CN109726618A - Array circuit and smart phone for sensor - Google Patents
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- CN109726618A CN109726618A CN201711044893.XA CN201711044893A CN109726618A CN 109726618 A CN109726618 A CN 109726618A CN 201711044893 A CN201711044893 A CN 201711044893A CN 109726618 A CN109726618 A CN 109726618A
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- 230000003287 optical effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
A kind of array circuit and smart phone for sensor, the sensor includes multiple sensing units of array arrangement, multiple sensing units of each column are connected on a conducting wire simultaneously, and the input terminal of at least two conducting wires connects altogether and formed pin and pin and is connected with control chip.Thus above-mentioned connection type is used, so that the pin number between sensor and control chip is greatly reduced, to save the area and packaging cost of chip；Cabling space is saved simultaneously, production and processing difficulty is allowed to reduce, cause to save production weld interval and improves product yield, therefore the problem of solving existing sensor array interconnection technique there is the chip pins docked with sensor excessively so as to cause occupying chip area, and increasing cost and be unfavorable for processing.
Description
Technical field
The invention belongs to sensor technical fields, more particularly to the array circuit and smart phone for sensor.
Background technique
Since iPhone IPhone5S in 2013 introduces fingerprint recognition, fingerprint identification technology in smart machine just
It is widely used, simply fast combines safe feature, hundreds of millions of people is allowed to receive and rely on fingerprint recognition work
For the tripper of the smart machines such as mobile phone, plate, while with the rise of mobile payment, given by fingerprint recognition instead of password
It is worried that user eliminates input password bring.Even to this day, fingerprint recognition mould group has become smart phone standard configuration.
Then, increase the demand of demand and full screen fingerprint recognition, fingerprint recognition to Mobile phone screen accounting for adaptation user
With being combined into for the problem of mobile phone development person for display technology.Such as shield lower optical finger print technology and shields lower ultrasonic fingerprint skill
Art all can be only applied to OLED screen, and the requirement to screen is high, and which limit the regions of application and fingerprint recognition to be fixed on one
A lesser range, greatly differs from each other with full frame fingerprint technique.
Using the fingerprint recognition shielded comprehensively, the area of sensor can be very big, by taking 5.5 inch display screens as an example, shows
Show that area is 6.85cm*12.18cm.But it is limited to the lines shape of human finger, therefore size sensor cannot be too big, compares
Common size is 508dpi, i.e., the interval of two neighboring sensing unit is 50u, then entire sensor will be 1370*2436
Array.
Currently, general in such a way that each column pixel all goes out a pin, this method is suitable for the fingerprint sensing of small array
Device, once the area of sensor extends to entire full screen, the number of pins needed be likely to be breached more than 1000 it is even more, lead
Cause the cabling resource of sensor and chip chamber nervous, the chip pin being mated with excessively occupies chip area and increases into
This, while being also unfavorable for processing.
Fig. 1 shows the sensor array connecting line construction that the prior art is related to, sensor 200 and cabling wiring board 300
It is connected, cabling wiring board 300 is connected with chip 600, due to the sensing unit all connection and number of pins of each column
It is more, therefore high production cost, long processing time and yield are low.
Therefore, existing sensor array interconnection technique there is the chip pin docked with sensor excessively so as to cause
The problem of occupying chip area, and increasing cost and be unfavorable for processing.
Summary of the invention
The purpose of the present invention is to provide the array circuits and smart phone for sensor, it is intended to solve existing sensing
There is the chip pins docked with sensor for device array interconnection technique excessively so as to cause occupying chip area, and increases
Cost and the problem of be unfavorable for processing.
First aspect present invention provides a kind of array circuit for sensor, and the sensor includes array arrangement
Multiple sensing units of multiple sensing units, each column are connected on the first conducting wire of same root, and at least described in two
The input terminal of first conducting wire connects altogether and is formed the first pin, and first pin is connected with control chip.
Second aspect of the present invention provides a kind of smart phone, including display screen and sensor, and the display screen is to described
The information that sensor is got is shown that the sensor includes multiple sensing units of array arrangement, the smart phone
It further include above-mentioned array circuit.
