the Figure 11 into Figure 13
Encapsulating structure 02 includes: underlay substrate 20 (can be rigid substrate or flexible substrate), the electronics device on underlay substrate 20
Part 21；Cover encapsulation film layer 01 described in any of the above-described embodiment of the electronic device 21；Wherein, the matrix in film layer 01 is encapsulated
The first surface 10a of layer 10 is towards above-mentioned electronic device 21, so as to pass through the opposite another side that base layer 10 is arranged in,
That is the super-hydrophobic layer 11 on second surface 10b stops the intrusion of extraneous steam.
Encapsulating film provided by beneficial effect achieved by above-mentioned encapsulating structure 02 and first aspect of the embodiment of the present invention
Beneficial effect achieved by layer 01 is identical, and details are not described herein again.
Wherein, in the encapsulating structure 02 that Figure 11 is illustrated, encapsulation film layer 01 is specifically included: successively far from underlay substrate 20
Base layer 10 and super-hydrophobic layer 11.
In the encapsulating structure 02 that Figure 12 is illustrated, encapsulation film layer 01 is specifically included: first successively far from underlay substrate 20
Organic film 12, base layer 10, super-hydrophobic layer 11 and inorganic film 13.
In the encapsulating structure 02 that Figure 13 is illustrated, encapsulation film layer 01 is specifically included: first successively far from underlay substrate 20
Organic film 12, base layer 10, super-hydrophobic layer 11, the second organic film 14 and inorganic film 13.
It should be noted that in above-mentioned Figure 11 into Figure 13, only being shown for the sake of for convenience of description with simple layer body surface super-hydrophobic
Layer 11, does not draw multiple spaced hydrophobic microprotrusions 110 on second surface 10b, hydrophobic microprotrusion 110 actually
Specific structure please refer to preceding description, details are not described herein again.
For being provided with inorganic film 13 above super-hydrophobic layer 11 in encapsulation film layer 01, and lower section is not provided with first and has
Inorganic film 13 is not provided with above the case where machine film layer 12 and super-hydrophobic layer 11, and the first organic film is arranged in lower section
12 the case where, details are not described herein again, please refers to detailed description of the diving to various composed structures in encapsulation film layer 01.
On the basis of the above, above-mentioned packed electronic device 21 is OLED (i.e. Organic Light-Emitting
Diode, organic electroluminescent LED) device.
Here, when OLED device is top emission type, i.e., its light issued is projected from encapsulation 01 side of film layer, film layer is encapsulated
Each layer in 01 can be made of the higher material of transparent or transmitance；When OLED device be bottom emitting type, i.e., its issue light
When projecting from 20 side of underlay substrate, underlay substrate 20 is made of the higher material of transparent or transmitance, to encapsulation film layer
01 transmitance is not construed as limiting.
It first elaborates below to the specific structure of OLED device.
OLED display has that self-luminous, driving voltage is low, luminous efficiency is high, the response time is short, clarity and comparison
Degree is high, many advantages, such as Flexible Displays and large area total colouring can be achieved, and is known as being most to have showing for development potentiality by industry
Showing device.
Selfluminous element therein, i.e. OLED device, generally include: the anode that is successively stacked on underlay substrate,
Hole injection layer, hole transmission layer, luminescent layer, electron transfer layer, electron injecting layer and cathode.It is usually also set on underlay substrate
It is equipped with thin film transistor (TFT) array (i.e. Thin Film Transistor Array, referred to as TFT Array), driving therein
TFT is for driving OLED device to shine.
The principle of luminosity of OLED device are as follows: semiconductor material and luminous organic material pass through carrier under electric field driven
Injection and composite guide photoluminescence.Specifically, OLED device generallys use indium-tin oxide electrode and metal electrode respectively as device
Anode and cathode, certain voltage driving under, electrons and holes are injected into electron transfer layer and sky from cathode and anode respectively
Cave transport layer, electrons and holes pass through electron transfer layer respectively and hole transmission layer moves to luminescent layer, and meet in luminescent layer,
It forms exciton and excites light emitting molecule, the latter issues visible light by radiative relaxation.
OLED device is extremely sensitive to steam and oxygen, is corroded by steam and oxygen, can generate stain, influence normally to send out
Therefore light, display using above-mentioned encapsulation film layer 01 provided in an embodiment of the present invention, can effectively stop the intrusion of steam, thus
So that the encapsulation film layer 01 has excellent waterproof effect, it can almost completely cut off the intrusion of extraneous steam completely, significantly improve
The service life of OLED device.
Fourth aspect of the embodiment of the present invention provides a kind of display device, as shown in figure 14, the display device 03, including it is above-mentioned
Encapsulating structure 02 described in any embodiment.