In conclusion above-mentioned array circuit and smart phone for sensor, the sensor include the more of array arrangement
Multiple sensing units of a sensing unit, each column are connected on a conducting wire simultaneously, and the input terminal of at least two conducting wires
Pin and pin is connect and is formed altogether to be connected with control chip.Thus above-mentioned connection type is used, so that sensor and control
Pin number between coremaking piece is greatly reduced, to save the area and packaging cost of chip；Cabling is saved simultaneously
Space allows production and processing difficulty to reduce, and causes to save production weld interval and improves product yield, therefore solves existing
There is the chip pins docked with sensor for some sensor array interconnection techniques excessively so as to cause occupying chip area,
And the problem of increasing cost and being unfavorable for processing.
Detailed description of the invention
Fig. 1 shows the array connecting line construction schematic diagram for the sensor that the prior art is related to.
Fig. 2 is the attachment structure schematic diagram for the array circuit for sensor that first embodiment of the invention provides.
Fig. 3 is the attachment structure schematic diagram for the array circuit for sensor that second embodiment of the invention provides.
Fig. 4 is the partial schematic that sensor array provided by the invention reduces cabling.
Fig. 5 is the attachment structure schematic diagram that sensor provided by the invention reduces cabling.
Fig. 6 is the sensor array attachment structure schematic diagram of smart phone provided by the invention.
Specific embodiment
In order to which technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, below in conjunction with
Accompanying drawings and embodiments, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
The array circuit for sensor of the embodiment of the present invention, by the way of switch control and channel multiplexing, full
In the case that sufficient products application requires, the pin number between sensor and chip is allowed to be greatly lowered, to reduce chip
Number of pins, save chip area and packaging cost；Meanwhile line number is greatly lowered and also saves cabling space,
It allows production and processing difficulty to reduce, save production weld interval and improves product yield.Present invention can apply to sensors
Array field, such as optical image sensor and ultrasonography sensor field, it can also be used to biometrics readers, scanner,
The products such as medical imaging device.
In order to illustrate technical solutions according to the invention, the following is a description of specific embodiments.
Fig. 2 shows the connection structures for the array circuit for sensor that first embodiment of the invention provides, in order to just
In explanation, only parts related to embodiments of the present invention are shown, and details are as follows:
The above-mentioned array circuit for sensor 200, the sensor 200 include multiple sensing units 210 of array arrangement,
Multiple sensing units of each column are connected on the first conducting wire of same root, and the input terminal of at least two first conducting wires is total
The first pin is connect and is formed, first pin is connected with control chip.
As an embodiment of the present invention, each sensing unit, which has individually to switch, is connected to (Fig. 2 use of the first conducting wire
211L1,211L2 ... are indicated) on, certainly, the input terminal of first conducting wire 211L1,211L2 and 211L3 connects altogether and forms the
One pin 211J1, and so on, first pin 211J1,211J2,211J3 and 211J4 is connected with control chip.
As an embodiment of the present invention, above-mentioned array circuit further includes the scanning port connecting with the first pin, Yi Ji
One driving port；
A first switch connecting with the first driving port is respectively provided on first conducting wire, first switch is used to drive according to first
The level signal of moved end mouthful output carries out on or off.
Specific embodiment as shown in Figure 2, the first conducting wire 211L1 are equipped with first switch 211S1, and first switch
211S1 carries out on or off according to the level signal of corresponding first driving port 231C1 output；For example, when the first driving
When port 231C1 exports high level, the first switch 211S1 conducting being attached thereto, when the first driving port 231C1 exports low electricity
Usually, the first switch 211S1 being attached thereto is closed.Certainly, the working principle of other first conducting wires and first switch is same
Foregoing description is consistent.
As an embodiment of the present invention, above-mentioned first driving port is S, the S root connecting with same first pin
First conducting wire is considered as one group of first conducting wire group, and the S in each first conducting wire group first switches are respectively by S
First driving port corresponds control, wherein S >=2.
As an embodiment of the present invention, above-mentioned array circuit further includes the second conducting wire that first number of conductors is S-N
Group, the S-N first switches in each second conducting wire group are corresponded by S-N first driving ports respectively
Control, wherein N >=1 S >.
It is considered as one group of first conducting wire using every 8 first conducting wires and 8 first driving ports in Fig. 2 specific embodiment
Group, then the first conducting wire in each group of the first conducting wire group all passes through first switch and converges in the first pin 221J1 respectively, and first draws
On foot 221J2, the first pin 221J3 ..., wherein first switch is TFT switch, can for single NMOS or
PMOS is also possible to the cmos switch of two metal-oxide-semiconductors composition.Wherein the unlatching of first switch is by the first driving port
231C1 ... ..., 231C4 ... ... control, the first driving port connect with control chip and are controlled by control chip
Logic circuit；First driving port 231C1 control first switch 221S1,221S9,221S17 and 221S25 conducting or
Shutdown, and so on.
Certainly, the first conducting wire of H column is divided into J the first conducting wire groups, each first conducting wire group may be designed to K (K be 1 with
The upper natural number less than H) column composition, without requiring H that can be eliminated by J, once there is remainder, remaining multiple first conducting wire conducts
Last group.If when in Fig. 2 including 34 column sensing unit, 32 column sensing units of front are divided into 4 group of first conducting wire group,
Remaining 2 column sensing unit is the second conducting wire of another set group, certainly, the first switch quilt of remaining 2 column sensing unit connection
Corresponding first driving port controls one by one.In H column sensing unit, the first conducting wire of each column connection is all connected by first switch
It is connected on the first pin, such as the first conducting wire 211L1 of the 1st column sensing unit connection passes through first switch 211S1 connection first
The first conducting wire 211L2 of pin 221J1, the connection of the 2nd column sensing unit pass through the first pin of first switch 211S2 connection
The first conducting wire 211L8 of 221J1 ... ..., the connection of the 8th column sensing unit pass through the first pin of first switch 211S8 connection
The first conducting wire 211L9 of 221J1, the connection of the 9th column sensing unit pass through the first pin of first switch 211S9 connection
221J2 ... ..., and so on.
Fig. 3 shows the connection structure of the array circuit for sensor of second embodiment of the invention offer, in order to just
In explanation, only parts related to embodiments of the present invention are shown, and details are as follows:
As an embodiment of the present invention, at least two first pins connect altogether and are formed second pin by the second conducting wire, the
Two pins are connected with control chip.Certainly, at least two second pins can connect altogether by privates and be formed third pin,
At least two third pins can be connect altogether by privates and form the 4th pin ... and so on, can be adopted according to actual needs
With make by the way of Multiple Superposition and channel sensor and control chip pin it is few as far as possible.In this embodiment, with
At least two first pins are connect altogether and are formed for second pin by the second conducting wire and are described.
As an embodiment of the present invention, above-mentioned array circuit further includes the second driving port, and second conducting wire is equipped with
The second switch connecting with second driving port, the second switch are used for the electricity according to second driving port output
Ordinary mail number carries out on or off.
On the basis of Fig. 2, Fig. 3 is connect altogether using the first pin 221J1 and the first pin 221J2 and is formed second pin
221K1 and the first pin 221J3 and the first pin 221J4 connect altogether and form second pin 221K2.Certainly, in the second conducting wire
It is equipped with the second switch (Fig. 3 is indicated using 211P1,211P2,211P3 and 211P4) connecting with the second driving port, the
The working principle of two switches is consistent with above-mentioned first switch.
As an embodiment of the present invention, above-mentioned second driving port is P, the P root connecting with the same second pin
Second conducting wire is considered as one group of privates group, and the P in each privates group second switches are respectively by P
Second driving port corresponds control, wherein P >=2.
As an embodiment of the present invention, above-mentioned array circuit further includes the privates that second number of conductors is P-M
Group, the P-M second switches in each privates group are corresponded by P-M second driving ports respectively
Control, wherein M >=1 P >.Second driving port is consistent with the above-mentioned first driving working principle of port.
Therefore, in order to allow number of pins to further decrease, by the first pin 221J1 and the first pin 221J2 again by
The mode of control switch switching pools second pin 221K1, and docks with control chip.The mode is not limited to only two
A first pin convergence, is also applied for more than two first pins and is converged.
Above-mentioned first switch and the second switch is all thin film transistor (TFT), the thin film transistor (TFT) include a-si (amorphous silicon),
The thin film transistor (TFT)s such as LTPS (low temperature polycrystalline silicon) and IGZO (indium gallium zinc oxide).