Encapsulating film provided by beneficial effect achieved by above-mentioned display device 03 and first aspect of the embodiment of the present invention
Beneficial effect achieved by layer 01 is identical, and details are not described herein again.
When above-mentioned packed electronic device 21 is OLED device, which is specially OLED display,
Encapsulating structure 02 therein can almost completely cut off the intrusion of extraneous steam completely, significantly improve the service life of OLED device, have
Conducive to the Curved screen and narrow frame design for realizing OLED display.
Above-mentioned display device 03 is specifically as follows display, TV, mobile phone, tablet computer, Digital Frame, navigator, intelligence
The products or component with any display function such as energy wrist-watch, Intelligent bracelet.
Here, above-mentioned display device 03 can also include the portions such as driving circuit section, touch-control structure, fingerprint recognition structure
Part, specific structure can be found in the relevant technologies, and the embodiment of the present invention repeats no more this.
In the description of above embodiment, particular features, structures, materials, or characteristics can be at any one or more
It can be combined in any suitable manner in a embodiment or example.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (14)
1. a kind of encapsulation film layer characterized by comprising
Base layer；The base layer includes: the first surface, opposite with the first surface towards electronic device to be packaged
Second surface；
Super-hydrophobic layer on the second surface, the super-hydrophobic layer include: multiple on the second surface
Every the hydrophobic microprotrusion of setting.
2. encapsulation film layer according to claim 1, which is characterized in that the hydrophobic microprotrusion includes: microprotrusion structure, inhales
It is attached to the low-surface-energy molecule of the microprotrusion body structure surface.
3. encapsulation film layer according to claim 2, which is characterized in that
In the face of the second surface, the microprotrusion structure is 25nm~500nm along the size of line direction and column direction,
The spacing of the two neighboring microprotrusion structure is 25nm~500nm；
On the direction perpendicular to the second surface, the height of the microprotrusion structure is 50nm~500nm；
The surface of the low-surface-energy molecule can be less than 30mJ/m2。
4. encapsulation film layer according to claim 2, which is characterized in that the microprotrusion structure is made of polymer, and
Perpendicular on the direction of the first surface, for the microprotrusion structure after being compressed, the stimulation volume by external condition can
It expands.
5. encapsulation film layer according to claim 4, which is characterized in that include amido in the structural formula of the polymer
And/or carboxylic acid group；The external condition is hydrone.
6. encapsulation film layer according to claim 2, which is characterized in that the low-surface-energy molecule is also dispersed in the dimpling
It rises in structure and/or the base layer.
7. encapsulation film layer according to claim 6, which is characterized in that the low-surface-energy molecule is covered by with porous
In the polymer capsule of structure, the polymer capsule is dispersed in the microprotrusion structure and/or the base layer.
8. encapsulation film layer according to any one of claims 1 to 7, which is characterized in that the base layer is made of polymer；
The encapsulation film layer further include: positioned at the first organic film of the first surface side, and/or positioned at described super-hydrophobic
Inorganic film of the layer far from the second surface side.
9. encapsulation film layer according to claim 8, which is characterized in that for the encapsulation film layer include the inoranic membrane
The case where layer, the encapsulation film layer further include: the second organic film between the super-hydrophobic layer and the inorganic film.
10. a kind of preparation method for encapsulating film layer characterized by comprising
There is provided base layer, the base layer include: towards electronic device to be packaged first surface, with the first surface phase
Pair second surface；
Super-hydrophobic layer is formed on the second surface, the super-hydrophobic layer includes: multiple on the second surface
Every the hydrophobic microprotrusion of setting.
11. the preparation method of encapsulation film layer according to claim 10, which is characterized in that described on the second surface
Super-hydrophobic layer is formed, the super-hydrophobic layer includes: multiple spaced hydrophobic microprotrusions on the second surface, packet
It includes:
Using any one of layer-by-layer, laser etching techniques, electrochemical vapour deposition (EVD) technology, spraying technology,
Multiple spaced microprotrusion structures are formed on the second surface；
Low-surface-energy molecule is adsorbed in the microprotrusion body structure surface.
12. a kind of encapsulating structure, comprising: underlay substrate, the electronic device on the underlay substrate；It is characterized in that, also
It include: the encapsulation film layer as described in any one of claim 1 to 9 for covering the electronic device；Wherein, in the encapsulation film layer
The first surface towards the electronic device.
13. encapsulating structure according to claim 12, which is characterized in that the electronic device is OLED device.
14. a kind of display device, which is characterized in that including encapsulating structure as described in claim 12 or 13.
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Application publication date: 20190607 |