The local principle that Fig. 4 shows sensor array reduction cabling provided by the invention is only shown for ease of description
Part related to the embodiment of the present invention, details are as follows:
As an embodiment of the present invention, above-mentioned array circuit further includes the operational amplifier being connected with the scanning port
1012,
Optical signal, magnetic signal, acoustical signal, ultrasonic signal, wave signal, power letter of the sensing unit for that will receive
Number, thermal signal or wet signal be converted to electric signal, and amplified by the operational amplifier 1012 to the electric signal.
When doing single pixel scan pattern, the switch of each pixel and the switch of each column are controlled, each conducting wire group only has
One pixel is connected to the first pin 221J1, as in the first conducting wire group, allows the first driving port by the control of logic circuit 1011
231C1 is high level, then first switch 211S1 is closed, remaining first switch disconnects, and first pixel (sensing unit) is logical at this time
It crosses first switch and is connected to operational amplifier, (Fig. 4 uses 2011,2012,2013,2014,2015,2016,2017 to sensing unit
And 2018 indicate) signals such as the light received, magnetic, sound, ultrasound, wave, power, heat, wet are converted into electric current or voltage signal,
Processing is amplified to signal by the operational amplifier 1012 of control chip 101 (Fig. 4 is indicated using IC), in operational amplifier
Output end obtains corresponding voltage or current signal to facilitate subsequent module to be handled.After the end of scan, it is switched to down
When one column pixel, first switch 211S2 closure, remaining first switch is disconnected, and second pixel is connected to operational amplifier 1012
Input terminal, the output end of operational amplifier 1012 obtains the relevant signal of corresponding secondary series pixel.Successively swept by 8 column
It retouches, it can be by all scanning completions of 8 pixels in this group.
Certainly, J group can work at the same time, and successively draw in the first pin 221J1, the first pin 221J2 ... first
Data are obtained on foot 221JJ, are scanned by 8 times, the data of current scan line in available M row.Similar switching row address,
It can also be gradually completing and the sensing unit of each row is scanned.
The present invention also provides smart phone, including display screen and sensor, the display screen obtains the sensor
To information shown that the sensor includes multiple sensing units of array arrangement, the smart phone further includes above-mentioned
Array circuit.
Fig. 5 and Fig. 6 respectively illustrates the connection structure and smart phone that sensor provided by the invention reduces cabling
Sensor array connection structure, for ease of description, only parts related to embodiments of the present invention are shown, and details are as follows:
As an embodiment of the present invention, a kind of smart phone, its working principles are as follows: (Fig. 6 is used the sensor on screen
200 indicate) it is made of array sensing unit, each sensing unit contains switching tube and photodiode, when signal light exposes to
It on finger and then reflexes on sensing unit, since finger is there are valley and a ridge lines, the optical signal amount reflexed to below finger has
Difference, the electric signal after sensing unit are also variant.
The characteristics of in view of Mobile phone screen, uses 5.8 cun of screens, and display area area is 16.26cm*8.24cm respectively, uses
The resolution ratio of 508dpi, pixel-matrix are 3256*1648, that is, contain 1648 arrays, be divided into one group using every 16 array, altogether
1648/16=103 group, in addition increased 16 control switch cablings, therefore 1648-103-16=1529 root can be reduced in total
Export cabling.
Therefore, above-mentioned to be embodied in for the array circuit of sensor and the advantage of smart phone:
(1) output cabling is reduced, is conducive to the area design of FPC being attached thereto, makes its space requirement low；
(2) output cabling is reduced, the area for being conducive to the FPC being attached thereto reduces, and makes its cost lower；
(3) reduce output cabling, be conducive to the welding of FPC being attached thereto, solder joint is less, working hour is less and yield more
It is high；
(4) output cabling is reduced, corresponding chip pin quantity is advantageously reduced, makes packing forms unrestricted, have
Help reduce packaging cost；
(5) output cabling is reduced, corresponding chip pin quantity is advantageously reduced, makes chip area smaller, help
In reduction chip cost；
(6) output cabling is reduced, corresponding chip pin quantity is advantageously reduced, makes solder joint number less, favorably
In saving cost, welding yield is improved.
In conclusion the embodiment of the invention provides array circuit and smart phone for sensor, the sensor packet
Multiple sensing units of array arrangement are included, multiple sensing units of each column are connected on a conducting wire simultaneously, and at least two
The input terminal of root conducting wire connects altogether and is formed pin and pin and is connected with control chip.Thus above-mentioned connection type is used,
So that the pin number between sensor and control chip is greatly reduced, to save the area and packaging cost of chip；
Cabling space is saved simultaneously, production and processing difficulty is allowed to reduce, leads to save production weld interval and to improve product good
Rate, thus solve existing sensor array interconnection technique there is the chip pin docked with sensor excessively so as to cause
The problem of occupying chip area, and increasing cost and be unfavorable for processing.The embodiment of the present invention is realized simply, is not needed
Increase additional hardware, can effectively reduce cost, there is stronger usability and practicality.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of array circuit for sensor, the sensor includes multiple sensing units of array arrangement, and feature exists
In, multiple sensing units of each column are connected on the first conducting wire of same root, and at least two first conducting wires
Input terminal connects altogether and is formed the first pin, and first pin is connected with control chip.
2. array circuit as described in claim 1, which is characterized in that further include the scanning end being connect with first pin
Mouth and the first driving port；
A first switch connecting with first driving port is respectively provided on first conducting wire, the first switch is used for root
On or off is carried out according to the level signal of first driving port output.
3. array circuit as claimed in claim 2, which is characterized in that first driving port is S, with same described the
First conducting wire described in the S root of one pin connection is considered as one group of first conducting wire group, the S in each first conducting wire group described the
One switch corresponds control by S first driving ports respectively, wherein S >=2.
4. array circuit as claimed in claim 3, which is characterized in that the array circuit further includes first number of conductors
For the second conducting wire group of S-N, the S-N first switches in each second conducting wire group are respectively by S-N described first
Port is driven to correspond control, wherein N >=1 S >.
5. array circuit as described in claim 1, which is characterized in that at least two first pins are connect simultaneously altogether by the second conducting wire
Second pin is formed, the second pin is connected with control chip.
6. array circuit as claimed in claim 5, which is characterized in that further include the second driving port, on second conducting wire
Equipped with the second switch connecting with second driving port, the second switch is used for according to second driving port output
Level signal carry out on or off.
7. array circuit as claimed in claim 6, which is characterized in that second driving port is P, with same described the
Second conducting wire described in the P root of two pins connection is considered as one group of privates group, the P in each privates group described the
Two switches correspond control by P second driving ports respectively, wherein P >=2.
8. array circuit as claimed in claim 7, which is characterized in that the array circuit further includes second number of conductors
For the privates group of P-M, the P-M second switches in each privates group are respectively by P-M described second
Port is driven to correspond control, wherein M >=1 P >.
9. array circuit as claimed in claim 2, which is characterized in that the array circuit further includes and the scanning port phase
The operational amplifier of connection,
The sensing unit is used for optical signal, magnetic signal, acoustical signal, ultrasonic signal, wave signal, the force signal, heat that will be received
Signal or wet signal are converted to electric signal, and are amplified by the operational amplifier to the electric signal.
10. a kind of smart phone, including display screen and sensor, the display screen carries out the information that the sensor is got
It has been shown that, the sensor includes multiple sensing units of array arrangement, which is characterized in that the smart phone further includes such as right
It is required that the described in any item array circuits of 1-9.
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| CN201711044893.XA CN109726618A (en) | 2017-10-31 | 2017-10-31 | Array circuit and smart phone for sensor |
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| CN201711044893.XA CN109726618A (en) | 2017-10-31 | 2017-10-31 | Array circuit and smart phone for sensor |
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| CN110232268A (en) * | 2019-05-31 | 2019-09-13 | 武汉华星光电技术有限公司 | A kind of fingerprint identification method, electronic equipment and display panel |
| CN110309820A (en) * | 2019-08-28 | 2019-10-08 | 深圳市汇顶科技股份有限公司 | The device and electronic equipment of fingerprint detection |
| US11194985B2 (en) | 2019-08-28 | 2021-12-07 | Shenzhen GOODIX Technology Co., Ltd. | Apparatus for fingerprint detection and electronic device |
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